SG82058A1 - Carrier head with controllable pressure and loading area for chemical mechanical polishing - Google Patents
Carrier head with controllable pressure and loading area for chemical mechanical polishingInfo
- Publication number
- SG82058A1 SG82058A1 SG9906629A SG1999006629A SG82058A1 SG 82058 A1 SG82058 A1 SG 82058A1 SG 9906629 A SG9906629 A SG 9906629A SG 1999006629 A SG1999006629 A SG 1999006629A SG 82058 A1 SG82058 A1 SG 82058A1
- Authority
- SG
- Singapore
- Prior art keywords
- mechanical polishing
- chemical mechanical
- loading area
- carrier head
- controllable pressure
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11418298P | 1998-12-30 | 1998-12-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG82058A1 true SG82058A1 (en) | 2001-07-24 |
Family
ID=22353793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG9906629A SG82058A1 (en) | 1998-12-30 | 1999-12-24 | Carrier head with controllable pressure and loading area for chemical mechanical polishing |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4519972B2 (en) |
KR (1) | KR100636455B1 (en) |
SG (1) | SG82058A1 (en) |
TW (1) | TW434111B (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6776692B1 (en) * | 1999-07-09 | 2004-08-17 | Applied Materials Inc. | Closed-loop control of wafer polishing in a chemical mechanical polishing system |
KR100423909B1 (en) * | 2000-11-23 | 2004-03-24 | 삼성전자주식회사 | Polishing head of a chemical mechanical polishing machine and polishing method using the polishing head |
KR100492330B1 (en) * | 2002-10-30 | 2005-05-27 | 두산디앤디 주식회사 | Carrier Head for Chemical Mechanical Polishing Apparatus |
JP3889744B2 (en) | 2003-12-05 | 2007-03-07 | 株式会社東芝 | Polishing head and polishing apparatus |
US7530153B2 (en) | 2005-09-21 | 2009-05-12 | Applied Materials, Inc. | Attaching components of a carrier head |
KR100840013B1 (en) * | 2006-12-28 | 2008-06-20 | 주식회사 실트론 | Polishing head for uniform pressure |
JP5236705B2 (en) * | 2010-09-08 | 2013-07-17 | 株式会社荏原製作所 | Polishing equipment |
US9610672B2 (en) * | 2014-06-27 | 2017-04-04 | Applied Materials, Inc. | Configurable pressure design for multizone chemical mechanical planarization polishing head |
KR102091418B1 (en) * | 2018-06-01 | 2020-04-23 | 주식회사 케이씨텍 | Carrier head of chemical mechanical apparatus and membrane used therein |
JP2022526214A (en) | 2019-02-14 | 2022-05-24 | アクス テクノロジー エルエルシー | Board carrier head and processing system |
KR102138700B1 (en) * | 2019-11-11 | 2020-07-29 | (주)제이씨글로벌 | Polishing head of chemical mechanical polishing apparatus |
CN115087518A (en) * | 2020-06-24 | 2022-09-20 | 应用材料公司 | Polishing carrier head with piezoelectric pressure control |
KR20230148377A (en) * | 2021-03-04 | 2023-10-24 | 어플라이드 머티어리얼스, 인코포레이티드 | Abrasive carrier head with floating edge control |
KR102650422B1 (en) * | 2021-03-17 | 2024-03-22 | 미크로 기켄 가부시키가이샤 | Polishing head and polishing processing device |
US20220410340A1 (en) * | 2021-06-25 | 2022-12-29 | Globalwafers Co., Ltd. | Polishing head assembly having recess and cap |
CN114166952B (en) * | 2021-12-08 | 2023-08-29 | 北京晶亦精微科技股份有限公司 | Adsorption detection device and adsorption detection method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0786310A1 (en) * | 1996-01-24 | 1997-07-30 | Ontrak Systems, Inc. | Wafer polishing head |
US5985094A (en) * | 1998-05-12 | 1999-11-16 | Speedfam-Ipec Corporation | Semiconductor wafer carrier |
WO2000021714A1 (en) * | 1998-10-09 | 2000-04-20 | Applied Materials, Inc. | A carrier head with a flexible membrane for chemical mechanical polishing |
US6106379A (en) * | 1998-05-12 | 2000-08-22 | Speedfam-Ipec Corporation | Semiconductor wafer carrier with automatic ring extension |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0811360B2 (en) * | 1987-01-19 | 1996-02-07 | 日本電信電話株式会社 | Uniform pressure / adhesion method |
JPH01101386A (en) * | 1987-10-13 | 1989-04-19 | Mitsubishi Metal Corp | Bonding of wafer |
JP3233664B2 (en) * | 1991-09-13 | 2001-11-26 | 土肥 俊郎 | Method and apparatus for planarization polishing of wafer with device |
JPH08267357A (en) * | 1995-03-31 | 1996-10-15 | Nec Corp | Abrasive device of substrate and abrasive method thereof |
JPH09246218A (en) * | 1996-03-07 | 1997-09-19 | Hitachi Ltd | Polishing method/device |
US6183354B1 (en) * | 1996-11-08 | 2001-02-06 | Applied Materials, Inc. | Carrier head with a flexible membrane for a chemical mechanical polishing system |
US6019670A (en) * | 1997-03-10 | 2000-02-01 | Applied Materials, Inc. | Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system |
JPH10277928A (en) * | 1997-03-31 | 1998-10-20 | Hitachi Ltd | Polishing device |
US5957751A (en) * | 1997-05-23 | 1999-09-28 | Applied Materials, Inc. | Carrier head with a substrate detection mechanism for a chemical mechanical polishing system |
-
1999
- 1999-12-24 SG SG9906629A patent/SG82058A1/en unknown
- 1999-12-30 KR KR1019990066061A patent/KR100636455B1/en not_active IP Right Cessation
-
2000
- 2000-01-04 JP JP2000000117A patent/JP4519972B2/en not_active Expired - Fee Related
- 2000-02-10 TW TW088123154A patent/TW434111B/en not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0786310A1 (en) * | 1996-01-24 | 1997-07-30 | Ontrak Systems, Inc. | Wafer polishing head |
US5985094A (en) * | 1998-05-12 | 1999-11-16 | Speedfam-Ipec Corporation | Semiconductor wafer carrier |
US6106379A (en) * | 1998-05-12 | 2000-08-22 | Speedfam-Ipec Corporation | Semiconductor wafer carrier with automatic ring extension |
WO2000021714A1 (en) * | 1998-10-09 | 2000-04-20 | Applied Materials, Inc. | A carrier head with a flexible membrane for chemical mechanical polishing |
Also Published As
Publication number | Publication date |
---|---|
JP4519972B2 (en) | 2010-08-04 |
KR20000048476A (en) | 2000-07-25 |
JP2000202762A (en) | 2000-07-25 |
TW434111B (en) | 2001-05-16 |
KR100636455B1 (en) | 2006-10-18 |
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