JPH0811360B2 - Uniform pressure / adhesion method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Purpose of the invention [Industrial field of application] The present invention is intended for various kinds of bonding, particularly for bonding a small chip or a curved sample having a large radius of curvature to a polishing jig with high accuracy. The present invention relates to a uniform pressing / bonding method provided and an apparatus directly used for carrying out the method.

[Conventional technology]

Conventionally, when polishing a small chip or a curved sample having a large radius of curvature, the sample is bonded to a sample bonding jig that is manufactured with high precision, and then the polishing operation is performed. In order to obtain accuracy when polishing a sample with ultra-precision, it is indispensable to bond the sample to the bonding surface of a sample bonding jig that is finished with high accuracy with high accuracy.

In the case of ordinary bonding, the sample bonding jig is heated to reach a predetermined temperature around the melting point of the adhesive to be applied, and then the thermosoftening adhesive (wax) is applied to the bonding surface of the sample bonding jig. Next, the sample is placed on the adhesion surface and cooled and solidified while applying pressure. The problem here is the pressing method, but the conventional pressing method simply adds a dead weight through the flat plate, so the entire area on the non-bonded surface side of the sample Could not be pressed uniformly. As a result, the adhesive layer becomes non-uniform, and even if an attempt is made to form a flat surface in the polishing step, the parallelism of the finished sample deteriorates.

FIG. 3 is a schematic cross-sectional view when a sample is bonded by the conventional bonding method, where α is a sample bonding jig, β is a heat-softening adhesive, γ is a sample, and ε is a load flat plate. Indicates.

Therefore, FIG. 3 (a) shows a case where the thickness of the adhesive β becomes non-uniform when a single sample γ is pressed and bonded to the sample bonding jig α. Has a thickness of several to several tens of μm.

Further, FIG. 3B shows the case where the samples γ ₁ , γ ₂ , and γ ₃ themselves are not parallelized, and the samples γ _{1 to} γ ₃ are bonded, or a plurality of samples γ _{1 to} γ _{3 having} different thicknesses are used. Shows the case where the sample adhesive jig α is adhered to the same adhesive surface α ′.
There is a drawback that there is a very large difference in the thickness of the.

In short, the conventional pressing / bonding method uses a flat plate (rigid plate).
Since the non-adhesive surface of the sample is pressed at, microscopically, it means that only a part of the sample is pressurized. That is, since a concentrated load is applied to a part of the sample, the sample itself will be bonded in an inclined posture, and in the case of simultaneous bonding of a plurality of samples, the thin sample will be completely free. Then, it will be bonded in an inclined posture without being restrained by the load on the plane.

Further, even in the case of a single sample, if the load is not applied properly, the sample is inclined and adhered.

When the next polishing step is performed in such an adhesive mode, no matter how fine polishing may be performed at this stage, as a result, polishing is performed as shown by the virtual L line in the figure. Therefore, the samples γ and γ _{1 to} γ ₃ have a large variation in thickness and have a very poor parallelism, which is a serious problem.

This is because it is not possible to uniformly press the entire area of the non-bonding surface side of the sample in the bonding step.

[Problems to be solved by the invention]

In view of the above-mentioned conventional drawbacks, the present invention provides a uniform pressure bonding method and apparatus which are effective and appropriate for uniformly pressing a sample to be bonded and performing high precision bonding.

(2) Configuration of the Invention [Means for Solving Problems] In the present invention, an adhesive is applied to the bonding surface of a sample or the bonding surface of a sample bonding jig, and the sample is bonded to the bonding surface of the sample bonding jig. Positioning is temporarily attached, and then the pressure is expanded by applying fluid pressure to the sealed inner side.・ When carrying out the bonding method, the opening on the opposite side of the pressure-sealed container, which is installed relative to the sample bonding jig that is attached to the surface plate with the built-in jig heater, can be elastically pressed like a diaphragm. A uniform pressurizing / bonding device, in which a pressure-sealing chamber is internally sealed by a film and a pressure-regulating valve is connected to a pressure-fluid inlet provided in the pressure-sealing container, is used. Even a poorly sampled sample with a different thickness Be a plurality of samples, it is capable of bonding with pressurized with evenly uniformly distributed load I tiles in the non-adhesive side whole area of each sample.

[Example 1] An apparatus used in Example 1 of the method of the present invention will be described with reference to Fig. 1 (a).

The uniform pressurizing / bonding apparatus A includes a platen 4 for heating a sample bonding jig α, which is vacuum-adsorbed and mounted on a mounting surface 2 by a vacuum hole 1, by a jig heating heater 3, and directly above the platen 4. The rim 7a is sandwiched by the sealing tool 6 along the inner edge of the downward opening port 5 facing the sample bonding jig α on the surface plate 4 so that it can be moved up and down and moved close to and closed by the sealing tool 6. A pressure sealing container 10 that expands the sealed pressure elastic film 7 with the pressure fluid P flowing into the pressure sealing chamber 9 from the pressure fluid inlet 8.
As shown in FIG. 1 (a), the pressure-sealing container 10 has the base end portions of the cantilever horizontal parallel arms 11 and 11 (only one of which is shown) for holding the pressure fluid inlet 8 projecting in the center at its free end. Upright guide stand 12 that stands upright in the neighborhood, split tube slider 13
It is mounted so that it can slide up and down, and is tightened and fixed by the adjusting screw 14 with knob.

 In the figure, 15, 16 and 17 are mounting screws and 18 is a spring.

A cylindrical slider 19 at the base end of the cantilever horizontal parallel arms 11 and 11 (only one of which is shown) as shown in FIG. It is also possible to automatically set the pressurizing enclosure 10 to the sample adhesion jig α on the surface plate 4 by the forward and reverse rotations of the pinion 21 that meshes with the rack 20 provided on the guide stud 12 so as to be able to adjust the distance. it can.

The pressure elastic film 7 must be heat resistant, and since a normal thermosoftening wax has a melting point of about 50 ° C. to about 250 ° C., a thickness of silicon rubber, Teflon, etc.
It is preferable to use a film of about 500 μm. Since silicone rubber is rich in elasticity, it may be relatively thick, and for example, a thickness of about 2 mm can be used.

Reference numeral 22 in the figure denotes a pressure adjusting valve that is interposed between the fluid pressure source 23 and the pressure fluid supply pipe 24.

It should be noted that the cantilever horizontal parallel arms 11, 11 are fixed to the upright guide stand 12 in place of the lifting and lowering transmission mechanism of the rack 20 and the pinion 21 shown in FIG. 1 (b), and the upright guide stand 12 itself is powered appropriately. It may be moved up and down through a source (not shown).

In this embodiment, the vertical type device has been explained exclusively, but a horizontal type device or an oblique type device may be used depending on the conditions.

Needless to say, not only the sample-bonding jig but also any sample-bonding object requiring high-precision bonding, such as a plate, can be applied, and other means for positioning and mounting the sample-bonding jig α on the surface 4 mounting surface 2 of the platen. As the above, an electromagnetic attraction means, a clamp means with a stopper, etc. can be arbitrarily selected.

Next, a first embodiment of the method of the present invention using the apparatus A will be described with reference to FIG.

First, the sample bonding jig α to be bonded is positioned and mounted on the mounting surface 2 of the surface plate 4 and vacuum-adsorbed through the vacuum hole 1, and then the jig heater 3 is operated to heat. When the surface of the sample bonding jig α is slightly higher than the melting point of the adhesive β, the sample bonding jig α is held at a constant temperature, and the bonding surface α ′ of the sample bonding jig α or the bonding surfaces γ ₁ of the samples γ _{1 to} γ ₃ The heat-softening adhesive β is applied to ′ to γ ₃ ′, the samples γ _{1 to} γ ₃ are lightly placed at the predetermined positions on the bonding surface α ′ of the sample bonding jig α, and the temporary mounting step is performed.

Then, as shown in Fig. 1 (a), loosen the adjustment screw with knob 14 and slide the split tube slider 13 into the upright guide stand.
Cantilever horizontally parallel by sliding along 12 or by driving a drive source (not shown) to rotate the pinion 20 counterclockwise as shown in FIG. 1 (b) and move it along the rack 19. arm
By moving 11 and 11 downward, the pressure-sealed container 10 is integrally lowered, and the pressure elastic film 7 is brought into contact with the non-adhesive surfaces γ ₁ ″ to γ ₃ ″ of the samples γ ₁ to γ ₃ .

At this time, since the pressure elastic film 7 is tensioned like a drum skin is stretched on the downward opening port 5 of the pressure-sealing container 10, the cantilevered horizontal parallel arms 11, 11 can be easily lowered. I understand.

Therefore, when the pressure elastic film 7 approaches or contacts the non-adhesive surfaces γ ₁ ″ to γ ₃ ″ of the samples γ _{1 to} γ ₃ , the first
In FIG. 1 (a), the adjusting screw with knob 14 is tightened and fixed, and in FIG. 1 (b), the driving of the drive source not shown is stopped to stop the pressure-sealed container 10 from descending and fixed. In this state, the pressure fluid supply pipe 24 is
When the pressure fluid P such as air or N ₂ gas is fed through the pressure fluid inlet port 8 through the pressure elastic film 7, the pressure elastic film 7 swells like a balloon, and the non-bonded surface γ ₁ ″ of the samples γ _{1 to} γ ₃
Since even pressure is applied evenly to the entire surface along γ ₃ ″, even distribution of pressure is possible even if the thicknesses of the samples γ _{1 to} γ ₃ vary.

The pressurization can be easily controlled by operating the pressure adjusting valve 22 to control the fluid pressure to be supplied into the pressure sealing chamber 9, and the pressurization can be continued at a constant pressure and a constant temperature for a certain period of time to obtain a predetermined adhesive β.
When the thickness and accuracy are reached, the heating operation of the jig heater 3 is stopped, the surface plate 4 is cooled and the adhesive β is solidified, and the samples γ ₁ to γ ₃ are attached to the bonding surface of the sample bonding jig α. The final attaching step of adhering to α'is completed.

Needless to say, the adhesive β is not limited to the heat-softening adhesive, and may be a room temperature curable adhesive.

By the way, the processing conditions such as the temperature to be set, the holding time thereof, and the pressure are different depending on the adhesive β to be used and the melting point thereof and the type and thickness of the pressure elastic film 7 to be used. 0.2 ~ for the pressure-elastic film 7.
Using silicon rubber of around 0.5 mm, pressure of 1-3 kg / cm ²
The N ₂ gas or air is fed into the pressure-filling chamber 9 and heated while it is filled.

Although the first embodiment of the present invention has been described as the case where N ₂ gas and air are used as the pressure fluid P, any other inert gas such as Ar gas can be applied, and a liquid such as water is also applicable. Samples γ _{1 to} γ ₃ , which are possible but heated with great care,
It is necessary to warm the sample bonding jig α in advance so as not to cool it.

[Embodiment 2] Here, a second embodiment of the method of the present invention will be described with reference to FIG.

In particular, when a curved sample γ having a large radius of curvature is adhered, it may be possible to achieve high precision adhesion by gradually extruding the adhesive Ζβ in the central portion outward.

Therefore, the tacking step is not different from that of the first embodiment of the method of the present invention, and the description thereof will be omitted.

In the final attaching step, the pressure elastic film 7 expanded by the pressure fluid P filling the pressure sealing chamber 9 is once brought into contact with the central portion of the heated sample γ, and after a certain period of time elapses, the pressure elastic film 7 is gradually and gradually removed. The pressure-sealed container 10 is lowered downward integrally with the cantilevered horizontal parallel arms 11, 11 or the pressure elastic film 7 is once brought into contact with the central portion of the sample γ, and after a certain period of time, the cantilevered horizontally. Parallel arms 11, 11 and pressure-sealed container 10
When the pressure adjusting valve 22 is operated while the pressure is statically fixed, the fluid pressure fed from the pressure fluid inlet 8 into the pressure sealing chamber 9 is gradually increased. The contact of γ with the non-adhesive surface γ ″ gradually increases from the center to the outside with time, and eventually the tiles come into close contact with the entire area. As a result, the excess adhesive β near the center is removed. Since the adhesive surface γ ′ of the sample γ is pushed in the direction and is brought into a uniformly pressed / heated state with respect to the adhesive surface α ′ of the sample bonding jig α, a highly accurate main bonding process is realized.

The same components as those in the first embodiment shown in FIG. 1 are designated by the same reference numerals.

The second embodiment is advantageous when a highly accurate adhesive β is used or when the adhesive β has a large coating thickness.

(3) Effects of the Present Invention According to the present invention, therefore, even if the surface of the sample exhibits irregularities or is warped in a complicated shape, the pressure elastic film surely adheres evenly to the entire sample non-adhesive surface side and becomes even. Since pressing is performed under pressure, the sample can be bonded with high accuracy while correcting the bonding posture.

Therefore, even when the parallelism of the samples is poor or when multiple samples with different thicknesses are bonded at the same time, uniform and accurate pressure is applied evenly over the entire non-bonded surface side of the sample to always achieve highly reliable and highly accurate bonding. Excellent effects such as

[Brief description of drawings]

FIG. 1 (a) is a schematic vertical sectional view showing a device used in the first embodiment of the method of the present invention, and FIG. 1 (b) is a central vertical sectional view of an elevation transmission mechanism showing another embodiment. FIG. 2 is an explanatory view of a second embodiment of the method of the present invention, and FIGS. 3 (a) and 3 (b) are explanatory views of a conventional bonding method. A: Uniform pressing / bonding device P: Pressure fluid α: Sample bonding jig α '... Bonding surface β: Adhesive γ, γ _{1 to} γ ₃ ... Sample γ', γ ₁ ′ to γ ₃ '... bonding surface _{γ ", γ 1" ~γ 3} "...... non-adhesive surface 1 ... vacuum hole, 3 ... jig heater 4 ... platen, 5 ... downstream release port 7 ...... Pressurized elastic film 8 …… Pressure fluid inlet 9 …… Pressure filling chamber 10 …… Pressure filling container 11,11 …… Cantilever horizontal parallel arm 12 …… Upright guide stand 14 …… Adjusting screw with knob

Claims (1)

[Claims] 1. A sample bonding jig is mounted on a surface plate having a built-in jig heating heater, the temperature of the surface plate is raised by the jig heating heater, and the surface of the sample bonding jig is the melting point of the adhesive. When the temperature becomes higher than the above, the adhesive is applied to the bonding surface of the sample or the bonding surface of the sample bonding jig while the sample is bonded to the bonding surface of the sample bonding jig, and the sample is positioned and temporarily attached to the bonding surface of the sample bonding jig. Next, with a pressurized elastic film that expanded by variably adjusting the fluid pressure inside the sealed inner side, the entire area of the non-bonding surface side of the sample was gradually expanded outward from the center of the elastic film and pressed outward. Then, the sample is permanently attached by following the bonding surface shape of the sample bonding jig, and when the predetermined adhesive thickness is reached, the heating operation of the jig heater is stopped and the platen is cooled. Uniform pressure and adhesion method characterized by