JPS5741171A - Grindstone for grinding and cutting - Google Patents

Grindstone for grinding and cutting

Info

Publication number
JPS5741171A
JPS5741171A JP10922680A JP10922680A JPS5741171A JP S5741171 A JPS5741171 A JP S5741171A JP 10922680 A JP10922680 A JP 10922680A JP 10922680 A JP10922680 A JP 10922680A JP S5741171 A JPS5741171 A JP S5741171A
Authority
JP
Japan
Prior art keywords
grindstone
cutting
abrasive
grain size
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10922680A
Other languages
Japanese (ja)
Inventor
Masayasu Abe
Masaharu Aoyama
Masafumi Miyagawa
Toshio Yonezawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10922680A priority Critical patent/JPS5741171A/en
Publication of JPS5741171A publication Critical patent/JPS5741171A/en
Pending legal-status Critical Current

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)

Abstract

PURPOSE: To obtain an excellent finished surface with a high degree of efficiency, providing a grindstone for cutting out as for example, semiconductor wafer from a cylindrical bar material, having a large abrasive grain size in the cutting portion thereof and a small abrasive grain size in the lateral portions.
CONSTITUTION: Both lateral surface 6 of a grindstone 5 which participate in the formation of cut surface of a material to be cut, are provided with abrasive 7 having a small grain size and a low hardness. Further, the cutting portion 8 or the peripheral and intermediate portion of the grindstone 5 which participate in removing the material to be cut, is provided with abrasive 9 having a large grain size and a high hardness so as to form a grindstone 5 for cutting and polishing. With the use of such a grindstone 5, the removal of the material by the large grain size abrasive 9 and the grinding of the cut groove surfaces by the fine abrasive 7 are simultaneously made, thereby the grinding with a high degree of cutting efficiency and the cutting of excellent cut surfaces can be simultaneously attained.
COPYRIGHT: (C)1982,JPO&Japio
JP10922680A 1980-08-11 1980-08-11 Grindstone for grinding and cutting Pending JPS5741171A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10922680A JPS5741171A (en) 1980-08-11 1980-08-11 Grindstone for grinding and cutting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10922680A JPS5741171A (en) 1980-08-11 1980-08-11 Grindstone for grinding and cutting

Publications (1)

Publication Number Publication Date
JPS5741171A true JPS5741171A (en) 1982-03-08

Family

ID=14504794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10922680A Pending JPS5741171A (en) 1980-08-11 1980-08-11 Grindstone for grinding and cutting

Country Status (1)

Country Link
JP (1) JPS5741171A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59143651U (en) * 1983-03-17 1984-09-26 額賀　義盛 cutting “to” stone
JPS6288574A (en) * 1985-10-14 1987-04-23 Mitsubishi Metal Corp Grinding wheel
JPS63174877A (en) * 1987-01-10 1988-07-19 Mitsubishi Metal Corp Electroformed thin blade grinding stone
JPH0230028A (en) * 1988-07-19 1990-01-31 Iida Sangyo Kk Thermal fuse

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59143651U (en) * 1983-03-17 1984-09-26 額賀　義盛 cutting “to” stone
JPS6288574A (en) * 1985-10-14 1987-04-23 Mitsubishi Metal Corp Grinding wheel
JPS63174877A (en) * 1987-01-10 1988-07-19 Mitsubishi Metal Corp Electroformed thin blade grinding stone
JPH0230028A (en) * 1988-07-19 1990-01-31 Iida Sangyo Kk Thermal fuse

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