KR101821853B1 - Superimposing apparatus and superimposing method - Google Patents

Abstract

The superposition device is a temporary fixing device for temporarily fixing the support plate 41 to the substrate 42 by pressing and heating a part of the support plate 41 superimposed on the substrate 42 toward the substrate 42 (24).

Description

[0001] SUPERIMPOSING APPARATUS AND SUPERIMPOSING METHOD [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a superimposing apparatus and a superimposing method for superposing a substrate and a support.

There has been a growing demand for highly integrated chips in a package by miniaturizing and thinning semiconductor silicon chips (hereinafter, referred to as chips) to be mounted, along with high-performance of mobile phones, digital AV devices and IC cards. In order to realize high integration of the chip in the package, it is necessary to make the thickness of the chip thin within a range of 25 to 150 mu m.

However, a semiconductor wafer (hereinafter, referred to as a wafer) serving as a base of a chip is thinned by grinding, its strength is weakened, and the wafer is cracked or warped well. Further, since it is difficult to automatically transport a wafer whose strength is weakened by making it thin, it has been difficult for a person to carry the wafer by hand.

For this reason, a wafer support system has been developed in which the strength of the wafer is maintained to prevent cracks and warpage of the wafer by bonding a plate made of glass or hard plastic, which is called a support plate, to the wafer to be ground have. Since the strength of the wafer can be maintained by the wafer support system, the conveyance of the thinned semiconductor wafer can be automated.

The wafer and the support plate are bonded using an adhesive tape, an adhesive containing a thermoplastic resin, or the like. After thinning the wafer to which the support plate is attached, the support plate is peeled from the substrate before dicing the wafer.

Here, when the support plate is bonded to the wafer, the technique of superposing the wafer and the support plate in a state of being aligned by using the superimposing device and then carrying the superimposed wafer and the support plate to the bonding device and bonding them is a patent It is described in documents 1 and 2.

Japanese Unexamined Patent Publication No. 2008-182127 (published on August 7, 2008) Japanese Unexamined Patent Publication No. 2001-059758 (published on September 17, 2012)

However, in the prior art, there is a possibility that a relative position between the wafer and the support plate may be displaced when the superposed wafer and the support plate are transferred to the application apparatus in the superposition apparatus. If a deviation occurs in the relative position between the wafer and the support plate, the subsequent treatment of the wafer is adversely affected.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and it is an object of the present invention to provide a technique for preventing misalignment in the relative position between a wafer and a support plate when the superposed wafer and the support plate are transferred to the application device in the superposition device and the superposition method The main purpose is to provide.

In order to solve the above problems, a superposition apparatus according to the present invention is a superposition apparatus for superposing a substrate and a support for supporting the substrate via an adhesive layer laminated on at least one of the substrate and the support, And temporarily fixing the support to the substrate by pressing and heating a part of the region of the support which is superposed on the substrate toward the substrate.

A superposition method according to the present invention is a superposition method in which a substrate and a support for supporting the substrate are superposed on each other with an adhesive layer laminated on at least any one of the substrate and the support, And temporarily fixing the support to the substrate by pressing the region toward the substrate and heating the substrate.

According to the present invention, since the overlapped wafer and the support plate can be temporarily fixed, it is possible to prevent the wafer and the support plate from being displaced relative to each other when the wafer and the support plate are transferred to the attaching apparatus.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a top view schematically showing the overall configuration of an integration system in one embodiment. FIG.
Fig. 2 is a top view schematically showing the configuration of the holding portion in one embodiment. Fig.
Fig. 3 (a) is a front view schematically showing a configuration of an overlapping portion in one embodiment, and Fig. 3 (b) is a view simplified from Fig. 3 (a).
Fig. 4 is a top view schematically showing the configuration of the position adjusting means in the embodiment; Fig.
Fig. 5 is a top view schematically showing the structure of a hooking member in one embodiment. Fig.
Fig. 6 is a diagram showing a configuration of a combining unit in one embodiment. Fig.
7 is a view for explaining the operation of the superimposing device in one embodiment.

<Overlapping device>

A superposition apparatus according to the present invention is a superposition apparatus for superposing a substrate and a support plate (support member) for supporting the substrate via an adhesive layer laminated on at least any one of the substrate and the support plate, And temporary fixing means for temporarily fixing the support plate to the substrate by pressing and heating a part of the support plate toward the substrate.

[Laminate]

The superimposing apparatus forms a laminate by superimposing a substrate and a support for supporting the substrate via an adhesive layer laminated on at least one of the substrate and the support. That is, the laminate is formed by laminating a substrate, an adhesive layer including, for example, a thermoplastic resin, and a support plate (support) supporting the substrate in this order. The adhesive layer can be formed by applying an adhesive to either one of the substrate and the support plate, or by sticking (sticking) an adhesive tape formed by applying an adhesive. Then, the laminate thus formed is placed (set) on a predetermined position of the attaching device by, for example, a transfer device such as a robot arm, and a pressing force is applied so that the substrate and the support plate can be joined have.

The forming method and the forming apparatus for forming the laminate, that is, the method of forming the adhesive layer and the adhesive layer forming apparatus are not particularly limited, and various methods and apparatus can be employed.

Further, the substrate is provided in processes such as thinning, transportation, mounting, etc., in a state in which the substrate is supported by the support plate (pasted). The substrate is not limited to the wafer substrate, and may be any substrate such as a ceramic substrate, a thin film substrate, or a flexible substrate which needs to be supported by, for example, a support plate.

The support plate is a support for supporting the substrate, and is attached to the substrate via an adhesive layer. Therefore, it is preferable that the support plate has a strength required to prevent breakage or deformation of the substrate during the processes such as thinning, transportation and mounting of the substrate, and it is preferable that the support plate is lighter. From the viewpoints described above, it is more preferable that the support plate is made of glass, silicon, acrylic resin, ceramic, or the like.

The adhesive constituting the adhesive layer may include, for example, a thermoplastic resin that improves thermal fluidity by heating as an adhesive material. Examples of the thermoplastic resin include an acrylic resin, a styrene resin, a maleimide resin, and a hydrocarbon resin.

The method of forming the adhesive layer, that is, the coating method of applying the adhesive to the substrate or the support plate, or the forming method of applying the adhesive to the substrate to form the adhesive tape is not particularly limited, For example, a spin coating method, a dipping method, a roller blade method, a spray method, and a coating method by a slit nozzle method.

The thickness of the adhesive layer may be suitably set according to the type of the substrate and the support plate to which the adhesive is applied, the treatment to be performed on the substrate after the application, etc. It is preferably within the range of 10 to 150 mu m, More preferable.

When the support plate is peeled from the substrate, a solvent may be supplied to the adhesive layer to dissolve the adhesive layer. Thereby, the substrate and the support plate can be separated from each other. In this case, if a through hole is formed in the thickness direction of the support plate, the solvent can be easily supplied to the adhesive layer through the through hole.

Further, other layers other than the adhesive layer may be further formed between the substrate and the support plate so long as they do not interfere with each other. For example, a separation layer may be formed between the support plate and the adhesive layer, which is altered by irradiating light. Since the separation layer is formed, the substrate and the support plate can be easily separated by irradiating light after the processes such as thinning, transportation, and mounting of the substrate.

[Integration system]

The superimposing apparatus according to the present invention can be mounted on an adhesion system in which the substrate 42 and the support plate 41 are joined together in one embodiment.

Fig. 1 is a configuration diagram showing the fusion system 1 according to the present embodiment, and shows a schematic configuration of the fusion system 1 as viewed from above. 1, the bonding system 1 includes a bonding unit 2, a holding unit 3, a first external carrying means 4, and a first external carrying means traveling path 5 to be. The bonding unit 2 is configured to include a pressure-reducible overlap portion 6 and a pressure-reducing pressure application portion 7. [ The holding unit 3 and the superimposing unit 6 constitute the superimposing apparatus according to the present embodiment and the superimposing unit 7 constitute the superimposing apparatus according to the present embodiment.

1 further shows a FOUP opener 50 provided in the bonding system 1, a spinner 52 for applying an adhesive layer to the substrate 42, a bake plate 51 for curing the applied adhesive layer, The external conveying means 54 and the pass line 53 for passing the substrate 42 to the first external conveying means 4 are shown.

The outer carrying means 4 has a structure capable of transporting the support plate 41, the substrate 42 and the laminated body 40 and is provided between the support plate 41 and the fusing unit 2, So that the substrate 42 and the laminate 40 can be fed and fed. The external conveying means (4) moves on the external conveying means runway (5). The external conveying means 4 and the external conveying means traveling path 5 that perform such functions can be prepared by a conventionally known technique.

(Holding portion)

Fig. 2 is a view showing a schematic configuration of the holding part 3. Fig. As shown in Fig. 2, the holding section 3 includes an image pickup section (first image pickup means, second image pickup means) 17a, 17b and a center position detection section 19, ) Or the support plate 41 (also, the support plate 41 is held in FIG. 2).

The imaging sections 17a and 17b are provided with areas 18a and 18b including different ends (first end face and second end face) of the substrate 42 or the support plate 41 held by the holding part 3 Respectively. The regions 18a and 18b are preferably set on a substantially diagonal line of the substrate 42 or the support plate 41 held by the holding portion 3, for example. The image pickup units 17a and 17b may be, for example, a CCD camera.

The center position detection unit 19 detects the center position of the substrate 42 or the support plate 41 held by the holding unit 3 based on a plurality of images picked up by the image pickup units 17a and 17b. The center position detection section 19 may be configured to calculate an imaginary circle based on the image of the cross section of the disk and detect the center position. The technique of detecting the center position based on the image of the cross section is not particularly limited as long as it uses known image processing.

(Overlapping portion)

Fig. 3 (a) is a schematic view of the overlapping section 6, and Fig. 3 (b) is a simplified view of Fig. 3 (a). 3 (a), the overlapping section 6 includes an elevating stage (supporting means) 21, a position adjusting section (position adjusting means) 22, a hooking member 23, a temporary fixing section A heater 24, a heater 25, and a pressing unit 26. As shown in Fig. The position adjusting section 22 and the engaging member 23 are moved in the horizontal direction and the lifting and lowering stage 21 and the temporary fixing section 24 are moved in the vertical direction as shown in Figure 3 (b) . In the overlapping portion 6, the support plate 41 and the substrate 42 are individually carried.

The lifting and lowering stage 21 is a member for holding the support plate 41 or the substrate 42 or the stacked body 40 in which the substrates 40 and 42 are stacked from the bottom surface thereof. For example, the support plate 41 or the substrate 42 ), Or a chuck for holding and holding the laminated body 40 on which the laminated body 40 is stacked. The lifting and lowering stage 21 is movable up and down in the vertical direction so that the support plate 41, the substrate 42 and the stacked body 40 to be held can be moved up and down in the vertical direction.

The placement surface 21a of the support plate 41 or the like in the lifting stage 21 is preferably formed of a resin such as polytetrafluoroethylene or PEEK so as not to damage the placement object . It is preferable to form a groove in the placement surface 21a. A groove is formed in the placement surface 21a so that a gas is introduced between the support plate 41, the substrate 42 and the stacked body 40 and the placement surface 21a when the interior of the overlapping portion 6 is depressurized It is possible to prevent the particles from remaining.

The position adjustment section 22 is a member for adjusting the position of the support plate 41 and the substrate 42 to be aligned in the horizontal direction for alignment. The position adjustment section 22 determines that the center positions of the support plate 41 and the substrate 42 are overlapped with each other based on the center positions of the support plate 41 and the substrate 42 detected by the center position detection section 19 The position of at least one of the support plate 41 and the substrate 42 in the in-plane direction is adjusted. For example, as shown in Fig. 4, the center position of the support plate 41 and the substrate 42 may be adjusted so as to overlap the predetermined central axis O.

As described above, the position adjustment section 22 is configured such that the center position of the substrate 42 and the support plate 41 detected by the center position detection section 19 overlap each other, and at least one of the substrate 42 and the support plate 41 In the in-plane direction. Thus, in the overlapping section 6, the center positions of the substrate and the support detected by the center position detection section 19 can be overlapped.

Insofar as the position of the support plate 41 and the substrate 42 in the horizontal direction can be appropriately adjusted, that is, as long as the support plate 41 and the substrate 42 can be moved to a desired horizontal position, The specific mechanism of the adjustment unit 22 is not particularly limited. 4, the position adjusting section 22 is pressed by the pressing sections 26a to 26d to abut against the support plate 41 or the substrate 42, so that the position of the support plate 41 And the position of the substrate 42 in the horizontal direction. The pressing portions 26a to 26d can be constituted by, for example, a step motor, an air cylinder or the like.

3A and 3B, the position at which the position adjustment section 22 abuts against the support plate 41 or the substrate 42 is, for example, in two stages. As a result, for example, the substrate 42 and the like having two sizes can be processed.

The hooking member 23 is provided on the support plate 41 where the alignment is performed (when the alignment of the substrate 42 is performed first, the substrate 42) is superimposed without changing its horizontal position . 5 is a view of the hooking member 23 seen from the upper surface side. The holding member 23 stably holds the support plate 41 by supporting a part of the periphery of the support plate 41 from below. The hooking member 23 is movable in the horizontal direction. When the support plate 41 is mounted on the lifting stage 21 and moved to the upper portion of the hooking member 23, the hooking member 23 is moved to a position where it does not overlap the support plate 41 at all. In this specification, in this state, it is assumed that the hooking member 23 is in the &quot; ejection position &quot;. After the support plate 41 is moved to the spacer insertion position, the holding member 23 is returned to the position where it overlaps with the support plate 41 so that the support plate 41 can be supported by the holding member 23. In this specification, it is assumed that the hooking member 23 is in the &quot; insertion position &quot; Fig. 5 shows a state in which the hooking member 23 is in the &quot; insertion position &quot;. The width d ₃ of overlapping of the support plates 41 and the members for supporting the support plates 41 of the holding members 23 when the holding members 23 are in the insertion position is limited, And may be about 1 to 5 mm from the periphery of the base 41 to the inside. Preferably 5 mm. In addition, the size of the hooking member 23 may be, for example, 5 mm in width width d ₄ , but is not limited thereto.

The material of the hooking member 23 is not particularly limited, and for example, a stainless steel (SUS) may be chamfered and resin coated with polytetrafluoroethylene or the like may be used.

The method of holding the support plate 41 is not limited to the method using the hooking member 23. For example, the temporary fixing section 24 may be provided with an electrostatic attraction function, and the support plate 41 after the positioning may be held by the temporary fixing section 24. At this time, the elevation stage 21 on which the support plate 41 is mounted may be moved upward, and the support plate 41 may be sucked to the temporary fixing portion 24. Thereby, the temporary fixing portion 24 can maintain the support plate 41 without changing its horizontal position.

The temporary fixing section 24 presses the area of a part of the support plate 41 superimposed on the substrate 42 toward the substrate 42 when the support plate 41 and the substrate 42 are overlapped with each other And temporarily fixes the support plate 41 to the substrate 42 by heating. The supporting plate 41 and the substrate 42 can be temporarily fixed by softening a part of the adhesive layer sandwiched between the support plate 41 and the substrate 42 have.

As described above, according to the present embodiment, since the support plate 41 and the substrate 42 can be temporarily fixed, when the stacked body 40 is transferred to the application unit 7, And the support plate 41 can be smoothly prevented from being displaced.

The temporary fixing section 24 is disposed between the support plate 41 and the substrate 42 in a pair with the elevation stage 21 and is in contact with the support plate 41 of the temporary fixing section 24 24a are not particularly limited and may be set in consideration of the strength of provisional fixing of the support plate 41 and the substrate 42 and generation of voids between the support plate 41 and the substrate 42 It may be set appropriately.

It is preferable that the area on the support plate 41 on which the contact surface 24a contacts is the central portion of the support plate 41. [ Thereby, the support plate 41 and the substrate 42 can be temporarily fixed in a balanced manner.

The temporary fixing portion 24 is provided with a heater (heating means) 25 for heating the contact surface 24a. Although the material of the temporary fixing portion 24 is not particularly limited, it may be made of aluminum or the like having good thermal conductivity, but the present invention is not limited to this, and stainless steel or the like may be used. The provisional fixing portion 24 may be a method of pressing by, for example, a spring mechanism, a method of driving by a stepping motor, and a method of controlling the pressing force against the support plate 41 by a torque applied to the stepping motor .

The temporary fixing portion 24 is formed vertically above the hooking member 23, and is configured to be movable up and down. The temporary fixing portion 24 does not move downward and is therefore in a position where it does not come into contact with the support plate 41 held by the fixing member 23. In this specification, Standby position &quot;. On the contrary, in the present specification, it is assumed that the temporary fixing portion 24 is moved downward, and as a result, the surface of the support plate 41 held by the hooking member 23 is pressed. 24 are located at the &quot; bonding position &quot;. The temporary fixing portion 24 is formed so as to be in contact with the central portion of the surface of the support plate 41 when the temporary fixing portion 24 is at the bonding position.

(Concubine)

Adhesive portion 7 has an aligning means for aligning the overlapped substrate 42 and support plate 41 by alignment. As the bonding means, the substrate 42 and the support plate 41 may be bonded by thermocompression bonding via an adhesive layer. For example, it is possible to form a press plate on the upper and lower sides of the interior of the application unit 7, and sandwich the laminate 40 before the bonding between the upper and lower press plates.

(Inner carrying means)

The overlapping portion 6 and the applying portion 7 may have a structure in which a wall dividing the inside of one processing chamber into two processing chambers is formed. In addition, the overlapping portion 6 and the application portion 7 may be structured such that the overlapping portion 6 and the application portion 7 are in contact with each other without gaps on the respective side surfaces. A gate 8 is provided at a boundary between the superposed portion 6 and the superposed portion 7 so as to transfer the superposed portion 6 and the laminated body 40 between the superposed portions 7. The gate 8 is controlled to be opened and closed by a shutter. The overlapping portion 6 is provided with an openable / closable enabling / disengaging means for carrying out delivery of the support plate 41, the substrate 42, and the laminated body 40 between the bonding unit 2 and the external carrying means 4 A window 9 is formed. Known pressure reducing means (not shown) are provided on the overlapping portion 6 and the attaching portion 7, respectively, so that the internal pressure state of each of the chambers can be independently controlled.

Since the impregnated portion 7 can be reduced in pressure, the substrate 42 and the support plate 41 can be bonded to each other via the adhesive layer in a reduced-pressure atmosphere. Since the substrate 42 can be pressed onto the adhesive layer in a reduced pressure atmosphere, the adhesive layer can be put into the depressed portion in the state where there is no air in the depression portion of the concavo-convex pattern on the surface of the substrate 42, It is possible to more reliably prevent the occurrence of air bubbles between the airbag 42.

The gate 8 is provided so that the laminated body 40 in which the alignment is performed can be moved from the overlapping portion 6 to the overlapping portion 7 while the shutter is open, (7) to the overlapping portion (6). The laminated body 40 before bonding can be moved from the overlapping section 6 to the overlapping section 7 under reduced pressure by opening the shutter in a state in which the overlapping section 6 and the overlapping section 7 are both depressurized .

The bonding unit 2 is further provided with internal transfer means (10 in Fig. 6) for transferring the laminated body 40 between the overlapping portion 6 and the application portion 7 via the gate 8 .

Fig. 6 is a configuration diagram showing the internal configuration of the conjugate unit 2 including the inner carrying means 10, as viewed from above. The specific mechanism is not particularly limited as long as the internal carrying means 10 is capable of moving the laminate 40 between the overlapping section 6 and the concatenation section 7. [ In the present embodiment, as shown in Fig. 6, the inner carrying means 10 is constituted by the inner carrying arm 11 and the arm pivot shaft 12. As shown in Fig. The inner carrying means 10 is rotated by the rotation of the arm pivot shaft 12 of the inner carrying arm 11 capable of supporting the stacked body 40 from the lower face thereof as a rotational center, 40 are moved. More specifically, in the present embodiment, two internal conveying means 10 are provided in which the pivotal axis of rotation is common. The arm pivot shaft 12 is formed on the side of the overlapping portion 6, but may be formed on the side of the overlapping portion 7. The arm pivot shaft 12 is provided on the side closer to the side where the delivery window 9 is formed from the viewpoint of shortening the stroke of delivery and reception between the overlapping section 6 and the external carrier means 4 . 6, the chain double-dashed line indicated by "B" indicates the standby position of the internal transfer arm 11 and the double-dashed line indicated by "C" indicates the position of the inner transfer arm 11 on the application portion 7 (Attending and receiving position).

The rotation speed of the inner transfer arm 11 can set the speed according to the situation. Therefore, when the inner transfer arm 11 holds the laminate 40, the inner transfer arm 11 can be rotated at low speed. When the laminate 40 is not held, (11) can be rotated at a high speed. It is also possible to control the acceleration / deceleration so that the start and stop of the rotation of the inner carrier arm 11 is smooth.

As shown in Fig. 6, in the state that the shutter 8 is opened, the inner transfer arm 11 which rotates moves through the gate 8 to the stacking position 40 It has an opening of the same width as can be moved. For opening and closing the gate 8, conventionally known means can be used, and for example, a gate valve structure can be applied.

[Operation of superposition device]

Next, a brief description will be given of the operation of the superimposing apparatus (holding unit 3 and superposition unit 6) according to the present embodiment.

Fig. 7 is a diagram for explaining the operation of the superimposing device according to the present embodiment in accordance with the internal state of the superimposing section 6. Fig. 3 (b), the respective members for holding or controlling the position adjusting section 22, the hooking member 23, and the temporary fixing section 24 are not shown.

(1. Transfer of Support Plate 41 to Holding Unit 3)

The support plate 41 is carried into the holding portion 3 by using the external carrying means 4. [ Then, the center position detection unit 19 detects the center position of the support plate 41.

(2. Loading of the Support Plate 41 onto the Overlap 6)

The support plate 41 is carried into the overlapping portion 6 through the delivery window 9 and mounted on the lifting stage 21 by using the external carrying means 4 Reference). At this point, it is preferable that the hooking member 23 be at the withdrawal position and the temporary fixing portion 24 be at the standby position.

(3. Support plate 41 alignment)

Next, the elevation stage 21 on which the support plate 41 is mounted is moved to a position where the position adjustment section 22 is present. The position of the support plate 41 in the horizontal direction is adjusted by the position adjustment unit 22 so that the center position of the support plate 41 detected in (1) overlaps with the predetermined center axis ( 7 (b)).

(4. insertion of the hooking member (23) - delivery of the support plate (41))

After the positioning of the support plate 41 is completed, the elevation stage 21 on which the support plate 41 is mounted is raised to the position where the holding member 23 is inserted. Then, the hooking member 23 is moved to the insertion position (see Fig. 7 (c)). As a result, the position of the support plate 41 in the horizontal direction can be held by the holding member 23 without changing the position of the position-aligned support plate 41, and the elevation stage 21 can be lowered again.

(5. Loading of the Support Plate 41 into the Holding Unit 3)

The substrate 42 is carried into the holding portion 3 by using the external carrying means 4. [ Then, the center position detection unit 19 detects the center position of the substrate 42.

(6. Carrying substrate 42)

The substrate 42 is carried into the overlapping portion 6 through the delivery window 9 and placed on the lifting stage 21 by using the external carrying means 4 ). After the substrate 42 is completely loaded into the overlapping portion 6 and the delivery window 9 is closed, the decompression of the overlapping portion 6 is started. The decompression of the overlapping portion 6 may be performed so that the reduced pressure state of the overlapping portion 6 and the reduced pressure state of the overlapping portion 7 at the time when the temporary fixing is completed are substantially the same as each other. Preferably, it is 10 Pa or less.

(7. Positioning the substrate 42)

Next, the elevation stage 21 on which the substrate 42 is mounted is moved to a position where the position adjustment section 22 is present. The position adjuster 22 adjusts the position of the substrate 42 in the horizontal direction so that the center position of the substrate 42 detected in (5) overlaps a predetermined center axis (Fig. 7 (e)).

(8. temporary fixing and removal of the hanging member)

The elevation stage 21 on which the substrate 42 with the aligned alignment is mounted is raised to a position overlapping with the support plate 41. [ After the lifting stage 21 reaches the position, the temporary fixing portion 24 is moved onto the support plate 41. Thereby, the contact surface 24a of the temporary fixing portion 24 comes into contact with the surface of the support plate 41 to press the surface of the support plate 41 (see Fig. 7 (f)). At the same time, the contact surface 24a is heated by the heater 25. As a result, the adhesive layer between the substrate 42 and the support plate 41 is thermally moved and temporarily fixed.

The temperature of the contact surface 24a is preferably heated to at least the room temperature by the low temperature tackiness (tackiness) of the thermoplastic resin as the adhesive material of the adhesive layer, and the glass transition point (Tg) Or more. By heating the adhesive layer to a temperature equal to or higher than the glass transition point of the thermoplastic resin, the thermal fluidity of the adhesive layer is improved and easily deformed. The temperature of the contact surface 24a is preferably 23 to 220 DEG C, and the heating time, that is, the pressing time is preferably 3 to 300 seconds, More preferably 5 to 180 seconds.

After the support plate 41 is pressed against the substrate 42 by the provisional fixing portion 24, the retaining member 23 is returned to the retracted position. As a result, both of the portions where the support plate 41 and the substrate 42 overlap overlap each other (see Fig. 7 (g)).

(9. End nested)

After the support plate 41 is overlapped with the substrate 42, the temporary fixing portion 24 is returned to the standby position. Subsequently, the elevation stage 21 on which the laminated body 40 in which the support plate 41 and the substrate 42 are stacked is lowered. Thus, the overlapping is completed (see Fig. 7 (h)).

(10. Returning the laminate 40)

The shutter of the gate 8 is opened and the inner carrying means 10 is moved to the overlapping portion 6 to hold the stacked body 40 (see Fig. 7 (i)). Then, the inner carrying means 10 conveys the laminated body 40 to the concavity 7 (see Fig. 7 (j)).

When the temporary fixing part 24 having an electrostatic attraction function is used as a method for holding the support plate 41, after the positioning of the support plate 41 is completed, (21) to the temporary fixing portion (24). By holding the support plate 41 on the temporary fixing portion 24, the position of the support plate 41 in the horizontal direction can be held by the provisional fixing portion 24 without changing the position of the support plate 41 in the horizontal direction. The electrostatic attraction of the support plate 41 may be released when the substrate 42 and the support plate 41 are temporarily fixed or after they are overlapped.

As described above, in the superimposing apparatus according to the present embodiment, the temporary fixing section 24 presses and heat a part of the area of the support plate 41 superimposed on the substrate 42 toward the substrate 42 The support plate 41 is temporarily fixed to the substrate 42. This prevents deviation of the relative positions of the substrate 42 and the support plate 41 when the stacked substrates are stacked have.

<Overlapping method>

A superposition method according to the present invention is a superposition method in which a substrate and a support for supporting the substrate are superposed on each other with an adhesive layer laminated on at least any one of the substrate and the support, And temporarily fixing the support to the substrate by pressing and heating the region toward the substrate. In one embodiment, the temporary fixing step of the superposing method can be carried out by using the provisional fixing means of the superimposing apparatus according to the present invention described above. Since the embodiment of the superposing method according to the present invention is based on the description of the superposing apparatus described above, the detailed description thereof will be omitted.

The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope of the claims. That is, the technical scope of the present invention also includes embodiments obtained by combining technical means suitably modified in the scope of claims.

Industrial availability

INDUSTRIAL APPLICABILITY The present invention can be widely applied to the industrial field of manufacturing products because it can improve the accuracy of the assembly of the substrate and the support plate in vacuum.

1: Integration system
2:
3:
4: External carrying means (carrying means)
5: External carrier Means
6: overlapping portion (first processing chamber)
7: Couple couple (second treatment room)
8: Gate
9: Send and Receive Window
10:
11: inner transfer arm
12: arm pivot shaft
17a, 17b: An image pickup section (first image pickup means, second image pickup means)
18a and 18b:
19:
21: lifting stage (supporting means)
22: position adjusting section (position adjusting means)
23:
24: provisional fixing means (provisional fixing means)
25: heater (heating means)
26:
40:
41: Support plate (support)
42: substrate
50: FOUP opener
51: Bake plate
52: Spinner
53: Pass Line
54: second outer carrying means

Claims (7)

A superimposing apparatus for superimposing a substrate and a support for supporting the substrate via an adhesive layer laminated on at least any one of the substrate and the support,
A spinner for applying an adhesive containing a thermoplastic resin to the substrate,
A holding member for holding the support,
And temporary fixing means for temporarily fixing the support to the substrate by pressing and heating a region of a part of the support superimposed on the substrate toward the substrate,
The temporary fixing means includes a contact surface contacting the part of the region and a heating means heating the contact surface,
The substrate is superimposed on the supporting member held on the supporting member after the supporting member is held by the supporting member and the temporary fixing means presses the region of the supporting member while heating the supporting member, Wherein the support is configured to release the engagement of the support. The method according to claim 1,
And a position adjusting means for adjusting a relative position between the substrate and the support,
Wherein the substrate and the support, whose relative positions are adjusted by the position adjusting means, overlap each other. The method according to claim 1,
And a supporting means for supporting the substrate,
Wherein the temporary fixing means is sandwiched between the substrate and the supporting member in a pair with the supporting means. The method according to claim 1,
And the part of the area is a central portion of the support. A superposition method for superposing a substrate and a support for supporting the substrate via an adhesive layer laminated on at least one of the substrate and the support,
Wherein the adhesive layer is a layer formed of an adhesive containing a thermoplastic resin,
And temporarily fixing the support to the substrate by pressing and heating a part of the region of the support superimposed on the substrate toward the substrate,
In the provisional fixing step, pressing and heating are performed by provisional fixing means including a contact surface contacting the partial area and a heating means heating the contact surface,
The substrate is superimposed on the supporting member held on the supporting member after the supporting member is held by the supporting member and the temporary fixing means presses the partial region while heating the supporting member, And releasing the engagement of the support body. delete delete

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