SG82058A1 - Carrier head with controllable pressure and loading area for chemical mechanical polishing - Google Patents

Carrier head with controllable pressure and loading area for chemical mechanical polishing

Info

Publication number
SG82058A1
SG82058A1 SG9906629A SG1999006629A SG82058A1 SG 82058 A1 SG82058 A1 SG 82058A1 SG 9906629 A SG9906629 A SG 9906629A SG 1999006629 A SG1999006629 A SG 1999006629A SG 82058 A1 SG82058 A1 SG 82058A1
Authority
SG
Singapore
Prior art keywords
mechanical polishing
chemical mechanical
loading area
carrier head
controllable pressure
Prior art date
Application number
SG9906629A
Inventor
M Zuniga Steven
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG82058A1 publication Critical patent/SG82058A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG9906629A 1998-12-30 1999-12-24 Carrier head with controllable pressure and loading area for chemical mechanical polishing SG82058A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11418298P 1998-12-30 1998-12-30

Publications (1)

Publication Number Publication Date
SG82058A1 true SG82058A1 (en) 2001-07-24

Family

ID=22353793

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9906629A SG82058A1 (en) 1998-12-30 1999-12-24 Carrier head with controllable pressure and loading area for chemical mechanical polishing

Country Status (4)

Country Link
JP (1) JP4519972B2 (en)
KR (1) KR100636455B1 (en)
SG (1) SG82058A1 (en)
TW (1) TW434111B (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6776692B1 (en) * 1999-07-09 2004-08-17 Applied Materials Inc. Closed-loop control of wafer polishing in a chemical mechanical polishing system
KR100423909B1 (en) * 2000-11-23 2004-03-24 삼성전자주식회사 Polishing head of a chemical mechanical polishing machine and polishing method using the polishing head
KR100492330B1 (en) * 2002-10-30 2005-05-27 두산디앤디 주식회사 Carrier Head for Chemical Mechanical Polishing Apparatus
JP3889744B2 (en) 2003-12-05 2007-03-07 株式会社東芝 Polishing head and polishing apparatus
US7530153B2 (en) 2005-09-21 2009-05-12 Applied Materials, Inc. Attaching components of a carrier head
KR100840013B1 (en) * 2006-12-28 2008-06-20 주식회사 실트론 Polishing head for uniform pressure
JP5236705B2 (en) * 2010-09-08 2013-07-17 株式会社荏原製作所 Polishing equipment
US9610672B2 (en) * 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
KR102091418B1 (en) * 2018-06-01 2020-04-23 주식회사 케이씨텍 Carrier head of chemical mechanical apparatus and membrane used therein
KR102138700B1 (en) * 2019-11-11 2020-07-29 (주)제이씨글로벌 Polishing head of chemical mechanical polishing apparatus
JP2023517454A (en) * 2020-06-24 2023-04-26 アプライド マテリアルズ インコーポレイテッド Polishing of carrier head by piezoelectric pressure control
KR20230148377A (en) * 2021-03-04 2023-10-24 어플라이드 머티어리얼스, 인코포레이티드 Abrasive carrier head with floating edge control
CN117083150A (en) * 2021-03-17 2023-11-17 超微细技研有限公司 Polishing head and polishing apparatus
US20220410340A1 (en) * 2021-06-25 2022-12-29 Globalwafers Co., Ltd. Polishing head assembly having recess and cap
CN114166952B (en) * 2021-12-08 2023-08-29 北京晶亦精微科技股份有限公司 Adsorption detection device and adsorption detection method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0786310A1 (en) * 1996-01-24 1997-07-30 Ontrak Systems, Inc. Wafer polishing head
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
WO2000021714A1 (en) * 1998-10-09 2000-04-20 Applied Materials, Inc. A carrier head with a flexible membrane for chemical mechanical polishing
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0811360B2 (en) * 1987-01-19 1996-02-07 日本電信電話株式会社 Uniform pressure / adhesion method
JPH01101386A (en) * 1987-10-13 1989-04-19 Mitsubishi Metal Corp Bonding of wafer
JP3233664B2 (en) * 1991-09-13 2001-11-26 土肥 俊郎 Method and apparatus for planarization polishing of wafer with device
JPH08267357A (en) * 1995-03-31 1996-10-15 Nec Corp Abrasive device of substrate and abrasive method thereof
JPH09246218A (en) * 1996-03-07 1997-09-19 Hitachi Ltd Polishing method/device
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6019670A (en) * 1997-03-10 2000-02-01 Applied Materials, Inc. Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system
JPH10277928A (en) * 1997-03-31 1998-10-20 Hitachi Ltd Polishing device
US5957751A (en) * 1997-05-23 1999-09-28 Applied Materials, Inc. Carrier head with a substrate detection mechanism for a chemical mechanical polishing system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0786310A1 (en) * 1996-01-24 1997-07-30 Ontrak Systems, Inc. Wafer polishing head
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
WO2000021714A1 (en) * 1998-10-09 2000-04-20 Applied Materials, Inc. A carrier head with a flexible membrane for chemical mechanical polishing

Also Published As

Publication number Publication date
KR20000048476A (en) 2000-07-25
KR100636455B1 (en) 2006-10-18
JP2000202762A (en) 2000-07-25
TW434111B (en) 2001-05-16
JP4519972B2 (en) 2010-08-04

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