JPS63180469A - Method and device for uniform pressing/bonding - Google Patents

Abstract

PURPOSE:To give uniform pressurization for achieving bonding with high precision, in the case of bonding together small chips etc., by pressing the whole area of the no-bonding side faces of samples by means of a pressurized elastic film expanded by fluid pressure applied to its tightly sealed inside. CONSTITUTION:Firstly, a sample bonding jig alpha is positioned on a surface plate 4 and subjected to vacuum adsorption, a heater 3 is heated in advance and samples gamma'1-gamma'3 are provisionally set in respective preset positions by means of thermal softening bonding agent beta. Next, a pressure enclosing vessel 10 is lowered along an upright guide stud 12 to make a pressurized elastic film 7 to touch the no-bonding side faces gamma''1-gamma''3 of the samples to fix it by clamping it by means of an adjusting screw 14 provided with a knob. Pressurized fluid P such as air is fed in the pressure enclosing vessel 10, under this condition, via a pressure regulation valve 22 so as to expand the pressurized elastic film 7. Then, uniformly distributed pressurization can be applied regardless of any scatter in the thickness of samples gamma1-gamma3 and then heating action of the heater 3 is stopped to complete bonding. Thus, bonding with high precision can be carried out even though the samples have unevenness on their surfaces and/or any warp in complicated configuration.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Purpose of the invention [Field of industrial application] The present invention is suitable for bonding various types of adhesives, particularly for bonding small chips or curved samples with a large radius of curvature to polishing jigs with high precision. The present invention relates to a uniform pressurization/adhesion method and an apparatus directly used for its implementation.

[Conventional technology]

Conventionally, when polishing a small piece depth or a curved sample with a large radius of curvature, the R111 polishing operation is performed after the sample is bonded to a highly precisely manufactured sample bonding jig. When polishing a sample with ultra-precision, it is essential to bond the sample with high precision to the bonding surface of a jig that touches the sample with high precision in order to maintain accuracy.

When performing upward bonding, heat the sample bonding jig and apply heat-softening adhesive (wax) to the bonding surface of the sample bonding jig after reaching a predetermined temperature around the melting point of the adhesive to be applied. . Next, the sample is placed on the adhesive surface and cooled and solidified while applying pressure. The problem with this 1 is the pressurization method, but the conventional pressurization method simply adds 1 degree of get weight via a flat plate, so the non-adhesive side of the sample It was not possible to apply pressure uniformly over the entire area. As a result, the adhesive layer becomes non-uniform and rII! Even if you try to make it flat in the polishing process, the parallelism of the finished sample will be disappointing.

Figure 3 is a schematic cross-sectional view of the sample bonded using the conventional bonding method, where α is the sample bonding jig, βμ is the thermosetting adhesive, γ is the sample, and ε is the sample bonding jig. Figure 3 (a) shows a single sample γ in the sample bonding jig α.
This figure shows a case where the thickness of adhesive β becomes uneven when pressurizing and bonding.
It is a cocoon of about 10 microns.

In addition, Fig. 3(b) shows a case where samples γ1 to γ3 whose parallelism is not achieved or a plurality of samples γ1 to γ3 with different thicknesses are bonded together using the sample bonding jig α. This shows the case of bonding to the same bonding surface α', which has the disadvantage that there is an extremely large difference in the thickness of the adhesive β.

In short, in the conventional pressurization/bonding method, a flat plate (rigid body) is pressed against the non-bonded surface of the sample, so when viewed microscopically, only a portion of the sample is pressurized. In other words, since a concentrated load is applied to a portion of the sample, the sample itself will be glued in an inclined position.Furthermore, when bonding multiple pieces at the same time, especially thin samples, the sample will be completely free. As a result, it is not restrained by the plane load and is glued in an inclined position.

Furthermore, even if there is only a single sample, if the load is placed incorrectly, the sample will be glued at an angle.

When entering the next Tii polishing process with this type of adhesion,
No matter how precise polishing can be performed at this stage, the polishing will end up as shown in virtual L11 in the figure, so there will be large variations in the thickness of samples γ, γ1 to γ3. This results in a processed sample with extremely poor parallelism, leading to human problems.

This is due to the fact that it is not possible to uniformly apply pressure to the entire non-adhesive side of the sample during the adhesion process.

[Problem that the invention seeks to solve]

SUMMARY OF THE INVENTION In view of the above-mentioned conventional drawbacks, the present invention provides a uniform pressure bonding method and apparatus that are effective and suitable for uniformly pressurizing samples to be bonded and bonding them with high precision.

(2) Structure of the Invention (Means for Solving the Problems) The present invention applies an adhesive to the adhesive surface of the specimen adhesion jig, which is likely the adhesive surface of the sample, and ni+'
＋r＋ Specimen ゛ is positioned and temporarily attached, and then
In carrying out the uniform pressurization/adhesion method, the sample is attached to the sample by applying fluid pressure to the inside of the sample to make it follow the shape of the adhesion surface of the sample adhesion jig. , Il! is a sample bonding jig that is attached to a surface plate with a built-in jig heater. The release ports on the opposite surfaces of the pressure containment bodies, which are arranged opposite each other so as to be freely adjustable, are hermetically sealed with a pressurized elastic film in the form of a diaphragm, thereby creating a pressure containment chamber therein and opening it in the pressure 1'1 body. This equipment uses a uniform pressurizing/adhesive device with a pressure regulating valve connected to the pressure fluid supply port, and can handle samples with poor parallelism or multiple samples with different thicknesses. It is possible to bond while applying pressure uniformly and evenly distributed over the entire area of the non-adhesive side.

〔Example〕

An embodiment of the device of the present invention will be described with reference to FIG. 1(a).

The uniform pressure/bonding device A of the present invention includes a surface plate 4 for heating a sample bonding jig α, which is vacuum-adsorbed and attached to a mounting surface 2 through a vacuum hole 1, by a jig heating heater 3; A diaphragm-like peripheral edge 7a is sandwiched between the sealing tools 6 along the inner edge of the downward release port 5 which is mounted directly above the panel 4 so as to be movable up and down, and faces the sample adhesion jig α on the fixed 14. Attached is a pressure enclosing container 10 that expands a hermetically sealed pressurized elastic film 7 with a pressure fluid P flowing into a pressure enclosing chamber 9 from a pressure fluid inlet 8.
and the pressure-enclosed container 10 as shown in FIG. 1(a).
The base end of a cantilevered horizontal parallel arm 11゜11 (only one side is shown), which clamps a palindromic pressurized fluid inlet 8 in the center at its free end, is attached to an applied guide stud 12 built nearby by a single-split cylinder slider. 13 so that it can slide up and down at different times]
Tightening is fixed using an adjustment screw 14 with a stop knob.

In the figure, 15, 16, and 17 are mounting screws, and 18 is a spring.

As shown in Fig. 1(b), the cantilevered horizontal parallel arm 11°11(
(Only one side shown) Attach the cylindrical slider 19 at the end of the glue to the applied guide stud 12 that stands nearby so that it can slide up and down.
When the saw mark is applied, the pressure 11 and the human body 10 are automatically applied to the sample adhesion jig α on the surface plate 4 by forward and reverse rotation of the pinion 21 which is externally engaged with the rank 20 provided on the applied guide stud 12. It can also be provided to freely adjust distance and distance.

The pressurized elastic film 7 must be heat resistant,
Since ordinary heat-softening wax has a melting point of about 50 DEG C. to about 250 DEG C., it is preferable to use a film made of silicone rubber, Aphron, etc. with a thickness of about 50 to 500 .mu.m. In the case of silicone rubber, it is highly elastic, so it can be relatively thick; for example, it can be used even if it is as thick as two shoes.

In the figure, reference numeral 22 denotes a pressure regulating valve interposed between the fluid pressure source 23 and the pressure fluid supply pipe 24.

Incidentally, instead of the transmission mechanism of the rank 20 and the pinion 21 shown in FIG. The upper and lower stomach may be activated via an appropriate power source (not shown).

Further, in this embodiment, the vertical type V4 straight machine has been exclusively described, but depending on the conditions, a horizontal type machine or a peeling machine may be used in the b-direction.

Furthermore, it goes without saying that it is applicable not only to the sample bonding jig but also to any sample bonding object that requires 15-accuracy bonding, such as a plate, and other means for positioning and mounting on the surface plate 4 of the sample bonding jig α. The method can be arbitrarily selected from electromagnetic adsorption means, clamping means using a stopper, etc.

[Operation Example 1] Next, a first operation example of the method of the present invention using the apparatus A of the present invention will be explained with reference to FIG.

First, the sample bonding jig α to be bonded is positioned on the mounting surface 2 of the surface plate 4 and vacuum suctioned via the vacuum hole 1, and then the jig heater 3 is operated to heat it. When the surface of sample adhesion jig α is slightly higher than the melting point of adhesive β, it is kept at a constant temperature, and the adhesive surface α of sample adhesion jig α is
'or apply heat-softening adhesive β to the bonding surfaces γ' to γ3' of the samples γ to γ, and lightly place the samples γ to γ3 at the predetermined positions on the bonding surfaces α' of the sample bonding jig α. Perform the tacking process using U.

Subsequently, as shown in FIG. 1(a), loosen the knob (J adjustment screw 14) and slide the split tube slider 13 along the applied guide stud 12, or drive a drive source (not shown) to move the slider 13 along the applied guide stud 12. As shown in (b), by rotating the binion 20 in the counterclockwise direction of the arrow and moving it along the rack 19, and moving the cantilevered horizontal parallel arm 11°11 downward, the pressure enclosure body 10 is integrally moved. The pressurized elastic film 7 is brought into contact with the non-adhesive surfaces γ1'' to γ3'' of the samples γ1 to γ3.

At this time, since the pressurized elastic film 7 is under tension like the skin of a drum on the downward release port 5 of the pressure-enclosed container 10, the lowering position of the cantilevered horizontal parallel arms 11 and 11 can be easily adjusted. I understand.

Therefore, when the pressurized elastic film 7 approaches or contacts the non-adhesive surfaces γ `` to γ '' of the samples γ 1 to γ 3, the knob-equipped adjustment screw 14 is tightened and fixed in FIG. figure(
In b), the driving of the drive source (not shown) is stopped, and the lowering of the pressure-enclosed container 10 is stopped and fixed. In this state, air or N2 is supplied from the fluid pressure source 23 through the pressure fluid supply pipe 24 via the pressure regulating valve 22 and from the pressure fluid supply port 8.
When a pressure fluid P such as gas is supplied, the pressurized elastic film 7
is inflated like a balloon, and the non-adhesive surface γ of samples γ to γ3
Since pressure is applied uniformly to the entire surface along .about..gamma.3", uniformly distributed pressure can be applied even if there are variations in the thickness of the samples .gamma.1 to .gamma.3.

The pressure can be adjusted simply by controlling the pressure of the fluid supplied into the pressure sealing chamber 9 by operating the pressure regulating valve 22, maintaining the pressure at a constant pressure and temperature for a certain period of time, and applying pressure to a predetermined adhesive. When the thickness and accuracy of β are reached, the heating operation of the jig heater 3 is stopped, the surface plate 4 is cooled, the adhesive β is solidified, and the samples γ1 to γ3 are attached to the bonding surface α of the sample bonding jig α. The process is completed by attaching water to the plate.

It goes without saying that the adhesive β is not limited to a heat-softening adhesive, but may also be an adhesive that hardens at room temperature.

By the way, the processing conditions such as the temperature to be set, the opening during holding, and the pressing force depend on the adhesive β used, its melting point, and the J used.
It varies depending on the type, thickness, etc. of the pressurized elastic film 7, and as a rough guide, the pressure elastic film 7 should be
Using silicone rubber after 0.5s+rpl, pressure 1~
3 kg/ai of N2 gas or air is supplied into the pressure chamber 9 and heated.

In addition, in the operation example of the present invention, the pressure fluid P is exclusively N2 gas,
Although we have explained the case of using air, other inert gases such as Ar gas can also be applied, and liquids such as water can also be used, but we have used heated samples γ to γ3, sample adhesion jig α It is necessary to warm it up beforehand so that it does not cool down.

(Operation Example 2) A second operation example of the method of the present invention will now be explained with reference to FIG.

In particular, when bonding a curved sample γ having a different radius of curvature, it may be possible to bond with higher precision by gradually pushing out the adhesive β in the center outward.

Therefore, since the tacking process is no different from the first operational example of the method of the present invention, the explanation will be omitted.

In the process of adding water, the pressurized elastic film 7 expanded by the pressure fluid P filled in the pressure enclosure chamber 9 is brought into contact with the center of the heated sample γ, and after a certain period of time has elapsed, gradually Either the pressure enclosure body 10 is lowered downward integrally with the cantilevered horizontal parallel arm 11.11, or the sample γ
After a certain period of time has elapsed after the pressurized elastic film 7 is once brought into contact with the central part of By gradually increasing the fluid pressure fed into the pressure containment chamber 9 from the inlet 8, as the pressurized elastic film 7 expands and expands, the contact on the non-adhesive surface γ of the sample γ gradually changes outward from the center. It gradually increases to
is pushed outward, and the bonding surface γ' of the sample γ is uniformly pressed and heated against the bonding surface α' of the sample bonding jig α, so that accurate watering can be achieved.

In the figures, constituent members not shown in FIG. 1 that are the same as those in the first embodiment are given the same reference numerals.

The second operation example is advantageous when using adhesive β with n precision or when the coating thickness of adhesive β is large.

(3) Effects of the present invention Thus, according to the present invention, even if the surface of the sample is uneven or curved in a complicated shape, the pressurized elastic film reliably adheres to the entire non-adhesive side of the sample and evenly coats the surface of the sample. Since the sample is pressed under pressure, it is possible to bond the sample with high precision while correcting the bonding posture.

Therefore, when the parallelism of the samples is poor or multiple samples with different thicknesses are to be bonded at the same time, uniform pressure is applied accurately over the entire non-bonded surface of the sample, resulting in always reliable and high-precision bonding. It has excellent effects such as achieving the following.

[Brief explanation of the drawing]

FIG. 1(a) is a central longitudinal sectional schematic diagram showing an embodiment of the device of the present invention, FIG. 1(b) is a central til-1-gi side view of a lift transmission mechanism showing another embodiment, and FIG. The second operation example explanatory diagram, FIGS. 3(a) and 3(b), are explanatory diagrams of the conventional connection method. A... Uniform pressure/bonding device P... Pressure fluid α... Sample adhesion jig α'... Adhesive surface α''... Non-adhesive surface β... Adhesive γ, γ ~ γ3 ...Sample γ', γ' to γ'...Adhesive surface γ", γ" to γ3'...Non-adhesive surface 1...Vacuum hole 3...Jig heater 4...
・Surface plate 5...Downward release lower...Pressure elastic film 8...Pressure fluid inlet 9...Pressure enclosure chamber 10...Pressure enclosure ii, ii...Cantilever horizontal parallel Arm 12... Apply 1 guide stud 14... Knob 1 adjustment screw

Claims (1)

[Claims] 1. Apply an adhesive to the adhesive surface of the sample or the adhesive surface of the sample adhesion jig, position and temporarily attach the sample to the adhesive surface of the sample adhesion jig, and then apply fluid to the sealed inside. By pressing the entire non-adhesive side of the sample with a pressurized elastic film expanded by applying pressure, the sample is made to follow the shape of the adhesion surface of the sample adhesion jig and attached. Adhesion method 2: A patent in which, during actual attachment, the pressure applied by the elastic film is gradually expanded outward from the vicinity of the center of the sample, and is finally applied to the entire non-adhesive side of the sample. Uniform pressurization/bonding method 3 according to claim 1, an opening on the opposite surface side of a pressure-containing container, which is disposed opposite to a sample bonding jig that is attached to a surface plate having a built-in jig heater, so that the distance can be adjusted freely. A uniform pressurizing/adhesive device 4, which has a diaphragm-like pressurized elastic film hermetically sealed to provide a pressure chamber therein, and a pressure regulating valve connected to a pressure fluid supply port opened in the pressure chamber; The uniform pressure/bonding device according to claim 3, wherein the pressure enclosure is configured such that an arm supporting the pressure enclosure is attached to a guide stud so that the distance and distance can be adjusted freely by an adjustment screw.