JP6352014B2 - Thickness measuring instrument - Google Patents

Description

  The present invention relates to a thickness measuring instrument and a thickness measuring method for measuring the thickness of a measurement object.

  As mobile phones, digital AV devices, IC cards, etc. have become more sophisticated, there is an increasing demand for higher integration of chips in packages by reducing the size and thickness of semiconductor silicon chips (hereinafter referred to as chips). ing. In order to achieve high integration of chips in the package, it is necessary to reduce the thickness of the chip to a range of 25 to 150 μm.

  Conventionally, the thickness of a semiconductor wafer (hereinafter referred to as a wafer) serving as a chip base and the thickness of a laminated body including the wafer are measured by a spectral interference type laser displacement meter. Specifically, for example, the surface (upper surface) of the laminate that is the object to be measured is irradiated with laser light from a spectral interference type laser displacement meter, and the spectrum that is the reflected light reflected on each surface of the wafer front and back surfaces and the laminate is measured. It receives light and measures the thickness of the wafer and the thickness of the laminate. Further, in Patent Document 1, a light spot is applied from the optical displacement meter to the front and back surfaces of the measurement object being transported by the transport device, the displacement of the front and back surfaces of the measurement object is measured, and the thickness is calculated. A thickness measuring device is described. The thickness measuring device corresponds to the position of the first light spot applied to the front surface on the back surface of the measurement object that transmits light in order to avoid interference between the light spots irradiated from the optical displacement meter. The second light spot is shifted and applied to a position in the vicinity of the position, and the measurement timing is synchronized with the conveyance speed of the measurement object.

Japanese Patent Laid-Open No. 9-273912

  However, in the conventional method of measuring the thickness of the wafer and the thickness of the laminated body by receiving the spectrum which is the reflected light reflected by the front and back surfaces of the wafer and each layer of the laminated body, for example, a wafer (circuit is formed) When the thickness of the device wafer) is measured, the state of the wafer surface (irregularities) varies depending on the circuit depending on the location, the material of the wafer, or the bump made of metal formed in the circuit, There is a problem that the thickness and the thickness of the laminate cannot be measured accurately. Furthermore, when the laminate includes a wafer and a glass as a support, and the refractive index of the wafer and the glass is close to each other, there is a problem in that the spectra overlap each other and the thickness cannot be measured accurately. doing. Moreover, in the thickness measuring apparatus described in Patent Document 1, when the apparatus slightly vibrates or the conveyance speed of the measurement object slightly fluctuates, the first light spot applied to the surface on the back surface of the measurement object Thus, the second light spot does not hit the position corresponding to the position, and the thickness cannot be measured accurately.

  The present invention has been made in consideration of the above problems, and the main purpose of the present invention is not affected by the minute vibration of the apparatus or the presence or absence of irregularities on the front and back surfaces of the measurement object. An object of the present invention is to provide a thickness measuring instrument and a thickness measuring method capable of accurately measuring the thickness.

  In order to solve the above-described problems, a thickness measuring instrument according to the present invention includes a first laser displacement meter and a second laser displacement meter that measure the displacement of the surface of an object to be measured, and the laser displacement meter. A calculation device that calculates the thickness of the measurement object from the first displacement and the second displacement that are calculated, and the first laser displacement meter and the second laser displacement meter In order to measure the displacement of the front and back surfaces, they are arranged opposite to each other on a straight line.

  In order to solve the above-described problem, a thickness measurement method according to the present invention includes a measurement object disposed between a first laser displacement meter and a second laser displacement meter that are opposed to each other on a straight line, and A measurement step of measuring the first displacement of the front surface of the measurement object and the second displacement of the back surface, and a calculation step of calculating the thickness of the measurement object by calculation from the first displacement and the second displacement. , At least.

  According to the present invention, a thickness measuring instrument capable of accurately measuring the thickness of the measurement object without being influenced by micro vibrations of the apparatus or the presence or absence of irregularities on the front and back surfaces of the measurement object, There is an effect that a thickness measuring method can be provided.

It is a top view of the thickness measuring device which concerns on one Embodiment of this invention. It is a side view of the said thickness measuring device. It is general | schematic sectional drawing which shows the state in which the said thickness measuring device is measuring the thickness of the laminated body which is a measuring object. It is a schematic plan view which shows the whole structure of the laminated body formation system provided with the said thickness measuring device. It is a flowchart which shows the laminated body formation method which the said laminated body formation system performs.

  Hereinafter, embodiments of the present invention will be described in detail.

[Measurement object]
The object to be measured is not particularly limited, but is preferably flat. For example, a wafer serving as a base of a chip, a laminate including the wafer, and a support plate (support) are preferable. Various layers such as an adhesive layer and a separation layer may be formed on the surface of the wafer. The wafer may be a substrate in which a fine structure such as an electronic circuit is formed on the surface on the adhesive layer side. Furthermore, it may be a laminate in which a support plate made of glass, silicon, acrylic resin, ceramic, or the like is attached via an adhesive layer. The measurement object is not limited to a laminate, a support plate, or a substrate made of a wafer, and an arbitrary substrate such as a thin film substrate or a flexible substrate can be selected.

  Hereinafter, as a measurement object, a laminated body in which a substrate made of a wafer, an adhesive layer, and a support plate made of glass are laminated will be mainly described as an example.

[Thickness measuring instrument]
A thickness measuring instrument according to an embodiment of the present invention will be described below with reference to FIGS. 1 and 2. As shown in FIGS. 1 and 2, the thickness measuring device 57 is a device for measuring the thickness of a laminate, for example, a measurement object, and measures thicknesses at a plurality of locations on the front and back surfaces of the laminate. And when obtaining thickness distribution, it is also called a thickness distribution measuring apparatus. Here, the thickness distribution of the laminate as the measurement object indicates an in-plane distribution on the upper surface (upper surface of the support plate) or the lower surface (lower surface of the substrate) of the laminate. Since the thickness measuring instrument 57 includes a non-contact laser displacement meter, the thickness distribution of the laminated body can be suitably measured.

  As shown in FIGS. 1 and 2, the thickness measuring device 57 includes a first laser displacement meter 26 that measures the displacement (first displacement) of the surface of the laminate, for example, a measurement object, and the back surface of the laminate. Are mainly provided with a displacement meter holding unit 21 that movably holds a second laser displacement meter 27 that measures the displacement (second displacement) and a measurement object holding unit 22 that holds the laminate.

  The displacement meter holding unit 21 is mainly composed of a first moving member 23, a pair of rail members 24, and a second moving member 25. Further, the displacement meter holding unit 21 includes a drive unit (not shown) that drives the first moving member 23 and the second moving member 25.

  The pair of rail members 24 are arranged in parallel with each other with the measurement object holding part 22 interposed therebetween, support the first moving member 23 so as to be movable, approach the measurement object holding part 22, and the measurement object. A guide for moving the first moving member 23 in a direction away from the holding portion 22 (in the direction of the arrow in FIG. 1).

  The first moving member 23 movably supports the second moving member 25 and moves the second moving member 25 in a direction orthogonal to the moving direction of the first moving member 23 (the arrow direction in FIGS. 1 and 2). It has become a guide to let you.

  The second moving member 25 has a “U” shape whose shape viewed from the side is open toward the measurement object holding part 22, and protrudes up and down toward the measurement object holding part 22. A first laser displacement meter 26 and a second laser displacement meter 27 are held at the tips of the jigs 25a and 25b. Specifically, the first laser displacement meter 26 is held at the tip of the measuring jig 25a protruding upward, and the second laser displacement meter 27 is attached to the tip of the measuring jig 25b protruding downward. Is held. In addition, a position adjusting member 26 a for aligning the first laser displacement meter 26 is provided at the tip of the measuring jig 25 a.

  The first laser displacement meter 26 includes an irradiation unit that irradiates the laminate, which is a measurement object, with laser light, a light receiving unit that receives only the laser light reflected from the surface of the laminate, and a signal that receives the received laser light. And a transmission unit (none of which is shown) that converts the data into a calculation device. Similarly, the second laser displacement meter 27 includes an irradiation unit that irradiates a laminate as a measurement object with laser light, a light receiving unit that receives only laser light reflected from the back surface of the laminate, and a laser that has received the laser. A transmission unit (none of which is shown) that converts light into a signal and transmits the signal to a calculation device. The first laser displacement meter 26 and the second laser displacement meter 27 are not particularly limited as long as they can measure the displacement of the surface of the laminate as a measurement object in a non-contact manner. More preferably, it is a spectral interference type laser displacement meter.

  The first laser displacement meter 26 and the second laser displacement meter 27 are arranged in a straight line in order to measure the displacement of the front and back surfaces of a laminate (not shown) placed on the measurement object holding unit 22. Are arranged opposite to each other. In addition, the first laser displacement meter 26 and the second laser displacement meter 27 are arranged so that the first laser displacement meter 26 and the second laser displacement meter 27 are arranged on the front surface or the back surface of the laminate placed on the measurement object holding unit 22. The measuring jigs 25a and 25b are attached to the tip portions of the measuring jigs 25a and 25b so that the straight line connecting the second laser displacement meters 27 is orthogonal. Accordingly, even if the first laser displacement meter 26 and the second laser displacement meter 27 are moved by driving the displacement meter holding unit 21 or the device is slightly vibrated, their relative positions and distances to each other. Is always constant.

  The displacement meter holding unit 21 moves the first moving member 23 and the second moving member 25 to thereby move the first laser displacement meter 26 and the second laser held at the distal ends of the measuring jigs 25a and 25b. The displacement meter 27 is moved to a desired position of the laminated body placed on the measurement object holding unit 22. That is, the displacement meter holding unit 21 is configured to move the first laser displacement meter 26 and the second laser displacement meter 27 relative to the measurement object holding unit 22. Specifically, the displacement meter holding unit 21 moves the first laser displacement meter 26 to a desired position on the surface of the laminate, and moves the second laser displacement meter 27 on the back surface of the laminate. The position is moved to a position corresponding to the desired position. However, in the present invention, the “desired position” refers to a position corresponding to the positions of a plurality of holes formed in the holding stage 31 and capable of exposing a part of the back surface of the laminated body.

  The measurement object holding unit 22 includes a holding stage (mounting table) 31 that holds, for example, a stacked body that is a measurement object. The holding stage 31 includes a suction mechanism for mounting and fixing the stacked body on the holding stage 31. By fixing the laminated body to the holding stage 31 using the suction mechanism, the thickness measuring device 57 can accurately measure the thickness of the laminated body while suppressing the warp even if the laminated body is warped. Can do. The configuration of the suction mechanism is not particularly limited, and a known suction device equipped with a vacuum pump or the like may be used.

  Further, the holding stage 31 is formed with a large number of holes (openings) (not shown) arranged in a grid pattern with an interval of 10 mm, for example. Thereby, in the state which hold | maintained the laminated body on the holding stage 31, a part of back surface of the said laminated body can be exposed through the said hole. In addition, the space | interval of holes is not specifically limited, For example, what is necessary is just to set suitably according to the magnitude | size etc. of a measurement object.

  Further, the thickness measuring device 57 calculates the thickness of the laminate by calculation from the first displacement and the second displacement measured by the first laser displacement meter 26 and the second laser displacement meter 27. For example, a calculation device (not shown) for outputting to an external display device is provided. The configuration of the calculation device is not particularly limited, and it is only necessary to include a known arithmetic device or a storage device that stores the thickness.

  Further, the thickness measuring device 57 is a control unit (not shown) for controlling the operation of the first laser displacement meter 26 and the second laser displacement meter 27 and the driving of the displacement meter holding unit 21 and the measurement object holding unit 22. )). Therefore, the operation of the drive unit that drives the first moving member 23 and the second moving member 25 is controlled by the control unit.

  In FIGS. 1 and 2, the displacement meter holding unit 21 moves the first laser displacement meter 26 and the second laser displacement meter 27 relative to the measurement object holding unit 22. However, the thickness measuring device is not limited to the configuration, and the measurement object holding unit is compared with the first laser displacement meter and the second laser displacement meter held by the displacement meter holding unit. The displacement meter holding unit and the measurement object holding unit may be configured to move relative to each other. Further, the relative movement of the displacement meter holding part and the measurement object holding part may be any movement such as linear movement, rotational movement, etc., and the thickness of a plurality of positions on the front and back surfaces of the laminate can be measured. It only has to be able to do it.

[Thickness measurement method]
Next, a method for measuring the thickness of the laminate using the thickness measuring instrument 57 having the above-described configuration will be described in order with reference to FIG.

  First, the laminate 40 that is a measurement object is placed on the holding stage 31 of the measurement object holding unit 22, and the laminate 40 is fixed to the holding stage 31 using an adsorption mechanism. At this time, the displacement meter holding unit 21 is located at the home position (initial position).

  Next, the displacement meter holding part 21 is driven, the first moving member 23 and the second moving member 25 are moved, and the first laser displacement meter 26 is moved to a desired position on the surface of the laminate 40. At the same time, the second laser displacement meter 27 is moved to a position corresponding to the desired position on the back surface of the laminate 40. Thereby, the laminated body 40 is arrange | positioned between the 1st laser displacement meter 26 and the 2nd laser displacement meter 27 which were opposingly arranged on the straight line. In addition, a straight line connecting the first laser displacement meter 26 and the second laser displacement meter 27 is orthogonal to the front surface or back surface of the laminate 40.

  After the movement, the first laser displacement meter 26 irradiates the upper surface of the laminated body 40 (the upper surface of the support plate 43) with laser light, and receives the laser light A reflected by the laminated body 40, while the second laser displacement. From the total 27, through the hole 32 formed in the holding stage 31, the lower surface of the stacked body 40 (the lower surface of the substrate 41) is irradiated with laser light, and the laser light B reflected by the stacked body 40 is received. Thereby, the 1st displacement of the surface of the laminated body 40 and the 2nd displacement of a back surface are measured (measurement process).

  At this time, the first laser displacement meter 26 and the second laser displacement meter 27 may simultaneously measure the displacement of the front and back surfaces of the stacked body 40 by irradiating the laser beam, or separately irradiate the laser beam. Thus, the displacement of the front and back surfaces of the laminate 40 may be measured separately. In the measurement with a certain hole 32, the positions of the first laser displacement meter 26 and the second laser displacement meter 27 are apparently fixed. It may be simultaneous or different from each other. However, the thickness can be more accurately measured by irradiating the laser beam at the same time, and the measurement time can be shortened.

  Further, the light receiving part of the first laser displacement meter 26 receives only the laser light A reflected by the surface of the laminate 40, and the light receiving part of the second laser displacement meter 27 is reflected by the back surface of the laminate 40. Only the laser beam B is received. That is, the first laser displacement meter 26 and the second laser displacement meter 27 detect only the reflected light from the front and back surfaces of the laminated body 40, and pass through the support plate 43, the adhesive layer 42, and the substrate 41, or in each of these layers. Since the reflected laser beam is not detected, the laser beams A and B do not interfere with each other.

  The first laser displacement meter 26 and the second laser displacement meter 27 convert the received laser light into a signal and transmit it to the calculation device. The calculation device calculates the thickness of the stacked body 40 by calculation from the first displacement and the second displacement (calculation step), and outputs the result to, for example, an external display device or stores it in a storage device. .

  When the measurement of the displacement of the front and back surfaces of the laminate 40 in a certain hole 32 is finished, the thickness measuring device 57 drives the displacement meter holding unit 21 to move the first moving member 23 and the second moving member 25. The first laser displacement meter 26 and the second laser displacement meter 27 are moved relative to a position to be measured next, specifically, a position corresponding to the position of the next hole 32. Thereby, the displacement of the front and back surfaces of the laminate 40 at the position of the next hole 32 is measured, and the thickness of the laminate 40 is calculated.

  Then, the said measurement is repeated according to the magnitude | size etc. of the laminated body 40, and multiple displacements of the surface of the laminated body 40 are measured. The thickness measuring instrument 57 measures the thickness by moving the first laser displacement meter 26 and the second laser displacement meter 27 relative to the stacked body 40, so that the thickness is measured over the entire front and back surfaces of the stacked body 40. Can be measured. Therefore, the thickness distribution of the laminate 40 can be measured. Further, since the relative position and distance of the first laser displacement meter 26 and the second laser displacement meter 27 are always constant, the presence or absence of irregularities on the front and back surfaces of the laminated body 40 is confirmed. The thickness of the laminate 40 can be accurately measured without being influenced by the above.

  In the above description, the displacement meter holding unit 21 moves the first laser displacement meter 26 and the second laser displacement meter 27 relative to the measurement object holding unit 22. The measurement method is not limited to this method, and the measurement object holding unit is moved relative to the first laser displacement meter and the second laser displacement meter held by the displacement meter holding unit. There may be a method in which the displacement meter holding unit and the measurement object holding unit move relative to each other.

[Laminated body formation system]
A laminated body forming system including the thickness measuring device 57 having the above-described configuration will be described below with reference to FIG. The laminated body forming system is a system for forming a laminated body by bonding a substrate and a support plate as a support through an adhesive layer.

  In consideration of processes such as thinning and mounting of the substrate after the formation of the laminate, the thickness distribution value of the laminate is preferably small. For product quality control, the thickness of the laminate in the semiconductor wafer manufacturing process It is preferable to measure the distribution. In the present embodiment, since the laminate forming system includes the thickness measuring device 57, the thickness distribution of the laminate can be measured during the laminate forming process, which is efficient. Moreover, the information regarding the thickness distribution of the laminated body is useful for, for example, detecting an abnormality in the produced laminated body.

  In the present embodiment, the thickness measuring device 57 measures the thickness distribution of the support plate before being attached to the substrate. Since the thickness distribution of the laminated body also depends on the thickness distribution of the support plate, it is possible to know what is caused by the abnormality of the produced laminated body by measuring the thickness distribution of the support plate in advance. Moreover, the information regarding the thickness distribution of the support plate is useful for detecting an abnormality of the support plate, for example.

  As shown in FIG. 4, the laminate forming system 1 forms a bonding layer on a spinner (coating apparatus) 52 that applies an adhesive on a substrate and a substrate on which the adhesive is applied. Bake plate (heating device) 51, substrate and support plate are bonded to each other via an adhesive layer to form a laminated body 6 and a pasting part (sticking device) 7, and the thickness distribution of the laminated body is measured. And a thickness measuring device 57 to be provided. And the laminated body formation system 1 is further provided with the carrier station (storage part) 50, the temperature control part 56, the 1st conveying apparatus 4, the 2nd conveying apparatus 54, and the washing | cleaning apparatus 53. FIG. The stacked body forming system 1 may include a holding unit 3 and an overlapping unit 6. In addition, the laminated body formation system 1 is provided with the control part (not shown) which controls operation | movement of each apparatus.

  Hereinafter, each apparatus of the laminated body formation system 1 is demonstrated.

(Applicator)
The spinner (coating device) 52 is a device that applies an adhesive onto a substrate. In the present embodiment, the second transport device 54 carries the substrate into the spinner 52 and places it thereon. The spinner 52 spin-coats an adhesive on the substrate while rotating the mounted substrate at, for example, 3000 rpm. The method for applying the adhesive to the substrate is not particularly limited, and examples thereof include spin coating, dipping, roller blades, spray coating, and slit coating. Further, the rotation speed of the substrate is not particularly limited, and may be set as appropriate according to the type of adhesive, the size of the substrate, and the like.

  Further, the spinner 52 may include a cleaning unit that further applies a cleaning liquid for cleaning the adhesive attached to the end face or the back surface of the substrate when the adhesive is applied on the substrate. Thereby, the end surface or the back surface of the substrate can be cleaned while applying the adhesive on the substrate without separately providing a cleaning device for cleaning the adhesive. Therefore, in the laminated body formation system 1 which concerns on this invention, space can be saved and the formation time of a laminated body can be shortened.

(Heating device)
The bake plate (heating device) 51 is a device that heats a substrate coated with an adhesive by a spinner 52 and forms an adhesive layer on the substrate. In this embodiment, after applying an adhesive on the substrate by the spinner 52, the substrate is placed on the bake plate 51 and the adhesive is baked. The adhesive can be baked by attaching a heat source to the bake plate 51 or attaching a heat source to the top plate. Examples of the heat source include a hot water heater, a warm air heater, an infrared heater, and an electric heater.

(Overlapping part)
The overlapping portion 6 is a device that overlaps the substrate and the support plate via an adhesive layer. For example, in the present embodiment, the superimposing unit 6 superimposes the substrate and the support plate after adjusting the relative position between the substrate and the support plate using a position adjusting unit (not shown). Yes.

(Paste device)
The sticking unit (sticking device) 7 is a device that forms a laminated body by sticking a substrate and a support plate through an adhesive layer. In the affixing unit 7, the adhesive layer is heated while pressing the substrate and the support plate superimposed in the overlapping unit 6. Specifically, for example, press plates may be provided on the upper and lower sides of the sticking unit 7, and the superposed substrate and support plate may be placed and pressed between the upper and lower press plates. Thereby, a laminated body can be formed.

(Lamination unit)
In the present embodiment, the overlapping portion 6 and the pasting portion 7 constitute a pasting unit 2. The bonding unit 2 can have a structure in which a wall that partitions the inside of one processing chamber into two processing chambers is provided. Alternatively, the bonding unit 2 may have a structure in which the overlapping portion 6 and the bonding portion 7 are in contact with each other without a gap on each side surface. At the boundary between the overlapping portion 6 and the attaching portion 7, a substrate and a support plate overlapped by the overlapping portion 6, and a gate 8 for delivering the laminate formed by attaching the attaching portion 7 are provided. ing. The opening and closing of the gate 8 is controlled by a shutter. A conventionally known structure can be used to open and close the gate 8, and for example, a gate valve structure can be applied.

  In addition, a delivery window 9 for delivering the substrate, the support plate, and the laminated body between the bonding unit 2 and the first transport device 4 is provided in the overlapping portion 6 so as to be openable and closable. The overlapping part 6 and the sticking part 7 are each provided with a known decompression device (not shown), and the state of the internal pressure of the overlapping part 6 and the sticking part 7 can be controlled independently. Further, the laminating unit 2 is provided with an internal transfer device (not shown) for transferring the laminate between the overlapping portion 6 and the affixing portion 7 via the gate 8.

  Since the affixing portion 7 has a configuration capable of reducing the pressure, the substrate and the support plate can be bonded to each other through an adhesive layer in a reduced pressure atmosphere. By pressure-bonding the substrate to the adhesive layer in a reduced-pressure atmosphere, the adhesive layer can enter the dent in a state where there is no air in the dent of the uneven pattern on the substrate surface. It is possible to more reliably prevent the generation of bubbles.

  The gate 8 is configured so that the superposed substrate and the support plate can be moved from the superimposing unit 6 to the pasting unit 7 with the shutter opened, and the laminated body is moved from the pasting unit 7 to the superposing unit 6. It is formed so that it can be moved. Therefore, the gate 8 opens the shutter in a state where both the overlapping portion 6 and the pasting portion 7 are depressurized, so that the superposed substrate and the support plate are transferred from the superposing portion 6 to the pasting portion 7 and the laminated body. Can be moved from the affixing portion 7 to the overlapping portion 6 under reduced pressure.

(Storage part)
The carrier station (storage unit) 50 stores a substrate and a support plate. In the present embodiment, the substrate and the support plate can be put into the stacked body forming system 1 via the carrier station 50. Moreover, the laminated body formed in the sticking part 7 can be taken out from the laminated body forming system 1 via the carrier station 50.

(Holding part)
The holding unit 3 is a device for aligning the substrate and the support plate. The holding unit 3 includes an imaging unit and a center position detection unit (not shown), and holds the substrate or the support plate before being overlaid.

  The imaging unit is composed of, for example, a CCD camera, and images each of regions including different end surfaces of the held substrate or support plate. The region is preferably set, for example, approximately on a diagonal line of the held substrate or support plate.

  The center position detection unit detects the center position of the held substrate or support plate based on a plurality of images captured by the imaging unit. The center position detection unit only needs to calculate a virtual circle based on the image of the end face of the disk and detect the center position. The technique for detecting the center position based on the image of the end face is not particularly limited as long as known image processing is used.

  After the center position is detected by the holding unit 3, the substrate or the support plate is transported to the overlapping unit 6 by the first transport device 4. Then, the position of the substrate or the support plate is adjusted by the position adjusting unit (not shown) in the overlapping unit 6 so that the center positions detected by the holding unit 3 overlap each other before the overlapping.

(Temperature adjuster)
The temperature adjusting unit 56 includes a cooling plate (not shown) that adjusts the temperature of the substrate by cooling the substrate, and a position adjusting device (not shown) that adjusts the position of the substrate. In the present embodiment, the first transfer device 4 and the second transfer device 54 deliver the substrate with the temperature adjustment unit 56 interposed therebetween.

  By placing the substrate or the laminated body on the cooling plate, the substrate or the laminated body can be cooled. Further, the substrate can be aligned using the position adjusting device during cooling. Therefore, the stack forming system 1 can be saved in space, and the stack forming time can be shortened.

  Furthermore, the temperature adjusting unit 56 has a cooling area for naturally cooling the substrate and the laminated body after the adhesive layer is formed. The cooling area should just be the structure which can release | release the heat | fever of a board | substrate and a laminated body efficiently. For example, a support point for supporting the substrate and the laminate is formed in the cooling area, and the inner periphery of the surface of the substrate and the laminate is supported by the support point at three to ten points. And the heat of the whole laminated body can be released efficiently.

(First transfer device)
The first transport device 4 transports the substrate among the carrier station 50, the bonding unit 2, the temperature adjustment unit 56, and the thickness measuring device 57. Moreover, the 1st conveying apparatus 4 moves the inside of the 1st conveying apparatus driving path 5 in the arrow direction in FIG. The first transport device 4 transports the substrate, the support plate, and the stacked body to desired positions in order to perform the next processing after the necessary processing is completed.

(Second transfer device)
The second transport device 54 transports the substrate among the temperature adjustment unit 56, the bake plate 51, the spinner 52, and the cleaning device 53. Further, the second transport device 54 moves in the second transport device travel path 55 in the direction of the arrow in FIG. 4, that is, in the direction orthogonal to the moving direction of the first transport device 4. The second transport device 54 transports the substrate to a desired position in order to perform the next processing after the necessary processing is completed.

(Cleaning device)
The cleaning device 53 is a device for cleaning the substrate coated with the adhesive. In this embodiment, the cleaning device 53 cleans the adhesive adhered to the end surface or the back surface of the substrate after applying the adhesive on the substrate. As a cleaning method, for example, the cleaning liquid may be applied to the end surface or the back surface while rotating the substrate having the adhesive attached to the end surface or the back surface at 3000 rpm.

  The cleaning liquid is not particularly limited as long as it contains a solvent capable of dissolving the adhesive, and examples thereof include linear hydrocarbons, branched hydrocarbons having 4 to 15 carbon atoms, and terpenes. Solvents, lactones, ketones, polyhydric alcohols, derivatives of polyhydric alcohols, cyclic ethers, esters, aromatic organic solvents and the like can be used. As the cleaning liquid, propylene glycol monomethyl ether acetate (PGMEA) and propylene glycol monomethyl ether (PGME) are more preferable.

[Laminate Forming Method]
Next, the process of forming a laminated body using the laminated body formation system 1 is demonstrated in order, referring the flowchart shown in FIG. Steps S1 to S10 shown in FIG. 5 represent processes related to the substrate, steps S11 to S13 represent processes related to the support plate, and steps S14 to S17 represent processes related to the laminated body.

  In step S <b> 1, the first transport device 4 inputs the substrate from the carrier station 50 into the stacked body forming system 1. The first transport device 4 transports the substrate to the temperature adjustment unit 56 while supporting the substrate.

  In step S <b> 2, the first transport device 4 places the substrate on the cooling plate of the temperature adjustment unit 56, and the temperature adjustment unit 56 adjusts the temperature of the substrate. Then, the substrate is aligned on the cooling plate by the position adjusting device of the temperature adjusting unit 56. After the alignment, the second transport device 54 carries the substrate into the spinner 52 while supporting the substrate (first loading step).

  In step S3, the second transport device 54 places the substrate on the spinner 52, and the spinner 52 applies an adhesive to the substrate (adhesive application step). Since the substrate is aligned in step S2, the adhesive can be evenly applied to the surface of the substrate by spin coating. Further, since the temperature of the substrate is adjusted in step S2, the adhesive can be applied under certain application conditions. After applying the adhesive to the substrate, the cleaning unit provided in the spinner 52 cleans (back rinses) the back surface of the substrate. Further, the cleaning unit may clean the edge surface of the substrate (edge back rinse) as necessary. After completion of the cleaning, the second transport device 54 transports the substrate to the bake plate 51 while supporting the substrate (second carry-in process).

In step S4, the second transport device 54 places the substrate on the bake plate 51, and uses the heat source to bake the adhesive applied to the substrate. By baking the adhesive, the solvent can be volatilized appropriately. The temperature for baking the adhesive (t ₁ ° C.) can be determined as appropriate depending on the type of adhesive.

In step S5, the adhesive is further baked. The temperature (t ₂ ° C) at which the adhesive is further baked can be appropriately determined according to the type of adhesive. After the completion of baking, the second transport device 54 transports the substrate to the temperature adjustment unit 56 while supporting the substrate.

  In step S6, the second transport device 54 places the substrate on the cooling plate, and the temperature adjustment unit 56 cools the substrate. Then, the substrate is aligned on the cooling plate by the position adjusting device. After the alignment, the second transport device 54 carries the substrate into the cleaning device 53 while supporting the substrate.

  In step S7, the second transfer device 54 places the substrate on the cleaning device 53, and the cleaning device 53 performs edge back rinsing on the end surface of the substrate and back rinsing on the back surface of the substrate. Thereby, when the adhesive is spin-coated on the substrate by the spinner 52, the adhesive adhered to the end surface and the back surface of the substrate can be removed. Here, since the position of the substrate is adjusted in step S6, the end face (edge) of the substrate can be accurately cleaned. After the cleaning of the substrate, the second transport device 54 transports the substrate to the bake plate 51 while supporting the substrate.

In step S <b> 8, the second transport device 54 places the substrate on the bake plate 51, and further bakes the adhesive applied to the substrate using a heat source. The temperature (t ₃ ° C) at which the adhesive is further baked can be appropriately determined according to the type of adhesive. Thereby, the adhesive on the substrate is dried and an adhesive layer is formed (adhesive layer forming step).

In steps S4, S5, and S8, assuming that the temperatures at which the adhesive is baked are t ₁ , t ₂ , and t ₃ (° C.), respectively, t ₁ <t ₂ <t ₃ (where t ₁ ≧ 60 (° C.) and t 1 ₃ ≦ 250 (° C.) is preferable, and the temperature at which the adhesive is baked between steps is preferably increased step by step. When baking at high temperature immediately after the application of adhesive is completed, defects such as warpage of the substrate due to shrinkage of the adhesive, wrinkles on the adhesive surface, and foaming of the adhesive are likely to occur, and a uniform adhesive layer should be formed. However, it is possible to form a uniform adhesive layer by raising the baking temperature stepwise.

  After the formation of the adhesive layer, the second transport device 54 transports the substrate to the temperature adjustment unit 56 while supporting the substrate.

  In step S <b> 9, the second transport device 54 supports the substrate on the support point of the cooling area, and the temperature adjustment unit 56 naturally cools the substrate. After natural cooling, the first transport device 4 carries the substrate to the holding unit 3 while supporting the substrate.

  In step S <b> 10, the first transport device 4 carries the substrate into the holding unit 3 and places it thereon. The holding unit 3 performs alignment of the substrate. After the alignment, the first transport device 4 carries the substrate into the overlapping portion 6 while supporting the substrate (third carry-in process).

  And before step S1-S10 regarding a board | substrate, after completion | finish, or in parallel, step S11-S13 regarding a support plate is performed. First, in step S <b> 11, the first transport device 4 loads the support plate from the carrier station 50 into the stacked body forming system 1. The first transport device 4 carries the support plate into the thickness measuring device 57 while supporting the support plate.

  In step S12, the first transport device 4 places the support plate on the thickness measuring device 57, and the thickness measuring device 57 measures the thickness distribution of the support plate (support thickness distribution measuring step). After measuring the thickness distribution, the first transport device 4 carries the support plate to the holding unit 3 while supporting the support plate. An abnormality of the support plate can be detected by measuring the thickness distribution of the support plate before the support plate is bonded to the substrate.

  In step S <b> 13, the first transport device 4 carries the support plate into the holding unit 3 and places it. And the holding | maintenance part 3 aligns a support plate. After the alignment, the first transport device 4 loads the support plate into the overlapping portion 6 in a state where the support plate is supported (fourth loading step).

  When the separation layer is formed on the support plate, the first transport device 4 transports the support plate so that the separation layer is positioned vertically above the support plate, and then the support plate is turned upside down. Then, it is preferable to convey it to the overlapping portion 6. Until the first conveyance device 4 supports the back surface of the support plate on which the separation layer is not formed before the separation layer 6 is carried in, the time for the separation layer and the first conveyance device 4 to contact is shortened. The separation layer can be prevented from being contaminated or damaged by the first transport device 4.

  The first transport device 4 transports the support plate to the overlapping unit 6 so that the support plate is positioned vertically above the separation layer. And the board | substrate and the said support plate which the 1st conveying apparatus 4 conveyed to the superimposition part 6 at the 3rd carrying-in process are piled up in the state which the separation layer and the contact bonding layer faced.

  The superposition of the substrate and the support plate may be performed after adjusting the relative position between the substrate and the support plate using a position adjustment unit (not shown) in the superposition unit 6. Thereby, the center positions of the substrate and the support plate can be overlapped without shifting.

  An internal transfer arm (not shown) carries the substrate and the support plate into the affixing unit 7 in a state where the overlapped substrate and the support plate are supported.

  In step S14, the sticking unit 7 sticks the superposed substrate and the support plate together through an adhesive layer (sticking step). At this time, while pressing the substrate and the support plate with a press plate, heating is performed until the thermoplastic material forming the adhesive layer reaches a temperature equal to or higher than the glass transition point. Thereby, the heat fluidity of the adhesive layer is improved, and the adhesive layer is easily deformed, so that a laminate can be formed.

  After forming the stacked body, the first transport device 4 transports the stacked body to the temperature adjusting unit 56 in a state where the stacked body is supported. In step S15, the 1st conveying apparatus 4 makes a laminated body be supported by the support point of a cooling area, and the temperature control part 56 cools a laminated body naturally. By naturally cooling, the warpage of the laminate can be reduced. In addition to natural cooling, cooling is completed in a shorter time by performing forced exhausting gently so as not to cause a temperature distribution in the substrate. After the cooling is completed, the first transport device 4 carries the laminated body into the thickness measuring device 57 while supporting the laminated body (fifth carrying-in process).

  In step S16, the thickness distribution of the laminated body carried into the thickness measuring instrument 57 is measured (laminate thickness distribution measuring step). Since the laminated body is naturally cooled in step S15, the thickness distribution of the laminated body at room temperature (for example, 25 ° C.) can be measured.

  By measuring the thickness distribution of the laminate, the quality of the laminate can be confirmed. In addition, since the thickness distribution of the support plate is measured in step S12, the unevenness in the laminated body can be detected by comparing the thickness distribution of the support plate with the thickness distribution of the laminated body. You can know if it is caused by

  Further, by providing a product number or the like on the substrate or the support plate, it is possible to manage the pasting accuracy for each laminate, and to feed back to the laminate formation process.

  In step S <b> 17, after the measurement of the thickness distribution of the stacked body is completed, the first transport device 4 transports the stacked body from the thickness measuring device 57 to the carrier station 50. Then, the laminated body is taken out from the carrier station 50.

  Therefore, the laminated body which bonded the board | substrate and the support plate through the contact bonding layer by the step of S1-S17 can be formed.

  Further, by carrying out conveyance using the above-mentioned two conveyance devices (first conveyance device 4 and second conveyance device 54) properly, a large number of devices constituting the laminate forming system 1 can be made compact as shown in FIG. Even if it arrange | positions, the board | substrate, a support plate, and a laminated body can be efficiently delivered between apparatuses, Therefore A laminated body can be formed efficiently.

  The substrate taken out from the carrier station 50 is subjected to processes such as thinning and mounting in the state of a laminated body supported by the support plate. And after completion | finish of a process, a support plate and a board | substrate can be easily isolate | separated by irradiating light to a separation layer through a support plate and changing a separation layer.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims, and the embodiments can be obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The thickness measuring device and the thickness measuring method according to the present invention can be widely used, for example, in a semiconductor wafer manufacturing process.

DESCRIPTION OF SYMBOLS 1 Laminate formation system 2 Bonding unit 3 Holding part 4 1st conveyance means (conveyance apparatus)
5 First transport means travel path 6 Overlap part (sticking device)
7 Affixing part (applying device)
8 Gate 9 Delivery Window 21 Displacement Meter Holding Unit 22 Measurement Object Holding Unit 23 First Moving Member 24 Rail Member 25 Second Moving Member 26 First Laser Displacement Meter 27 Second Laser Displacement Meter 31 Holding Stage (Mounting Stage)
50 Carrier station (storage)
51 Bake plate (heating device)
52 Spinner (coating device)
53 Cleaning device 54 Second conveying means (conveying device)
55 Second transport means travel path 56 Temperature control unit 57 Thickness measuring device

Claims (9)

A first laser displacement meter and a second laser displacement meter for measuring the displacement of the surface of the object to be measured; and a displacement meter holding unit for holding the first laser displacement meter and the second laser displacement meter movably A calculation device that calculates the thickness of the measurement object from the first displacement and the second displacement measured by the laser displacement meter, and a measurement object holding unit that holds the measurement object movably With
The first laser displacement meter and the second laser displacement meter are arranged to face each other on a straight line in order to measure the displacement of the front and back surfaces of the measurement object ,
The measuring object holding unit includes a mounting table on which the measuring object is mounted, and the mounting table has a plurality of openings exposing a part of the back surface of the measuring object . .   The thickness measuring instrument according to claim 1, wherein the first laser displacement meter and the second laser displacement meter simultaneously measure the displacement of the front and back surfaces of the measurement object.   The thickness measuring instrument according to claim 1 or 2, wherein a straight line connecting the first laser displacement meter and the second laser displacement meter is orthogonal to the front surface or the back surface of the measurement object.   The thickness measuring instrument according to any one of claims 1 to 3, wherein the first laser displacement meter and the second laser displacement meter are spectral interference type laser displacement meters. The thickness measuring instrument according to any one of claims 1 to 4, wherein the mounting table includes a suction mechanism for holding a measurement object. A pasting device that forms a laminate by laminating the substrate on which the adhesive layer is formed and the support through the adhesive layer;
The thickness measuring instrument according to any one of claims 1 to 5 , which measures the thickness of the laminate as a measurement object;
A laminate forming system comprising: An applicator for applying an adhesive on the substrate;
A heating device for heating the substrate coated with the adhesive to form an adhesive layer on the substrate;
The laminate forming system according to claim 6 , further comprising: A storage unit for storing the substrate;
A temperature control unit for adjusting the temperature of the substrate;
A first transfer device for transferring a substrate between the storage unit, the sticking device, and the temperature adjustment unit;
A second transport device for transporting the substrate between the temperature control unit, the coating device, and the heating device;
The laminate forming system according to claim 7 , further comprising: The laminated body formation according to claim 8 , wherein the temperature adjusting unit includes a cooling plate that adjusts the temperature of the substrate, and a position adjusting device that adjusts the position of the substrate on the cooling plate. system.

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