TWI657227B - Thickness measurement apparatus - Google Patents

Abstract

A thickness measuring device and a thickness measuring method capable of accurately measuring the thickness of the object to be measured without being affected by the presence or absence of unevenness on the front and back surfaces of the object to be measured.

The thickness measuring device includes: first and second laser displacement meters (26, 27) for measuring a displacement of a surface of the object to be measured; and a calculating device for first and second displacements measured by a laser displacement meter The thickness of the object to be measured is calculated by calculation; the first and second laser displacement meters (26, 27) are arranged to face each other in a straight line so as to measure the displacement of the front and back surfaces of the object to be measured.

Description

Thickness measuring device

The present invention relates to a thickness measuring device and a thickness measuring method for measuring the thickness of an object to be measured.

With the high functionality of mobile phones, digital AV devices, and IC cards, the semiconductor wafers (hereinafter referred to as wafers) to be mounted are miniaturized and thinned, thereby gradually increasing the height of the wafers in the package. Increase. In order to achieve a high degree of integration of the wafers in the package, the thickness of the wafer must be reduced to a range of 25 to 150 μm.

Conventionally, the thickness of a semiconductor wafer (hereinafter referred to as a wafer) as a base of a wafer or the thickness of a laminate including the wafer is measured by a spectral interference laser displacement sensor. . Specifically, for example, the laser beam is irradiated from the spectral interference type laser displacement meter to the surface (upper surface) of the layer to be measured, and then the reflected light reflected on the back surface of the wafer or the layers of the laminate is received. The spectrum is used to determine the thickness of the wafer or the thickness of the laminate. Further, Patent Document 1 describes a thickness measuring device from an optical type. The displacement meter hits the front and back of the measurement object to be transported by the conveyance device, and measures the displacement of the front and back surfaces of the measurement object to calculate the thickness. In order to avoid interference between the light spots irradiated by the optical displacement meter, the thickness measuring device causes the second light spot to be displaced in the back surface of the object to be measured through which the light is transmitted, and the first light hitting the surface The position of the point corresponds to the position adjacent to the position, and the measurement time point is measured in synchronization with the conveyance speed of the measurement object.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 9-273912

However, the method of measuring the thickness of the wafer or the thickness of the laminate by measuring the reflected light reflected on the back surface of the wafer or the layers of the laminate, for example, is to measure the wafer on which the circuit is formed (component) The thickness of the wafer is the problem that the state of the wafer surface (concavity and convexity) varies depending on the location of the wafer, or because of the material of the wafer, or because it is formed in the wafer The bumps made of metal of the circuit make it impossible to accurately measure the thickness of the wafer or the thickness of the laminate. Further, when the laminate includes a wafer and a support, that is, glass, and the refractive indices of the wafer and the glass are close to each other, the spectra are also heavy. The stack cannot be correctly measured for thickness. Further, in the thickness measuring device described in Patent Document 1, if the device has slight vibration or the conveying speed of the measuring object slightly changes, the second spot cannot be hit in the back surface of the measuring object, and the surface is hit. The position of the first spot corresponds to the position, and there is a problem that the thickness cannot be accurately measured.

The present invention has been made in view of the above problems, and a main object of the present invention is to provide a thickness measuring device capable of accurately measuring the thickness of the object to be measured without being affected by the microvibration of the device or the presence or absence of unevenness on the front and back surfaces of the object to be measured. Thickness measurement method.

In order to solve the above problems, the thickness measuring device according to the present invention includes: a first laser displacement meter and a second laser displacement meter that measure a displacement of a surface of the object to be measured; and a calculation device that is configured by the laser displacement Calculating the thickness of the object to be measured by calculating the first displacement and the second displacement; the first laser displacement meter and the second laser displacement meter are arranged in a line on the straight line to measure the object to be measured The displacement on the back of the watch.

In order to solve the above problems, the thickness measuring method of the present invention is characterized in that at least the measurement project is performed, and the object to be measured is placed between the first laser displacement meter and the second laser displacement meter which are arranged in line on the straight line, and is measured. a first displacement of the surface of the object to be measured and a second displacement of the back surface; and a calculation process for calculating the thickness of the object to be measured by the first displacement and the second displacement.

According to the present invention, it is possible to provide a thickness measuring device capable of accurately measuring the thickness of the object to be measured without being affected by the microvibration of the device or the presence or absence of unevenness on the front and back surfaces of the object to be measured. Thickness measurement method.

1‧‧‧Layered body formation system

2‧‧‧Fitting unit

3‧‧‧ Keeping Department

4‧‧‧First means of transport (handling device)

5‧‧‧The first way to move

6‧‧‧Overlay (attachment device)

7‧‧‧ Attachment (attachment device)

8‧‧‧ brake

9‧‧‧Acceptance window

21‧‧‧ Displacement Meter Maintenance Department

22‧‧‧Measurement object holding unit

23‧‧‧First moving member

24‧‧‧ Track members

25‧‧‧Second moving member

26‧‧‧First Laser Displacement Meter

27‧‧‧Second laser displacement gauge

31‧‧‧Maintaining platform (mounting table)

50‧‧‧Transportation station (storage department)

51‧‧‧Bake plate (heating device)

52‧‧‧Rotator (coating device)

53‧‧‧cleaning device

54‧‧‧Second handling means (handling device)

55‧‧‧Second handling means

56‧‧‧ Temperature Regulation Department

57‧‧‧ Thickness measuring device

Fig. 1 is a plan view showing a thickness measuring device according to an embodiment of the present invention.

Fig. 2 is a side view of the above thickness measuring device.

[Fig. 3] A schematic cross-sectional view showing a state in which the thickness of the layer to be measured is measured.

Fig. 4 is a schematic plan view showing the overall configuration of a laminate forming system including the thickness measuring device.

Fig. 5 is a schematic flow chart showing a method of forming a laminate by the above-described laminate forming system.

Hereinafter, embodiments of the present invention will be described in detail.

[Measurement object]

The object to be measured is not particularly limited, but is preferably a flat plate. For example, it is preferably a wafer as a base of a wafer or a laminate or a branch containing the wafer. Shelf (support). Various layers such as an adhesive layer or a separation layer may be formed on the surface of the wafer. Further, the wafer may be a substrate having a fine structure such as an electronic circuit formed on the surface on the adhesive layer side. Further, a laminate of a support plate made of glass, enamel, acrylic resin, ceramics or the like may be attached to the adhesive layer. In addition, the object to be measured is not limited to a laminate, a support plate, or a substrate made of a wafer, and any substrate such as a film substrate or a flexible substrate can be selected.

In the following, as a measurement object, a laminate in which a substrate made of a wafer, an adhesive layer, and a support plate made of glass is laminated is mainly described as an example.

[thickness measuring device]

The thickness measuring device according to one embodiment of the present invention will be described below with reference to Figs. 1 and 2 . As shown in FIG. 1 and FIG. 2, the thickness measuring device 57 is a device for measuring the thickness of a measurement object, that is, for example, a laminate, and the thickness of the complex surface of the laminate is measured to obtain a thickness distribution. In this case, it is also called a thickness distribution measuring device. Here, the thickness distribution of the laminate, which is the object to be measured, indicates the in-plane distribution among the upper surface (the upper surface of the support plate) or the lower surface (the lower surface of the substrate) of the laminate. Since the thickness measuring device 57 is provided with a non-contact laser displacement meter, the thickness distribution of the laminate can be favorably measured.

As shown in FIG. 1 and FIG. 2, the thickness measuring device 57 mainly includes a displacement meter holding unit 21 that measures a displacement (first displacement) of a surface of a measurement object, that is, a first laser displacement meter. 26 and The second laser displacement meter 27 that measures the displacement (second displacement) of the back surface of the laminate is movably held, and the measurement object holding portion 22 holds the laminate.

The displacement gauge holding portion 21 is mainly composed of a first moving member 23, a pair of rail members 24, and a second moving member 25. Further, the displacement gauge holding unit 21 includes a driving unit (not shown) that drives the first moving member 23 and the second moving member 25.

The pair of rail members 24 are disposed in parallel with each other across the measurement object holding portion 22, and the first moving member 23 is movably supported so that the first moving member 23 approaches the measurement object holding portion 22 The direction and the guide that moves away from the direction in which the object holding portion 22 is moved (the direction of the arrow in FIG. 1).

The first moving member 23 movably supports the second moving member 25 in a direction for making the second moving member 25 orthogonal to the moving direction of the first moving member 23 (in FIGS. 1 and 2) Arrow direction) Move the guide.

The shape of the second moving member 25 is a "ㄈ" shape that opens toward the object to be measured holding portion 22, and the tip end portion of the measuring jigs 25a and 25b that protrude upward and downward toward the object to be measured object 22 is formed. The first laser displacement meter 26 and the second laser displacement meter 27 are maintained. Specifically, the first laser displacement meter 26 is held at the tip end portion of the measurement jig 25a protruding from the upper side, and the second laser displacement meter 27 is held at the tip end portion of the measurement jig 25b protruding from the lower side. Further, at the tip end portion of the measuring jig 25a, a position for performing the alignment of the first laser displacement gauge 26 is provided. The adjustment member 26a is placed.

The first laser displacement meter 26 includes an illuminating unit that irradiates the laminated body to the laser beam, and the light receiving unit receives only the laser light reflected on the surface of the laminated body; and the transmitting unit receives the laser light. The laser light is converted into a signal and transmitted to a calculation device (none of which is shown). Similarly, the second laser displacement meter 27 includes an illuminating unit that irradiates the laminated body with the measuring object, that is, the laser beam, and the light receiving unit receives only the laser light that is reflected on the back surface of the laminated body; and the transmitting unit The received laser light is converted into a signal and transmitted to a calculation device (none of which is shown). In addition, the first laser displacement meter 26 and the second laser displacement meter 27 are not particularly limited as long as the displacement of the surface of the layered object, which is a measurement object, can be measured in a non-contact manner. Spectral interference laser displacement meter.

The first laser displacement meter 26 and the second laser displacement meter 27 are arranged to face each other in a straight line so as to measure the displacement of the front and back surfaces of the laminate (not shown) placed on the object to be measured 22 . Further, the first laser displacement gauge 26 and the second laser displacement gauge 27 are attached to the leading end portions of the measuring jigs 25a and 25b so that the first laser displacement gauge 26 and the second laser displacement gauge are coupled. The straight line of 27 is orthogonal to the surface or the back surface of the laminate placed on the measurement object holding portion 22. Therefore, even if the first laser displacement gauge 26 and the second laser displacement gauge 27 are moved by the displacement of the displacement gauge holding portion 21 or the device is slightly vibrated, the relative position or distance between them is always constant.

Further, the displacement gauge holding portion 21 is designed to move the first moving member 23 and the second moving member 25, thereby holding the measuring fixture The first laser displacement gauge 26 and the second laser displacement gauge 27 at the tip end portions of the 25a and 25b are moved to a desired position of the laminate placed on the measurement object holding portion 22. In other words, the displacement meter holding unit 21 is configured to relatively move the first laser displacement gauge 26 and the second laser displacement gauge 27 with respect to the measurement target holding unit 22. Specifically, the displacement gauge holding portion 21 is designed to move the first laser displacement gauge 26 to a desired position among the surfaces of the laminate, and to move the second laser displacement gauge 27 to the laminate. The position on the back side corresponding to the above required position. However, the above-mentioned "required position" in the present invention means a position corresponding to the position of the plurality of holes which are formed on the holding platform 31 and which can expose a part of the back surface of the laminate.

The measurement object holding unit 22 includes a holding platform (mounting table) 31, and holds a measurement object, that is, a laminate. Further, the holding platform 31 is provided with an adsorption mechanism for placing and fixing the laminate to the holding platform 31. The laminate is fixed to the holding stage 31 by the suction mechanism, whereby the thickness measuring device 57 can suppress the warpage and the thickness of the laminate can be accurately measured even if the warped laminate is encountered. Further, the configuration of the adsorption mechanism is not particularly limited, and a known adsorption device including vacuum pumping or the like can be used.

Further, in the holding platform 31, for example, a plurality of holes (openings) (not shown) arranged in a checkerboard shape at intervals of 10 mm are formed. As a result, a part of the back surface of the laminate can be exposed through the hole while the laminate is held by the holding stage 31. In addition, the interval between the holes is not particularly limited, for example, it is possible to measure the pair The size of the object, etc., is appropriately set.

Further, the thickness measuring device 57 includes a calculation device (not shown), which is a first displacement and a second displacement measured by the first laser displacement gauge 26 and the second laser displacement gauge 27, and calculates a layer by calculation The thickness of the integrated body is output to, for example, an external display device. The configuration of the calculation device is not particularly limited, and any known calculation device or memory device having a memory thickness may be provided.

Further, the thickness measuring device 57 includes a control unit (not shown) that controls driving of the displacement meter holding unit 21 and the measurement object holding unit 22, or the first laser displacement meter 26 and the second laser displacement meter 27 action. Therefore, the driving portions of the first moving member 23 and the second moving member 25 are driven, and the operation thereof is controlled by the control unit.

In addition, in FIG. 1 and FIG. 2, the displacement meter holding unit 21 is configured to relatively move the first laser displacement gauge 26 and the second laser displacement gauge 27 with respect to the measurement target holding unit 22. The measuring device is not limited to this configuration, and the measuring object holding portion may be configured to relatively move with respect to the first laser displacement meter and the second laser displacement meter held by the displacement meter holding portion, and may be configured to be displaced. The gauge holding unit and the measurement target holding unit move relative to each other. In addition, the relative movement of the displacement meter holding unit and the measurement object holding unit may be any movement such as linear movement or rotational movement, and may be designed to measure the thickness of the plurality of front and back surfaces of the laminate.

[Measurement method of thickness]

Next, referring to FIG. 3, the thickness of the above configuration will be sequentially described. The degree measuring device 57 measures the thickness of the laminate.

First, the laminate 40, which is a measurement object, is placed on the holding platform 31 of the measurement object holding portion 22, and the laminate 40 is fixed to the holding platform 31 by an adsorption mechanism. At this time, the displacement gauge holding portion 21 is located at the home position (initial position).

Next, the displacement meter holding portion 21 is driven to move the first moving member 23 and the second moving member 25 to move the first laser displacement gauge 26 to a desired position among the surfaces of the laminated body 40, and The two laser displacement meters 27 are moved to a position corresponding to the desired position among the back surfaces of the above-described laminated body 40. As a result, the laminate 40 is disposed between the first laser displacement meter 26 and the second laser displacement meter 27 that are disposed opposite each other on a straight line. Further, the straight line connecting the first laser displacement gauge 26 and the second laser displacement gauge 27 is orthogonal to the front surface or the back surface of the laminated body 40.

After the movement, from the first laser displacement meter 26, the upper surface of the laminated body 40 (the upper surface of the support plate 43) is irradiated with the laser light, and the laser light A reflected by the laminated body 40 is received, and on the other hand, from the second mine The displacement meter 27 irradiates the lower surface of the laminate 40 (the lower surface of the substrate 41) with laser light through the hole 32 formed in the holding stage 31, and receives the laser light B reflected by the laminate 40. Thereby, the first displacement of the surface of the laminated body 40 and the second displacement of the back surface (measurement engineering) were measured.

At this time, the first laser displacement meter 26 and the second laser displacement meter 27 can simultaneously irradiate the laser light to simultaneously measure the displacement of the front and back surfaces of the laminated body 40, and can also separately irradiate the laser light to measure the laminated body 40, respectively. Back of the table The displacement of the face. In the measurement of one hole 32, the positions of the first laser displacement meter 26 and the second laser displacement meter 27 are fixed in terms of apparent, so that the time of the laser light irradiation can be simultaneously with each other, or Different from each other. However, by simultaneously irradiating the laser light, the thickness can be measured more accurately, and the measurement time can be shortened.

Further, the light receiving portion of the first laser displacement meter 26 receives only the laser light A reflected on the surface of the laminated body 40, and the light receiving portion of the second laser displacement meter 27 receives only the back surface of the laminated body 40. Laser light B. That is, the first laser displacement gauge 26 and the second laser displacement gauge 27 detect only the reflected light from the front and back surfaces of the laminated body 40, and do not detect the penetrating support plate 43 or the adhesive layer 42, the substrate 41 or It is the laser light reflected by the layers, so the laser light A, B does not interfere with each other.

The first laser displacement meter 26 and the second laser displacement meter 27 convert the received laser light into a signal and transmit it to the calculation device. The calculation device calculates the thickness (calculation process) of the laminate 40 by the first displacement and the second displacement, and outputs the result to, for example, an external display device or to the memory device.

After the displacement measurement of the front and back surfaces of the laminated body 40 of one of the holes 32 is completed, the thickness measuring device 57 drives the displacement gauge holding portion 21 to move the first moving member 23 and the second moving member 25 to shift the first laser beam. The gauge 26 and the second laser displacement gauge 27 are relatively moved to the next measurement position, specifically, the position corresponding to the position of the next hole 32. Thereby, the displacement of the front and back surfaces of the laminated body 40 at the position of the next hole 32 is measured, and the thickness of the laminated body 40 is calculated.

Thereafter, the above measurement is repeated in accordance with the size of the layered body 40 or the like, and the displacement of the surface of the plurality of laminated bodies 40 is measured. The thickness measuring device 57 measures the relative movement of the first laser displacement gauge 26 and the second laser displacement gauge 27 with respect to the laminate 40, so that the thickness can be measured over the entire front and back surfaces of the laminate 40. . Therefore, the thickness distribution of the laminate 40 can be measured. Further, since the relative positions or distances of the first laser displacement gauge 26 and the second laser displacement gauge 27 are always constant, they are not affected by the microvibration of the device or the presence or absence of unevenness on the front and back surfaces of the laminated body 40. The thickness of the laminate 40 can be accurately measured.

In the above description, the displacement measuring unit 21 moves the first laser displacement gauge 26 and the second laser displacement gauge 27 relative to the measurement target holding unit 22, but the thickness measurement method is The method is not limited to this method, and may be a method of relatively moving the measurement target holding portion with respect to the first laser displacement gauge and the second laser displacement gauge held by the displacement gauge holding portion, or may be a displacement gauge A method in which the holding portion and the measurement object holding portion move relative to each other.

[Layered body formation system]

Hereinafter, a laminated body forming system including the thickness measuring device 57 having the above configuration will be described with reference to Fig. 4 . The laminate forming system is a system in which a substrate and a support, that is, a support plate, are bonded to each other through an adhesive layer to form a laminate.

If the substrate thinning and assembly process after the formation of the laminate is considered, the thickness distribution of the laminate is preferably small. For the quality management of the product, it is preferable to measure the layer in the manufacturing process of the semiconductor wafer. Integrated body Thickness distribution. In the present embodiment, the laminate forming system includes the thickness measuring device 57, whereby the thickness distribution of the laminate can be measured in the process of forming the laminate, which is more efficient. Further, information on the thickness distribution of the laminate can be used, for example, for the abnormality detection of the manufactured laminate.

Further, in the present embodiment, the thickness measuring device 57 measures the thickness distribution of the support plate before the substrate is attached. The thickness distribution of the laminate is also affected by the thickness distribution of the support plate. Therefore, by measuring the thickness distribution of the support plate in advance, it is possible to understand the cause of the abnormality of the produced laminate. Further, information on the thickness distribution of the support plate can be used, for example, for abnormality detection of the support plate.

As shown in FIG. 4, the laminate forming system 1 includes a spinner (coating device) 52 to which an adhesive is applied on a substrate, and a baking plate (heating device) 51 to apply a substrate to which an adhesive has been applied. Heated to form an adhesive layer on the substrate; and the overlapping portion 6 and the attaching portion (attaching device) 7, and the substrate and the supporting plate are bonded to each other through the adhesive layer to form a laminate; and a thickness measuring device 57; The thickness distribution of the laminate was measured. Further, the laminated body forming system 1 further includes a carrier station (storage unit) 50, a temperature adjustment unit 56, a first conveyance device 4, a second conveyance device 54, and a cleaning device 53. The laminate forming system 1 may include the holding portion 3 and the overlapping portion 6. Further, the laminate forming system 1 includes a control unit (not shown) that controls the operation of each device.

Hereinafter, each device of the laminate forming system 1 will be described.

(coating device)

A rotator (coating device) 52 is a device for applying an adhesive to a substrate. In the present embodiment, the second conveyance device 54 carries the substrate and places it on the rotator 52. The rotator 52 spin-coats the substrate to be placed on the substrate while rotating the substrate at, for example, 3000 rpm. The method of applying the adhesive to the substrate is not particularly limited, and examples thereof include a method such as spin coating, dipping, roller blade, spray coating, and slit coating. Further, the rotation speed of the substrate is not particularly limited, and may be appropriately set depending on the type of the adhesive, the size of the substrate, and the like.

Further, the rotator 52 may further include a cleaning portion that applies a cleaning liquid to the substrate to wash the adhesive adhering to the end surface or the back surface of the substrate when the adhesive is applied to the substrate. In this way, it is not necessary to separately provide a cleaning device for cleaning the adhesive, and the end surface or the back surface of the substrate can be cleaned while applying an adhesive to the substrate. Therefore, according to the laminated body forming system 1 of the present invention, space can be saved and the formation time of the laminated body can be shortened.

(heating equipment)

The baking plate (heating device) 51 is a device for heating the substrate coated with the adhesive by the rotator 52 to form an adhesive layer on the substrate. In the present embodiment, after the adhesive is applied onto the substrate by the rotator 52, the substrate is placed on the baking sheet 51 to bake the adhesive. The heat source is assembled to the baking sheet 51, or the heat source is assembled to the top plate, whereby the adhesive can be baked. Examples of the heat source include, for example, a warm water heater and warm air heating. , infrared heaters, electric heaters, etc.

(overlap)

The overlapping portion 6 is a device for laminating the substrate and the supporting plate through the adhesive layer. For example, in the present embodiment, the overlapping portion 6 is designed such that the relative position of the substrate and the support plate is adjusted by a position adjusting portion (not shown), and then the substrate and the supporting plate are superposed.

(attachment device)

The attaching portion (attaching device) 7 is a device for bonding a substrate and a supporting plate through an adhesive layer to form a laminate. In the attaching portion 7, the adhesive layer is heated while pressing the substrate and the support plate which are superimposed on the overlapping portion 6. Specifically, for example, a press plate may be provided on the upper and lower sides of the attaching portion 7, and the stacked substrate and the support plate may be placed between the upper and lower pressurizing plates and pressed. Thereby, a laminate can be formed.

(fitting unit)

In the present embodiment, the overlapping portion 6 and the attaching portion 7 constitute the bonding unit 2. The fitting unit 2 can be designed to be provided with a partition wall inside a processing chamber to be partitioned into two processing compartments. Alternatively, the bonding unit 2 can also be configured to be in contact with each other on the side surfaces of the overlapping portion 6 and the attaching portion 7 without a gap. At the boundary between the overlapping portion 6 and the attaching portion 7, a gate 8 is provided for the substrate and the supporting plate which are superposed on the overlapping portion 6, and the laminated body formed by bonding the bonding portion 7 Grant. Gate 8 A shutter is used to control its switch. The switch of the gate 8 can be constructed using conventional techniques, such as the ability to utilize a gate valve configuration.

Further, a receiving window 9 is provided in the overlapping portion 6 for switching between the bonding unit 2 and the first conveying device 4 to transfer the substrate, the support plate, and the laminate. A well-known pressure reducing device (not shown) is provided in each of the overlapping portion 6 and the attaching portion 7, and the internal pressure state of the overlapping portion 6 and the attaching portion 7 can be independently controlled. Further, the bonding unit 2 is provided with an internal conveying device (not shown), and the transmission gate 8 transfers the laminate between the overlapping portion 6 and the attaching portion 7.

Since the attaching portion 7 is configured to be decompressible, the substrate and the support plate can be bonded to each other through the adhesive layer in a reduced pressure environment. By pressing the substrate to the adhesive layer in a reduced pressure environment, the adhesive layer can be made to penetrate into the depression without the presence of air in the depression of the uneven pattern on the surface of the substrate, so that it can be more reliably prevented. Air bubbles occur between the adhesive layer and the substrate.

The gate 8 is formed such that the stacked substrate and the support plate can be moved from the overlapping portion 6 to the attaching portion 7 in a state where the shutter is opened, and the laminated body can be moved from the attaching portion 7 to the stack Joint part 6. Therefore, the gate 8 is configured to open the shutter in a state where the overlapping portion 6 and the attaching portion 7 are both decompressed, whereby the laminated substrate and the supporting plate can be stacked under reduced pressure. The joint portion 6 is moved to the attaching portion 7, and the laminated body can be moved from the attaching portion 7 to the overlapping portion 6 under reduced pressure.

(storage department)

The transfer station (storage unit) 50 is a storage substrate and a support plate. In addition, In the present embodiment, the substrate and the support plate can be introduced into the laminate forming system 1 through the transfer station 50. Further, the laminate formed on the attaching portion 7 can be taken out from the laminate forming system 1 through the transfer station 50.

(holding section)

The holding portion 3 is a device for performing calibration of the substrate and the support plate. The holding unit 3 includes an imaging unit and a central position detecting unit (not shown), and is designed to hold the substrate or the support plate before being stacked.

The imaging unit is configured, for example, by a CCD camera, and is designed to photograph the regions of the end faces that are different from each other including the held substrate or the support plate. This region, for example, is preferably set to be substantially diagonal to the substrate or support plate being held.

The center position detecting unit detects the center position of the held substrate or the support plate based on the plurality of images captured by the imaging unit. The center position detecting unit calculates an imaginary circle based on the image of the end surface of the circular plate to detect the center position. The detection technique based on the center position of the end image can be performed using well-known image processing, and is not particularly limited.

The substrate or the support plate is conveyed to the overlapping portion 6 by the first conveying device 4 after the holding portion 3 is detected at the center position. Then, the substrate or the support plate is superposed on the center portion of the overlapping portion 6 by the position adjusting portion (not shown) so as to be overlapped at the center position detected by the holding portion 3.

(temperature adjustment unit)

The temperature adjustment unit 56 includes a cooling plate (not shown) that cools the substrate to adjust the temperature of the substrate, and a position adjustment device (not shown) that adjusts the position of the substrate. In the present embodiment, the first transfer device 4 and the second transfer device 54 are configured to transfer and receive the substrate via the temperature adjustment unit 56.

By placing the substrate or the laminate on the cooling plate, the substrates or laminates can be cooled. Further, the substrate can be calibrated by the position adjustment device during cooling. Therefore, the laminated body forming system 1 can save space and shorten the formation time of the laminated body.

Further, the temperature adjustment portion 56 has a cooling region for naturally cooling the substrate and the laminate after the formation of the adhesive layer. The cooling zone can be configured to efficiently dissipate heat from the substrate and the laminate. For example, a support point for supporting the substrate and the laminate is formed in the cooling region, and the inner peripheral portion of the surface of the substrate and the laminate is supported at the support point by three to ten points, thereby enabling the substrate and the substrate The heat of the entire laminate is efficiently dissipated.

(first handling device)

The first conveyance device 4 conveys the substrate between the conveyance station 50, the bonding unit 2, the temperature adjustment unit 56, and the thickness measuring device 57. Further, the first conveying device 4 moves in the first conveying device travel path 5 in the direction of the arrow in FIG. The first conveying device 4 transports the substrate, the support plate, and the laminate to a desired position in order to perform the next process after the necessary processing is completed.

(second handling device)

The second conveyance device 54 conveys the substrate between the temperature adjustment unit 56, the bake plate 51, the rotator 52, and the cleaning device 53. Further, the second conveying device 54 moves in the second conveying device travel path 55 in the direction of the arrow in FIG. 4, that is, in the direction orthogonal to the moving direction of the first conveying device 4. The second conveyance device 54 transports the substrates to the desired positions in order to perform the next process after the necessary processing is completed.

(cleaning device)

The cleaning device 53 is a device for washing a substrate coated with an adhesive. In the present embodiment, the cleaning device 53 is formed by applying an adhesive to the substrate and then adhering the adhesive adhering to the end surface or the back surface of the substrate. As a washing method, for example, the substrate on which the adhesive agent is adhered on the end surface or the back surface can be applied to the end surface or the back surface while rotating at 3000 rpm.

The washing liquid is not particularly limited as long as it contains a solvent capable of dissolving the adhesive. For example, a linear hydrocarbon, a branched hydrocarbon having 4 to 15 carbon atoms, or a terpene can be used. Terpene) is a solvent, a lactone, a ketone, a polyvalent alcohol, a polyvalent alcohol derivative, a cyclic ether, an ester, or an aromatic organic solvent. As the washing liquid, propylene glycol monomethyl ether acetate (PGMEA) or propylene glycol monomethyl ether (PGME) is preferred.

[Layered body formation method]

Next, a process of forming a laminate using the laminate forming system 1 will be described in order with reference to the flowchart shown in FIG. Steps S1 to S10 shown in Fig. 5 indicate the processing of the substrate, steps S11 to S13 indicate the processing of the support plate, and steps S14 to S17 indicate the processing of the laminate.

In step S1, the first conveyance device 4 loads the substrate from the conveyance station 50 into the laminate formation system 1. The first conveyance device 4 conveys the substrate to the temperature adjustment unit 56 while supporting the substrate.

In step S2, the first conveyance device 4 places the substrate on the cooling plate of the temperature adjustment unit 56, and the temperature adjustment unit 56 adjusts the temperature of the substrate. Then, the substrate is calibrated on the cooling plate by the position adjusting device of the temperature adjusting portion 56. After the completion of the calibration, the second transfer device 54 carries the substrate into the rotator 52 while supporting the substrate (first carry-in process).

In step S3, the second transfer device 54 mounts the substrate on the rotator 52, and the rotator 52 applies an adhesive to the substrate (adhesive coating process). Since the calibration of the substrate is performed in step S2, the adhesive can be applied to the surface of the substrate in a uniform manner. Further, since the temperature of the substrate is adjusted in step S2, the adhesive can be applied under a constant coating condition. After the adhesive is applied to the substrate, it is placed in the cleaning portion of the rotator 52, and the back surface of the substrate is washed (back rinse). In addition, the cleaning unit may also wash the end faces of the substrate (edge/back rimse) as necessary. After the cleaning is completed, the second conveying device 54 carries the substrate into the baking sheet 51 while supporting the substrate (the second loading machine) Cheng).

In step S4, the second transfer device 54 mounts the substrate on the baking sheet 51, and bakes the adhesive applied to the substrate by a heat source. The solvent can be appropriately volatilized by baking the adhesive. Further, the temperature of the baking adhesive (t ₁ ° C) can be appropriately set depending on the type of the adhesive.

In step S5, the adhesive is further baked. The temperature at which the adhesive is further baked (t ₂ ° C) can be appropriately set in accordance with the type of the adhesive. After the baking is completed, the second conveyance device 54 conveys the substrate to the temperature adjustment unit 56 while supporting the substrate.

In step S6, the second conveyance device 54 mounts the substrate on the cooling plate, and the temperature adjustment unit 56 cools the substrate. Then, the substrate is calibrated on the cooling plate by the position adjusting device. After the calibration is completed, the second conveyance device 54 carries the substrate into the cleaning device 53 while supporting the substrate.

In step S7, the second conveying device 54 mounts the substrate on the cleaning device 53, and the cleaning device 53 performs edge/backwashing on the end surface of the substrate, and backwashes the back surface of the substrate. Thereby, when the adhesive is spin-coated on the substrate in the rotator 52, the adhesive adhering to the end surface and the back surface of the substrate can be removed. Here, since the position adjustment of the substrate is performed in step S6, the end surface (edge) of the substrate can be accurately cleaned. After the cleaning of the substrate is completed, the second transfer device 54 transports the substrate to the baking sheet 51 while supporting the substrate.

In step S8, the second transfer device 54 mounts the substrate on the baking sheet 51, and further applies an adhesive to the substrate by a heat source. The temperature at which the adhesive is further baked (t ₃ ° C) can be appropriately set in accordance with the type of the adhesive. Thereby, the adhesive on the substrate is dried to form an adhesive layer (adhesive layer forming process).

In steps S4, S5 and S8, if the temperatures of the baking adhesives are respectively set to t ₁ , t ₂ , t ₃ (° C), it is preferable to satisfy t ₁ <t ₂ < t ₃ (wherein It is a mode of t ₁ ≧ 60 (°C) and t ₃ ≦ 250 (°C) to gradually increase the temperature of the baking adhesive between steps. If the adhesive is baked at a high temperature immediately after the application of the adhesive, problems such as warpage of the substrate caused by shrinkage of the adhesive, wrinkles of the adhesive surface, foaming of the adhesive, etc. may occur, and a uniform adhesive layer may not be formed, but by the stage Slightly increase the baking temperature to form a uniform adhesive layer.

After the adhesive layer is formed, the second conveyance device 54 conveys the substrate to the temperature adjustment portion 56 while supporting the substrate.

In step S9, the second conveyance device 54 supports the substrate at the support point of the cooling region, and the temperature adjustment portion 56 naturally cools the substrate. After the natural cooling, the first conveying device 4 carries the substrate into the holding portion 3 while supporting the substrate.

In step S10, the first conveyance device 4 carries the substrate and places it on the holding portion 3. The holding unit 3 performs calibration of the substrate. After the calibration, the first conveying device 4 carries the substrate into the overlapping portion 6 while supporting the substrate (the third carrying-in process).

Further, steps S11 to S13 regarding the support plate are performed before, after, or in parallel with the above-described steps S1 to S10 of the substrate. First, in step S11, the first handling device 4 carries the support plate from the delivery station. 50 is put into the laminated body formation system 1. The first conveying device 4 carries the support plate into the thickness measuring device 57 while supporting the support plate.

In step S12, the first conveying device 4 mounts the support plate on the thickness measuring device 57, and the thickness measuring device 57 measures the thickness distribution of the support plate (support thickness distribution measurement project). After the thickness distribution is measured, the first conveying device 4 carries the support plate to the holding portion 3 while supporting the support plate. Before the support plate is attached to the substrate, the thickness distribution of the support plate is measured, whereby the abnormality of the support plate can be detected.

In step S13, the first conveying device 4 carries the loading plate and places it on the holding portion 3. Then, the holding portion 3 aligns the support plate. After the calibration, the first conveying device 4 carries the support plate into the overlapping portion 6 while supporting the support plate (fourth loading process).

In the case where the separation layer is formed on the support plate, the first conveying device 4 preferably conveys the support plate in such a manner that the separation layer is located vertically above the support plate, and then the support plate is turned upside down and then transported to the stack. Joint part 6. The first conveying device 4 supports the back surface of the support plate on which the separation layer is not formed until it is moved into the overlapping portion 6, whereby the time during which the separation layer comes into contact with the first conveying device 4 can be shortened, and the separation layer can be suppressed by the first The handling device 4 is contaminated or damaged.

The first conveying device 4 conveys the support plate to the overlapping portion 6 such that the support plate is positioned vertically above the separation layer. Then, the first conveyance device 4 in the third loading operation is conveyed to the substrate of the overlapping portion 6, and the support plate is superposed in a state in which the separation layer and the adhesive layer face each other.

The stack of the substrate and the support plate can be utilized in the overlap portion 6 The position adjustment unit (not shown) adjusts the relative position of the substrate and the support plate. Thereby, the center positions of the substrate and the support plate are not deviated, and their center positions can be overlapped.

The internal transfer arm (not shown) carries the substrates and the support plate into the attaching portion 7 while supporting the stacked substrate and the support plate.

In step S14, the attaching portion 7 bonds the laminated substrate and the support plate through the adhesive layer (attachment process). At this time, the substrate and the support plate are pressed by the pressurizing plate, and the thermoplastic material forming the adhesive layer is heated to a temperature equal to or higher than the glass transition point. Thereby, the thermal fluidity of the adhesive layer is improved and it is easily deformed, so that a laminate can be formed.

After the formation of the laminate, the first conveyance device 4 conveys the laminate to the temperature adjustment portion 56 while supporting the laminate. In step S15, the first conveyance device 4 supports the laminate at the support point of the cooling zone, and the temperature adjustment unit 56 naturally cools the laminate. By natural cooling, the warpage of the laminate can be reduced. Further, in addition to the natural cooling, the forced exhaust is gradually performed so that no temperature distribution occurs in the substrate, whereby the cooling is completed in a shorter time. After the completion of the cooling, the first conveyance device 4 carries the laminate into the thickness measuring device 57 while supporting the laminate (the fifth loading operation).

In step S16, the thickness distribution (layer thickness distribution measurement project) of the laminate carried into the thickness measuring device 57 is measured. Since the laminate is naturally cooled in step S15, the thickness distribution of the laminate at room temperature (for example, 25 ° C) can be measured.

The quality of the laminate can be confirmed by measuring the thickness distribution of the laminate. Further, since the thickness distribution of the support plate is measured in the step S12, it is possible to know which of the support plate or the adhesive layer is the unevenness in the laminate by comparing the thickness distribution of the support plate with the thickness distribution of the laminate. Caused by the person.

Further, by providing a product number or the like on the substrate or the support plate, the adhesion accuracy of each laminate can be managed, and feedback processing can be fed back to the laminate.

In step S17, after the measurement of the thickness distribution of the laminate is completed, the first conveyance device 4 conveys the laminate from the thickness measuring device 57 to the transfer station 50. Then, the laminate is taken out from the transfer station 50.

Therefore, by the steps of steps S1 to S17, it is possible to form a laminate in which the substrate and the support plate are bonded to each other through the adhesive layer.

Further, by using the above-described two transport devices (the first transport device 4 and the second transport device 54), a plurality of devices constituting the laminate forming system 1 are closely arranged as shown in FIG. Since the substrate, the support plate, and the laminate between the devices can be efficiently transferred, the laminate can be efficiently formed.

The substrate taken out from the transfer station 50 is supplied to a thinner, assembled, or the like in a state of being supported by the laminate of the support plate. Further, after the completion of the process, the light is transmitted through the support plate to the separation layer to degrade the separation layer, whereby the support plate and the substrate can be easily separated.

The present invention is not limited to the above embodiments, and various modifications can be made within the scope of the claims. The embodiments obtained by appropriately combining the technical means disclosed are also included in the technical scope of the present invention.

[Industry Utilization]

The thickness measuring device and the thickness measuring method of the present invention can be widely used, for example, in the manufacturing process of a semiconductor wafer.

Claims (9)

A thickness measuring device comprising: a first laser displacement meter and a second laser displacement meter for measuring a displacement of a surface of the object to be measured; and a displacement gauge holding unit movably holding the first laser displacement Taking the second laser displacement meter; and the calculation device, the first displacement and the second displacement measured by the laser displacement meter are calculated by calculating the thickness of the object to be measured; and the object holding portion is movably The first laser displacement meter and the second laser displacement meter are arranged to face each other in a straight line so as to measure the displacement of the front and back surfaces of the object to be measured, and the object to be measured is provided with a measurement target. The mounting table has a plurality of openings that expose a part of the back surface of the object to be measured. The thickness measuring device according to claim 1, wherein the first laser displacement meter and the second laser displacement meter simultaneously measure the displacement of the front and back surfaces of the object to be measured. The thickness measuring device according to claim 1 or 2, wherein the straight line connecting the first laser displacement meter and the second laser displacement meter is orthogonal to the surface or the back surface of the object to be measured . The thickness measuring device according to claim 1 or 2, wherein the first laser displacement meter and the second laser displacement meter are spectral interference type laser displacement meters. The thickness measuring device according to claim 1 or 2, wherein the mounting table includes an adsorption mechanism for holding the object to be measured. A laminate forming system comprising: a bonding device, a substrate on which an adhesive layer is formed, and a support are bonded to each other through the adhesive layer to form a laminate; and Patent Application No. 1 to The thickness measuring device according to any one of the items 5, wherein the thickness of the laminate as the object to be measured is measured. The laminate forming system according to claim 6, further comprising: a coating device for applying an adhesive on the substrate; and a heating device for heating the substrate coated with the adhesive to form on the substrate Adhesive layer. The laminate forming system according to claim 7, further comprising: a storage unit for storing a substrate; a temperature adjustment unit for adjusting a temperature of the substrate; and a first conveying device at the storage portion and the attaching device And transporting the substrate between the temperature adjustment units; and the second transfer device transporting the substrate between the temperature adjustment unit, the coating device, and the heating device. The laminate forming system according to claim 8, wherein the temperature adjusting unit includes a cooling plate to adjust a temperature of the substrate, and a position adjusting device that adjusts a position of the substrate on the cooling plate.