DE69717510T2 - Halbleiterscheiben-Polierkopf - Google Patents

Halbleiterscheiben-Polierkopf

Info

Publication number
DE69717510T2
DE69717510T2 DE69717510T DE69717510T DE69717510T2 DE 69717510 T2 DE69717510 T2 DE 69717510T2 DE 69717510 T DE69717510 T DE 69717510T DE 69717510 T DE69717510 T DE 69717510T DE 69717510 T2 DE69717510 T2 DE 69717510T2
Authority
DE
Germany
Prior art keywords
wafer
housing
retainer
respect
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69717510T
Other languages
English (en)
Other versions
DE69717510D1 (de
Inventor
Konstantin Volodarsky
David Edwin Weldon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE69717510D1 publication Critical patent/DE69717510D1/de
Publication of DE69717510T2 publication Critical patent/DE69717510T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
DE69717510T 1996-01-24 1997-01-08 Halbleiterscheiben-Polierkopf Expired - Fee Related DE69717510T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59086196A 1996-01-24 1996-01-24

Publications (2)

Publication Number Publication Date
DE69717510D1 DE69717510D1 (de) 2003-01-16
DE69717510T2 true DE69717510T2 (de) 2003-10-02

Family

ID=24364029

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69717510T Expired - Fee Related DE69717510T2 (de) 1996-01-24 1997-01-08 Halbleiterscheiben-Polierkopf

Country Status (5)

Country Link
US (1) US5803799A (de)
EP (1) EP0786310B1 (de)
JP (1) JPH09201763A (de)
AT (1) ATE228915T1 (de)
DE (1) DE69717510T2 (de)

Families Citing this family (96)

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JP3183388B2 (ja) * 1996-07-12 2001-07-09 株式会社東京精密 半導体ウェーハ研磨装置
US6183354B1 (en) 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6146259A (en) 1996-11-08 2000-11-14 Applied Materials, Inc. Carrier head with local pressure control for a chemical mechanical polishing apparatus
JP3705670B2 (ja) * 1997-02-19 2005-10-12 株式会社荏原製作所 ポリッシング装置及び方法
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US6244946B1 (en) * 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
EP0881039B1 (de) * 1997-05-28 2003-04-16 Tokyo Seimitsu Co.,Ltd. Halbleiterscheibe Poliervorrichtung mit Halterring
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
TW436369B (en) * 1997-07-11 2001-05-28 Tokyo Seimitsu Co Ltd Wafer polishing device
US6113479A (en) * 1997-07-25 2000-09-05 Obsidian, Inc. Wafer carrier for chemical mechanical planarization polishing
US5916015A (en) * 1997-07-25 1999-06-29 Speedfam Corporation Wafer carrier for semiconductor wafer polishing machine
TW434095B (en) * 1997-08-11 2001-05-16 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
MY120754A (en) * 1997-08-11 2005-11-30 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
US5989103A (en) * 1997-09-19 1999-11-23 Applied Materials, Inc. Magnetic carrier head for chemical mechanical polishing
US6080040A (en) * 1997-11-05 2000-06-27 Aplex Group Wafer carrier head with inflatable bladder and attack angle control for polishing
JP3006568B2 (ja) * 1997-12-04 2000-02-07 日本電気株式会社 ウエハ研磨装置および研磨方法
US6068548A (en) * 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US6531397B1 (en) 1998-01-09 2003-03-11 Lsi Logic Corporation Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
JPH11285966A (ja) * 1998-04-02 1999-10-19 Speedfam-Ipec Co Ltd キャリア及びｃｍｐ装置
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
US6113480A (en) * 1998-06-02 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus for polishing semiconductor wafers and method of testing same
US6251215B1 (en) * 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US6210255B1 (en) 1998-09-08 2001-04-03 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6159079A (en) 1998-09-08 2000-12-12 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
SG96263A1 (en) * 1998-09-25 2003-05-23 Tdk Corp Method for processing slider
US6347979B1 (en) * 1998-09-29 2002-02-19 Vsli Technology, Inc. Slurry dispensing carrier ring
JP2000187832A (ja) * 1998-10-05 2000-07-04 Exclusive Design Co Inc 磁気ディスク及び他の基板を自動研磨する方法及び装置
US6244942B1 (en) 1998-10-09 2001-06-12 Applied Materials, Inc. Carrier head with a flexible membrane and adjustable edge pressure
US6277014B1 (en) 1998-10-09 2001-08-21 Applied Materials, Inc. Carrier head with a flexible membrane for chemical mechanical polishing
US6132298A (en) * 1998-11-25 2000-10-17 Applied Materials, Inc. Carrier head with edge control for chemical mechanical polishing
US6220930B1 (en) * 1998-11-03 2001-04-24 United Microelectronics Corp. Wafer polishing head
US6165058A (en) * 1998-12-09 2000-12-26 Applied Materials, Inc. Carrier head for chemical mechanical polishing
SG82058A1 (en) * 1998-12-30 2001-07-24 Applied Materials Inc Carrier head with controllable pressure and loading area for chemical mechanical polishing
US6422927B1 (en) 1998-12-30 2002-07-23 Applied Materials, Inc. Carrier head with controllable pressure and loading area for chemical mechanical polishing
US6162116A (en) * 1999-01-23 2000-12-19 Applied Materials, Inc. Carrier head for chemical mechanical polishing
US6179709B1 (en) * 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
TW436378B (en) * 1999-02-05 2001-05-28 Mitsubishi Materials Corp Wafer polishing apparatus and method for making a wafer
US6645050B1 (en) * 1999-02-25 2003-11-11 Applied Materials, Inc. Multimode substrate carrier
US6368189B1 (en) 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6231428B1 (en) * 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6113468A (en) * 1999-04-06 2000-09-05 Speedfam-Ipec Corporation Wafer planarization carrier having floating pad load ring
US6431968B1 (en) 1999-04-22 2002-08-13 Applied Materials, Inc. Carrier head with a compressible film
WO2000078504A1 (en) * 1999-06-19 2000-12-28 Speedfam-Ipec Corporation Method and apparatus for increasing the lifetime of a workpiece retaining structure and conditioning a polishing surface
US6224472B1 (en) * 1999-06-24 2001-05-01 Samsung Austin Semiconductor, L.P. Retaining ring for chemical mechanical polishing
US6241593B1 (en) * 1999-07-09 2001-06-05 Applied Materials, Inc. Carrier head with pressurizable bladder
US6358121B1 (en) 1999-07-09 2002-03-19 Applied Materials, Inc. Carrier head with a flexible membrane and an edge load ring
US6855043B1 (en) 1999-07-09 2005-02-15 Applied Materials, Inc. Carrier head with a modified flexible membrane
US6494774B1 (en) 1999-07-09 2002-12-17 Applied Materials, Inc. Carrier head with pressure transfer mechanism
KR100468178B1 (ko) * 1999-07-28 2005-01-26 미츠비시 마테리알 가부시키가이샤 쓰리챔버 ｃｍｐ 연마 헤드 및 그 이용 방법
US6663466B2 (en) 1999-11-17 2003-12-16 Applied Materials, Inc. Carrier head with a substrate detector
US6375549B1 (en) 2000-03-17 2002-04-23 Motorola, Inc. Polishing head for wafer, and method for polishing
US6450868B1 (en) 2000-03-27 2002-09-17 Applied Materials, Inc. Carrier head with multi-part flexible membrane
US6361419B1 (en) 2000-03-27 2002-03-26 Applied Materials, Inc. Carrier head with controllable edge pressure
US6390905B1 (en) * 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US7140956B1 (en) 2000-03-31 2006-11-28 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6666756B1 (en) * 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
US6354928B1 (en) * 2000-04-21 2002-03-12 Agere Systems Guardian Corp. Polishing apparatus with carrier ring and carrier head employing like polarities
US6436828B1 (en) 2000-05-04 2002-08-20 Applied Materials, Inc. Chemical mechanical polishing using magnetic force
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6409579B1 (en) * 2000-05-31 2002-06-25 Koninklijke Philips Electronics N.V. Method and apparatus for conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish
US6540592B1 (en) 2000-06-29 2003-04-01 Speedfam-Ipec Corporation Carrier head with reduced moment wear ring
US6447380B1 (en) 2000-06-30 2002-09-10 Lam Research Corporation Polishing apparatus and substrate retainer ring providing continuous slurry distribution
US6722965B2 (en) * 2000-07-11 2004-04-20 Applied Materials Inc. Carrier head with flexible membranes to provide controllable pressure and loading area
US20040005842A1 (en) * 2000-07-25 2004-01-08 Chen Hung Chih Carrier head with flexible membrane
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
US6857945B1 (en) 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
US6419567B1 (en) 2000-08-14 2002-07-16 Semiconductor 300 Gmbh & Co. Kg Retaining ring for chemical-mechanical polishing (CMP) head, polishing apparatus, slurry cycle system, and method
US6652357B1 (en) 2000-09-22 2003-11-25 Lam Research Corporation Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
US6443815B1 (en) * 2000-09-22 2002-09-03 Lam Research Corporation Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
JP4818505B2 (ja) * 2000-10-19 2011-11-16 不二越機械工業株式会社 ウェーハ研磨ヘッド
US6447368B1 (en) 2000-11-20 2002-09-10 Speedfam-Ipec Corporation Carriers with concentric balloons supporting a diaphragm
US6468131B1 (en) 2000-11-28 2002-10-22 Speedfam-Ipec Corporation Method to mathematically characterize a multizone carrier
US6910949B1 (en) 2001-04-25 2005-06-28 Lam Research Corporation Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers
US6582277B2 (en) 2001-05-01 2003-06-24 Speedfam-Ipec Corporation Method for controlling a process in a multi-zonal apparatus
US6722942B1 (en) 2001-05-21 2004-04-20 Advanced Micro Devices, Inc. Chemical mechanical polishing with electrochemical control
CN100513076C (zh) * 2001-05-29 2009-07-15 株式会社荏原制作所 抛光装置与抛光方法
US6893327B2 (en) * 2001-06-04 2005-05-17 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
KR100421445B1 (ko) * 2001-09-28 2004-03-09 삼성전자주식회사 연마 헤드 조립 방법 및 연마 헤드 조립 시의 공기 누설검사장치
US6890249B1 (en) 2001-12-27 2005-05-10 Applied Materials, Inc. Carrier head with edge load retaining ring
US6872130B1 (en) 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
US20030182015A1 (en) * 2002-03-19 2003-09-25 Domaille Michael D. Polisher
US6689258B1 (en) 2002-04-30 2004-02-10 Advanced Micro Devices, Inc. Electrochemically generated reactants for chemical mechanical planarization
US6790123B2 (en) 2002-05-16 2004-09-14 Speedfam-Ipec Corporation Method for processing a work piece in a multi-zonal processing apparatus
AU2003300375A1 (en) * 2002-10-11 2004-05-04 Semplastics, L.L.C. Retaining ring for use on a carrier of a polishing apparatus
US7001245B2 (en) * 2003-03-07 2006-02-21 Applied Materials Inc. Substrate carrier with a textured membrane
US20060180486A1 (en) * 2003-04-21 2006-08-17 Bennett David W Modular panel and storage system for flat items such as media discs and holders therefor
KR100600231B1 (ko) * 2003-07-12 2006-07-13 동부일렉트로닉스 주식회사 씨엠피 폴리싱 헤드 및 그 동작방법
US7255771B2 (en) 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
US6935938B1 (en) 2004-03-31 2005-08-30 Lam Research Corporation Multiple-conditioning member device for chemical mechanical planarization conditioning
KR101214506B1 (ko) 2004-11-01 2012-12-27 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
US7101272B2 (en) * 2005-01-15 2006-09-05 Applied Materials, Inc. Carrier head for thermal drift compensation
JP4814677B2 (ja) * 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置
KR101617716B1 (ko) * 2008-03-25 2016-05-03 어플라이드 머티어리얼스, 인코포레이티드 개량된 캐리어 헤드 멤브레인
US7749052B2 (en) * 2008-09-08 2010-07-06 Applied Materials, Inc. Carrier head using flexure restraints for retaining ring alignment
US10160093B2 (en) * 2008-12-12 2018-12-25 Applied Materials, Inc. Carrier head membrane roughness to control polishing rate

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JPS55157473A (en) * 1979-05-22 1980-12-08 Nippon Telegr & Teleph Corp <Ntt> Polishing method
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Also Published As

Publication number Publication date
JPH09201763A (ja) 1997-08-05
EP0786310A1 (de) 1997-07-30
DE69717510D1 (de) 2003-01-16
US5803799A (en) 1998-09-08
EP0786310B1 (de) 2002-12-04
ATE228915T1 (de) 2002-12-15

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee