TW201540511A - Bonding method - Google Patents

Abstract

An object of the present invention is to prevent a substrate from being damaged, while allowing the substrate and a support to separate from a plate member. A bonding method according to a solution of the present invention comprises: a pressing step in which a laminate (50) is interposed between a pair of plate members (2) and pressed, and a separating step in which, after the pressing step, gas is discharged from a discharging section (28) that is provided on a surface of the plate member of at least one side of the pair of plate members (2) that is jointed to the laminate (50) and a separation pin (27) that is provided on the plate member of at least one side of the pair of plate members (2) is operated to apply a force to the laminate (50) so as to have the laminate (50) separate from the plate member that is provided with the discharging section (28).

Description

Attachment method

The present invention relates to a method of attaching a substrate and a support to an adhesive layer via an adhesive layer.

As an attachment technique of attaching a substrate and a support via an adhesive layer, for example, the extrusion processing method of the inorganic substrate described in Patent Document 1 is a pair of hot plates heated to a predetermined temperature by a vacuum extruder. A device for assembling a laminate comprising an inorganic substrate made of a semiconductor or a ceramic and an auxiliary material for laminating processing is provided, and after the combination device brings the pair of hot plates into contact, the application is performed for at least 10 seconds or more. The low pressure load from the start of pressurization to 0.05 MPa.

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2002-192394 (published on July 10, 2002)

However, the inventors of the present invention have found that a substrate such as a wafer substrate and a support for supporting the substrate are attached to each other via an adhesive layer, and the prior extrusion processing method described in Patent Document 1 is employed. Next, the following problems will occur. In other words, when the substrate and the support are pushed and pressed by the plate member using an extruder having a pair of upper and lower plate members, the plate member can be adhered to the support or the substrate. Therefore, when the flatness of the plate member and the support is high, the substrate and the support may be attached to the plate member.

Here, when the substrate and the support attached to the plate member are detached from the plate member only by a jig such as a pin, the force applied by the pin may cause damage to the substrate.

The present invention has been made in view of the above problems, and an object thereof is to provide a method of attaching a substrate and a support member from the plate member while preventing damage to the substrate.

In order to solve the above problems, the attachment method of the present invention is to apply a pressing force to a laminate formed by laminating a substrate, an adhesive layer, and a support supporting the substrate in this order. a method of attaching the support body to the support layer via the adhesive layer, wherein the method includes: a pressing step of pressing the pair of plate members into the laminate; and pressing the step after the pressing step At least among the board members One of the plate members is supplied to the laminate by a delivery portion provided on a surface of the laminate, and the laminate is formed by a release member provided by at least one of the pair of plate members. The body is biased to separate the laminate from the plate member provided with the delivery portion.

According to the present invention, it is possible to prevent the substrate from being damaged and to remove the substrate and the support from the plate member.

2‧‧‧ board components

2a‧‧‧Bottom plate member (plate member)

2b‧‧‧Upper plate member (plate member)

27‧‧‧Disengagement pin (disengagement member)

27a‧‧‧ pin (disengagement member)

27b‧‧‧Spring (disengagement member)

28‧‧‧Send out

50‧‧‧Layer

Fig. 1 is a schematic explanatory view showing a method of attaching an embodiment of the present invention.

Fig. 2 is a schematic explanatory view showing an attachment device used in the attachment method of an embodiment of the present invention.

Fig. 3 is a schematic explanatory view showing a attaching apparatus according to a modification used in the attaching method of an embodiment of the present invention.

In the attaching method according to an embodiment of the present invention, the substrate and the substrate are formed by applying a pressing force to a laminate formed by laminating a substrate, an adhesive layer, and a support supporting the substrate in this order. a method of attaching the support body via the adhesive layer, comprising: a pressing step of pressing the pair of plate members into the laminate and pressing the same; and the pressing After the step, the gas is supplied to the laminate from the delivery portion provided on the surface of the laminate of at least one of the pair of plate members, and at least one of the pair of plate members is used. The detaching member provided in one of the plate members biases the laminated body to separate the laminated body from the plate member on which the delivery portion is provided.

According to the above configuration, it is possible to prevent the substrate from being broken and to separate the substrate and the support from the plate member.

<attach method>

One embodiment of the attachment method of the present invention will be described in more detail with reference to Figs. 1 and 2. Fig. 1 is a schematic explanatory view showing a method of attaching an embodiment of the present invention. 2 is a schematic explanatory view of an attaching device used in the attaching method of an embodiment of the present invention.

The attaching method according to an embodiment of the present invention is applied by laminating a substrate 50, an adhesive layer, and a support plate (supporting body) of the supporting substrate in this order. a method of attaching a substrate to a support body via an adhesive layer, comprising: a pressing step of pressing the laminated body 50 on the pair of plate members 2 and pressing it (Fig. 1 (b)); After the pressing step, gas is supplied to the laminated body 50 from the delivery portion 28 provided on the surface of the laminated body 50 of at least one of the pair of plate members 2, and the pair of plate members 2 are used. The disengagement pin (disengagement member) 27 provided in at least one of the plate members biases the laminate 50 and separates the laminate 50 from the plate member on which the delivery portion 28 is provided (Fig. 1(d) ).

Further, the attaching method according to an embodiment of the present invention includes a step of separating the pair of plate members 2 from each other after the pressing step and before the detaching step ((c) of Fig. 1).

Further, in the attaching method according to an embodiment of the present invention, after the detaching step, the laminated body 50 is held by the detaching pin 27 ((d) and (f) of Fig. 1).

The attaching method shown in (a) to (f) of Fig. 1 can be carried out by using the attaching device shown in Fig. 2. One of the attaching devices shown in Fig. 2 is provided to separate the plate member 2 from the upper and lower sides, and the delivery portion 28 and the disengagement pin 27 are provided on the upper side upper plate member 2b.

Further, the escape pin 27 is housed in the delivery portion 28. Here, the disengagement pin 27 is provided with the pin 27a and the spring 27b, and the spring 27b presses the pin 27a. Further, it is formed that the gas can be sent out from the delivery portion 28 to the laminate 50. Here, the gas passes through the pipe 26 and the supply port 25 from the outside, and is supplied to the delivery portion 28 from the communication passage 24a of the upper plate member 2b.

In addition, the pressing plate 22 is provided on the surface of the upper side plate member 2b where the laminated body 50 is contacted, and the mounting surface 12 is provided on the surface which the laminated body 50 of the lower side plate member 2a contacts. Here, in the pressing plate 22 and the mounting plate 12, the flatness of the surface which the laminated body 50 contacts is set to 1.0 micrometer or less at the time of non-pressing.

Further, the attachment method of the present embodiment is carried out under vacuum conditions.

In the substrate attached to the support plate by the attaching device To form a fine circuit. Here, in order to accurately process the circuit component on the substrate, when the substrate and the support plate are attached via the adhesive layer, it is required to attach the substrate to the support plate so as not to be deflected and to obtain high planarity. . Further, the substrate and the support plate are required to be attached in such a manner as to form a uniform thickness. Therefore, the formation of the laminate using the attached substrate and the support plate is carried out under vacuum conditions using the plate member 2 having a high degree of flatness.

Here, when the plate member 2 having a high degree of flatness is formed and the substrate and the support plate are attached via the adhesive layer under vacuum, the plate member 2 and the laminate 50 have a high flatness. Therefore, the adhesion between the plate member 2 and the laminate 50 is made high. Therefore, when the pressing of the laminated body 50 is completed and the upper side plate member 2b and the lower side plate member 2a are separated, the laminated body 50 may adhere to the upper side plate member 2b without being detached. Here, if the jig 50 is to be detached from the plate member by the jig, there is a fear that the substrate is broken.

In the attachment method of the present embodiment, the gas is sent out from the delivery unit 28 to the laminate 50 in the detachment step, and the separation pin 27 of the upper plate member 2b provided in the pair of plate members 2 is used. The laminate 50 is forced. Thereby, the laminated body 50 can be smoothly detached from the upper side plate member 2b without the transition of the laminated body 50 by the jig. Therefore, it is possible to prevent the substrate from being damaged when the laminated body 50 is detached from the upper side plate member 2b. In other words, in the attachment method of the present embodiment, it is possible to prevent the substrate from being damaged and to separate the laminate 50 from the upper side plate member 2b while forming a laminate having high planarity.

Further, the disengagement pin 27 is in the detaching step, and the laminated body 50 which is sent out of the upper side plate member 2b by the use of the gas is gently pressed. The lower side plate member 2a is held and held. Thereby, the laminated body 50 does not slide on the lower side plate member 2a, and the positional deviation can be prevented.

[pressing step]

As shown in FIGS. 1(a) and 1(b), in the pressing step included in the attaching method of the present embodiment, the laminated body 50 is inserted into the pair of plate members 2 and pressed.

First, as shown in Fig. 1(a), after the substrate and the support plate are laminated via an adhesive, the laminate 50 is placed (positioned) on the substrate by a transfer device such as a robot arm. The mounting plate 12 of the device.

Preferably, the substrate and the support plate are temporarily fixed in such a manner that the relative positions of the substrate and the support plate do not deviate in a state in which the adhesive is laminated in advance. Alternatively, the substrate and the support plate may be stacked on the plate member of the attaching device via the adhesive layer by a transfer device such as a robot arm, and placed on the mounting plate 12 of the attaching device.

Moreover, the method of forming the laminate 50 and the forming apparatus, that is, the method of forming the adhesive layer or the adhesive layer forming apparatus, and the method of laminating the substrate and the support sheet or the laminating apparatus are not particularly limited, A variety of methods or devices can be employed. As shown in Fig. 1(b), the laminate 50 may be formed by laminating the substrate, the adhesive layer, and the support plate in this order when a pressing force is applied by the attaching device.

Next, as shown in Fig. 1(b), in the pressing step, the laminated body 50 of the lower side plate member 2a provided in the attaching device is placed. The upper side plate member 2b and the lower side plate member 2a are used to be intruded and pressed. Here, the pressing force is applied to the laminated body 50 by the pillar members 3 supporting the pair of plate members 2 shown in FIG. 2 and via the pair of plate members 2.

In the pressing step, the pressing plate 22 and the placing plate 12 of the laminated body 50 are directly inserted, and the flatness of the surface on which the laminated body 50 contacts is set to 1.0 μm or less at the time of non-pressing. Therefore, the laminated body 50 which is inserted and pressed by the pair of plate members 2 can obtain high flatness without deflection.

In the pressing step, when the pressing force is applied to the laminated body 50, it is preferable to set the laminated body 50 to a temperature in the range of 50 ° C or more and 300 ° C or less to heat the adhesive layer provided in the laminated body. Thereby, the fluidity of the adhesive layer can be suppressed. For this reason, it is possible to apply a pressing force to the laminate in a uniform manner in the thickness of the adhesive layer. Further, since the laminate can be formed using an adhesive having a high glass transition temperature, a laminate having high heat resistance can be formed.

In the pressing step, the pressing force applied to the laminated body 50 may be adjusted as appropriate depending on the size of the laminated body. Further, the pressing force is applied to the laminated body 50 by a pressurizing device (not shown) via the upper supporting member 3b and the upper side plate member 2b.

Further, the pressing step may be performed under vacuum conditions. In the vacuum condition, by applying a pressing force to the laminated body 50, even if the substrate used for forming the laminated body 50 is provided with a step due to a circuit component or the like, the adhesive layer can be buried in the substrate. difference. The vacuum condition of the pressing step is preferably in the range of 0.1 Pa or more and 10 Pa or less. borrow Thereby, the step of the adhesive layer can be appropriately embedded in the substrate of the laminate 50.

[Isolation step]

The evacuation step included in the attachment method of the present embodiment will be described with reference to (c) and (e) of Fig. 1. Fig. 1(c) is a schematic explanatory view of the evacuation step; Fig. 1(e) is an enlarged view of the area e of the broken line portion of Fig. 1(c).

As shown in FIGS. 1(c) and 1(e), the attaching method according to the present embodiment includes a step of separating the pair of plate members from each other after the pressing step and before the separating step. Here, "isolation" means physically separating components that are close to each other by a distance.

In the evacuation step, the pressurizing device (not shown) moves the upper plate member 2b upward and the lower plate member 2a by moving the upper plate member 2b upward in the upper support member 3b (Fig. 1(c) And Figure 2). Thereby, the laminated body 50 is released from the pressing force applied by the pair of plate members 2.

Further, in the evacuation step, the distance between the upper side plate member 2b and the lower side plate member 2a is preferably such that the upper side plate member 2b and the lower side plate member 2a are separated from each other by a distance of 1 mm or more and 5 mm or less, and the upper side plate member is allowed to be separated. 2b is more preferably separated from the lower side plate member 2a by a distance of 2 mm or more and 4 mm or less.

As shown in FIG. 1(c), at this stage, the laminate 50 is attached to the pressing plate 22. In particular, the pressing plate provided in the upper side plate member 2b When the flatness at the time of non-pressing is 1.0 μm or less, the laminated body 50 can be easily attached to the surface of the pressing plate 22. In this case, the laminated body 50 is in close contact with the upper side plate member 2b against the elastic pressure of the spring 27b of the release pin 27 provided in the upper side plate member 2b. Further, as shown in FIG. 1(e), the opening portion of the delivery portion 28 is closed by the laminate 50.

[disengagement step]

The detachment step included in the attachment method of the present embodiment will be described with reference to (d) and (f) of Fig. 1. Fig. 1(d) is a schematic explanatory view of the detachment step; Fig. 1(f) is an enlarged view of the field f of the broken line portion of Fig. 1(d).

As shown in Fig. 1(d), in the detachment step, the gas is sent out from the delivery portion 28 provided on the surface of the upper laminate member 2b of the contact laminate 50 to the laminate 50, and the release pin provided on the upper plate member 2b is used. 27 applies force to the laminate 50. Thereby, the laminated body 50 is detached from the upper side plate member 2b provided with the delivery part 28 (FIG. 1 (d)).

By feeding the gas from the delivery unit 28 to the laminate 50, the adhesion between the laminate 50 and the upper plate member 2b is lowered. In addition, when the adhesion between the laminate 50 and the upper plate member 2b is lowered, the force of the spring 27b provided in the release pin 27 is applied to the laminate 50 in a direction away from the upper plate member 2b. Thereby, the laminated body 50 can be smoothly detached from the upper side plate member 2b without the transition force of the laminated body 50 by the disengagement pin 27. Therefore, it is possible to prevent the substrate from being damaged when the laminated body 50 is detached from the upper side plate member 2b. In other words, even if a laminate having a high planarity is formed, it is possible to prevent the substrate from being damaged while allowing the laminate 50 to be formed. It is detached from the upper side plate member 2b.

Further, in the attaching method of the present embodiment, the laminated body 50 is held by the release pin 27 after the detachment step. In other words, the gas is sent out from the delivery unit 28 in the detachment step, and the laminated body 50 detached from the upper side plate member 2b is lightly pressed against the placing plate 12 provided on the lower side plate member 2a by the detachment pin 27. And to maintain (Figure 1 (d) and (f)). Thereby, it is possible to prevent the positional deviation of the laminated body 50 detached from the upper side plate member 2b due to the impact of the detachment. Therefore, the laminated body 50 can be appropriately held on the lower side plate member 2a.

Further, in the detachment step, if the distance between the upper side plate member 2b and the lower side plate member 2a is a distance in the range of 1 mm or more and 5 mm or less, the upper side plate member 2b and the lower side plate member 2a are separated from each other, and the detachment step is performed. The laminated body 50 can be appropriately held on the lower side plate member 2a by the detachment pin 27 without excessive impact on the laminated body 50.

In the detachment step, the gas sent to the laminate 50 may be air or an inert gas such as nitrogen or argon. Further, a gas such as air or an inert gas may be adjusted to atmospheric pressure or compressed (pressurized). Further, in the detachment step, the timing at which the gas is sent out from the delivery unit 28 to the laminate 50 is not particularly limited as long as the upper plate member 2b is moved upward in the upward separation step.

Here, the amount of the gas sent to the laminate 50 is preferably 0.1 m ³ or less, more preferably 0.01 m ³ or less. Further, the lower limit of the amount of gas may be at least sent, and the smaller the better, the larger the value is greater than 0 m ³ . Thereby, the decompression conditions in the room in which the attachment device is provided can be appropriately maintained. That is, after the detachment step, it is not necessary to modify or adjust the decompression conditions for performing the pressing step. Therefore, after the detachment step, the next attached laminate can be quickly carried into the attaching device and the pressing step can be performed. That is, the next laminate can be attached quickly.

[Layer 50]

The laminate 50 to be attached is formed by laminating a substrate, an adhesive layer containing, for example, a thermoplastic resin, a support plate supporting the substrate, and the like in this order. That is, the laminate 50 is formed by applying an adhesive to either one of the substrate or the support plate, or by forming an adhesive layer by applying an adhesive to the adhesive tape. The adhesive layer and the support plate are laminated in this order.

The substrate is supplied to a processing procedure such as thinning, conveyance, and mounting while being supported (attached) to the support plate. The substrate is not limited to the wafer substrate. For example, any substrate such as a ceramic substrate, a film substrate, or a flexible substrate that is supported by the support plate may be used. Further, it is also possible to set a step on the surface of the substrate by using a circuit element or the like.

The support plate is a support for supporting the substrate and attached to the substrate via an adhesive layer. Therefore, the support plate may have a necessary strength in order to prevent breakage or deformation of the substrate during processing such as thinning, transport, or mounting of the substrate, and it is preferable to be lighter. From the above viewpoints, the support plate is preferably made of glass, iridium, acryl resin, ceramics or the like.

An adhesive constituting the adhesive layer, for example, containing The thermoplastic resin which is heated to improve the thermal fluidity may be used as the adhesive material. Examples of the thermoplastic resin include a propylene resin, a styrene resin, a maleic imine resin, a hydrocarbon resin, and an elastomer.

The method of forming the subsequent layer, that is, the method of applying the adhesive to the substrate or the support sheet, or the method of forming the adhesive to form the adhesive on the substrate is not particularly limited, and is used as an adhesive. Examples of the coating method include a spin coating method, a dipping method, a roll coating method, a doctor blade method, a spray coating method, a coating method using a slit nozzle, and the like.

The thickness of the layer to be applied may be set as appropriate depending on the type of the substrate to be attached and the support plate, and the treatment of the substrate after the attachment, and is preferably in the range of 10 to 150 μm, and in the range of 15 to 100 μm. Better.

Further, when the support plate is peeled off from the substrate, the solvent may be supplied to the adhesive layer and the adhesive layer may be dissolved. Thereby, the substrate can be separated from the support plate. At this time, if the support plate is formed with a through hole penetrating in the thickness direction thereof, the solvent can be easily supplied to the adhesive layer via the through hole, which is preferable.

Further, another layer other than the adhesive layer may be further formed between the substrate and the support plate so as not to interfere with the adhesion. For example, a separation layer that is degraded by irradiation of light may be formed between the support plate and the adhesive layer. By forming the separation layer, it is possible to easily separate the substrate from the support plate by irradiating light after a processing procedure such as thinning, transporting, or mounting of the substrate.

[attachment device]

The attachment device used in the attachment method of the present embodiment will be described in more detail with reference to Fig. 2 . As shown in Fig. 2, in the attaching device, the plate member 2 has a disk-like appearance and is composed of a lower plate member 2a and an upper plate member 2b disposed in the vertical direction. Further, the pair of plate members 2 are supported by the strut members 3. The upper side plate member 2b is provided with a release pin (disengagement member) 27 and a delivery part 28. Further, the lower side plate member 2a is provided with a transfer pin 17.

Moreover, the attaching apparatus shown in FIG. 2 can be sealed at the time of attachment, and can be accommodated in a room (not shown) which can form a decompression environment inside by a suction device etc.. Thereby, the attachment method can be carried out under vacuum conditions.

(lower side plate member 2a)

The lower side plate member (plate member) 2a is a portion on which the laminated body is placed, for example, the mounting plate 12 on which the laminated body is placed below the substrate side, and is fixed to the center of the lower supporting member 3a of the stay member 3 The support plate 14 at the portion of the support member 31 and the intermediate plate 13 provided between the mounting plate 12 and the support plate 14 are formed.

The placing plate 12 and the intermediate plate 13 are formed of ceramics such as alumina. Further, between the placing plate 12 and the intermediate plate 13, a heating device (not shown) such as surface heating or belt heating that heats the lower side plate member 2a is inserted. That is, the lower side plate member 2a is provided with a heating device Set. Further, the lower side plate member 2a is provided with a thermometer 16 made of, for example, a thermocouple or the like for measuring the surface temperature of the placing board 12.

The support plate 14 is formed of a metal such as stainless steel, ceramics or stone. The intermediate plate 13 has a function of an insulator that prevents short-circuiting of the heating device and the support plate 14. Further, in the case where the support plate 14 is formed of metal, it is easy to fix the lower side plate member 2a to the lower side support member 3a. Further, the placing plate 12, the intermediate plate 13, and the supporting plate 14 are fixed to each other by a plurality of screws and nuts.

The mounting plate 12 has a flatness of 1.0 μm or less when the surface thereof is formed without pressing. Here, the flatness is a numerical value indicating the degree of unevenness with respect to the plane; "the flatness is 1.0 μm or less", and the unevenness of the surface of the mounting plate 12 (and the pressing plate 22 to be described later) when the non-pressing is performed is ± 1.0 μm or less. In addition, the mounting plate 12 has a thickness (thickness in the vertical direction) of, for example, 35 mm or more so that the amount of deflection at the time of pressing can be reduced. Since the mounting plate 12 is formed of ceramics, the flatness of the surface can be easily processed to 1.0 μm or less. Further, the ceramic is smaller than the metal, and the surface of the mounting plate 12 and the surface of the pressing plate 22 at the time of pressing in a heated state can be reduced in bending or skew due to a small thermal expansion coefficient, that is, due to bending or skewing, etc. It is less likely to occur and the planarity (horizontality) of each of the above surfaces can be maintained.

(transport pin 17)

The lower side plate member 2a further includes a plurality of conveying pins 17 that lift the laminated body 50 when the laminated body 50 is conveyed. The transfer pin 17 is attached to the mounting plate The part of the contact laminate of 12 is provided in order to facilitate the conveyance operation by the conveyance device.

The conveyance pin 17 is a member that lifts the laminate 50 at the time of conveyance in order to facilitate the conveyance operation of the laminate 50 by the conveyance device before the pressing step. The transfer pin 17 is made of a metal such as stainless steel whose tip end is formed in a circular shape, and is movably provided inside the mounting plate 12. Then, the conveyance pin 17 is controlled by the control unit, and is housed inside the placing plate 12 when the laminated body 50 is pressed, and when the pressing of the laminated body 50 is released, the mounting plate 12 is removed. The surface is highlighted. By this, the conveyance pin 17 can lift the laminated body 50 from the surface of the mounting board 12 when the laminated body 50 is conveyed without damage of a board|substrate.

(upper side plate member 2b)

The upper side plate member (plate member) 2b is pressed by a portion contacting the laminated body 50, for example, a pressing plate 22 of the supporting plate, and a support plate 24 fixed to a portion of the center supporting member 41 of the upper supporting member 3b of the strut member 3 And an intermediate plate 23 provided between the pressing plate 22 and the support plate 24.

The pressing plate 22 and the intermediate plate 23 are formed of ceramics such as alumina. Further, between the pressing plate 22 and the intermediate plate 23, a heating device (not shown) such as surface heating or belt heating is incorporated. That is, the upper side plate member 2b has a heating device therein. Further, the upper side plate member 2b includes a thermometer 16 which is formed of, for example, a thermocouple or the like for measuring the surface temperature of the pressing plate 22.

The support plate 24 is formed of a metal such as stainless steel or ceramic or stone. The intermediate plate 23 functions as an insulator that prevents short-circuiting of the heating device and the support plate 24. Further, in the case where the support plate 24 is formed of metal, it is easy to fix the upper side plate member 2b to the upper side support member 3b. Further, the pressing plate 22, the intermediate plate 23, and the supporting plate 24 are fixed to each other by a plurality of screws and nuts.

Further, a communication passage 24a is provided in the support plate 24. The communication flow path 24a is connected to the outside of the chamber (not shown) by the supply port 25 through the pipe 26. The communication channel 24a is capable of supplying the gas supplied from the outside of the attachment device through the pipe 26 and the supply port 25 to the delivery portion 28. Thereby, the attaching device can send the gas from the delivery unit 28 to the laminate 50.

The communication flow path 24a is provided on the surface on the contact side of the intermediate plate 23 of the support plate 24, and is fixed to the outside of the upper side plate member 2b, that is, to the inside of the chamber, by the pressing plate 22 and the intermediate plate 23 being fixed to each other.

The pressing plate 22 has a flatness of 1.0 μm or less when the surface thereof is formed without pressing. In addition, the pressing plate 22 has a thickness (thickness in the vertical direction) of, for example, 35 mm or more so that the amount of deflection at the time of pressing can be reduced. Since the pressing plate 22 is formed of ceramics, the flatness of the surface can be easily processed to 1.0 μm or less.

(out of the pin 27)

The upper side plate member 2b is provided at a portion of the pressing plate 22 that contacts the laminated body 50, and includes a plurality of layers that prevent the laminated body 50 from being attached to the upper side plate member 2b. Disengage the pin (disengagement member) 27.

The release pin 27 is formed of a metal such as stainless steel, and includes a pin 27a and a spring that elastically biases the pin 27a so as to protrude from the surface of the pressing plate 22 as shown in Figs. 1(e) and 1(f). 27b. Thereby, after the laminated body 50 is pressed, when the lower side plate member 2a and the upper side plate member 2b are separated, the force in the direction away from the upper side plate member 2b can be applied to the laminated body 50.

Further, it is preferable that the tip end A of the side of the contact layer of the pin 27a is rounded so as not to damage the laminate. Further, the number of the disengagement pins 27 is not particularly limited, and the number of the best arrangements is that the number of the laminated bodies can be stabilized and pressed, and in one example, three places can be provided on the pressing plate 22.

[Sending unit 28]

The delivery portion 28 is provided in the hole of the pressing plate 22, and the gas supplied from the communication channel 24a is sent to the laminate 50. By the delivery unit 28, the gas is sent out from the pressing plate 22 to the laminate, and the laminated body 50 attached to the pressing plate 22 can be smoothly separated.

Further, as shown in FIG. 2, in the attaching device used in the attaching method of the present embodiment, the escape pin 27 is housed in the delivery portion 28 provided in the plate member 2. The detachment pin 27 can be stored in the delivery unit 28 and the gas can be sent out from the delivery unit 28, whereby the attachment device can be easily configured. Further, the hole provided in the pressing plate 22 can be reduced.

(support member 3)

The pillar member 3 is disposed in the vertical direction, and is configured by a lower side support member 3a that supports the lower side plate member 2a and an upper side support member 3b that supports the upper side plate member 2b. The lower support member 3a and the upper support member 3b are formed of a metal such as stainless steel or ceramic or stone.

The lower side support member 3a is composed of a center support member 31 fixed to the base 30, at least a central portion supporting the lower side plate member 2a, and a plurality of peripheral support members 32 fixed to the base 30 and supporting the center portion of the lower side plate member 2a. Composition. Next, the lower side support member 3a fixes the lower side plate member 2a so that the surface of the mounting board 12 may be horizontal. The diameter of the center support member 31 may have a necessary strength for supporting the lower side plate member 2a at the time of pressing, and it is preferable to make the heat of the lower side plate member 2a not to be dissipated. The lower support member 3a has the number of the peripheral support members 32, and the lower side plate member 2a is supported in a well-balanced manner so as not to dissipate the heat of the lower side plate member 2a, preferably in the range of 3 to 10, 6 Or 8 is better. The plurality of peripheral support members 32 are disposed at equal intervals in order to support the entire lower plate member 2a in a well-balanced manner, that is, to maintain the level of the surface of the mounting plate 12. The diameter of the peripheral supporting member 32 may have a required strength for reducing the amount of deflection of the lower side plate member 2a at the time of pressing, and it is preferable to prevent the heat of the lower side plate member 2a from being dissipated.

The upper support member 3b is constructed by a pressurizing device (not shown) that applies a pressing force (application load) to the press laminate 50, and a center support member 41 that supports at least a central portion of the upper side plate member 2b. to make. Next, the upper side support member 3b fixes the upper side plate member 2b such that the surface of the pressing plate 22 is horizontal. The diameter of the center support member 41 may have a necessary strength for supporting the upper side plate member 2b when pressed. The center support member 41 is driven by a pressurizing device to be movable in the vertical direction. Therefore, the upper side support member 3b supports the upper side plate member 2b so as to be freely movable in order to apply a pressing force to the laminated body 50.

The peripheral support member 32 is composed of a tubular portion 32a and a support portion 32b housed in the tubular portion 32a. The support portion 32b is formed to be movable in the moving direction of the upper side plate member 2b by entering and exiting the tubular portion 32a, that is, relatively freely expanding and contracting in the vertical direction. Specifically, the support portion 32b is configured such that the tip end portion thereof can be fixed to the support plate 14 and the lower side plate member 2a can be pressed against the pressing force formed by the upper side plate member 2b, thereby reducing the amount of deflection of the lower side plate member 2a. For example, it is free to expand and contract in units of 0.1 μm.

In the support portion 32b, the flatness of the surface of the mounting plate 12 is, for example, 1.0 μm or less, that is, the curvature or the skew of the surface of the mounting plate 12 is corrected to maintain the planarity (horizontality) of the surface of the mounting plate 12. For example, the expansion and contraction operation can be performed manually by a tool or the like, and the surface of the mounting plate 12 can be maintained by correcting the curvature or the skew of the surface of the placing plate 12. Further, the configuration or method of correcting the curvature or the skew of the surface of the mounting plate 12 at the time of non-pressing is not particularly limited, and various configurations or methods can be employed if the planarity of the surface of the placing plate 12 can be maintained.

Moreover, the expansion and contraction operation of the manual support portion 32b is performed. It can be carried out according to various standards. For example, a micrometer may be disposed on the lower side of the placing plate 12, and the support portion 32b may be expanded and contracted such that the bending or skew of the placing plate 12 is corrected based on the measured value of the micrometer. Further, the plate member 2 may be pressed by a pressure sheet, and the support portion 32b may be expanded and contracted so that the pressure distribution is not biased by the measurement result of the pressure distribution measuring device. Alternatively, after the plate member 2 is actually pressed and the laminate formed by bonding the support plate to the substrate is actually pressed, the flatness of the laminate may be measured, and based on the measurement result, the laminate which can be obtained by pressing may be used. The manner in which the flatness of the body is raised causes the support portion 32b to expand and contract.

[Modification of Attachment Device]

The attaching device used in the attaching method of the present invention is not limited to the configuration of the attaching device shown in Fig. 2. For example, an attachment device having the following configuration may be employed.

(Modification 1)

As shown in FIG. 3(a), a modification (Modification 1) of the attachment device is different from the attachment device shown in FIG. 2, and the supply port 25 and the pipe 26 are not provided on the side surface portion of the support plate 24. And on the upper face. Further, the pipe 26 communicates with the outside of the chamber via a communication passage provided in the upper portion of the center support member 41. Thereby, the gas can be sent out to the delivery unit 28 via the communication passage 24a provided in the support plate 24. Therefore, the attaching apparatus shown in FIG. 3 can shorten the length of the piping 26 in the interior part. From Further, it is possible to further enlarge the space in the room in which the attaching device is provided. Moreover, in the attaching apparatus shown in FIG. 3, in order to move up and down of the upper side plate member 2b, and the piping 26 also raises and falls, the piping 26 does not expand and contract. That is, the attaching device shown in Fig. 3 can prevent an increase in the load of the piping 26 due to the elevation of the upper side plate member 2b.

Here, as shown in FIG. 3(b), the communication flow path 24a is provided on the surface on the side where the intermediate plate 23 of the support plate 24 contacts. Further, the communication hole 25 and the pipe 26 are communicated by the communication hole a. Further, the communication hole b is communicated to the delivery portion 28 provided on the pressing plate 22 via the intermediate plate 23. Thereby, it is formed that the gas can be sent out from the delivery portion 28 from the outside of the chamber.

The depth of the groove formed in the communication passage 24a of the support plate 24 is preferably in the range of 0.5 mm or more and 1 mm or less. Further, the width of the groove constituting the communication passage 24a is preferably in the range of 5 mm or more and 12 mm or less. Further, the diameter of the communication hole a that communicates from the communication passage 24a to the supply port 25 and the pipe 26 is preferably in the range of 2 mm or more and 4 mm or less, by connecting the depth and the width of the communication flow path 24a, and the communication. The diameter of the hole a is set to the above range, and in the detachment step, an excessive amount of gas can be prevented from being sent to the laminate. Further, in the communication flow path 24a of the attaching device shown in Fig. 2, the same depth as the depth and width of the groove connecting the flow path 24a and the diameter of the communication hole a can be applied to the same as the attaching device shown in Fig. 3. condition.

Further, in the attaching device shown in FIG. 3, the other members having the same component numbers as those of the attaching device shown in FIG. 2 have the same functions, and the description thereof will be omitted.

(Modification 2)

Further, as a modification (variation 2) of still another attachment device, a sensing unit that senses the amount of deflection of the plate member 2 when a pressing force is applied to the laminate 50 may be employed (not In the drawing, a sticking device such as a control unit (not shown) that expands and contracts the peripheral supporting member 32 so as to offset the amount of deflection sensed by the sensing unit.

Specifically, the sensing unit includes a plurality of image sensing elements such as a CCD or a COMS, and the imaging plate member 2, that is, the placing plate 12 and the pressing plate 22, can be configured to be non-contact and sensed. The amount of deflection. The sensing limit of the sensing portion can be set to 1.0 μm by using an image sensing element such as CCD or COMS. The amount of deflection can be sensed based on the center portion of the placing plate 12 or the center portion of the pressing plate 22 as a reference. Further, the sensing unit may be configured to include a plurality of image sensing elements, and the measuring board 12 may be replaced by a sensor such as a pressure sensor incorporated in the plate member 2. And the pressure distribution of the pressing plate 22 is sensed to sense the amount of deflection.

The control unit is based on the sensing result (measurement result) of the sensing unit, and the peripheral portion of the mounting plate 12 and the pressing plate 22 are based on the center portion of the mounting plate 12 or the center portion of the pressing plate 22 . The peripheral support member 32 is pulse-controlled at a high gear ratio such that the amount of deflection of the peripheral portion is 1.0 μm or less, that is, the amount of deflection is equal to or less than, for example, the sensing limit of the sensing portion. The expansion and contraction operation of the support portion 32b. That is, if the deformation with the sensing portion and the control portion is adopted In the attachment device, when the laminate 50 is pressed, that is, when the substrate and the support are attached, the amount of deflection of the peripheral portion of the mounting plate 12 and the peripheral portion of the pressing plate 22 can be fed back. Control and correct. For this reason, the substrate and the support can be uniformly attached via the adhesive layer. Further, the control of the expansion and contraction operation of the support portion 32b is not limited to the above-described pulse control. For example, the motor control may be performed by a method other than pulse control, or a load cell may be disposed to perform feedback control.

Further, the control unit may be configured to perform the expansion and contraction operation of the support portion 32b of the peripheral support member 32 when the control unit is not pressed. In other words, the support portion 32b may be configured to correct the curvature of the surface of the mounting plate 12 and the surface of the pressing plate 22, and to maintain the surface of the mounting plate 12 and the surface of the pressing plate 22, irrespective of the pressing operation. In the form of planarity (horizontality), the control unit controls the expansion and contraction operation. In addition, the control unit may be configured to cancel the pulse control of the expansion and contraction operation of the support portion 32b so that the expansion and contraction operation of the support portion 32b can be performed manually by, for example, a tool or the like.

(Modification 3)

Further, in another modification (variation 3) of the other attachment device, the upper support member 3b may have a peripheral support member similarly to the lower support member 3a. In other words, a plurality of peripheral supporting members may be provided outside the center portion of the center supporting member 41 and the supporting upper side plate member 2b.

The upper side support member 3b has a peripheral support member In order to prevent the heat of the upper side plate member 2b from being dissipated, and to support (press) the entire upper plate member 2b in a balanced manner, it is preferably in the range of 3 to 10, and more preferably 6 or 8. In order to support (press) the entire upper side plate member 2b in a balanced manner, that is, the plurality of peripheral side support members are disposed at equal intervals so as to maintain the level of the surface of the pressing plate 22. The diameter of the peripheral supporting members may be required to reduce the amount of deflection of the upper side plate member 2b at the time of pressing, and it is preferable to prevent the heat of the upper side plate member 2b from being dissipated.

Further, the peripheral supporting member is constituted by a tubular portion and a supporting portion housed in the tubular portion, similarly to the peripheral supporting member 32. The support portion is formed to be movable in the moving direction of the upper side plate member 2b by entering and exiting the tubular portion, that is, relatively freely expanding and contracting in the vertical direction. Specifically, the support portion can reduce the amount of deflection of the upper side plate member 2b by allowing the tip end portion to abut against the support plate 24 (fixed as necessary) against the pressing force formed by the upper side plate member 2b. The method, for example, can be freely stretched and formed in units of 0.1 μm. The support portion can perform the expansion and contraction operation by hand using, for example, a tool, and correct the flatness of the surface of the pressing plate 22 by correcting the curvature or the skew of the surface of the pressing plate 22.

Further, the configuration or method of correcting the curvature or the skew of the surface of the pressing plate 22 at the time of non-pressing is not particularly limited, and various configurations or methods can be employed if the planarity of the surface of the pressing plate 22 can be maintained. For example, the attachment device may be provided with a sensing unit and a control unit as in the above-described modification, and the control unit may be provided in addition to the support portion 32b of the peripheral support member 32. In addition, the expansion and contraction operation of the support portion of the peripheral support member of the upper support member 3b may be similarly controlled.

(Modification 4)

Further, in another modification (variation 4) of the other attachment device, the attachment device may be provided with positional deviation sensing of the positional deviation of the sensing laminate when the position of the laminated body 50 is deviated in the detaching step. Means (not shown). Thereby, it is possible to quickly sense the problem caused by the positional deviation of the laminate in the detachment step.

As the positional deviation sensing means, for example, a fiber optic sensor can be cited. The optical fiber sensor can be provided in a plurality of widths in the range of 0.5 mm or more and 5 mm or less from the end of the position where the laminate is in contact with each other when pressed by the upper side plate member 2b. Further, in the lower side plate member 2a, a plurality of mirrors that reflect light irradiated by a plurality of optical fiber sensors may be provided. Here, the plurality of optical fiber sensors provided in the upper side plate member 2b and the plurality of mirrors provided on the lower side plate member 2a may be disposed to face each other in a one-to-one direction.

Thereby, if the light irradiated by the fiber sensor is reflected by the mirror and sensed in all the fiber sensors, the fiber sensor determines whether the layer 50 is deviated from the specified position. Further, if the light irradiated by the plurality of fiber sensors is blocked by the laminate 50 at least at one place, the fiber sensor determines that the laminate 50 is deviated from the designated position. Thereby, it is possible to sense the positional deviation of the laminated body 50 in the detachment step and prevent the malfunction at the time of manufacture of the laminated body.

The attaching device can sense the positional deviation of the laminated body by providing at least three sets of optical fiber sensors and mirrors. Further, of course, it is also possible to provide a configuration in which the optical fiber sensor is provided in the lower side plate member 2a and the mirror is provided in the upper side plate member 2b.

<Another embodiment of the attachment method>

The attachment method of the present invention is not limited to the above embodiment. For example, regarding the detachment step included in the attachment method of another embodiment, for example, the laminate 50 attached to the lower side plate member 2a may be detached in the detachment step.

In this case, as an example, a spring may be provided in the transfer pin 17 provided in the lower side plate member 2a, and the gas may be sent out from the outside in the concave portion of the storage transfer pin 17. Thereby, the recessed part in which the conveyance pin 17 is accommodated can be used as a delivery part, and the conveyance pin 17 can be used as a disengagement pin. Therefore, similarly to the case where the laminated body 50 is attached to the upper side plate member 2b, the laminated body 50 can be detached from the lower side plate member 2a. In addition, it is needless to say that the lower side plate member 2a is provided with the attaching means of the delivery part 28 and the disengagement pin 27, and the detachment process is performed, and the laminated body 50 attached to the lower side plate member 2a is detached.

Further, regarding the detachment step included in the attachment method of still another embodiment, for example, the laminate 50 attached to the upper side plate member 2b may be attached to the delivery portion provided on the upper side plate member 2b. The gas is sent out, and the laminated body 50 is biased by the release pin provided on the lower side plate member 2a. The attaching method of this embodiment mode can also be in FIG. The tip end A of the disengagement pin provided in the side plate member 2a shown in (e) and (f) is, for example, provided with a suction member such as a suction cup, and the suction member is used to laminate the direction away from the upper side plate member 2b. Body 50 applies force. Further, after the detachment step, the laminate 50 may be held on the lower side plate member 2a by sucking the laminated body 50 by the suction member.

In the case where the lower side member 2a is attached to the laminate 50, the lower plate member 2a may be provided with a delivery portion for delivering the gas to the laminate 50, and the upper plate member 2b may be provided with the release member. The composition of the sales. Thereby, the gas can be sent out from the lower side plate member 2a to the laminated body 50. Moreover, the laminated body 50 can be urged in the direction away from the lower side plate member 2a by the disengagement pin which has the suction member provided in the upper side plate member 2b. Therefore, the detachment step included in the attaching method of the present invention can be appropriately performed.

Further, in the pressing step and the detaching step of the embodiment, the two steps may be performed by fixing the upper side plate member 2b and driving the lower side plate member 2a and the lower side supporting member 3a in the vertical direction by the pressurizing means. Alternatively, the pressing step and the detaching step may be performed by driving the lower side plate member 2a and the upper side plate member 2b in the vertical direction.

The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the embodiments obtained by appropriately combining the technical means disclosed in the different embodiments are also included. The technical scope of the present invention. Further, it is possible to form new technical features by combining the technical means respectively disclosed in the respective embodiments.

[Examples] [Evaluation of the detachment of the laminate]

The evaluation of the detachability of the laminate attached to the upper side plate member was carried out by the attaching method of the present invention. Further, as the attaching device, a attaching device having the configuration shown in Fig. 2 is used.

TZNR (registered trademark)-A4017t (manufactured by Tokyo Ohka Kogyo Co., Ltd.) was spin-coated on a semiconductor wafer substrate (12 吋, 矽), and baked at a temperature of 90 ° C, 160 ° C, and 220 ° C for 4 minutes. An adhesive layer (film thickness 50 μm) was formed.

Next, as a support plate, a double-layer glass support (12 Å, thickness: 700 μm) was used, and a separation layer was formed on the support plate by a plasma CVD method using fluorocarbon. As a condition for the separation layer forming step, the separation layer was subjected to a CVD method using C ₄ F ₈ as a reaction gas under conditions of a flow rate of 400 sccm, a pressure of 700 mTorr, a high-frequency power of 2,500 W, and a film formation temperature of 240 ° C. A fluorocarbon film (thickness 1 μm) was formed on the support plate.

Next, the support plate, the separation layer, the adhesive layer, and the wafer substrate are sequentially laminated, and the pressing force is applied to the support plate and the wafer substrate by pressing under a vacuum of 4000 kgf for 50 seconds under vacuum. (press the step).

Thereafter, the upper side plate member is separated from the lower side plate member by moving the upper side plate member upward (the alienation step). Further, here, the distance between the laminate attached to the upper side plate member and the lower side plate member is made In the 2mm mode, the evacuation step is performed.

Thereafter, atmospheric pressure air was sent out from the delivery portion provided in the upper side plate member by 0.1 m ³ to carry out a detachment step. The adhesion method was carried out 10 times, and the presence or absence of the adhesion of the laminate to the upper side plate member and the detachment property of the laminate formed by the separation step when the laminate was attached to the upper side plate member were evaluated. Further, in the detachment step, whether or not a positional deviation of 2 mm or more occurred in the laminate was evaluated by using an optical fiber sensor provided in the attachment device.

〔result〕

Table 1 shows the results of the detachment of the laminate formed by the step of detaching the laminate to the upper side member and the step of detaching the laminate when the upper side member was attached. For the attachment of the laminate of Table 1 to the upper side member, the laminate is evaluated as (x) when the laminate is attached to the upper side member before the detachment step, and the laminate is not attached to the upper side member. The evaluation is (○). Further, the detachability of the laminate was evaluated as (○) when the laminate in which the substrate was not broken by the detachment step and the substrate was not displaced. Further, (-) in the column of the detachment of the laminate of Table 1 means that the layered body was not attached to the upper side plate member at the stage of the detachment step, and thus the detachment step was not performed.

From the above evaluation results, it was confirmed that even if the upper side plate member was attached to the laminate, by performing the detachment step, the laminate can be smoothly separated from the upper side plate member without damaging the substrate.

Further, when the detachment step is performed, the laminate position deviation detection error does not occur. Therefore, it was confirmed that the laminated body 50 detached from the upper side plate member 2b was held without positional deviation on the lower side plate member.

In addition, it was confirmed that the vacuum condition inside the chamber after the detachment step was maintained at about 10 Pa, and the condition that the laminate was continuously attached was maintained.

[Industrial use possibility]

The attaching method of the present invention can be widely used, for example, in the manufacturing steps of a miniaturized semiconductor device.

2‧‧‧ board components

2a‧‧‧Bottom plate member (plate member)

2b‧‧‧Upper plate member (plate member)

12‧‧‧Loading board

13‧‧‧Intermediate board

14‧‧‧Support board

17‧‧‧Transportation

22‧‧‧ Press plate

23‧‧‧Intermediate board

24‧‧‧Support board

24a‧‧‧Connected flow path

25‧‧‧ supply port

26‧‧‧Pipe

27‧‧‧Disengagement pin (disengagement member)

27a‧‧‧ pin (disengagement member)

27b‧‧‧Spring (disengagement member)

28‧‧‧Send out

50‧‧‧Layer

Claims (6)

A bonding method for applying a pressing force to a laminate obtained by laminating a substrate, an adhesive layer, and a support supporting the substrate in this order, thereby interposing the substrate and the support between the adhesives a method of attaching a layer to a layer, comprising: a pressing step of pressing the pair of plate members into the laminate; and pressing the plate from at least one of the pair of plate members The member is connected to the layered body at a feeding portion provided on a surface of the layered body, and the layer is formed by a separating member provided on at least one of the pair of plate members. Applying force to disengage the laminated body from the plate member provided with the delivery portion. The attaching method according to the first aspect of the invention, wherein after the pressing step and before the separating step, the step of separating the pair of plate members from each other is included. The attaching method according to the first or second aspect of the invention, wherein the detaching member is housed in the delivery portion provided in the plate member. The attaching method according to any one of claims 1 to 3, wherein, after the detaching step, the detaching member is used to hold the laminate. The attaching method according to the second aspect of the invention, wherein the pair of plate members are separated upward and downward, and the delivery portion and the detaching member are provided on the upper plate member. . The attaching method according to any one of the first to fifth aspects of the present invention, wherein the amount of the gas sent to the laminate is 0.1 m ³ or less.