JP6291275B2 - Pasting method - Google Patents

Description

  The present invention relates to an attaching method for attaching a substrate and a support through an adhesive layer.

  As a pasting technique for attaching a substrate and a support through an adhesive layer, for example, Patent Document 1 discloses an inorganic substrate made of a semiconductor or ceramics between a pair of upper and lower heating plates heated to a predetermined temperature in a vacuum press. A combination set of a laminate material including an auxiliary material for lamination processing is installed, and the pair of hot plates are brought into contact with the combination set, and then a low pressure load of at least 0.05 MPa from the start of pressurization is applied for 10 seconds. An inorganic substrate pressing method performed as described above is described.

JP 2002-192394 A (published July 10, 2002)

  However, when the present inventors examined, for example, in order to paste a substrate such as a wafer substrate and a support body supporting the substrate through an adhesive layer, a conventional one as described in Patent Document 1 is used. It has been found that the following problems occur when the press working method is used. That is, when a press machine including a pair of upper and lower plate members is used and the substrate and the support are sandwiched and pressed by the plate members, the plate member and the support or substrate are brought into close contact with each other. For this reason, when the flatness of the plate member and the support is high, the substrate and the support may be attached to the plate member.

  Here, if the substrate and the support attached to the plate member are to be detached from the plate member using only a jig such as a pin, the substrate may be damaged by the force applied by the pin.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a sticking method capable of detaching the substrate and the support from the plate member while preventing the substrate from being damaged.

  In order to solve the above problems, the attaching method according to the present invention is to apply a pressing force to a laminate formed by laminating a substrate, an adhesive layer, and a support that supports the substrate in this order, A method of attaching the substrate and the support through the adhesive layer, the pressing step of sandwiching and pressing the laminated body between a pair of plate members, and the pair of plates after the pressing step A gas is sent from a delivery part provided on a surface of at least one plate member in contact with the laminated body toward the laminated body, and a release member provided on at least one of the pair of plate members is provided. And a detaching step of detaching the laminate from the plate member provided with the delivery section by applying a force to the laminate by the separating member.

  According to the present invention, the substrate and the support can be detached from the plate member while preventing the substrate from being damaged.

It is a figure explaining the outline of the sticking method which concerns on one Embodiment of this invention. It is a figure explaining the outline of the sticking apparatus used for the sticking method which concerns on one Embodiment of this invention. It is a figure explaining the outline of the sticking apparatus which concerns on the modification used for the sticking method which concerns on one Embodiment of this invention.

  A sticking method according to an embodiment of the present invention includes applying a pressing force to a laminate formed by laminating a substrate, an adhesive layer, and a support that supports the substrate in this order, thereby supporting the substrate and the support. It is a sticking method which sticks a body through the adhesive layer, and includes a pressing step of sandwiching and pressing the laminated body between a pair of plate members, and at least one of the pair of plate members after the pressing step Gas is sent from the delivery portion provided on the surface of the plate member in contact with the laminate to the laminate, and the laminate is provided by the detachment member provided on at least one of the pair of plate members. A desorption step of detaching the laminate from the plate member provided with the delivery section by applying a force to the body.

  According to the above configuration, the substrate and the support can be detached from the plate member while preventing the substrate from being damaged.

<Paste method>
One Embodiment of the sticking method based on this invention is described in detail using FIG.1 and FIG.2. FIG. 1 is a diagram for explaining the outline of a sticking method according to an embodiment of the present invention. Moreover, FIG. 2 is a figure explaining the outline of the sticking apparatus used for the sticking method which concerns on one Embodiment of this invention.

  A sticking method according to an embodiment of the present invention includes applying a pressing force to a laminate 50 in which a substrate, an adhesive layer, and a support plate (support) that supports the substrate are laminated in this order. A pressing step (FIG. 1 (b)) in which the laminated body 50 is sandwiched and pressed between the pair of plate members 2, and after the pressing step, At least one plate of the pair of plate members 2 is configured to send gas toward the laminate 50 from the delivery portion 28 provided on the surface of the pair of plate members 2 that contacts the laminate 50 of at least one plate member. A detaching step of detaching the stacked body 50 from the plate member provided with the delivery section 28 by applying a force to the stacked body 50 by a detaching pin (detaching member) 27 provided on the member ((1 in FIG. 1). d)) , It encompasses a.

  Moreover, the sticking method according to an embodiment of the present invention includes a separation step of separating the pair of plate members 2 from each other after the pressing step and before the detachment step ((c) in FIG. 1). .

  Moreover, the sticking method which concerns on one Embodiment of this invention hold | maintains the laminated body 50 using the detachment pin 27 after a detachment | desorption process ((d) and (f) of FIG. 1).

  The pasting method shown in FIGS. 1A to 1F may be performed using the pasting apparatus shown in FIG. The pair of plate members 2 provided in the sticking device shown in FIG. 2 are separated from each other in the vertical direction, and the delivery portion 28 and the detachment pin 27 are provided on the upper plate member 2b located on the upper side.

  The detaching pin 27 is accommodated in the delivery unit 28. Here, the detaching pin 27 includes a pin 27a and a spring 27b, and the spring 27b biases the pin 27a. In addition, gas can be sent from the delivery unit 28 toward the laminated body 50. Here, the gas is supplied to the delivery unit 28 from the communication channel 24a in the upper plate member 2b via the pipe 26 and the supply port 25 from the outside.

  In addition, the pressing plate 22 is provided on the surface of the upper plate member 2b that contacts the stacked body 50, and the mounting plate 12 is provided on the surface of the lower plate member 2a that contacts the stacked body 50. Here, in the pressing plate 22 and the mounting plate 12, the flatness of the surface in contact with the stacked body 50 is set to be 1.0 μm or less when not pressed.

  Moreover, the sticking method which concerns on this embodiment is performed on vacuum conditions.

  A fine circuit can be formed on the substrate that is attached to the support plate by the attaching device. Here, in order to process circuit elements on the substrate with high accuracy, when the substrate and the support plate are pasted through the adhesive layer, the substrate is pasted on the support plate so as to obtain high flatness without bending. It is required to be done. Further, it is required to attach the substrate and the support plate so as to have a uniform thickness. For this reason, formation of the laminated body by sticking a board | substrate and a support plate is performed using the plate member 2 with high flatness under vacuum conditions.

  Here, when the substrate and the support plate are attached via an adhesive layer under vacuum conditions so as to be sandwiched between the plate members 2 having high flatness, the flatness in the plate member 2 and the laminated body 50 is increased. The degree of adhesion between the plate member 2 and the laminated body 50 is increased. For this reason, even if the pressing to the laminated body 50 is finished and the upper plate member 2b and the lower plate member 2a are separated, the laminated body 50 may stick to the upper plate member 2b and not be detached. Here, if the laminated body 50 is detached from the plate member using a jig, the substrate may be damaged.

  In the sticking method according to the present embodiment, in the detachment process, gas is sent from the delivery unit 28 toward the laminate 50, and the laminate is provided by the detachment pins 27 provided on the upper plate member 2b of the pair of plate members 2. Apply force to 50. Accordingly, the laminate 50 can be successfully detached from the upper plate member 2b without applying excessive force to the laminate 50 with a jig. Therefore, it is possible to prevent the substrate from being damaged when the stacked body 50 is detached from the upper plate member 2b. That is, in the sticking method according to the present embodiment, the laminate 50 can be detached from the upper plate member 2b while preventing the substrate from being damaged even when forming a laminate with high flatness.

  Further, the detachment pin 27 holds the stacked body 50, which has been detached from the upper plate member 2b by sending gas in the detachment process, by lightly pressing it against the lower plate member 2a. Thereby, it is possible to prevent the stacked body 50 from being displaced without sliding on the lower plate member 2a.

[Pressing process]
As shown to (a) and (b) of FIG. 1, in the press process which the sticking method which concerns on this embodiment includes, the laminated body 50 is pinched | interposed into a pair of plate member 2, and is pressed.

  First, as shown in FIG. 1 (a), the laminated body 50 is formed by placing a substrate and a support plate on each other with an adhesive layer, and then placing the pasting device by a transport device such as a robot arm. It is placed (set) on the plate 12.

  It is more preferable that the substrate and the support plate are temporarily fixed so that the relative position between the substrate and the support plate is not shifted in a state where the substrate and the support plate are previously overlapped with each other via an adhesive layer. Alternatively, the substrate and the support plate are superimposed on the plate member of the sticking device via an adhesive layer by a transfer device such as a robot arm, and placed on the placement plate 12 of the sticking device. Also good.

  The forming method and forming apparatus for forming the laminate 50, that is, the adhesive layer forming method and the adhesive layer forming apparatus, and the substrate and support plate overlapping method and the overlapping apparatus are particularly limited. Instead, various methods and apparatuses can be employed. As shown in FIG. 1B, the laminated body 50 only needs to be formed by laminating the substrate, the adhesive layer, and the support plate in this order at the time when the pressing force is applied by the sticking device. .

  Next, as shown in FIG. 1B, in the pressing step, the laminated body 50 placed on the lower plate member 2a provided in the sticking device is moved by the upper plate member 2b and the lower plate member 2a. Press to pinch. Here, the pressing force is applied to the stacked body 50 via the pair of plate members 2 by the support members 3 that support the pair of plate members 2 shown in FIG. 2.

  In the pressing step, the pressing plate 22 and the mounting plate 12 that directly sandwich the stacked body 50 are set so that the flatness of the surface in contact with the stacked body 50 is 1.0 μm or less when not pressed. For this reason, the laminated body 50 pressed so that it may be pinched | interposed into a pair of plate member 2 can obtain high flatness without bending.

  In the pressing step, when a pressing force is applied to the laminated body 50, it is preferable to heat the adhesive layer included in the laminated body at a temperature in the range of 50 ° C. or higher and 300 ° C. or lower. Thereby, the fluidity of the adhesive layer can be controlled. For this reason, a pressing force can be suitably applied to the laminate so that the adhesive layer has a uniform thickness. Moreover, since a laminated body can be formed using an adhesive with a high glass transition temperature, a laminated body with high heat resistance can be formed.

  In the pressing step, the pressing force applied to the stacked body 50 may be appropriately adjusted according to the size of the stacked body. In addition, the said pressing force is applied to the laminated body 50 through the upper side support member 3b and the upper side plate member 2b with a pressurization apparatus (not shown).

  Further, the pressing step may be performed under vacuum conditions. Even when the stacked body 50 is formed using a substrate provided with a step by a circuit element or the like by applying a pressing force to the stacked body 50 under a vacuum condition, the adhesive layer is embedded to the step of the substrate. be able to. It is preferable that the vacuum conditions in a press process are conditions of the range of 0.1 Pa or more and 10 Pa or less. Thus, the adhesive layer can be suitably embedded up to the level difference of the substrate in the stacked body 50.

[Separation process]
With reference to (c) and (e) of FIG. 1, the separation step included in the attaching method according to the present embodiment will be described. (C) of FIG. 1 is a figure explaining the outline of a separation | spacing process, (e) of FIG. 1 is the figure which expanded the area | region e of the broken line part in (c) of FIG.

  As shown in FIGS. 1C and 1E, the attaching method according to the present embodiment includes a separation step of separating the pair of plate members from each other after the pressing step and before the detaching step. Is included. Here, “separation” means that adjacent members are physically separated from each other.

  In the separation step, a pressure device (not shown) moves the upper plate member 2b upward via the upper support member 3b, thereby separating the upper plate member 2b and the lower plate member 2a (see FIG. 1 (c) and FIG. 2). Thereby, the stacked body 50 is released from the pressing force applied by the pair of plate members 2.

  In the separation step, the upper plate member 2b and the lower plate member 2a are separated so that the distance between the upper plate member 2b and the lower plate member 2a is within a range of 1 mm or more and 5 mm or less. It is preferable that the upper plate member 2b and the lower plate member 2a are separated so that the distance is within a range of 2 mm or more and 4 mm.

  As shown in FIG. 1C, the laminated body 50 is attached to the pressing plate 22 at this stage. In particular, when the flatness when the pressing plate 22 included in the upper plate member 2b is not pressed is 1.0 μm or less, the laminate 50 is easily attached to the surface of the pressing plate 22. In this case, the laminate 50 is in close contact with the upper plate member 2b against the urging force of the spring 27b that urges the detaching pin 27 provided in the upper plate member 2b. Further, as illustrated in FIG. 1E, the opening of the delivery unit 28 is blocked by the stacked body 50.

[Desorption step]
With reference to FIGS. 1D and 1F, the desorption process included in the attaching method according to the present embodiment will be described. (D) of FIG. 1 is a figure explaining the outline | summary of a desorption process, (f) of FIG. 1 is the figure which expanded the area | region f of the broken line part in (d) of FIG.

  As shown in FIG. 1 (d), in the detaching step, gas is sent from the delivery section 28 provided on the surface of the upper plate member 2b in contact with the laminate 50 toward the laminate 50, and the upper plate member 2b. A force is applied to the stacked body 50 by the detachment pin 27 provided on the substrate. Thereby, the laminated body 50 is detached from the upper plate member 2b provided with the delivery part 28 ((d) in FIG. 1).

  By sending the gas from the delivery unit 28 toward the laminated body 50, the adhesion between the laminated body 50 and the upper plate member 2b is lowered. Further, when the adhesion between the laminated body 50 and the upper plate member 2b is lowered, the laminated body 50 is forced to move away from the upper plate member 2b by the urging force of the spring 27b provided in the detaching pin 27. Added. Accordingly, the laminate 50 can be successfully detached from the upper plate member 2b without excessively applying force to the laminate 50 with the removal pin 27. Therefore, it is possible to prevent the substrate from being damaged when the stacked body 50 is detached from the upper plate member 2b. That is, even when a highly planar laminate is formed, the laminate 50 can be detached from the upper plate member 2b while preventing the substrate from being damaged.

  Moreover, in the sticking method which concerns on this embodiment, the laminated body 50 is hold | maintained using the detachment pin 27 after a detachment | desorption process. That is, the stack 50 detached from the upper plate member 2b by sending gas from the delivery unit 28 in the detaching step is placed on the mounting plate 12 provided in the lower plate member 2a by the detaching pin 27. It is held by pressing it lightly ((d) and (f) in FIG. 1). Accordingly, it is possible to prevent the stacked body 50 detached from the upper plate member 2b from being displaced due to the detached impact. For this reason, the laminated body 50 can be suitably hold | maintained on the lower side plate member 2a.

  In the separation step, the upper plate member 2b and the lower plate member 2a are separated so that the distance between the upper plate member 2b and the lower plate member 2a is within a range of 1 mm or more and 5 mm or less. If so, the stack 50 can be suitably held on the lower plate member 2a by the release pin 27 without giving excessive impact to the stack 50 in the detaching step.

In the desorption step, the gas sent toward the stacked body 50 may be air or an inert gas such as N ₂ or argon. Moreover, gas, such as air or an inert gas, may be adjusted to atmospheric pressure and may be compressed (pressurized). In addition, in the desorption process, the timing of sending the gas from the delivery unit 28 toward the stacked body 50 is not particularly limited as long as it is after the upper plate member 2b starts to move upward in the separation process.

Here, the amount of gas delivered toward the laminated body 50 is preferably 0.1 m ³ or less, and more preferably 0.01 m ³ or less. Note that the lower limit of the amount of gas may be sent even slightly, preferably the less, be greater than 0 m ^3. Thereby, the pressure reduction conditions in the chamber in which the sticking device is provided can be suitably maintained. That is, it is not necessary to prepare a decompression condition for performing the pressing step after the desorption step. Therefore, after the detachment step, the laminated body to be subsequently applied can be carried into the attaching device and the pressing step can be performed. That is, the next laminated body can be quickly affixed.

[Laminate 50]
The laminated body 50 to be attached is formed by laminating a substrate, an adhesive layer containing, for example, a thermoplastic resin, and a support plate that supports the substrate in this order. That is, the laminate 50 is formed after an adhesive layer is formed by applying an adhesive to one of the substrate and the support plate, or by applying an adhesive tape to which the adhesive is applied. The substrate, the adhesive layer, and the support plate are laminated in this order.

  The substrate is subjected to processes such as thinning, conveyance, and mounting while being supported (attached) to the support plate. The substrate is not limited to a wafer substrate, and may be any substrate such as a ceramic substrate, a thin film substrate, or a flexible substrate that needs to be supported by a support plate. Further, a step may be provided on the surface of the substrate by a circuit element or the like.

  The support plate is a support that supports the substrate, and is attached to the substrate via an adhesive layer. Therefore, the support plate only needs to have a strength necessary to prevent breakage or deformation of the substrate during a process such as thinning, transporting, and mounting of the substrate, and is desirably lighter. From the above viewpoint, the support plate is more preferably made of glass, silicon, acrylic resin, ceramic, or the like.

  The adhesive which comprises an adhesive bond layer should just contain the thermoplastic resin which heat-fluidity improves by heating, for example as an adhesive material. Examples of the thermoplastic resin include acrylic resins, styrene resins, maleimide resins, hydrocarbon resins, and elastomers.

  The method for forming the adhesive layer, that is, the method for applying the adhesive to the substrate or the support plate, or the method for forming the adhesive tape by applying the adhesive to the substrate is not particularly limited. Examples of the method for applying the adhesive include a spin coating method, a dipping method, a roller blade method, a doctor blade method, a spray method, and a coating method using a slit nozzle.

  What is necessary is just to set the thickness of an adhesive bond layer suitably according to the kind etc. of the board | substrate used as a sticking object, a support plate, the process given to the board | substrate after sticking, but it exists in the range of 10-150 micrometers. Preferably, it is in the range of 15-100 μm.

  When the support plate is peeled from the substrate, a solvent is supplied to the adhesive layer to dissolve the adhesive layer. Thereby, a board | substrate and a support plate can be isolate | separated. At this time, if the support plate has a through hole penetrating in the thickness direction, the solvent can be easily supplied to the adhesive layer through the through hole, which is more preferable.

  Further, a layer other than the adhesive layer may be further formed between the substrate and the support plate as long as the attachment is not hindered. For example, a separation layer that is altered by irradiation with light may be formed between the support plate and the adhesive layer. Since the separation layer is formed, the substrate and the support plate can be easily separated by irradiating light after processes such as thinning, transporting, and mounting of the substrate.

[Paste device]
The sticking device used in the sticking method according to the present embodiment will be described in more detail with reference to FIG. As shown in FIG. 2, in the sticking apparatus, the plate member 2 has a disk-like appearance, and is composed of a lower plate member 2a and an upper plate member 2b arranged in the vertical direction. Further, the pair of plate members 2 are supported by support members 3. The upper plate member 2 b includes a detachment pin (detachment member) 27 and a delivery unit 28. Further, the lower plate member 2 a includes a conveyance pin 17.

  In addition, the sticking apparatus shown in FIG. 2 can be sealed at the time of sticking, and is accommodated in a chamber (not shown) in which the inside of the sticking apparatus can be in a reduced pressure environment using a suction device or the like. Thus, the sticking method can be performed under vacuum conditions.

(Lower plate member 2a)
The lower plate member (plate member) 2a is a part in contact with the laminated body, for example, the mounting plate 12 on which the laminated body is placed with the substrate side down, and the center of the lower support member 3a of the column member 3 The support plate 14 is a part fixed to the support member 31, and the intermediate plate 13 is provided between the mounting plate 12 and the support plate 14.

  The mounting plate 12 and the intermediate plate 13 are formed of ceramics such as alumina. In addition, a heating device (not shown) such as a surface heater or a ribbon heater is interposed between the mounting plate 12 and the intermediate plate 13 to heat the lower plate member 2a. That is, the lower plate member 2a has a built-in heating device. Further, the lower plate member 2a includes a thermometer 16 that measures the temperature of the surface of the mounting plate 12, for example, a thermocouple.

  The support plate 14 is made of metal such as stainless steel, ceramics, stone, or the like. The intermediate plate 13 has a function as an insulator that prevents a short circuit between the heating device and the support plate 14. Further, when the support plate 14 is made of metal, it is easy to fix the lower plate member 2a to the lower support member 3a. The mounting plate 12, the intermediate plate 13, and the support plate 14 are fixed to each other with a plurality of bolts and nuts.

  The surface of the mounting plate 12 is formed so that the flatness when not pressed is 1.0 μm or less. Here, the flatness is a numerical value indicating the degree of unevenness with respect to the flat surface, and “the flatness is 1.0 μm or less” means that the surface of the mounting plate 12 (and a pressing plate 22 described later) at the time of non-pressing. It means that the unevenness is ± 1.0 μm or less. Moreover, the mounting plate 12 has a thickness (thickness in the vertical direction) of, for example, 35 mm or more so that the amount of bending at the time of pressing can be reduced. Since the mounting plate 12 is made of ceramics, it can be easily processed so that the flatness of the surface thereof is 1.0 μm or less. In addition, since ceramic has a smaller coefficient of thermal expansion than metal, it is possible to reduce the curvature and distortion of the surface of the mounting plate 12 and the surface of the pressing plate 22 when pressed in a heated state, that is, the curvature and distortion. Therefore, the flatness (levelness) of each surface can be maintained.

(Transport pin 17)
The lower plate member 2a further includes a plurality of transport pins 17 that lift the stacked body 50 when the stacked body 50 is transported. The conveyance pins 17 are provided in the portion of the placement plate 12 that is in contact with the stacked body in order to facilitate the conveyance operation by the conveyance device.

  The transport pin 17 is a member that lifts the stacked body 50 during transport in order to facilitate the transport operation of the stacked body 50 by the transport device before and after the pressing step. The transfer pin 17 is made of a metal such as stainless steel having a round tip, and is movably installed inside the placement plate 12. And the conveyance pin 17 is accommodated in the mounting plate 12 when the laminated body 50 is pressed by the control unit, for example, and protrudes from the surface of the mounting plate 12 when the pressing of the laminated body 50 is released. As such, its operation is controlled. As a result, the transport pins 17 can lift the stacked body 50 from the surface of the mounting plate 12 when transporting the stacked body 50 without scoring the substrate.

(Upper plate member 2b)
The upper plate member (plate member) 2b is a part that is in contact with the stacked body 50 and is fixed to, for example, the pressing plate 22 that presses the support plate and the center support member 41 of the upper support member 3b of the column member 3. The support plate 24 and the intermediate plate 23 provided between the pressing plate 22 and the support plate 24 are configured.

  The pressing plate 22 and the intermediate plate 23 are made of ceramics such as alumina. A heating device (not shown) such as a surface heater or a ribbon heater is sandwiched between the pressing plate 22 and the intermediate plate 23. That is, the upper plate member 2b has a built-in heating device. Further, the upper plate member 2b is provided with a thermometer 16 made of, for example, a thermocouple for measuring the temperature of the surface of the pressing plate 22.

  The support plate 24 is made of metal such as stainless steel, ceramics, stone, or the like. The intermediate plate 23 has a function as an insulator that prevents a short circuit between the heating device and the support plate 24. Further, when the support plate 24 is made of metal, it is easy to fix the upper plate member 2b to the upper support member 3b. The pressing plate 22, the intermediate plate 23, and the support plate 24 are fixed to each other with a plurality of bolts and nuts.

  The support plate 24 is provided with a communication channel 24a. The communication channel 24 a communicates with the outside of the chamber (not shown) through a supply port 25 through a pipe 26. The communication channel 24 a can supply the gas supplied from the outside of the sticking device through the pipe 26 and the supply port 25 to the delivery unit 28. Thereby, the sticking device can send gas from the sending part 28 toward the laminated body 50.

  The communication channel 24a is provided on the surface of the support plate 24 on the side where the intermediate plate 23 comes into contact, and the pressing plate 22 and the intermediate plate 23 are fixed to each other so that the outside of the upper plate member 2b, that is, the inside of the chamber. Isolated.

  The surface of the pressing plate 22 is formed so that the flatness when not pressed is 1.0 μm or less. Further, the pressing plate 22 has a thickness (a thickness in the vertical direction) of, for example, 35 mm or more so that the amount of bending at the time of pressing can be reduced. Since the pressing plate 22 is formed of ceramics, it can be easily processed so that the flatness of the surface thereof is 1.0 μm or less.

(Detaching pin 27)
The upper plate member 2b includes a plurality of detaching pins (detaching members) 27 that prevent the stacked body 50 from sticking to the upper plate member 2b at a portion of the pressing plate 22 that contacts the stacked body 50.

  The detaching pin 27 is made of a metal such as stainless steel, and is elastic so that the pin 27a and the pin 27a protrude from the surface of the pressing plate 22 as shown in FIGS. And a spring 27b for urging the spring. Thereby, after pressing the laminated body 50, when the lower plate member 2a and the upper plate member 2b are separated, a force can be applied to the laminated body 50 in a direction away from the upper plate member 2b.

  Moreover, it is more preferable that the tip A of the pin 27a on the side in contact with the laminated body is rounded so as not to bend the laminated body. The number of the detaching pins 27 is not particularly limited, but it is preferable that the number of the detachable pins 27 can be stably pressed, and in one example, three positions can be provided on the pressing plate 22.

[Sending unit 28]
The delivery unit 28 is a hole provided in the pressing plate 22 and delivers the gas supplied from the communication channel 24 a toward the stacked body 50. The sending unit 28 sends the gas from the pressing plate 22 toward the stacked body, whereby the stacked body 50 attached to the pressing plate 22 can be successfully detached.

  As shown in FIG. 2, in the sticking device used in the sticking method according to the present embodiment, the detachment pin 27 is accommodated in a delivery part 28 provided on the plate member 2. By storing the detachment pin 27 in the delivery unit 28 and allowing the gas to be delivered from the delivery unit 28, the sticking device can be configured simply. Moreover, the hole provided in the press plate 22 can be decreased.

(Supporting member 3)
The column member 3 is arranged in the vertical direction, and includes a lower support member 3a that supports the lower plate member 2a and an upper support member 3b that supports the upper plate member 2b. The lower support member 3a and the upper support member 3b are made of metal such as stainless steel, ceramics, stone, or the like.

  The lower support member 3a is fixed to the base 30, and a center support member 31 that supports at least the central portion of the lower plate member 2a, and a plurality of lower support members 3a that are fixed to the base 30 and support other than the central portion of the lower plate member 2a. And the peripheral support member 32. The lower support member 3a fixes the lower plate member 2a so that the surface of the mounting plate 12 is horizontal. The diameter of the center support member 31 only needs to have a strength necessary to support the lower plate member 2a at the time of pressing, but a smaller one is required so as not to release heat of the lower plate member 2a. desirable. The number of the peripheral support members 32 included in the lower support member 3a is within a range of 3 to 10 in order to support the entire lower plate member 2a in a balanced manner without releasing the heat of the lower plate member 2a. It is preferable that the number is 6, or 8 or more. The plurality of peripheral support members 32 are arranged at equal intervals to support the entire lower plate member 2a in a balanced manner, that is, so that the surface of the mounting plate 12 can be maintained level. . The diameter of the peripheral support member 32 only needs to have a strength necessary for reducing the amount of bending of the lower plate member 2a at the time of pressing, but in order not to let the heat of the lower plate member 2a escape. The thinner one is desirable.

  The upper support member 3b is connected to a pressure device (not shown) that applies (loads) a pressing force to press the laminated body 50, and is configured by a center support member 41 that supports at least the central portion of the upper plate member 2b. Has been. And the upper side support member 3b is fixing the upper side plate member 2b so that the surface of the press plate 22 may become horizontal. The diameter of the center support member 41 should just have intensity | strength required in order to support the upper side plate member 2b at the time of a press. The center support member 41 is movable in the vertical direction by being driven by a pressure device. Therefore, the upper support member 3b supports the upper plate member 2b so as to be movable in order to apply a pressing force to the stacked body 50.

  The peripheral support member 32 includes a cylindrical portion 32a and a support portion 32b accommodated in the cylindrical portion 32a. The support portion 32b can be expanded and contracted relatively in the moving direction of the upper plate member 2b, that is, in the vertical direction, by entering and exiting the cylindrical portion 32a. Specifically, the tip of the support portion 32b is fixed to the support plate 14, presses the lower plate member 2a against the pressing force by the upper plate member 2b, and the amount of bending of the lower plate member 2a For example, it can be expanded and contracted in units of 0.1 μm.

  The support portion 32b is such that the flatness of the surface of the mounting plate 12 is, for example, 1.0 μm or less, that is, the surface of the mounting plate 12 is corrected by correcting the curvature or distortion of the surface of the mounting plate 12. The sexuality (levelness) is maintained. For example, the expansion and contraction operation is manually performed using a tool or the like, and the flatness of the surface of the mounting plate 12 can be maintained by correcting the curvature or distortion of the surface of the mounting plate 12. The configuration and method for correcting the curvature or distortion of the surface of the mounting plate 12 at the time of non-pressing are not particularly limited as long as the planarity of the surface of the mounting plate 12 can be maintained. Various configurations and methods can be employed.

  In addition, the expansion / contraction operation | movement of the support part 32b by manual can be performed based on various references | standards. For example, a micrometer may be disposed below the mounting plate 12 and the support portion 32b may be expanded and contracted so as to correct the bending or distortion of the mounting plate 12 based on the measurement value of the micrometer. . Alternatively, the pressure distribution measuring device (sensor sheet) may be pressed against the plate member 2 and the support portion 32b may be expanded and contracted based on the measurement result of the pressure distribution measuring device so that there is no bias in the pressure distribution. Moreover, after actually pressing the laminated body in which the support plate is bonded to the substrate by the plate member 2, the flatness of the laminated body is measured by measuring the flatness of the laminated body and based on the measurement result. The support portion 32b may be expanded and contracted so as to improve the degree.

[Variation of application device]
The sticking device used in the sticking method according to the present invention is not limited to the structure of the sticking device shown in FIG. For example, a sticking device having the following configuration can also be used.

(Modification 1)
As shown in (a) of FIG. 3, in one modified example (modified example 1) of the sticking device, unlike the sticking device shown in FIG. 2, the supply port 25 and the pipe 26 are not side portions of the support plate 24. It is provided on the upper surface. In addition, the pipe 26 communicates with the outside of the chamber via a communication channel provided in the upper part of the center support member 41. As a result, the gas can be delivered to the delivery unit 28 via the communication channel 24 a provided in the support plate 24. For this reason, in the sticking apparatus shown in FIG. 3, the length of the piping 26 in the chamber can be shortened. Therefore, the space in the chamber in which the sticking device is provided can be made wider. Moreover, in the sticking apparatus shown in FIG. 3, since the piping 26 also raises / lowers in conjunction with raising / lowering of the upper side plate member 2b, the piping 26 does not expand / contract. That is, in the sticking apparatus shown in FIG. 3, it is possible to prevent a load from being applied to the pipe 26 due to the elevation of the upper plate member 2b.

  Here, as shown in FIG. 3B, the communication flow path 24 a is provided on the surface of the support plate 24 on the side where the intermediate plate 23 contacts. Further, the communication port a communicates with the supply port 25 and the pipe 26. Further, the communication hole b communicates with the delivery portion 28 provided on the pressing plate 22 through the intermediate plate 23. As a result, gas can be delivered from the delivery part 28 from the outside of the chamber.

  It is preferable that the groove constituting the communication flow path 24a provided in the support plate 24 has a depth in the range of 0.5 mm or more and 1 mm or less. Moreover, it is preferable that the width | variety of the groove | channel which comprises the communicating flow path 24a exists in the range of 5 mm or more and 12 mm or less. In addition, the diameter of the communication hole a communicating with the supply port 25 and the pipe 26 from the communication flow path 24a is preferably in the range of 2 mm or more and 4 mm or less, and the depth and width of the communication flow path 24a, and the communication hole a. By setting the diameter of the gas in the above range, it is possible to prevent an excessive amount of gas from being sent out toward the laminate in the desorption process. In the communication channel 24a of the sticking device shown in FIG. 2, the same conditions as those of the sticking device shown in FIG. 3 can be applied to the depth and width of the groove of the communication channel 24a and the diameter of the communication hole a.

  In addition, in the sticking apparatus shown in FIG. 3, about the other member which has the same member number as the sticking apparatus shown in FIG. 2, since it has the same function, the description is abbreviate | omitted.

(Modification 2)
Further, as another modified example (modified example 2) of the pasting device, a detecting unit (not shown) that detects the amount of bending of the plate member 2 that occurs when a pressing force is applied to the laminated body 50, and a detecting unit include You may use the sticking apparatus provided with the control part (not shown) which expands / contracts the periphery supporting member 32 so that the detected bending amount may be offset.

  Specifically, the detection unit includes a plurality of imaging elements such as CCD and COMS, and detects the amount of deflection in a non-contact manner by imaging the plate member 2, that is, the mounting plate 12 and the pressing plate 22. Can be configured. By using an image sensor such as CCD or COMS, the detection limit of the detection unit can be set to 1.0 μm. The amount of bending can be detected based on the center of the mounting plate 12 or the center of the pressing plate 22. In addition, the detection unit includes a plurality of sensors such as a pressure sensor built in the plate member 2 instead of the configuration including a plurality of imaging elements, and measures the pressure distribution applied to the mounting plate 12 and the pressing plate 22. The bend amount may be detected.

  Based on the detection result (measurement result) of the detection unit, the control unit bends the peripheral part of the mounting plate 12 and the peripheral part of the pressing plate 22 with reference to the central part of the mounting plate 12 or the central part of the pressing plate 22. The expansion / contraction operation of the support portion 32b of the peripheral support member 32 is pulse-controlled at a high gear ratio so that the amount is 1.0 μm or less, that is, the deflection amount is, for example, below the detection limit by the detection portion. can do. That is, if the sticking device according to this modification including the detection unit and the control unit is used, the peripheral portion of the mounting plate 12 and the pressing force are pressed when the laminate 50 is pressed, that is, when the substrate and the support are stuck. The amount of deflection of the peripheral portion of the plate 22 can be corrected by feedback control. For this reason, it becomes possible to affix a board | substrate and a support body uniformly through an adhesive bond layer. In addition, control of the expansion-contraction operation | movement of the support part 32b is not limited to the pulse control mentioned above, For example, motor control may be performed by methods other than pulse control, and a load cell may be arrange | positioned and feedback control may be carried out.

  In addition, the control unit may be configured to control the expansion / contraction operation of the support portion 32b of the peripheral support member 32 even when not pressed. That is, regardless of the pressing operation, the support portion 32b always corrects the curvature and distortion of the surface of the mounting plate 12 and the surface of the pressing plate 22 to correct the flatness (horizontal) The expansion / contraction operation may be controlled by the control unit so as to maintain the property. The control unit is configured to cancel the pulse control of the expansion / contraction operation of the support portion 32b so that the support portion 32b can be manually expanded / contracted using a tool or the like when not pressed. Also good.

(Modification 3)
Further, in another modified example (modified example 3) of the sticking device, the upper support member 3b may also include a peripheral support member, similarly to the lower support member 3a. That is, a plurality of peripheral support members may be provided on the center support member 41 and configured to support other than the center portion of the upper plate member 2b.

  The number of peripheral support members included in the upper support member 3b is within a range of 3 to 10 in order to support (press) the entire upper plate member 2b in a balanced manner without releasing the heat of the upper plate member 2b. Preferably, there are 6 or 8 more. The plurality of peripheral supporting members are arranged at equal intervals so as to support (press) the entire upper plate member 2b in a balanced manner, that is, to maintain the level of the surface of the pressing plate 22. . The diameters of these peripheral support members only have to have a strength necessary for reducing the amount of bending of the upper plate member 2b during pressing, but are thinner so as not to release heat of the upper plate member 2b. Is preferable.

  In addition, the peripheral support member can be constituted by a cylindrical portion and a support portion accommodated in the cylindrical portion, like the peripheral support member 32. The support part can be expanded and contracted relatively in the moving direction of the upper plate member 2b, that is, in the vertical direction, by entering and exiting the cylindrical part. Specifically, the front end of the support portion is in contact with the support plate 24 (fixed as necessary) to reduce the amount of bending of the upper plate member 2b against the pressing force of the upper plate member 2b. For example, it can be expanded and contracted in units of 0.1 μm. The support portion is manually expanded and contracted using, for example, a tool, and the flatness of the surface of the pressing plate 22 can be maintained by correcting the curvature and distortion of the surface of the pressing plate 22.

  The configuration and method for correcting the curvature and distortion of the surface of the pressing plate 22 when not pressed are not particularly limited, and various types can be used as long as the flatness of the surface of the pressing plate 22 can be maintained. Configurations and methods can be employed. For example, as in the above-described modification, the sticking device includes a detection unit and a control unit, and the control unit expands and contracts the support portion of the peripheral support member included in the upper support member 3b in addition to the support portion 32b of the peripheral support member 32. May be controlled in the same manner.

(Modification 4)
Further, in another modified example (modified example 4) of the sticking device, the sticking device detects a misalignment of the laminate when the misalignment of the laminate 50 occurs in the detaching step (see FIG. (Not shown). Thereby, the malfunction by a position shift of a layered product in a desorption process can be detected quickly.

  An example of the misregistration detection means is an optical fiber sensor. A plurality of optical fiber sensors may be provided with a width in the range of 0.5 mm or more and 5 mm or less from the end of the position where the laminated body is in contact with the upper plate member 2b toward the outside. The lower plate member 2a may be provided with a plurality of reflecting mirrors that reflect the light emitted from the plurality of optical fiber sensors. Here, the plurality of optical fiber sensors provided on the upper plate member 2b and the plurality of reflecting mirrors provided on the lower plate member 2a may be provided so as to face each other one to one.

  Thereby, if the light irradiated by the optical fiber sensor is reflected by the reflecting mirror and detected by all the optical fiber sensors, the optical fiber sensor determines that the laminated body 50 is not displaced from the predetermined position. Moreover, if the light irradiated by the plurality of optical fiber sensors is blocked by the laminated body 50 at least at one place, the optical fiber sensor determines that the laminated body 50 is displaced from a predetermined position. Thereby, the position shift of the laminated body 50 in the detaching process can be detected, and problems during the production of the laminated body can be prevented.

  The sticking device may be configured to detect the positional deviation of the laminated body by providing at least three sets of optical fiber sensors and reflecting mirrors. It goes without saying that an optical fiber sensor may be provided on the lower plate member 2a, and a reflecting mirror may be provided on the upper plate member 2b.

<Another embodiment of the sticking method>
The sticking method according to the present invention is not limited to the above embodiment. For example, in the detaching step included in the attaching method according to another embodiment, for example, the laminate 50 attached to the lower plate member 2a may be detached in the detaching step.

  In this case, as an example, a spring may be provided on the transfer pin 17 provided on the lower plate member 2a, and the gas may be sent from the outside to the recess for storing the transfer pin 17. As a result, the concave portion that accommodates the transport pin 17 can be used as the delivery portion, and the transport pin 17 can be used as the detachment pin. For this reason, the laminated body 50 can be detached from the lower plate member 2a in the same manner as when the laminated body 50 is attached to the upper plate member 2b. It should be noted that the stacking unit 50 attached to the lower plate member 2a may be detached by performing the detaching process using a sticking device having the lower plate member 2a provided with the delivery section 28 and the detaching pin 27. Needless to say.

  Further, in the detachment step included in the attaching method according to another embodiment, for example, gas is sent from the delivery unit provided on the upper plate member 2b toward the laminated body 50 attached to the upper plate member 2b. And a force may be applied to the laminated body 50 using a detachment pin provided on the lower plate member 2a. In the sticking method according to the present embodiment, for example, a suction member such as a suction cup is provided at the tip A of the detachment pin provided in the lower plate member 2a shown in FIGS. You may apply force to the laminated body 50 in the direction away from the upper side plate member 2b using an adsorption member. In addition, after the desorption step, the stacked body 50 may be held on the lower plate member 2a by adsorbing the stacked body 50 with the adsorbing member.

  In addition, when the laminated body 50 adheres to the lower plate member 2a, the lower plate member 2a is provided with a delivery unit that sends gas toward the laminated body 50, and the upper plate member 2b is provided with an adsorption member. You may make it the structure which provides a detaching pin. Thereby, gas can be sent out from the lower plate member 2a toward the laminated body 50. Moreover, force can be applied to the laminated body 50 in the direction away from the lower plate member 2a by the detaching pin provided with the suction member provided on the upper plate member 2b. Therefore, the desorption process included in the attaching method according to the present invention can be suitably performed.

  In the pressing step and the detaching step according to the embodiment, the upper plate member 2b is fixed, and the lower plate member 2a and the lower support member 3a are driven in the vertical direction by a pressurizing device. You may do it. Further, the pressing step and the detaching step may be performed by driving the lower plate member 2a and the upper plate member 2b in the vertical direction.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention. Furthermore, a new technical feature can be formed by combining the technical means disclosed in each embodiment.

[Evaluation of detachability of laminate]
With the attaching method according to the present invention, the detachability of the laminate attached to the upper plate member was evaluated. In addition, as a sticking apparatus, the sticking apparatus provided with the structure shown in FIG. 2 was used.

  TZNR (registered trademark) -A4017t (manufactured by Tokyo Ohka Kogyo Co., Ltd.) is spin-coated on a semiconductor wafer substrate (12 inches of silicon) and baked at temperatures of 90 ° C., 160 ° C., and 220 ° C. for 4 minutes each to form an adhesive layer. (Film thickness 50 μm).

Next, a bare glass support (12 inches, thickness 700 μm) was used as a support plate, and a separation layer was formed on the support plate by a plasma CVD method using fluorocarbon. Fluorocarbon as a separation layer is formed by performing a CVD method using C ₄ F ₈ as a reactive gas under the conditions of a flow rate of 400 sccm, a pressure of 700 mTorr, a high-frequency power of 2500 W, and a film formation temperature of 240 ° C. A film (thickness 1 μm) was formed on the support plate.

  Next, the support plate, the separation layer, the adhesive layer, and the wafer substrate are stacked in this order, and the pressing force is applied to the support plate and the wafer substrate by pressing for 50 seconds with a pressure of 4000 kgf under vacuum. (Pressing step).

  Thereafter, the upper plate member and the lower plate member were separated by moving the upper plate member upward (a separation step). Here, the separation step was performed so that the distance between the laminate attached to the upper plate member and the lower plate member was 2 mm.

After that, 0.1 m ^{3 of} atmospheric pressure air was sent out from the sending part provided on the upper plate member, and the desorption process was performed. The sticking method was performed 10 times, and the presence or absence of the laminate stuck to the upper plate member and the detachability of the laminate due to the detaching process when the laminate stuck to the upper plate member were evaluated. Moreover, in the detachment | desorption process, it evaluated using the optical fiber sensor with which the sticking apparatus was equipped about whether the laminated body produced position shift of 2 mm or more.

〔result〕
Table 1 shows the results of the presence or absence of the laminate attached to the upper plate member and the detachability of the laminate by the detachment process when the laminate is attached to the upper plate member. Regarding the attachment of the laminate to the upper plate member in Table 1, the case where the laminate was attached to the upper plate member before the detaching step was (x), and the laminate was not attached to the upper plate member. The case was evaluated as (◯). Further, the detachability of the laminate was evaluated as (◯) when the laminate was detached in the detachment process without causing damage to the substrate and without displacement of the substrate. In addition, (-) in the column of the detachability of the laminated body in Table 1 means that the detaching process was not performed because the laminated body was not attached to the upper plate member at the stage of performing the separating process. To do.

  From the above evaluation results, it was confirmed that even when the laminate was stuck to the upper plate member, the laminate can be successfully detached from the upper plate member without damaging the substrate by performing the detachment process.

  In addition, when the desorption process was performed, no misalignment detection error of the laminate occurred. Therefore, it was confirmed that the stacked body 50 detached from the upper plate member 2b was held on the lower plate member without causing a positional shift.

  Moreover, the vacuum condition inside the chamber after the desorption step was maintained at about 10 Pa, and it was confirmed that the condition was maintained such that the laminate can be continuously attached.

  The sticking method according to the present invention can be widely used, for example, in a manufacturing process of a miniaturized semiconductor device.

2 Plate member 2a Lower plate member (Plate member)
2b Upper plate member (plate member)
27 Detachment pin (detachment member)
27a pin (detaching member)
27b Spring (detaching member)
28 Sending part 50 Laminate

Claims (5)

The substrate and the support are attached via the adhesive layer by applying a pressing force to the laminate formed by laminating the substrate, the adhesive layer, and the support supporting the substrate in this order. A sticking method,
A pressing step of sandwiching and pressing the laminated body between a pair of plate members;
A separation step in which the pair of plate members are vertically separated while the laminate is attached to the upper plate member of the pair of plate members;
By sending gas from the delivery part provided on the surface of the upper plate member in contact with the laminate to the laminate and applying force to the laminate by the detaching member provided on the upper plate member A desorption step of detaching the laminate from the upper plate member in this order ,
The sticking method characterized by holding the laminated body using the detaching member after the detaching step . The substrate and the support are attached via the adhesive layer by applying a pressing force to the laminate formed by laminating the substrate, the adhesive layer, and the support supporting the substrate in this order. A sticking method,
A pressing step of sandwiching and pressing the laminated body between a pair of plate members;
A separation step in which the pair of plate members are vertically separated while the laminate is attached to the upper plate member of the pair of plate members;
By sending gas from the delivery part provided on the surface of the upper plate member in contact with the laminate to the laminate and applying force to the laminate by the detaching member provided on the upper plate member A desorption step of detaching the laminate from the upper plate member in this order,
In the separation step, the separation is performed such that the distance between the pair of plate members is a distance within a range of 1 mm or more and 5 mm or less. The sticking method according to claim 1 or 2 , wherein the detaching member is accommodated in the delivery part provided in the upper plate member. The amount of the said gas sent toward the said laminated body is 0.1 m < ³ > or less, The sticking method of any one of Claims 1-3 characterized by the above-mentioned.   The sticking method of any one of Claims 1-4 whose flatness of the surface which the said laminated body contacts of the said upper side plate member is 1.0 micrometer or less at the time of non-pressing.

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