TWI813866B - Peeling film crimping device - Google Patents

Abstract

[Issue] Simply switch the pressing force of the pressure-bonding member on the release film. [Solution] Since the type of spring acting on the crimping member 81 can be switched by changing the distance between the plate 83 and the crimping member 81, that is, changing the moving distance of the plate 83, the crimping member can be switched. 81 Pushing force on the peeling film T3. Therefore, compared with a device that replaces a spring in order to switch the pressing force, for example, the pressing force of the pressure-contacting member 81 against the release adhesive film T3 can be easily changed according to the type of the protective adhesive film T2. In addition, since there is no need for an expensive sensor to detect the pushing force or a complicated control device for controlling the pushing force, the cost for switching the pushing force can be suppressed.

Description

Peeling film crimping device

The invention relates to a peeling adhesive film crimping device.

When grinding the wafer, a protective film is affixed to the non-grinding surface, and the protective film is held by the chuck table, and the wafer is ground using a grinding stone so that the wafer becomes a predetermined thickness. Afterwards, peel off the protective film.

At this time, the dicing adhesive film is first adhered to the grinding surface of the wafer and the annular frame arranged to surround the wafer, and integrated. Thereafter, as disclosed in Patent Document 1, one end of the tape-shaped release tape is crimped to the protective tape, and the other end of the tape-shaped release tape is stretched to peel off the protective tape from the wafer. . [Known technical documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2017-220506

[Problem to be solved by the invention] As a peelable adhesive film, heat sealing materials are often used which melt the adhesive when heated. Then, by pushing the heated crimping member against the release adhesive film on the protective adhesive film, the release adhesive film is press-bonded to the protective adhesive film. Protective films include protective films for bump wafers with bumps on the surface and protective films for component wafers.

The protective adhesive film for bump wafers has a thick adhesive layer to protect the bumps, so it is difficult to press and peel off the adhesive film. Therefore, the pressing force of the crimping member on the peeling adhesive film needs to be increased. On the other hand, the protective adhesive film used for component wafers has a thin adhesive layer, and the wafer is also very thin. Therefore, in order not to crush the wafer, the pressing force of the pressure-bonding member on the release film needs to be weakened.

In this way, the pressing force of the pressing member against the peeling adhesive film is changed according to the type of protective adhesive film. However, in the past, in order to change the pushing force, expensive sensors for measuring the pushing force and control means for adjusting the pushing force were used. Therefore, there is a problem that the apparatus for crimping the release adhesive film to the protective adhesive film becomes expensive.

An object of the present invention is to simply switch the pressing force of the pressure-bonding member against the release adhesive film.

[Technical means to solve the problem] The peeling adhesive film crimping device of the present invention (the peeling adhesive film crimping device) crimps the peeling adhesive film to the protective adhesive film, and the protective adhesive film is adhered to one side of the wafer held by the holding table; The peeling adhesive film crimping device is provided with: a crimping member to push the peeling adhesive film prepared above the protective adhesive film against the protective adhesive film; and a moving means to move the crimping member close to and away from the peeling adhesive film. Move in the direction; the switching mechanism connects the crimping member and the moving means, and is used to switch the pushing force between the strong pushing force and the weak pushing force. The pushing force pushes the peeling film against the crimping member. force to the protective film; and control means; wherein, the switching mechanism is provided with: a plate supported on the moving means; a first spring disposed between the plate and the crimping member. When the plate member contracts when approaching the crimping member, a first reaction force is exerted; and a second spring is disposed between the plate member and the crimping member. If the plate member contracts when approaching the crimping member , then a second reaction force stronger than the first reaction force is exerted; the control means includes: a first control part that controls the moving means so as to set the distance between the plate member and the crimping member as the first range , causing the first reaction force of the first spring to act on the crimping member, so that the peeling adhesive film is pressed with a weak pushing force by the crimping member and is crimped to the protective adhesive film; and the second The control unit controls the moving means to position the distance between the plate member and the crimping member in a second range corresponding to a distance shorter than the first range, and causes the second reaction force of the second spring to act At the crimping member, the peeling adhesive film is pressed by the crimping member with a strong pressing force and is crimped to the protective adhesive film.

[Invention effect] In this peeling adhesive film crimping device, changing the distance between the plate and the crimping member, that is, only changing the moving distance of the plate, can switch the pressing force of the crimping member on the peeling adhesive film. Therefore, in this release adhesive film pressure-bonding device, the pressing force of the pressure-bonding member against the release adhesive film can be easily changed according to the type of protective adhesive film. In addition, since there is no need for an expensive sensor to detect the pushing force or a complicated control device for controlling the pushing force, the cost for switching the pushing force can be suppressed.

[First Embodiment] The peeling device according to the first embodiment peels the protective film T2 from the wafer W shown in FIG. 1 . The wafer W is, for example, a semiconductor wafer having a circular appearance. Multiple components are formed on the surface Wa on one side of the wafer W, and a circular protective adhesive film T2 is pasted on them.

The protective adhesive film T2 is, for example, a circular film having the same outer diameter as the wafer W. The protective film T2 includes: a protective film base material T2a, which becomes the exposed surface; and a protective film adhesive layer T2b, which has an adhesive layer with adhesive properties.

In addition, as shown in FIG. 1 , the wafer W, the annular frame F and the cutting film T1 together form a workpiece group. In the formation of the workpiece group, first, the outer peripheral part of the circular cutting tape T1 is adhered to the annular ring-shaped frame F having the opening Fa so as to seal the opening Fa.

Then, in such a manner that the center of the wafer W is located at the center of the opening Fa of the annular frame F, the adhesive surface of the dicing adhesive film T1 of the opening Fa is pushed to the surface Wb on the other side of the wafer W. Thereby, the dicing adhesive film T1 is adhered to the surface Wb on the other side of the wafer W. The wafer W is supported by the annular frame F through the dicing adhesive film T1 through the dicing adhesive film T1 adhered to the opening Fa of the annular frame F.

Such wafer W is held by the holding means 3 of the peeling device 1 shown in FIG. 2 . The holding means 3 includes a holding stage 30 that holds the other surface Wb side of the wafer W, and an annular frame holding portion 31 that holds the annular frame F.

The holding table 30 provided in the peeling device 1 has, for example, a circular appearance, and includes an adsorption part 300 for adsorbing the wafer W and a frame 301 for supporting the adsorption part 300 . The adsorption part 300 has a holding surface 300a. The holding surface 300a is the exposed surface of the adsorption part 300, and is flush with the upper surface of the frame 301. The holding surface 300a is connected to a suction source (not shown), and holds the wafer W by suction. The holding platform 30 is supported by the moving means 11 through the connecting member 302 connected to the bottom surface of the holding platform 30 .

The moving means 11 includes a movable plate 110 and a guide rail 111 that support the connecting member 302 . The movable plate 110 moves back and forth in the X-axis direction while sliding on the guide rail 111, thereby allowing the holding means 3 including the holding table 30 to move back and forth in the X-axis direction as a whole.

For example, four annular frame holding portions 31 (only two are shown in FIG. 2 ) are evenly arranged around the holding base 30 . The annular frame holding part 31 is provided with a clamping jig 310 and a lifting means 311 for raising and lowering the clamping jig 310 in the Z-axis direction. The clamping jig 310 has a pair of clamping members 310a and 310b that can approach and move away from each other, and the annular frame F can be clamped by these clamping members.

The lifting means 311 is a cylinder, for example, and includes a cylinder tube 311a and a piston rod 311b. The cylinder tube 311a has a piston (not shown) inside, and has a bottomed cylindrical shape with a bottom on the base end side (-Z direction side). The piston rod 311b is inserted into the cylinder tube 311a, and one end thereof is mounted on the piston. The other end of the piston rod 311b is fixed to the clamping fixture 310. In addition, the base end side of the cylinder tube 311a is fixed to the upper surface of the movable plate 110. By supplying or exhausting gas to the cylinder tube 311a, the pressure inside the cylinder tube 311a is changed. Thereby, the piston rod 311b moves in the Z-axis direction, and the clamping jig 310 moves in the Z-axis direction accordingly.

When the wafer W is fixed to the holding means 3 of the peeling device 1 , the wafer W is placed on the holding surface 300 a so that the center of the wafer W is located approximately at the center of the holding surface 300 a of the holding table 30 . Thereby, the surface Wb on the other side of the wafer W comes into contact with the holding surface 300a of the holding table 30 through the dicing tape T1. Furthermore, the annular frame F is in contact with the clamping member 310b of the clamping jig 310 in the open state.

Next, by transmitting the suction force of the suction source (not shown) to the holding surface 300a, the holding table 30 suction-holds the other surface Wb side of the wafer W on the holding surface 300a through the dicing tape T1. In addition, the clamping member 310a of the clamping jig 310 rotates in the direction of arrow R1 and clamps the annular frame F together with the clamping member 310b. Furthermore, the lifting means 311 lowers the clamping jig 310 that clamps the annular frame F in the −Z direction. Thereby, as shown in FIG. 3 , the annular frame F is held by the annular frame holding part 31 .

In addition, as shown in FIG. 3 , the peeling device 1 has: a peeling adhesive film adhering means 4, which is arranged on the upper part of the holding means 3 and press-bonds the strip-shaped peeling adhesive film T3 to the protective adhesive film T2 of the wafer W; and , holding means 2, holding the peeling film T3.

The holding means 2 includes a pair of clamping plates 20 that can approach and move away from each other along the Z-axis direction. The holding means 2 can move in parallel on the horizontal plane, and can move up and down along the Z-axis direction. In the step of pasting the release adhesive film T3 to the protective adhesive film T2 of the wafer W, the holding means 2 is positioned above the annular frame holding portion 31 on the +X direction side.

The release adhesive film sticking means 4 includes: a release adhesive film supply means 40 that supplies the release adhesive film T3; a cutting portion 41 that cuts the release adhesive film T3; and a release adhesive film crimping portion 42. The release tape T3 includes a release tape base material T3a composed of a base material and a release tape adhesive layer T3b. The peelable adhesive film adhesive layer T3b has stronger adhesive force than the protective adhesive film adhesive layer T2b of the protective adhesive film T2. In addition, in the first embodiment, the release tape T3 has softer properties than the protective tape T2.

The release film supply means 40 includes a release film roll (not shown), a support roller 400, and a pair of drive rollers 401 arranged side by side in the Z-axis direction. The support roller 400 and the pair of drive rollers 401 have, for example, a cylindrical appearance extending in the Y-axis direction. In the release adhesive film supply means 40 , the release adhesive film T3 is placed on the support roller 400 and is clamped by a pair of drive rollers 401 . Then, the front end T3d of the release adhesive film T3 is clamped by the pair of clamping plates 20 of the clamping means 2 and pulled out.

The peeling adhesive film crimping part 42 has a movable pressing part 61 that can move in the Z-axis direction, a moving means 63 that moves the movable pressing part 61, and a heater 62 that generates heat by flowing an electric current.

The movable pressing part 61 can be moved up and down in the Z-axis direction by the moving means 63, and its lower end can press the release adhesive film T3 to the protective adhesive film T2. The heater 62 is installed on the side of the movable pressing part 61 . Therefore, in the first embodiment, the contact portion of the release tape T3 and the protective tape T2 can be heated while being pressed by the movable pressing portion 61 .

The cutting part 41 is provided with a cutter 411 having a sharp blade. The cutter 411 has a sharp blade as its lower end, extends linearly in the Y-axis direction, and is movable in the Z-axis direction. The cutting part 41 further has a cutter moving part 412. The cutter moving part 412 moves the cutter 411 along the Z-axis direction.

As shown in FIG. 4 , when the release adhesive film T3 is adhered, first, the release adhesive film T3 of a predetermined length is supplied from the release adhesive film supply means 40 . Then, the front end T3d of the release adhesive film T3 is held by the holding means 2. Next, the release adhesive film crimping portion 42 descends to push the release adhesive film T3 downward, so that the release adhesive film adhesive layer T3b of the release adhesive film T3 contacts the protective adhesive film base material T2a of the protective adhesive film T2 and continues to be pushed. Furthermore, the heater 62 is energized to generate heat. Thereby, the contact portion of the release adhesive film T3 and the protective adhesive film T2 is heated and pressed by the release adhesive film pressing portion 42 . As a result, the adhesive of the release tape adhesive layer T3b of the release tape T3 melts, and the release tape adhesive layer T3b is well pressure-bonded to the protective tape base material T2a of the protective tape T2.

Next, as shown in FIG. 5 , the cutter 411 of the cutting unit 41 is lowered, the blade of the cutter 411 cuts into the release adhesive film T3, and the release adhesive film T3 is cut into a strip shape. Thereby, as shown in FIG. 6 , one end T3 c of the strip-shaped release adhesive film T3 is adhered to the outer peripheral edge T2 d of the protective adhesive film T2 of the wafer W. After the cutter 411 cuts the release adhesive film T3, the release adhesive film supply means 40, the cutting part 41 and the release adhesive film crimping part 42 are raised in the +Z direction and withdrawn from the release adhesive film T3. Thereafter, the holding means 2 continues to hold the peeling adhesive film T3, and the movable plate 111 of the peeling device 1 moves in the +X direction along the guide rail. Thereby, the protective adhesive film T2 to which the release adhesive film T3 is pressed is peeled off from the wafer W.

Here, the release adhesive film crimping device including the release adhesive film crimping portion 42 in the release adhesive film sticking means 4 will be described in more detail. A release adhesive film crimping device 50 including a release adhesive film crimping portion 42 is shown in FIG. 7 . The release adhesive film pressing device 50 presses the release adhesive film T3 to the protective adhesive film T2 adhered to the wafer W held by the holding table 30 . As shown in FIG. 7 , the peeling film crimping device 50 includes, in addition to the peeling film crimping portion 42 , a control means 51 provided in a frame (not shown) of the peeling device 1 .

As mentioned above, the release adhesive film crimping part 42 includes the movable pressing part 61 which can move along the Z-axis direction, and the moving means 63 which moves the movable pressing part 61. The heater 62 of the peeling film crimping portion 42 is omitted in FIG. 7 and the like.

The moving means 63 moves the movable pressing part 61 to move the pressing member 81 provided at the lower end of the movable pressing part 61 in a direction approaching and away from the release adhesive film T3. As shown in FIG. 7 , the moving means 63 includes a support plate 71 , a fixed shaft 73 supported on the support plate 71 , a connector 75 slidable on the surface of the fixed shaft 73 , a cylinder 77 , a ball screw 78 and a motor 79 .

The ball screw 78 is supported by the support plate 71 and rotated by the motor 79 . The connector 75 has a screw hole screwed into the ball screw 78 and an insertion hole penetrated by the fixed shaft 73 . By rotating the ball screw 78 , the connector 75 slides on the surface of the fixed shaft 73 along the Z-axis direction.

The cylinder 77 is fixed to the connector 75, and a movable pressing part 61 is attached to the lower end thereof. The cylinder 77 follows the rotation of the ball screw 78 and slides on the surface of the fixed shaft 73 along the Z-axis direction together with the connector 75 . Thereby, the movable pressing part 61 installed at the lower end of the cylinder 77 moves in the Z-axis direction.

The movable pressing part 61 has a pressure contact member 81 and a switching mechanism 82 . The pressing member 81 is a member for pushing the release adhesive film T3 prepared above the protective adhesive film T2 against the protective adhesive film T2. The pressure contact member 81 has a plate shape, for example, and is provided at the lower end of the movable pressing part 61 . Furthermore, the crimping member 81 has a protrusion 81a on its lower surface. When the crimping member 81 pushes the release adhesive film T3 against the protective adhesive film T2, the protrusion 81a of the crimping member 81 comes into contact with the release adhesive film T3. In addition, a heater for heating the protrusion 81a may be provided inside the crimping member 81 or the protrusion 81a.

The switching mechanism 82 is connected to the pressure contact member 81 and the cylinder 77 of the moving means. The switching mechanism 82 is provided to switch the pressing force, which is the force of the pressing member 81 to push the release adhesive film T3 against the protective adhesive film T2, between a strong pressing force and a weak pressing force.

The switching mechanism 82 has a plate 83 supported by the cylinder 77 of the moving means 63; an intermediate base 85 disposed below the plate 83; and four guide rods 87 (only two guide rods are shown in FIG. 7 etc. 87).

The plate member 83 and the intermediate base 85 have, for example, the same plate shape as the crimping member 81 . The lower ends of the guide rods 87 are fixed at equal intervals near the outer periphery of the crimping member 81 and extend in the +Z direction from the crimping member 81 .

In addition, the upper end of the guide rod 87 is supported by the plate 83 so as to be slidable with respect to the through hole (not shown) of the plate 83 while penetrating the through hole of the plate 83 . The intermediate base 85 is arranged between the crimping member 81 and the plate member 83 . The middle base 85 is provided with a through hole (not shown) identical to that of the plate member 83 . The guide rod 87 slides through this through hole.

In addition, the switching mechanism 82 is provided with four first springs 84 and four second springs 86 (only two springs are shown in FIG. 7 ). These first spring 84 and second spring 86 are arranged at predetermined positions between the pressure contact member 81 and the plate 83 .

That is, the lower end of the first spring 84 is fixed to the upper surface of the pressure contact member 81 , and the upper end is fixed to the lower surface of the intermediate base 85 . In addition, the lower end of the second spring 86 is fixed to the upper surface of the intermediate base 85 , and the upper end is fixed to the lower surface of the plate 83 .

Therefore, when the movable pressing part 61 including the crimping member 81 and the switching mechanism 82 is in a state where the peeling adhesive film T3 is not in contact with the crimping member 81 (no load state) as shown in FIG. 7 , the intermediate base 85 is disposed. In a state supported by the first spring 84 and the second spring 86 on both sides, the guide rod 87 is located approximately in the middle of the guide rod 87 . Furthermore, the pressure contact member 81 is supported by the first spring 84 .

In addition, the switching mechanism 82 is provided with, for example, four stoppers 88 on the lower surface of the intermediate base 85 . The stopper 88 extends in the -Z direction from the lower surface of the intermediate base 85 . The length of the stopper 88 is set so that a predetermined distance is provided between the lower end of the stopper 88 and the upper surface of the crimping member 81 in the no-load state shown in FIG. 7 .

In addition, if the movable pressing part 61 is moved in the -Z direction by the moving means 63 and the peeling adhesive film T3 is pressed to the protective adhesive film T2 by the pressing member 81, then the pressing member 81 and the intermediate base 85 The first spring 84 disposed therebetween will contract, and the plate 83 will approach the crimping member 81 . That is, the distance between the intermediate base 85 and the crimping member 81 becomes narrower.

When the first spring 84 approaches the crimping member 81 through the plate 83 and the distance between the intermediate base 85 and the crimping member 81 narrows and contracts, a relatively weak first reaction force (elastic force) is exerted.

On the other hand, the second spring 86 has a larger spring constant than the first spring 84 . Therefore, if the second spring 86 approaches the pressure contact member 81 through the plate 83 and the distance between the plate 83 and the intermediate base 85 becomes narrower and contracts, a second reaction force stronger than the first reaction force will be exerted.

The control means 51 moves the movable pressing part 61 in the Z-axis direction using the moving means 63, thereby pressing the release adhesive film T3 to the protective adhesive film T2. In particular, the control means 51 is provided with: a first control part 53 that presses the release adhesive film T3 with a weak pressing force by the pressing member 81 and presses it to the protective adhesive film T2; and a second control part 55 that presses the peeling film T3 with a weak pressing force. The member 81 presses the peeling adhesive film T3 with a strong pushing force and presses it to the protective adhesive film T2.

Next, the press-bonding operation of the release adhesive film T3 to the protective adhesive film T2 by the release adhesive film pressing device 50 will be described in more detail. First, as shown in FIGS. 8 and 9 , examples of the wafer W used in the first embodiment include an element wafer W1 thinned by a grinding device or the like, and a bump having a bump on the surface. Wafer W2.

In the element wafer W1 shown in FIG. 8 , a protective adhesive film T2D for an element wafer is used as the protective adhesive film T2. The protective adhesive film T2D used for component wafers has a relatively thin protective adhesive film layer T2b1. Therefore, the protective adhesive film T2D for the element wafer has a structure in which the peelable adhesive film T3 is relatively easily pressed and bonded. In addition, the element wafer W1 is formed to be thinner than the bump wafer W2. Therefore, it is preferable that the pressing force used to press the release adhesive film T3 to the protective adhesive film T2D by the pressing member 81 is relatively weak, so that the device wafer W1 will not be broken.

In the release adhesive film crimping device 50 , when the release adhesive film T3 is press-bonded to the protective adhesive film T2D of the element wafer W1 , the first control unit 53 of the control unit 51 controls the moving unit 63 to move the movable pressing unit 61 toward - Move in the Z direction, and push the release adhesive film T3 toward the protective adhesive film T2D by the pressing member 81 . At this time, the first control unit 53 positions the distance between the plate 83 and the pressure contact member 81 within the first range. This first range is a range in which the pressing force transmitted from the switching mechanism 82 to the pressure contact member 81 is mainly based on the first reaction force of the first spring 84 . That is, this first range is a range in which the stopper 88 provided on the lower surface of the intermediate base 85 does not come into contact with the upper surface of the crimping member 81 in the first embodiment. Next, this first range is a range in which the distance between the plate member 83 and the intermediate base 85 does not change.

Here, in the switching mechanism 82 , the first spring 84 and the second spring 86 are connected in series through the intermediate base 85 . Therefore, to the extent that the stopper 88 does not contact the upper surface of the crimping member 81 and the crimping member 81 has pushed the release adhesive film T3 to the protective adhesive film T2D, the spring constant has a large 2Spring 86 will not shrink. On the other hand, the first spring 84 with a small spring constant contracts. Therefore, the urging force transmitted from the switching mechanism 82 to the pressure contact member 81 is composed of the relatively small first reaction force of the first spring 84 . Therefore, the peeling adhesive film T3 is pressed to the protective adhesive film T2D by the pressing member 81 with a relatively weak pressing force.

That is, in this case, the first control unit 53 sets the distance between the plate 83 and the crimping member 81 as the first range and causes the first reaction force of the first spring 84 to act on the crimping member 81 . The peeling adhesive film T3 is pressed with a weak pressing force by the pressing member 81 and pressed to the protective adhesive film T2D.

On the other hand, in the bump wafer W2 shown in FIG. 9 , the bump wafer protective adhesive film T2B is used as the protective adhesive film T2. The protective adhesive film T2B used for the bump wafer is to protect the bumps and has a relatively thick protective adhesive film layer T2b2. Therefore, the protective adhesive film T2B for bump wafers has a configuration in which it is relatively difficult to press and release the adhesive film T3. Therefore, it is preferable that the pressing force used to press the release adhesive film T3 to the protective adhesive film T2B by the pressing member 81 is relatively strong.

In the release adhesive film crimping device 50 , when the release adhesive film T3 is press-bonded to the protective adhesive film T2B of the bump wafer W2 , the second control unit 55 of the control unit 51 controls the moving unit 63 to move the movable pressing unit 61 . -Z direction movement, and the peeling adhesive film T3 is pushed toward the protective adhesive film T2D by the pressing member 81 . At this time, the second control unit 55 positions the distance between the plate 83 and the pressure contact member 81 to a second range corresponding to a distance shorter than the first range. This second range is a range in which the pressing force transmitted from the switching mechanism 82 to the pressure contact member 81 becomes the second reaction force by the second spring 86 . That is, the second range is the range in which the stopper 88 contacts the upper surface of the pressure contact member 81 and pushes against this surface in the first embodiment. At this time, the upper surface of the pressure contact member 81 and the lower surface of the intermediate base 85 are connected by the stopper 88 .

In this case, the second spring 86 receives the force in the −Z direction from the moving means 63 and contracts to exert the second reaction force.

Therefore, the pressing force transmitted from the switching mechanism 82 to the pressure contact member 81 is composed of the relatively strong second reaction force of the second spring. Therefore, the peeling adhesive film T3 is pushed to the protective adhesive film T2B by the pressing member 81 with a relatively strong force.

That is, in this case, the second control unit 55 sets the distance between the plate 83 and the crimping member 81 as the second range and causes the second reaction force of the second spring 86 to act on the crimping member 81 . The pressure-bonding member 81 presses the release adhesive film T3 with a strong pressing force and press-bonds it to the protective adhesive film T2B.

As described above, in the first embodiment, when the wafer W is the element wafer W1, the first control unit 53 controls the moving means 63 to set the distance between the plate member 83 and the pressure bonding member 81 as the first range. This first range is a range in which the pressing force transmitted from the switching mechanism 82 to the pressure contact member 81 becomes the first reaction force by the first spring 84 . Thereby, the first reaction force of the first spring 84 acts on the pressure-contacting member 81 , and the pressure-contacting member 81 presses the release adhesive film T3 with a weak pressing force and press-bonds it to the protective adhesive film T2D.

On the other hand, when the wafer W is the bump wafer W2, the second control unit 55 controls the moving means 63 so that the distance between the plate 83 and the pressure bonding member 81 is defined as the second range. The pressing force transmitted from the switching mechanism 82 to the pressure contact member 81 falls within the range of the second reaction force of the second spring 86 . Thereby, the second reaction force by the second spring 86 acts on the pressing member 81, and the pressing member 81 presses the release adhesive film T3 with a strong pressing force and presses it to the protective adhesive film T2B.

In this way, in the first embodiment, by changing the distance between the plate member 83 and the pressure-contacting member 81, that is, only changing the moving distance of the plate member 83, the pressing force of the pressure-contacting member 81 on the release adhesive film T3 can be switched. Therefore, in the first embodiment, compared with a device that replaces a spring in order to switch the pressing force, for example, it is a device that can easily change the pressing force of the pressure-contacting member 81 against the release adhesive film T3 according to the type of the protective adhesive film T2. . In addition, since there is no need for an expensive sensor to detect the pushing force or a complicated control device for controlling the pushing force, the cost for switching the pushing force can be suppressed.

[Second Embodiment] The grinding device of the second embodiment has a configuration in which the peeling device 1 shown in the first embodiment is provided with a peeling film crimping device 50 a shown in FIG. 10 instead of the peeling film crimping device 50 .

The peeling tape crimping device 50 a is also similar to the peeling tape crimping device 50 , and is a device that crimps the peeling tape T3 to the protective tape T2 adhered to the surface Wa on the side of the wafer W held by the holding table 30 As shown in FIG. 10 , in the structure of the release adhesive film crimping device 50 ( FIG. 7 ), a release adhesive film crimping portion 42 a is provided instead of the release adhesive film crimping portion 42 .

The release adhesive film crimping portion 42 a is as shown in FIG. 10 . In the structure of the release adhesive film crimping portion 42 ( FIG. 7 ), a movable pressing portion 61 a is provided instead of the movable pressing portion 61 . Furthermore, the movable pressing part 61a is configured to include a switching mechanism 82a instead of the switching mechanism 82. That is, the peeling tape crimping device 50a is a device that includes the switching mechanism 82a instead of the switching mechanism 82 in the configuration of the peeling tape crimping device 50.

The switching mechanism 82a is the cylinder 77 that connects the pressure contact member 81 and the moving means 63, the same as the switch mechanism 82, and is provided to switch the pressing force between the strong pressing force and the weak pressing force. The pressing force is the pressure contacting member. 81 The force that pushes the peeling adhesive film T3 against the protective adhesive film T2.

The switching mechanism 82a has the same plate 83 and guide rod 87 supported by the cylinder 77 of the moving means 63 as shown in FIG. 7 . That is, the lower ends of the guide rods 87 are fixed at equal intervals near the outer periphery of the crimping member 81 and extend in the +Z direction from the crimping member 81 . In addition, the upper end of the guide rod 87 is supported by the plate 83 so as to be slidable with respect to the through hole (not shown) of the plate 83 while penetrating the through hole of the plate 83 .

In addition, the switching mechanism 82a is the same as the switching mechanism 82, and includes: four first springs 84; and four second springs 86, each having a larger spring constant than the first springs 84 (only two springs are shown in FIG. 10 ). In addition, in the switching mechanism 82a, the second spring 86 is shorter than the first spring 84.

In the switching mechanism 82a, the upper end of the first spring 84 is fixed to the lower surface of the plate 83, and the lower end is fixed to the upper surface of the pressure contact member 81. Furthermore, the second spring 86, which is shorter than the first spring 84, has an upper end fixed to the lower surface of the plate member 83 and a lower end free.

Therefore, the movable pressing portion 61a including the pressure-contacting member 81 and the switching mechanism 82a becomes the pressure-contacting member 81 in a state where the release adhesive film T3 is not in contact with the pressure-contacting member 81 as shown in FIG. 10 (no load state). The state supported by the first spring 84.

In this way, the switching mechanism 82a is different from the switching mechanism 82 (Fig. 7) in that it does not include the intermediate base 85 and the stopper 88, and the first spring 84 and the second spring 86 are connected in parallel.

In the second embodiment, as shown in FIG. 11 , when the protective adhesive film T2D of the element wafer W1 is pressed and the peeling adhesive film T3 is pressed, the first control part 53 of the control means 51 controls the moving means 63 to movable push The portion 61a moves in the −Z direction, and the pressing member 81 presses the release adhesive film T3 to the protective adhesive film T2D.

At this time, the first control unit 53 positions the distance between the plate 83 and the pressure contact member 81 within the first range. This first range is a range in which the pressing force transmitted from the switching mechanism 82 a to the pressure contact member 81 becomes the first reaction force by the first spring 84 . That is, in the second embodiment, this first range is a range in which the second spring 86 does not come into contact with the upper surface of the pressure contact member 81 .

In this case, since the second spring 86 is not in contact with the crimping member 81, the second reaction force in the second spring 86 is not exerted, and only the first spring fixed to both the plate 83 and the crimping member 81 is exerted. 1st reaction force in 84. Therefore, the urging force transmitted from the switching mechanism 82 a to the pressure contact member 81 is composed of the relatively small first reaction force of the first spring 84 . Therefore, the peeling adhesive film T3 is pressed to the protective adhesive film T2D by the pressing member 81 with a relatively weak pressing force.

That is, in this case, the first control unit 53 sets the distance between the plate 83 and the crimping member 81 as the first range and causes the first reaction force of the first spring 84 to act on the crimping member 81 . The peeling adhesive film T3 is pressed with a weak pressing force by the pressing member 81 and pressed to the protective adhesive film T2D.

On the other hand, as shown in FIG. 12 , when the protective adhesive film T2B of the bump wafer W2 is pressed against the release adhesive film T3, the second control unit 55 of the control unit 51 controls the moving unit 63 so that the movable pressing unit 61a Move in the -Z direction, and press the release adhesive film T3 to the protective adhesive film T2B by the pressing member 81 . At this time, the second control unit 55 positions the distance between the plate 83 and the pressure contact member 81 to a second range corresponding to a distance shorter than the first range. This second range is a range in which the pressing force transmitted from the switching mechanism 82 a to the pressure contact member 81 includes the second reaction force of the second spring 86 . That is, in the second embodiment, the second range is a range in which the second spring 86 comes into contact with the upper surface of the pressure contact member 81 and presses this surface.

In this case, while the first spring 84 exerts the first reaction force, the second spring 86 also exerts the second reaction force. Therefore, the pressing force transmitted from the switching mechanism 82a to the pressure contact member 81 becomes the combined force of the first reaction force and the second reaction force that is stronger than the first reaction force. Therefore, the peeling adhesive film T3 is pushed to the protective adhesive film T2B by the pressing member 81 with a relatively strong force.

That is, in this case, the second control part 55 uses the distance between the plate 83 and the pressure-contact member 81 as the second range to cause the second reaction force of the second spring 86 to act on the pressure-contact member 81, and The pressure-bonding member 81 presses the release adhesive film T3 with a strong pressing force and press-bonds it to the protective adhesive film T2B.

Therefore, in the second embodiment shown in FIGS. 10 to 12 , the distance between the plate 83 and the crimping member 81 is also changed, that is, only the moving distance of the plate 83 is changed, so that the pressure of the crimping member 81 can be switched to the peeling adhesive. Pushing force of membrane T3. Therefore, the pressing force of the pressure-bonding member 81 against the release adhesive film T3 can be easily changed according to the type of the protective adhesive film T2. In addition, since a sensor or the like is not required, the cost for switching the pressing force can also be suppressed.

Furthermore, in this second embodiment, by making the spring constant of the second spring 86 significantly larger than that of the first spring 84, when the distance between the plate member 83 and the pressure contact member 81 falls into the second range, the spring constant can be adjusted from The pressing force transmitted to the pressure contact member 81 by the switching mechanism 82 a is mainly based on the second reaction force of the second spring 86 .

In addition, in the first embodiment and the second embodiment, four first springs 84 and four second springs 86 are provided. The number of these first springs 84 and second springs 86 is not limited to four and may be any number. In addition, in the second embodiment shown in FIG. 10 and others, the first spring 84 may be disposed between the plate 83 and the pressure contact member 81 so as to pass through the inside of the second spring 86 (the inside of the spiral).

1: Peeling device 2: Holding means 3: Maintain means 30: Holding platform 31: Annular frame holding part 4: Peel off the adhesive film and stick it on 40: Stripping film supply means 41: Cutting part 42,42a: Peel off adhesive film crimping part 50,50a: Stripping film crimping device 51:Control means 53: 1st Control Department 55:Second Control Department 61,61a: Movable pushing part 62:Heater 63:Mobile means 81: Crimping components 82,82a: switching mechanism 83: Board 85:Middle pedestal 87: Guide rod 88:stop 84: 1st spring 86: 2nd spring F: ring frame Fa: Open your mouth T1: Cutting film T2: Protective film T3: Peel off the adhesive film W:wafer W1: component wafer W2: Bump wafer

FIG. 1 is an explanatory diagram showing a wafer according to the embodiment. FIG. 2 is an explanatory diagram showing the structure of a workpiece group including a wafer and a peeling device. FIG. 3 is an explanatory diagram showing the structure of a peel-off film adhering means arranged above the wafer held by the peel-off device. 4 is an explanatory diagram showing a state in which the release adhesive film crimping portion of the release adhesive film adhering means is press-bonding the release adhesive film to the protective adhesive film of the wafer. FIG. 5 is an explanatory diagram showing a state in which the cutting part of the peeling adhesive film adhering means is cutting the peeling adhesive film by a cutter. FIG. 6 is an explanatory diagram showing a state in which one end of the strip-shaped release tape is pressed against the outer peripheral edge of the protective tape of the wafer. 7 is an explanatory diagram showing the structure of a release adhesive film crimping device including a release adhesive film crimping unit and a control means. FIG. 8 is an explanatory diagram showing a state in which the release adhesive film is pressed onto the protective adhesive film of the device wafer. FIG. 9 is an explanatory diagram showing a state in which the release tape is pressed onto the protective tape of the bump wafer. FIG. 10 is an explanatory diagram showing a second embodiment of a release adhesive film crimping device including a release adhesive film crimping unit and a control means. FIG. 11 is an explanatory diagram showing a state in which the release tape is pressed onto the protective tape of the device wafer. FIG. 12 is an explanatory diagram showing a state in which the release tape is pressed onto the protective tape of the bump wafer.

42: Peel off the adhesive film crimping part

50: Peeling film crimping device

51:Control means

53: 1st Control Department

55:Second Control Department

61: Movable pushing part

63:Mobile means

71:Support plate

73:Fixed shaft

75:Connector

77:Cylinder

78: Ball screw

79:Motor

81: Crimping components

81a:Protrusion

82:Switch mechanism

83:Plate

84: 1st spring

85:Middle pedestal

86: 2nd spring

87: Guide rod

88:stop

T2: Protective film

T2a: Protective film base material

T2b: Protective film adhesive layer

T3: Peel off the adhesive film

W:wafer

Claims (1)

A peeling adhesive film crimping device that crimps the peeling adhesive film to a protective adhesive film, which is adhered to the surface of one side of the wafer held by the holding table; the peeling adhesive film crimping device has: The crimping component pushes the peeling adhesive film prepared above the protective adhesive film against the protective adhesive film; Moving means to move the crimping member in a direction approaching and away from the peeling adhesive film; A switching mechanism connects the crimping member and the moving means, and is used to switch the pressing force between the strong pushing force and the weak pushing force. The pressing force pushes the peeling adhesive film against the protective adhesive by the crimping member. membrane force; and means of control; Among them, the switching mechanism has: panels, supported on the means of movement; The first spring is disposed between the plate and the crimping member, and exerts a first reaction force when the plate approaches the crimping member and contracts; and The second spring is disposed between the plate and the crimping member, and when the plate is contracted by approaching the crimping member, it exerts a second reaction force stronger than the first reaction force; This control method has: The first control part controls the moving means so that the first reaction force according to the first spring acts on the pressure-contacting member by taking the distance between the plate and the crimping member as the first range. The peeling adhesive film is pressed by the pressing member with a weak pushing force and pressed to the protective adhesive film; and The second control part controls the moving means to position the distance between the plate member and the pressure contact member in a second range corresponding to a distance shorter than the first range, so that the second range according to the second spring The reaction force acts on the crimping member, and the peeling adhesive film is pressed by the crimping member with a strong pushing force and is crimped to the protective adhesive film.