TW202036761A - Peeling glue film crimping device which has no need to use an expensive sensor and a control device to change the push-press force - Google Patents

Abstract

An object of the present invention is to simply switch a push-press force of a crimping member to a peeling glue film. The invention includes switching the type of a spring acting on the crimping member 81 by changing an interval between a plate 83 and the crimping member 81, that is, changing the moving distance of the plate 83, so that the push-press force of the crimping member 81 applied on the peeling glue film T3 can be changed. Therefore, as compared to a device that replaces a spring in order to switch the push-press force, the push-press force of the peeling glue film T3 by the pressing member 81 can be easily changed according to a type of the protective glue film T2. In addition, since there is no need of a high-price sensor for detecting the push-press force and a complicated control device for controlling the push-press force, the cost for switching the push-press force can be suppressed.

Description

Peeling film crimping device

The invention relates to a crimping device for peeling adhesive films.

When grinding the wafer, stick a protective film on the side of the non-grinding surface, hold the protective film by the chuck table, and grind the wafer in such a way that the wafer becomes a predetermined thickness by a grinding stone. After that, the protective film was peeled off.

At this time, first, the dicing glue film is attached to the grinding surface of the wafer and the ring frame arranged so as to surround the wafer, and they are integrated. After that, as disclosed in Patent Document 1, the end of the strip-shaped release film is crimped to the protective film, and the end of the release film is stretched to peel the protective film from the wafer . [Literature Technical Literature] [Patent Literature]

[Patent Document 1] JP 2017-220506 A

[The problem to be solved by the invention] As a peeling adhesive film, in most cases, a heat sealing material that melts the adhesive when heated is used. Then, by pushing the heated crimping member against the release adhesive film on the protective adhesive film, the release adhesive film is crimped to the protective adhesive film. The protective film includes a protective film for bump wafers with bumps on the surface, and a protective film for device wafers.

The protective adhesive film for bump wafers has a thick adhesive layer to protect the bumps, so it is difficult to press and peel off the adhesive film. Therefore, the pressing force of the crimping member on the peeling film should be increased. On the other hand, the protective adhesive film for the component wafer has a thin adhesive layer, and the wafer is also very thin. Therefore, in order not to crush the wafer, the pressing force of the crimping member on the peeling film should be weakened.

In this way, it is necessary to change the pressing force of the pressure bonding member against the peeling film according to the type of the protective film. However, in the past, in order to change the pressing force, an expensive sensor for measuring the pressing force and a control means for adjusting the pressing force were used. Therefore, there is a problem that a device for crimping the peeling adhesive film to the protective adhesive film becomes expensive.

The object of the present invention is to simply switch the pressing force of the pressure bonding member against the peeling film.

[Technical means to solve the problem] The peeling adhesive film crimping device of the present invention (the peeling adhesive film crimping device) crimps the peeling adhesive film to the protective adhesive film, and the protective adhesive film is adhered to the side surface of the wafer held by the holding table; The peeling adhesive film crimping device is provided with: a crimping member for pushing the peeling adhesive film prepared above the protective adhesive film to the protective adhesive film; and a moving means to make the crimping member approach and away from the peeling adhesive film The switching mechanism connects the crimping member and the moving means, and is used to switch the pressing force between a strong pressing force and a weak pressing force. The pressing force is the pressing member pushing the peeling film against To the protective film; and control means; wherein, the switching mechanism is provided with: a plate, which is supported by the moving means; a first spring, arranged between the plate and the crimping member, if The plate is contracted close to the crimping member to exert a first reaction force; and a second spring is arranged between the plate and the crimping member, and shrinks when the plate approaches the crimping member , It exerts a second reaction force stronger than the first reaction force; the control means includes: a first control unit that controls the movement means to set the distance between the plate and the crimping member as the first range , Making the first reaction force of the first spring act on the crimping member, and the crimping member pushes the peeling film with a weak pushing force and crimps it to the protective film; and second The control unit controls the moving means to position the distance between the plate and the crimping member in a second range corresponding to a distance shorter than the first range, and act on the second reaction force of the second spring On the crimping member, the peeling film is pressed by the crimping member with a strong pushing force and crimped to the protective film.

[Invention Effect] In the peeling adhesive film crimping device, the distance between the plate and the crimping member is changed, that is, the pressing force of the crimping member on the peeling adhesive film can be switched only by changing the moving distance of the plate. Therefore, in the peeling adhesive film pressure bonding device, the pressing force of the pressure bonding member against the peeling adhesive film can be easily changed according to the type of the protective adhesive film. In addition, since there is no need for an expensive sensor for detecting the pushing force and no complicated control device for controlling the pushing force, the cost for switching the pushing force can be suppressed.

[First Embodiment] The peeling apparatus of the first embodiment peels the protective adhesive film T2 from the wafer W shown in FIG. 1. The wafer W is, for example, a semiconductor wafer having a circular appearance. A plurality of components are formed on the surface Wa on one side of the wafer W, and a circular protective adhesive film T2 is pasted thereon.

The protective adhesive film T2 is a circular film having the same outer diameter as the wafer W, for example. The protective adhesive film T2 includes: a protective adhesive film substrate T2a, which becomes an exposed surface; and a protective adhesive film adhesive layer T2b, which has an adhesive layer with adhesive properties.

In addition, as shown in FIG. 1, the wafer W, the ring frame F and the dicing film T1 together form a workpiece group. In the formation of the workpiece group, first, the outer peripheral portion of the circular cutting film T1 is adhered to the ring-shaped frame F having the opening Fa to seal the opening Fa.

After that, the adhesive surface of the dicing film T1 of the opening Fa is pushed against the surface Wb on the other side of the wafer W in such a way that the center of the wafer W is located at the center of the opening Fa of the ring frame F. Thereby, the dicing glue film T1 is adhered to the surface Wb on the other side of the wafer W. The wafer W is in a state of being supported by the ring frame F through the dicing film T1 by the dicing film T1 stuck to the opening Fa of the ring frame F.

Such a wafer W is held by the holding means 3 of the peeling apparatus 1 shown in FIG. 2. The holding means 3 includes a holding table 30 holding the wafer W on the other side of the surface Wb side, and a ring frame holding portion 31 holding the ring frame F.

The holding table 30 included in the peeling apparatus 1 has, for example, a circular appearance, and is provided with a suction part 300 which suctions the wafer W, and a frame 301 which supports the suction part 300. The suction part 300 has a holding surface 300a. The holding surface 300 a is an exposed surface of the suction portion 300 and forms the same surface as the upper surface of the frame body 301. The holding surface 300a communicates with a suction source (not shown), and holds the wafer W by suction. The holding table 30 is supported by the moving means 11 through the connecting member 302 connected to the bottom surface of the holding table 30.

The moving means 11 includes a movable plate 110 and a guide rail 111 that support the connecting member 302. The movable plate 110 moves back and forth in the X-axis direction while sliding on the guide rail 111, whereby the holding means 3 including the holding table 30 can be moved back and forth in the X-axis direction integrally.

For example, four ring-shaped frame holding parts 31 (only two are shown in FIG. 2) are evenly arranged around the holding table 30. The ring-shaped frame holding portion 31 includes a clamping jig 310 and an elevating means 311 that raises and lowers the clamping jig 310 in the Z-axis direction. The clamping jig 310 has a pair of clamping members 310a and 310b that can approach and move away from each other, and the ring frame F can be clamped by these clamping members.

The lifting means 311 is, for example, an air cylinder, and includes a cylinder tube 311a and a piston rod 311b. The cylinder tube 311a includes a piston (not shown) inside, and has a bottomed cylindrical shape with a bottom on the proximal side (−Z direction side). The piston rod 311b is inserted into the cylinder tube 311a, and one end of the piston rod is mounted on the piston. The other end of the piston rod 311b is fixed to the clamping jig 310. In addition, the base end side of the cylinder tube 311 a is fixed to the upper surface of the movable plate 110. By supplying or exhausting gas to the cylinder tube 311a, the pressure inside the cylinder tube 311a is changed. Thereby, the piston rod 311b moves in the Z-axis direction, and the clamping jig 310 moves in the Z-axis direction accordingly.

When the wafer W is fixed to the holding means 3 of the peeling apparatus 1, the wafer W is placed on the holding surface 300 a so that its center is approximately at the center of the holding surface 300 a of the holding table 30. Thereby, the surface Wb on the other side of the wafer W penetrates the dicing film T1 and contacts the holding surface 300a of the holding table 30. In addition, the ring frame F is in contact with the clamping member 310b of the clamping jig 310 in the opened state.

Next, by transmitting the suction force of an unshown suction source to the holding surface 300a, the holding table 30 sucks and holds the other surface Wb side of the wafer W on the holding surface 300a through the dicing film T1. In addition, the clamping member 310a of the clamping jig 310 rotates toward the arrow R1 direction, and clamps the ring frame F together with the clamping member 310b. Furthermore, the elevating means 311 lowers the clamping jig 310 that clamps the ring frame F in the -Z direction. Thereby, as shown in FIG. 3, the ring frame F is held by the ring frame holding portion 31.

In addition, as shown in FIG. 3, the peeling device 1 has: a peeling adhesive film sticking means 4, which is arranged on the upper part of the holding means 3, and presses a strip-shaped peeling adhesive film T3 to the protective adhesive film T2 of the wafer W; and , Holding means 2, holding the peeling film T3.

The holding means 2 includes a pair of clamping plates 20 that can approach and move away from each other along the Z-axis direction. The holding means 2 can move in parallel on a horizontal plane, and move up and down along the Z-axis direction. In the step of attaching the peeling adhesive film T3 to the protective adhesive film T2 of the wafer W, the holding means 2 is positioned above the ring frame holding portion 31 on the +X direction side.

The peeling adhesive film sticking means 4 includes: a peeling adhesive film supply means 40 to supply the peeling adhesive film T3; a cutting part 41 to cut the peeling adhesive film T3; and a peeling adhesive film crimping part 42. The peeling adhesive film T3 includes a peeling adhesive film substrate T3a and a peeling adhesive film adhesive layer T3b composed of a substrate. The peeling adhesive film adhesive layer T3b has stronger adhesive force than the protective adhesive film adhesive layer T2b of the protective adhesive film T2. In addition, in the first embodiment, the release adhesive film T3 has a softer property than the protective adhesive film T2.

The peeling film supply means 40 includes a peeling film roll (not shown), a support roller 400, and a pair of drive rollers 401 arranged side by side in the Z-axis direction. The support roller 400 and the pair of drive rollers 401 have, for example, a cylindrical appearance extending in the Y-axis direction. In the peeling adhesive film supply means 40, the peeling adhesive film T3 is held on the supporting roller 400 and clamped by a pair of driving rollers 401. Then, the tip T3d of the peeling adhesive film T3 is clamped and pulled out by a pair of clamping plates 20 of the holding means 2.

The peeling adhesive film crimping portion 42 has a movable pressing portion 61 that can move in the Z-axis direction; a moving means 63 that moves the movable pressing portion 61; and a heater 62 that generates heat by flowing current.

The movable pressing portion 61 can be raised and lowered in the Z-axis direction by the moving means 63, and can press the peeling adhesive film T3 to the protective adhesive film T2 by its lower end. The heater 62 is attached to the side of the movable pressing portion 61. Therefore, in the first embodiment, the movable pressing portion 61 can heat the contact portion of the release adhesive film T3 and the protective adhesive film T2 while pressing.

The cutting unit 41 includes a cutter 411 having a sharp blade. The cutter 411 has a sharp blade as a lower end, extends linearly in the Y-axis direction, and is movable in the Z-axis direction. The cutting unit 41 further has a cutter moving unit 412. The cutter moving unit 412 moves the cutter 411 in the Z-axis direction.

As shown in FIG. 4, in the pasting of the peeling adhesive film T3, first, a predetermined length of the peeling adhesive film T3 is supplied from the peeling adhesive film supply means 40. Then, the tip T3d of the peeling adhesive film T3 is held by the holding means 2. Next, the peeling adhesive film crimping portion 42 descends, pushing the peeling adhesive film T3 downward, so that the peeling adhesive film adhesive layer T3b of the peeling adhesive film T3 contacts the protective adhesive film substrate T2a of the protective adhesive film T2 and continues to push. Furthermore, the heater 62 is energized to cause the heater 62 to generate heat. Thereby, the contact part of the peeling adhesive film T3 and the protective adhesive film T2 is pressed by the peeling adhesive film crimping part 42 while being heated. As a result, the adhesive of the peeling adhesive film adhesive layer T3b of the peeling adhesive film T3 melts, and the peeling adhesive film adhesive layer T3b is well pressure-bonded to the protective adhesive film substrate T2a of the protective adhesive film T2.

Next, as shown in FIG. 5, the cutter 411 of the cutting portion 41 descends, the blade of the cutter 411 cuts into the release adhesive film T3, and the release adhesive film T3 is cut into a strip shape. As a result, as shown in FIG. 6, one end T3c of the strip-shaped peeling adhesive film T3 is stuck on the outer peripheral edge T2d of the protective adhesive film T2 of the wafer W. After the cutter 411 cuts the peeling adhesive film T3, the peeling adhesive film supply means 40, the cutting portion 41, and the peeling adhesive film crimping portion 42 are raised in the +Z direction and withdrawn from the peeling adhesive film T3. After that, the holding means 2 continues to hold the peeling adhesive film T3, and the movable plate 111 of the peeling device 1 moves in the +X direction along the guide rail. Thereby, peeling of the protective adhesive film T2 to which the peeling adhesive film T3 is crimped from the wafer W is performed.

Here, the peeling adhesive film crimping device including the peeling adhesive film crimping portion 42 in the peeling adhesive film sticking means 4 will be described in more detail. FIG. 7 shows a peeling adhesive film crimping device 50 including a peeling adhesive film crimping portion 42. The peeling adhesive film crimping device 50 crimps the peeling adhesive film T3 to the protective adhesive film T2 adhered to the wafer W held by the holding table 30. As shown in FIG. 7, in addition to the peeling adhesive film crimping portion 42, the peeling adhesive film crimping device 50 further includes a control means 51 provided in a housing (not shown) of the peeling device 1.

As described above, the peeling adhesive film crimping portion 42 includes a movable pressing portion 61 that can move along the Z-axis direction, and a moving means 63 that moves the movable pressing portion 61. In FIG. 7 etc., the heater 62 for peeling the adhesive film crimping portion 42 is omitted.

The moving means 63 moves the pressing member 81 provided at the lower end of the movable pressing portion 61 in a direction approaching and away from the peeling adhesive film T3 by moving the movable pressing portion 61. As shown in FIG. 7, the moving means 63 includes a support plate 71, a fixed shaft 73 supported by the support plate 71, a connector 75 and cylinder 77 slidable on the surface of the fixed shaft 73, a ball screw 78 and a motor 79.

The ball screw 78 is supported by the support plate 71 and is rotated by the motor 79. The connector 75 has a screw hole screwed with the ball screw 78 and an insertion hole penetrated by the fixed shaft 73. By rotating the ball screw 78, the coupling 75 slides on the surface of the fixed shaft 73 along the Z-axis direction.

The cylinder 77 is fixed to the connector 75, and a movable pressing part 61 is attached to the lower end. The cylinder 77 follows the rotation of the ball screw 78 and slides on the surface of the fixed shaft 73 along the Z-axis direction together with the coupling 75. Thereby, the movable pressing portion 61 attached to the lower end of the cylinder 77 moves in the Z-axis direction.

The movable pressing portion 61 has a pressing member 81 and a switching mechanism 82. The crimping member 81 is a member for pushing the release adhesive film T3 prepared above the protective adhesive film T2 to the protective adhesive film T2. The crimping member 81 has a plate shape, for example, and is provided at the lower end of the movable pressing portion 61. In addition, the crimping member 81 has a protrusion 81a on its lower surface. When the crimping member 81 pushes the release adhesive film T3 to the protective adhesive film T2, the protrusion 81a of the crimping member 81 contacts the release adhesive film T3. In addition, a heater for heating the protrusion 81a may be provided inside the crimping member 81 or the protrusion 81a.

The switching mechanism 82 is connected to the pressing member 81 and the air cylinder 77 of the moving means. The switching mechanism 82 is provided to switch the pressing force between a strong pressing force and a weak pressing force, and the pressing force is the force of the crimping member 81 pushing the peeling adhesive film T3 against the protective adhesive film T2.

The switching mechanism 82 has: a plate 83, which is supported by the cylinder 77 of the moving means 63; an intermediate base 85, which is arranged below the plate 83; and four guide rods 87 (in FIG. 7 etc., only two guide rods are shown) 87).

The plate 83 and the intermediate base 85 have the same plate shape as the crimping member 81, for example. The guide rod 87 is fixed to the vicinity of the outer periphery of the crimping member 81 at equal intervals at its lower end, and extends from the crimping member 81 in the +Z direction.

In addition, the upper end of the guide rod 87 is supported by the plate 83 so as to be slidable with respect to the through hole (not shown) of the plate 83 while passing through the through hole (not shown) of the plate 83. The intermediate base 85 is arranged between the crimping member 81 and the plate 83. The intermediate base 85 is provided with a through hole (not shown) similar to that of the plate 83. The guide rod 87 slidably penetrates this through hole.

In addition, the switching mechanism 82 includes four first springs 84 and four second springs 86 (only two are shown in FIG. 7 ). The first spring 84 and the second spring 86 are arranged at predetermined positions between the pressing member 81 and the plate 83.

That is, the lower end of the first spring 84 is fixed to the upper surface of the pressure contact member 81 and the upper end is fixed to the lower surface of the intermediate base 85. In addition, the lower end of the second spring 86 is fixed to the upper surface of the intermediate base 85 and the upper end thereof is fixed to the lower surface of the plate 83.

Therefore, the movable pressing portion 61 including the crimping member 81 and the switching mechanism 82 is in a state where the peeling film T3 is not in contact with the crimping member 81 as shown in FIG. 7 (no load state), and the intermediate base 85 is arranged In the state supported by the first spring 84 and the second spring 86 on both sides, the guide rod 87 is located approximately in the middle. In addition, the pressure contact member 81 is in a state supported by the first spring 81.

In addition, the switching mechanism 82 includes, for example, four stoppers 88 on the lower surface of the intermediate base 85. The stopper 88 extends in the -Z direction from the lower surface of the intermediate base 85. The length of the stopper 88 is set so that a predetermined interval is provided between the lower end of the stopper 88 and the upper surface of the crimping member 81 in the no-load state shown in FIG. 7.

In addition, if the movable pressing portion 61 is moved in the -Z direction by the moving means 63, and the peeling adhesive film T3 is pressed to the protective adhesive film T2 by the pressing member 81, the pressing member 81 and the intermediate base 85 The first spring 84 arranged therebetween will contract, and the plate 83 will approach the pressing member 81. That is, the interval between the intermediate pedestal 85 and the crimping member 81 is narrowed.

When the first spring 84 approaches the crimping member 81 by the plate 83 and the interval between the intermediate base 85 and the crimping member 81 is narrowed and contracted, a relatively weak first reaction force (elastic force) will be exerted. On the other hand, the second spring 86 has a spring constant greater than that of the first spring 84. Therefore, when the second spring 86 approaches the pressing member 81, the gap between the plate 83 and the intermediate base 85 is narrowed and contracted, and the second spring 86 exerts a second reaction force stronger than the first reaction force.

The control means 51 moves the movable pressing portion 61 in the Z-axis direction by using the moving means 63 to perform pressure bonding of the peeling adhesive film T3 to the protective adhesive film T2. In particular, the control means 51 is provided with: a first control unit 53 for pressing the peeling film T3 with a weak pressing force by the crimping member 81 and crimping to the protective film T2; and a second control unit 55 for crimping The member 81 presses the peeling adhesive film T3 with a strong pressing force and is crimped to the protective adhesive film T2.

Next, the pressure bonding operation of the peeling adhesive film T3 to the protective adhesive film T2 by the peeling adhesive film pressing device 50 will be described in more detail. First, as shown in FIGS. 8 and 9, as the wafer W used in the first embodiment, there are exemplified a device wafer W1 thinned by a grinding device or the like, and bumps provided with bumps on the surface. Wafer W2.

In the element wafer W1 shown in FIG. 8, as the protective adhesive film T2, a protective adhesive film T2D for the element wafer is used. The protective adhesive film T2D for the device wafer has a relatively thin protective adhesive film layer T2b1. Therefore, the protective adhesive film T2D for the element wafer has a structure that is relatively easy to crimp the release adhesive film T3. In addition, the element wafer W1 has a thinner structure than the bump wafer W2. Therefore, it is preferable that the pressing force for crimping the peeling adhesive film T3 to the protective adhesive film T2D by the crimping member 81 is relatively weak, so that the device wafer W1 is not broken.

In the peeling adhesive film press bonding apparatus 50, when the peeling adhesive film T3 is press-bonded to the protective adhesive film T2D of the element wafer W1, the first control section 53 of the control means 51 controls the moving means 63 to move the movable pressing section 61 toward − Move in the Z direction, and press the peeling adhesive film T3 to the protective adhesive film T2D by the crimping member 81. At this time, the first control unit 53 positions the distance between the plate 83 and the crimping member 81 in the first range. This first range is a range in which the pressing force transmitted from the switching mechanism 82 to the pressing member 81 is mainly based on the first reaction force of the first spring 84. That is, this first range is a range in which the stopper 88 provided on the lower surface of the intermediate base 85 does not contact the upper surface of the pressing member 81 in the first embodiment. Next, this first range is a range where the distance between the plate 83 and the intermediate base 85 does not change.

Here, in the switching mechanism 82, the first spring 84 and the second spring 86 are connected in series through the intermediate base 85. Therefore, in the case where the stopper 88 does not touch the upper surface of the crimping member 81 and the crimping member 81 has pressed the peeling adhesive film T3 to the protective adhesive film T2D, the first with a large spring constant 2 The spring 86 will not contract. On the other hand, the first spring 84 having a small spring constant contracts. Therefore, the pushing force transmitted from the switching mechanism 82 to the pressing member 81 is composed of the relatively small first reaction force of the first spring 84. Therefore, the peeling adhesive film T3 is pressed to the protective adhesive film T2D by the pressing member 81 with a relatively weak pressing force.

That is, in this case, the first control section 53 sets the distance between the plate 83 and the crimping member 81 as the first range to cause the first reaction force of the first spring 84 to act on the crimping member 81. The peeling adhesive film T3 is pressed with a weak pressing force by the crimping member 81 and crimped to the protective adhesive film T2D.

On the other hand, in the bump wafer W2 shown in FIG. 9, as the protective adhesive film T2, the protective adhesive film T2B for the bump wafer is used. The protective adhesive film T2B for bump wafers has a relatively thick protective adhesive film T2b2 to protect the bumps. Therefore, the protective adhesive film T2B for bump wafers has a structure that is relatively difficult to press the release adhesive film T3. Therefore, it is preferable that the pressing force for crimping the peeling adhesive film T3 to the protective adhesive film T2B by the crimping member 81 is relatively strong.

In the peeling adhesive film pressing device 50, when the peeling adhesive film T3 is pressed against the protective adhesive film T2B of the bump wafer W2, the second control section 55 of the control means 51 controls the moving means 63 to move the movable pressing section 61 toward -Move in the Z direction, and press the peeling adhesive film T3 to the protective adhesive film T2D by the crimping member 81. At this time, the second control unit 55 positions the distance between the plate 83 and the crimping member 81 in a second range corresponding to a distance shorter than the first range. This second range is a range in which the pressing force transmitted from the switching mechanism 82 to the pressing member 81 becomes the second reaction force by the second spring 86. That is, this second range is the range in which the stopper 88 contacts the upper surface of the pressure contact member 81 and pushes against this surface in the first embodiment. At this time, the upper surface of the pressing member 81 and the lower surface of the intermediate base 85 are connected by the stopper 88.

In this case, the second spring 86 receives the force in the -Z direction from the moving means 63 and contracts, and exerts a second reaction force.

Therefore, the pressing force transmitted from the switching mechanism 82 to the pressing member 81 is composed of the relatively strong second reaction force of the second spring. Therefore, the peeling adhesive film T3 is pressed to the protective adhesive film T2B by the crimping member 81 with relatively strong force.

That is, in this case, the second control section 55 sets the distance between the plate 83 and the crimping member 1 as the second range, and causes the second reaction force of the second spring 86 to act on the crimping member 81. The peeling adhesive film T3 is pressed with a strong pressing force by the crimping member 81 and crimped to the protective adhesive film T2B.

As described above, in the first embodiment, when the wafer W is the element wafer W1, the first control unit 53 controls the moving means 63, and the distance between the plate 83 and the pressing member 81 is set as the first range. The first range is a range in which the pressing force transmitted from the switching mechanism 82 to the pressure contact member 81 becomes the first reaction force by the first spring 84. Thereby, the first reaction force by the first spring 84 is applied to the crimping member 81, and the crimping member 81 pushes the peeling adhesive film T3 with a weak pressing force and crimps it to the protective adhesive film T2D.

On the other hand, when the wafer W is a bump wafer W2, the second control unit 55 controls the moving means 63 so that the distance between the plate 83 and the crimping member 81 is set as the second range, and the second range is The pressing force transmitted from the switching mechanism 82 to the pressure contact member 81 becomes a range based on the second reaction force of the second spring 86. Thereby, the second reaction force by the second spring 86 is applied to the crimping member 81, and the crimping member 81 presses the peeling adhesive film T3 with a strong pressing force and crimps it to the protective adhesive film T2B.

In this way, in the first embodiment, by changing the interval between the plate 83 and the crimping member 81, that is, only by changing the moving distance of the plate 83, the pressing force of the crimping member 81 on the peeling adhesive film T3 can be switched. Therefore, in the first embodiment, compared to a device that replaces a spring in order to switch the pressing force, for example, it becomes a device that can easily change the pressing force of the pressing member 81 against the peeling adhesive film T3 according to the type of the protective adhesive film T2. . In addition, since there is no need for an expensive sensor for detecting the pushing force and no complicated control device for controlling the pushing force, the cost for switching the pushing force can be suppressed.

[Second Embodiment] The grinding device of the second embodiment is the peeling device 1 shown in the first embodiment, and has the following configuration: instead of the peeling adhesive film crimping device 50, the peeling adhesive film crimping device 50a shown in FIG.

The peeling adhesive film crimping device 50a is also the same as the peeling adhesive film crimping device 50, and is a device for crimping the peeling adhesive film T3 to the protective adhesive film T2 attached to the side Wa of the wafer W held by the holding table 30 As shown in FIG. 10, in the configuration of the peeling adhesive film crimping device 50 (FIG. 7 ), a peeling adhesive film crimping portion 42 a is provided instead of the peeling adhesive film crimping portion 42.

The peeling adhesive film crimping portion 42 a is as shown in FIG. 10. In the configuration of the peeling adhesive film crimping portion 42 (FIG. 7 ), a movable pressing portion 61 a is provided instead of the movable pressing portion 61. Furthermore, the movable pressing portion 61 a has a switching mechanism 82 a instead of the switching mechanism 82 in the configuration of the movable pressing portion 61. That is, the peeling adhesive film crimping device 50 a is a device that includes a switching mechanism 82 a instead of the switching mechanism 82 in the configuration of the peeling adhesive film crimping device 50.

The switching mechanism 82a is the same as the switching mechanism 82, connecting the pressing member 81 and the cylinder 77 of the moving means 63, and is provided to switch the pressing force between a strong pressing force and a weak pressing force. The pressing force is a pressing member 81 pushes the peeling adhesive film T3 to the force of the protective adhesive film T2.

The switching mechanism 82a has the same plate 83 and the guide rod 87 supported by the cylinder 77 of the moving means 63 as shown in FIG. 7. That is, the lower end of the guide rod 87 is fixed to the vicinity of the outer periphery of the crimping member 81 at equal intervals, and extends from the crimping member 81 in the +Z direction. In addition, the upper end of the guide rod 87 is supported by the plate 83 so as to be slidable with respect to the through hole (not shown) of the plate 83 while passing through the through hole (not shown) of the plate 83.

In addition, the switching mechanism 82a is the same as the switching mechanism 82, and includes: four first springs 84; and four second springs 86, which have a spring constant greater than that of the first spring 84 (only two are shown in FIG. 10) ). In addition, in the switching mechanism 82a, the second spring 86 becomes shorter than the first spring 84.

In the switching mechanism 82a, the upper end of the first spring 84 is fixed to the lower surface of the plate 83, and the lower end is fixed to the upper surface of the crimping member 81. In addition, the second spring 86, which is shorter than the first spring 84, has the upper end fixed to the lower surface of the plate 83 and the lower end is a free end.

Therefore, the movable pressing portion 61a including the crimping member 81 and the switching mechanism 82a becomes the crimping member 81 in a state where the peeling film T3 is not in contact with the crimping member 81 (no load state) as shown in FIG. The state supported by the first spring 84.

In this way, the switching mechanism 82a is different from the switching mechanism 82 (FIG. 7) in that the intermediate base 85 and the stopper 88 are not provided, and the first spring 84 and the second spring 86 are connected in parallel.

In the second embodiment, as shown in FIG. 11, when the protective adhesive film T2D of the element wafer W1 is pressure-bonded to the peeling adhesive film T3, the first control section 53 of the control means 51 controls the moving means 63 to move the pressure The portion 61a moves in the -Z direction, and the release adhesive film T3 is pressed to the protective adhesive film T2D by the crimping member 81.

At this time, the first control unit 53 positions the distance between the plate 83 and the crimping member 81 in the first range. This first range is a range in which the pressing force transmitted from the switching mechanism 82 a to the pressing member 81 becomes the first reaction force by the first spring 84. That is, this first range is a range in which the second spring 86 does not contact the upper surface of the pressure contact member 81 in the second embodiment.

In this case, because the second spring 86 is not in contact with the crimping member 81, the second reaction force of the second spring 86 is not exerted, and only the first spring fixed to both the plate 83 and the crimping member 81 is exerted The first reaction force in 84. Therefore, the pressing force transmitted from the switching mechanism 82a to the pressing member 81 is composed of the relatively small first reaction force of the first spring 84. Therefore, the peeling adhesive film T3 is pressed to the protective adhesive film T2D by the pressing member 81 with a relatively weak pressing force.

That is, in this case, the first control section 53 sets the distance between the plate 83 and the crimping member 81 as the first range to cause the first reaction force of the first spring 84 to act on the crimping member 81. The peeling adhesive film T3 is pressed with a weak pressing force by the crimping member 81 and crimped to the protective adhesive film T2D.

On the other hand, as shown in FIG. 12, when the protective adhesive film T2B of the bump wafer W2 is pressure-bonded and peeled off the adhesive film T3, the second control section 55 of the control means 51 controls the moving means 63 to make the movable pressing section 61a Move in the -Z direction, and press the release adhesive film T3 to the protective adhesive film T2B by the crimping member 81. At this time, the second control unit 55 positions the distance between the plate 83 and the crimping member 81 in a second range corresponding to a distance shorter than the first range. This second range is a range in which the pressing force transmitted from the switching mechanism 82 a to the pressure contact member 81 includes the second reaction force by the second spring 86. That is, in the second embodiment, this second range is a range in which the second spring 86 comes into contact with the upper surface of the pressing member 81 and presses this surface.

In this case, while the first spring 81 exerts the first reaction force, the second spring 86 also exerts the second reaction force. Therefore, the pressing force transmitted from the switching mechanism 82a to the pressure contact member 81 becomes the resultant force of the first reaction force and the second reaction force stronger than the first reaction force. Therefore, the peeling adhesive film T3 is pressed to the protective adhesive film T2B by the crimping member 81 with relatively strong force.

That is, in this case, the second control section 55 sets the distance between the plate 83 and the crimping member 81 as the second range to cause the second reaction force of the second spring 86 to act on the crimping member 81, and The peeling adhesive film T3 is pressed with a strong pressing force by the crimping member 81 and crimped to the protective adhesive film T2B.

Therefore, in the second embodiment shown in FIGS. 10 to 12, the distance between the plate 83 and the crimping member 81 is also changed, that is, only the moving distance of the plate 83 is changed, and the crimping member 81 can be switched to the peeling glue. The pushing force of the membrane T3. Therefore, the pressing force of the pressure bonding member 81 against the peeling adhesive film T3 can be easily changed according to the type of the protective adhesive film T2. In addition, since a sensor or the like is not required, the cost for switching the pushing force can also be suppressed.

Furthermore, in this second embodiment, by making the spring constant of the second spring 86 significantly larger than that of the first spring 84, when the distance between the plate 83 and the crimping member 81 falls within the second range, the The pressing force transmitted from the switching mechanism 82 a to the pressing member 81 is mainly based on the second reaction force of the second spring 86.

In addition, in the first embodiment and the second embodiment, each of the first spring 84 and the second spring 86 includes four. The number of these first springs 84 and second springs 86 is not limited to four and may be any number. In addition, in the second embodiment shown in FIG. 10 and the like, between the plate 83 and the crimping member 81, the first spring 84 may pass through the inside of the second spring 86 (the inside of the spiral).

1: Stripping device 2: Holding means 3: keep the means 30: hold the stage 31: Ring frame holding part 4: The means of peeling off the adhesive film 40: Stripping film supply means 41: Cutting part 42,42a: peel off the film crimping part 50, 50a: peeling film crimping device 51: Control 53: The first control part 55: The second control part 61, 61a: Movable pressing part 62: heater 63: mobile means 81: Crimp components 82, 82a: switching mechanism 83: Board 85: middle pedestal 87: guide rod 88: Stopper 84: The first spring 86: The second spring F: ring frame Fa: opening T1: Cutting film T2: Protective film T3: Peel off the film W: Wafer W1: Component wafer W2: bumped wafer

FIG. 1 is an explanatory diagram showing a wafer of the embodiment. FIG. 2 is an explanatory diagram showing the structure of a work group including wafers and a peeling device. 3 is an explanatory diagram showing the structure of a peeling adhesive film sticking means arranged above a wafer held by the peeling device. 4 is an explanatory diagram showing a state in which the release adhesive film crimping portion of the release adhesive film bonding means is crimping the release adhesive film to the protective adhesive film of the wafer. Fig. 5 is an explanatory diagram showing a state in which the cutting portion of the peeling adhesive film sticking means is cutting the peeling adhesive film by a cutter. 6 is an explanatory diagram showing a state in which one end of the strip-shaped release adhesive film has been crimped on the outer periphery of the protective adhesive film of the wafer. FIG. 7 is an explanatory diagram showing the structure of a peeling adhesive film pressing device including a peeling adhesive film pressing part and a control means. FIG. 8 is an explanatory diagram showing a state in which the release adhesive film is pressed to the protective adhesive film of the element wafer. FIG. 9 is an explanatory diagram showing a state in which the release adhesive film is pressed to the protective adhesive film of the bump wafer. Fig. 10 is an explanatory diagram showing a second embodiment of a peeling adhesive film pressing device including a peeling adhesive film pressing portion and a control means. FIG. 11 is an explanatory diagram showing a state in which the release adhesive film is pressed to the protective adhesive film of the element wafer. FIG. 12 is an explanatory diagram showing a state in which the release adhesive film is pressed to the protective adhesive film of the bump wafer.

42: Peel off the film crimping part

50: Stripping film crimping device

51: Control

53: The first control part

55: The second control part

61: Movable pushing part

63: mobile means

71: support plate

73: fixed shaft

75: Linker

77: cylinder

78: Ball screw

79: Motor

81: Crimp components

81a: protrusion

82: switching mechanism

83: plate

84: The first spring

85: middle pedestal

86: The second spring

87: guide rod

88: Stopper

T2: Protective film

T2a: Protective film substrate

T2b: Protective film adhesive layer

T3: Peel off the film

W: Wafer

Claims (1)

A peeling adhesive film crimping device that crimps the peeling adhesive film to a protective adhesive film, the protective adhesive film being adhered to the side of the wafer held by a holding table; the peeling adhesive film crimping device includes: A crimping member, pushing the peeling adhesive film prepared above the protective adhesive film to the protective adhesive film; Moving means to move the crimping member in a direction approaching and away from the peeling film; The switching mechanism connects the crimping member and the moving means, and is used to switch the pushing force between a strong pushing force and a weak pushing force. The pushing force is the crimping member pushing the peeling film against the protective glue The force of the membrane; and Control means Among them, the switching mechanism has: The plate is supported by the moving means; The first spring is arranged between the plate and the crimping member, and when the plate approaches the crimping member and contracts, it exerts a first reaction force; and The second spring is arranged between the plate and the crimping member, and if the plate is contracted by approaching the crimping member, it will exert a second reaction force that is stronger than the first reaction force; The control method has: The first control unit controls the moving means so that the first reaction force based on the first spring acts on the pressing member by using the distance between the plate and the pressing member as the first range The peeling adhesive film is pressed by the crimping member with a weak pressing force and crimped to the protective adhesive film; and The second control unit controls the moving means so that the distance between the plate and the crimping member is positioned in a second range corresponding to a distance shorter than the first range, so that the second spring according to the second The reaction force acts on the crimping member, and the peeling film is pressed by the crimping member with a strong pushing force and crimped to the protective film.

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