JP6014302B2 - Bonding apparatus and bonding method - Google Patents

Description

  The present invention relates to a bonding apparatus and a bonding method used for bonding a substrate and a support.

  As mobile phones, digital AV devices, IC cards, etc. have become more sophisticated, there is an increasing demand for higher integration of chips in packages by reducing the size and thickness of semiconductor silicon chips (hereinafter referred to as chips). ing. In order to achieve high integration of chips in the package, it is necessary to reduce the thickness of the chip to a range of 25 to 150 μm.

  However, a semiconductor wafer (hereinafter referred to as a wafer) serving as a base of a chip is thinned by grinding, its strength is weakened, and the wafer is likely to be cracked or warped. Further, since it is difficult to automatically transport a wafer whose strength has been reduced by making it thin, it has to be transported manually, and the handling thereof is complicated.

  Therefore, a wafer support system has been developed that maintains the strength of the wafer and prevents the occurrence of cracks and warpage of the wafer by bonding a plate made of glass or hard plastic, called a support plate, to the wafer to be ground. . Since the strength of the wafer can be maintained by the wafer support system, the transport of the thinned semiconductor wafer can be automated.

  The wafer and the support plate are bonded together using an adhesive tape, a thermoplastic resin, an adhesive, or the like. After thinning the wafer to which the support plate is attached, the support plate is peeled from the substrate before dicing the wafer.

  As a means for bonding the support plate to the wafer, there is a bonding apparatus. This bonding apparatus includes a coating unit that applies an adhesive to a wafer, a baking unit that heats and cures the adhesive, a bonding unit that bonds the wafer and a support plate, and the like. Further, Patent Document 1 discloses a bonding apparatus including an overlapping unit that overlaps a wafer and a support plate at a predetermined position before bonding the wafer and the support plate.

JP 2008-182127 A (released on August 7, 2008) JP 2009-212196 A (published September 17, 2009)

  As the circuit level difference on a substrate such as a wafer becomes higher, it becomes necessary to bond the substrate and a support (support plate) in a vacuum. For this reason, it is necessary to evacuate the bonding apparatus, particularly the part where the bonding is actually performed.

  As a result of investigations by the present inventors, after the bonding portion in the bonding apparatus is vacuum-treated in the bonding process, the vacuum is released to release the atmosphere in order to transport the substrate bonded to the support to the next process. Then, the temperature of the bonding stage of the bonding portion changed and became unstable, and the problem was found that the accuracy of bonding was lowered.

  Therefore, the present invention has been made in view of the above problems, and a main object thereof is to provide a bonding apparatus capable of performing bonding with high accuracy even when vacuum processing is performed.

  In order to solve the above-described problems, a bonding apparatus according to the present invention is a bonding apparatus that bonds a substrate and a support. In the bonding apparatus, the substrate and the support are bonded to each other prior to the bonding between the substrate and the support. A first process chamber capable of depressurization having an alignment means for performing the alignment, and a second process chamber capable of depressurization having a bonding means for bonding the aligned substrate and the support. And the first processing chamber and the second processing chamber have at least one set of the substrate and the support that are aligned from the first processing chamber to the second processing chamber. It is the structure formed so that it can move under reduced pressure.

  The bonding apparatus according to the present invention includes a first process chamber capable of depressurization having alignment means and a second process chamber capable of depressurization having bonding means. The body is movable under reduced pressure from the first processing chamber to the second processing chamber. Therefore, the substrate and the support can be transported and aligned while the second processing chamber having the bonding means is always kept in a reduced pressure state. Therefore, the temperature stability of the bonding means is improved, thereby preventing a decrease in bonding accuracy.

It is a figure which shows the structure of the principal part of the bonding apparatus of this invention in one Embodiment. It is a figure which shows the whole structure of the bonding apparatus of this invention in one Embodiment. It is a figure which shows the structure of the internal conveyance arm of the bonding apparatus of this invention in one Embodiment, (a) is a top view, (b) is a side view. It is a figure showing the positional relationship of two internal conveyance arms of the bonding apparatus of this invention in one Embodiment, (a) And (b) is located in the process chamber from which two internal conveyance arms mutually differ. An example is shown. It is a figure which shows the structure of the alignment means of the load lock interior in one Embodiment, and is the figure which looked at the load lock interior from the side surface side. It is a figure which shows the structure of the outer diameter matching mechanism in one Embodiment of the bonding apparatus of this invention. It is a figure which shows the state of each structure of the bonding apparatus in each process in one Embodiment of the bonding method of this invention in order of a process. It is a figure which shows the state of each structure of the bonding apparatus in each process in one Embodiment of the bonding method of this invention in order of a process. It is the figure which looked at the spacer mechanism in one Embodiment from the upper surface.

  An embodiment of a bonding apparatus and a bonding method according to the present invention will be described below with reference to FIGS.

[1. (Laminating device)
The laminating apparatus according to the present invention is an apparatus for laminating a substrate and a support, and includes a first process chamber that can be depressurized and a second process chamber that can be depressurized. The first processing chamber has alignment means for aligning the substrate and the support prior to bonding the substrate and the support. On the other hand, the second processing chamber has a bonding means for bonding the substrate and the support aligned in the first processing chamber. In the first processing chamber and the second processing chamber, at least one pair of substrates and supports aligned in the first processing chamber can be moved from the first processing chamber to the second processing chamber under reduced pressure. It is formed to become.

  In this embodiment, a process for temporarily bonding a wafer (substrate) to glass (support plate) that is a support plate for the wafer support system will be described as an example, but the present invention is not limited to this. . In the present specification, a superposition of a glass and a wafer is referred to as a “glass laminated wafer” regardless of before and after the main bonding.

  FIG. 2 is a configuration diagram showing the bonding apparatus 1 in the present embodiment, and shows a schematic configuration when the bonding apparatus 1 is viewed from directly above. As shown in FIG. 2, the bonding apparatus 1 includes a bonding unit 2, a pre-aligner 3, a first external transport unit 4, and a first external transport unit travel path 5. 2 further includes a FOUP opener 50 provided in the bonding apparatus 1, a spinner 52 that applies an adhesive layer to the wafer, a bake plate 51 that cures the applied adhesive layer, a second external transfer means 54, and a wafer. A pass line 53 for delivery to the first external transport means 4 is shown.

  The bonding unit 2 includes a load lock chamber (first processing chamber) 6 that can be decompressed and a joining chamber (second processing chamber) 7 that can be decompressed. The load lock chamber 6 and the joining chamber 7 have a structure in which a wall that partitions the inside of one processing chamber into two processing chambers is provided. In addition, the load lock chamber 6 and the joining chamber 7 may have a structure in which the load lock chamber 6 and the joining chamber 7 are in contact with each other without a gap on each side surface. At the boundary between the load lock chamber 6 and the bonding chamber 7, a gate 8 for delivering the glass laminated wafer between the load lock chamber 6 and the bonding chamber 7 is provided. The gate 8 is controlled to be opened and closed by a shutter. Further, the load lock chamber 6 is provided with an openable / closable delivery window 9 for delivering glass, a wafer and a glass laminated wafer between the bonding unit 2 and the external transfer means 4. Each of the load lock chamber 6 and the joining chamber 7 is provided with a known decompression means (not shown), and the internal pressure state of each chamber can be controlled independently.

  Since the bonding chamber 7 has a configuration capable of reducing the pressure, the wafer and the glass can be bonded together via an adhesive layer in a reduced pressure atmosphere. By pressure bonding the wafer to the adhesive layer in a reduced pressure atmosphere, the adhesive layer can enter the recess in a state where there is no air in the recess of the uneven pattern on the wafer surface. It is possible to more reliably prevent the generation of bubbles during the interval.

  The gate 8 can move the aligned glass laminated wafer from the load lock chamber 6 to the bonding chamber 7 with the shutter opened, and the bonded glass laminated wafer from the bonding chamber 7. It is formed so that it can be moved to the load lock chamber 6. By opening the shutter in a state where both the load lock chamber 6 and the bonding chamber 7 are depressurized, the glass laminated wafer before bonding can be moved from the load lock chamber 6 to the bonding chamber 7 under reduced pressure. Yes.

  The laminating unit 2 is further provided with an internal transfer means (10 in FIG. 1) for delivering the glass laminated wafer between the load lock chamber 6 and the bonding chamber 7 via the gate 8. Details of the internal conveyance means will be described later.

  The load lock chamber 6 has alignment means for aligning the wafer and glass prior to bonding of the wafer and glass. Details of the alignment means will be described later.

  The bonding chamber 7 has a bonding means for bonding the wafer and the glass that have been aligned and aligned. As the bonding means, a configuration in which the wafer and glass are bonded together by thermocompression bonding through an adhesive layer is possible. For example, a configuration is possible in which press plates are provided above and below the inside of the bonding chamber 7 and a glass laminated wafer before bonding is sandwiched between the upper and lower press plates.

  According to the bonding unit 2 having the above-described configuration, the pressure state inside the joining chamber 7 and the pressure state inside the load lock chamber 6 can be controlled independently. That is, while the joining chamber 7 is always kept in a vacuum state, the inside of the load lock chamber 6 can be evacuated or atmospheric pressure. For this reason, when it is necessary to maintain the atmospheric pressure in order for the bonding unit 2 to transfer the wafer, the glass, and the glass laminated wafer to and from the external transfer means 5, only the load lock chamber 6 is set to the atmospheric pressure. Thus, the bonding chamber 7 having the bonding means can be maintained in a vacuum state. When transferring the glass laminated wafer between the load lock chamber 6 and the bonding chamber 7, the bonding chamber 7 is vacuumed by opening the shutter of the gate 8 after the load lock chamber 6 is evacuated. Delivery can be performed while maintaining the state. According to the above, since the bonding chamber 7 having the bonding means can always be evacuated, it is possible to prevent a temperature change from occurring in the bonding means, thereby preventing a reduction in bonding accuracy. be able to.

  In addition, the wafer and glass can be bonded (bonded) in the bonding chamber 7 even while the load lock chamber 6 is opened to the atmosphere and is evacuated again. On the other hand, in the configuration where the bonded portion needs to be opened to the atmosphere for transporting the glass laminated wafer to the next process, the bonding process is performed while the glass laminated wafer is transported to the next process of releasing the glass laminated wafer. Can not proceed. Therefore, the bonding apparatus 1 can shorten the entire processing time as compared with a configuration in which the bonding portion needs to be opened to the atmosphere.

  If a specific example is given and demonstrated, when the structure which needs to open | release the bonding part to air | atmosphere was used, the whole processing time required 3 minutes as other operation time besides the bonding time. On the other hand, when the bonding apparatus 1 was used, the other operation time other than the bonding time was 1 minute. That is, the processing time can be reduced by 2 minutes in one bonding process.

  As the pre-aligner 3, the suction device disclosed in Patent Document 2 can be used for glass and wafer alignment.

  The external transfer means 4 has a configuration that can carry glass, a wafer, and a glass laminated wafer, and can transfer the glass, the wafer, and the glass laminated wafer to and from the bonding unit 2. The external transport unit 4 moves on the external transport unit travel path 5. The external conveying means 4 and the external conveying means traveling path 5 that bear such a function can be prepared by a conventionally known technique.

  The bake plate 51 is a unit that cures the adhesive layer applied to the wafer.

<Internal transfer means>
The bonding unit 2 includes an internal transfer means 10 that moves the glass laminated wafer between the load lock chamber 6 and the bonding chamber 7. FIG. 1 is a configuration diagram of the internal configuration of the bonding unit 2 including the internal conveyance means 10 as viewed from above. As long as the internal transfer means 10 is configured to be able to move the glass laminated wafer between the load lock chamber 6 and the bonding chamber 7, there is no particular limitation on the specific mechanism. In the present embodiment, as shown in FIG. 1, the internal transfer means 10 includes an internal transfer arm 11 and an arm pivot shaft 12. The internal transfer means 10 is a mechanism for moving the glass laminated wafer 40 by turning about the arm turning shaft 12 of the internal transfer arm 11 that can support the glass laminated wafer 40 from the lower surface thereof. As will be described in detail later, in the present embodiment, two internal conveyance means 10 having a common pivot axis for rotation are provided. The arm turning shaft 12 is provided on the load lock chamber 6 side, but may be configured on the joining chamber 7 side. From the viewpoint that the transfer stroke between the load lock chamber 6 and the external transfer means 4 can be shortened, the arm pivot shaft 12 is formed on the side close to the side surface on which the transfer window 9 is formed. It is preferable. In FIG. 1, a two-dot chain line indicated by “B” represents a standby position of the internal transfer arm 11, and a two-dot chain line indicated by “C” indicates the position (the bonding chamber 7) of the internal transfer arm 11 in the bonding chamber 7. (Delivery position).

  The rotation speed of the internal transfer arm 11 can be set according to the situation. Therefore, when the internal transfer arm 11 holds the glass laminated wafer 40, the internal transfer arm 11 can be rotated at a low speed. When the glass transfer wafer 40 is not held, the internal transfer arm 11 can be moved at a high speed. It can be rotated. In addition, acceleration / deceleration can be controlled so that the turning up and stopping of the internal transfer arm 11 is smooth.

  As shown in FIG. 1, the gate 8 has an opening width that allows the rotating internal transfer arm 11 to pass the gate 8 and carry the glass laminated wafer 40 to the bonding chamber delivery position C when the shutter is open. It has become. Conventionally known means can be used to open and close the gate 8, and for example, a gate valve structure can be applied.

  FIGS. 3A and 3B are diagrams showing the internal transfer arm 11 in a state where the glass laminated wafer is held, in which FIG. 3A shows the upper surface, and FIG. 3B shows the side surface. As shown in FIGS. 3A and 3B, the internal transfer arm 11 is formed by a transfer arm main body 13 and a transfer arm target holding portion 14 provided at the lower part of the transfer arm main body 13. . The internal transfer arm 11 is configured to hold the glass laminated wafer 40 by supporting the glass laminated wafer 40 from the lower surface by the transfer arm target holding unit 14.

  A shift preventing member 15 for preventing the shift of the substrate is formed at a portion of the transport arm target holding unit 14 that contacts the substrate. The displacement preventing member 15 is preferably formed of a heat resistant material, and more preferably has heat resistance at 250 ° C. In the case where the substrate is not displaced even without the substrate displacement preventing means, the displacement preventing member 15 or the like may not be formed.

  The transfer arm target holding unit 14 is further provided with a fall prevention guide 16.

The size of the transfer arm target holding unit 14 is not limited as long as it does not interfere with the internal transfer. From the viewpoint that the glass laminated wafer 40 can be stably held, the transfer arm target holding unit 14 is preferably larger. Therefore, it is preferable to design as large as possible within a range that does not interfere with internal conveyance. In order to avoid unnecessary contact between the glass laminated wafer 40 and the internal transfer arm 11, when the internal transfer arm 11 is in the transfer position (before supporting the glass laminated wafer 40), distance d ₁ between the upper surface and the lower surface of the transfer arm body 13 is not more 2mm the structures distance d ₂ between the glass laminate wafer support surface and the lower surface of the glass laminate wafer 40 in the transport arm subject holding section 14 is equal to or greater than 2mm It is preferable that

  As described above, in the present embodiment, two internal conveyance means 10 are provided (internal conveyance means 10a and internal conveyance means 10b), and the positions in the vertical direction are different from each other. FIG. 4 is a view for explaining the positional relationship between the two internal transfer means 10a and 10b, showing a partial configuration inside the load lock chamber 6 and the joining chamber 7, and delivering the bonding unit 2 It is a figure when it sees from the side surface in which the window 9 is formed. FIG. 4A shows a state in which the internal transfer means 10a is on the load lock chamber 6 side and the internal transfer means 10b is on the bonding chamber 7 side. On the other hand, FIG. 4B shows a state in which the internal transfer means 10a is on the bonding chamber 7 side and the internal transfer means 10b is on the load lock chamber 6 side. As shown in FIG. 4A and FIG. 4B, the internal conveyance means 10 a and the internal conveyance means 10 b are provided with different heights from the floor surface 32 of the bonding unit 2. The central axis 33 of each rotation is the same.

  In FIG. 4A, the internal transfer means 10a is in a position corresponding to the state in which the elevating stage 21 in the load lock chamber 6 is in the internal transfer lower arm transfer position, and the internal transfer means 10b is connected to the joining chamber. 7 is a position corresponding to a state in which the elevating pin 31 in the inner transfer upper arm transfer position. The elevating pins 31 are attached to the lower press plate 34 of a pair of upper and lower press plates. On the other hand, in FIG. 4B, the internal transfer means 10a is in a position corresponding to the state where the elevating pins 31 are in the internal transfer lower arm transfer position, and the internal transfer means 10b The position corresponds to the state at the arm delivery position. That is, the internal transfer means 10 a plays a role of moving the glass laminated wafer 40 located at the internal transfer lower arm transfer position between the load lock chamber 6 and the bonding chamber 7. Further, the internal transfer means 10 b plays a role of moving the glass laminated wafer 40 located at the internal transfer upper arm transfer position between the load lock chamber 6 and the bonding chamber 7.

<Positioning means>
An alignment means for aligning the wafer and the glass provided in the load lock chamber 6 will be described. FIG. 5 is a diagram for explaining a specific configuration of the alignment means in the present embodiment, and shows the inside of the load lock chamber 6. As shown in FIG. 5, inside the load lock chamber 6, an elevating stage (elevating member) 21 that can move up and down, an outer diameter adjusting mechanism (position adjusting means) 22 that can move in the horizontal direction, and a movable in the horizontal direction. Positioning means constituted by a spacer mechanism (position fixing means, holding member) 23 and a temporary pressing tool (position fixing means, pressing member) 24 that can move up and down is provided. For convenience of explanation, in FIG. 5, illustration of the respective members for holding or controlling the outer diameter matching mechanism 22, the spacer mechanism 23, and the temporary presser 24 is omitted.

(Elevating stage)
The elevating stage 21 is a member that holds a glass or wafer to be aligned or a glass laminated wafer in which these are stacked from the bottom surface. The elevating stage 21 can move up and down in the vertical direction, whereby the glass, wafer and glass laminated wafer 40 to be held can be moved up and down in the vertical direction. Stop positions of the elevating stage 21 in the bonding apparatus 1 are an outer diameter alignment position, an internal transfer lower arm transfer position, an internal transfer upper arm transfer position, a temporary bonding position, and a spacer insertion position in order from the vertically lower side.

  The outer diameter matching position is a position when the outer diameter matching mechanism 22 is used to match the outer diameter of the glass and wafer placed on the elevating stage 21. The internal transfer lower arm transfer position is a position when the glass laminated wafer 40 is transferred between the elevating stage 21 and the internal transfer arm 10a. The internal transfer upper arm transfer position is a position when the glass laminated wafer 40 is transferred between the elevating stage 21 and the internal transfer arm 10b. The temporary bonding position is a position when temporary bonding between the wafer and the glass is performed using the temporary pressing tool 24. The spacer insertion position is a position at which the glass whose outer diameter has been adjusted is held by the spacer mechanism 23 before temporary bonding. In addition, although there exists an external conveyance means delivery position as another stop position, in this Embodiment, an external conveyance means delivery position is the same height position as an internal conveyance lower arm delivery position.

(Outer diameter matching mechanism)
The outer diameter alignment mechanism 22 is a member that adjusts the position in the horizontal direction of the glass and wafer to be aligned for alignment. As long as the position of the glass and wafer in the horizontal direction can be adjusted appropriately, that is, as long as the glass and wafer can be moved to a desired horizontal position, the specific mechanism of the outer diameter adjusting mechanism 22 is not particularly limited. In the present embodiment, as shown in FIG. 6, the outer diameter adjusting mechanism 22 includes a plurality of air cylinders (pressing members) 25a and 25b provided with springs, another air cylinder 28 provided with a spring, and A plurality of stepping motors (pressing members) 26a and 26b are used.

  The air cylinders 25a and 25b and the stepping motors 26a and 26b form a pair of the stepping motor 26a and the air cylinder 25a. Similarly, the stepping motor 26b and the air cylinder 25b form a pair of pairs. . The stepping motor 26a (26b) is arranged so as to be able to push the glass or wafer in the outer diameter alignment position inward from the peripheral edge thereof, and the corresponding air cylinder 25a (25b) is connected to the stepping motor 26a (26b). ) And is arranged so that stress can be applied to the glass or wafer in the direction opposite to the direction in which the stepping motor 26a (26b) pushes.

  The air cylinders 25a and 25b and the stepping motors 26a and 26b are arranged so that a straight line connecting the stepping motor 26a and the air cylinder 25a and a straight line connecting the stepping motor 26b and the air cylinder 25b are orthogonal to each other. Yes. Thereby, glass and a wafer can be moved to a desired position on a horizontal plane.

  The air cylinder 28 is provided for performing notch alignment. At the tip of the air cylinder 28, a part that fits into a notch 43 provided on the glass and the wafer is attached.

  Each of the air cylinders 25a and 25b, the stepping motors 26a and 26b, and the air cylinder 28 is provided so that it can move forward and backward in a direction parallel to the direction in which the glass and the wafer are pushed. That is, each of these members can move in the direction of a double-ended arrow shown next to each member in FIG. In the present specification, a case where each member of the outer diameter matching mechanism 22 is moved in the horizontal radial direction and is away from the glass or the wafer is referred to as an “open state”. In addition, when the members of the outer diameter matching mechanism 22 are moved in a direction approaching each other and the glass or wafer can be pushed, the outer diameter matching mechanism 22 is referred to as a “closed state”.

  A CCD camera is installed in the pre-aligner 3. The CCD camera detects the outer periphery of the glass or wafer placed in the pre-aligner 3. A control unit (not shown) of the stepping motors 26a and 26b controls the stepping motors 26a and 26b based on the detection result input in advance from the CCD camera to adjust the horizontal position of the glass or wafer to a predetermined position. . In this embodiment, the outer periphery of the glass or wafer is detected using a CCD camera. However, any sensor that can detect the diameter of the glass or wafer may be used, and a general transmission sensor can be used.

(Spacer mechanism)
The spacer mechanism 23 is a member that holds the glass whose outer diameter has been adjusted (wafer when the outer diameter of the wafer is first adjusted) until temporary bonding without changing the horizontal position. . FIG. 9 is a view of the spacer mechanism 23 as seen from the upper surface side. The spacer mechanism 23 stably holds the glass 41 by supporting a part of the peripheral edge of the glass 41 from below. The spacer mechanism 23 is movable in the horizontal direction. When the glass 41 is placed on the elevating stage 21 and carried to the spacer insertion position, the spacer mechanism 23 is moved to a position where it does not overlap the glass 41 at all. In this specification, in this state, the spacer mechanism 23 is referred to as being in the “extraction position”. After the glass 41 is brought into the spacer insertion position, the spacer mechanism 23 is returned to a position overlapping the glass so that the glass can be supported by the spacer mechanism 23. In this specification, it is called that the spacer mechanism 23 is in the “insertion position” in this state. FIG. 9 shows a state where the spacer mechanism 23 is in the “insertion position”. When the spacer mechanism 23 is in the insertion position, the width d ₃ of the overlap between the glass and each member that supports the glass 41 of the spacer mechanism 23 is, without limitation, about 1 to 5 mm from the periphery of the glass to the inside. obtain. It is preferably 5 mm. Further, the size of the spacer mechanism 23 may be, for example, the lateral width d ₄ of 5 mm, but is not limited thereto.

  The material of the spacer mechanism 23 is not particularly limited, and for example, stainless steel (SUS) can be used.

(Temporary presser)
The temporary presser 24 is a member that prevents a positional deviation in the horizontal direction that may occur when the glass and the wafer are overlapped by pressing the glass against the wafer. The temporary presser 24 is provided vertically above the spacer mechanism 23 and is configured to be movable up and down. In the present specification, the temporary pressing tool 24 is in the “standby position” that the temporary pressing tool 24 is not moved downward and is therefore not in contact with the glass held by the spacer mechanism 23. . On the other hand, in this specification, the temporary pressing tool 24 is “bonded” because the temporary pressing tool 24 moves downward and, as a result, is in a position where the glass surface held by the spacer mechanism 23 is pressed. It is said to be in position. The temporary presser 24 is provided so as to come into contact with the central portion of the glass surface when the temporary presser 24 is in the joining position.

  The temporary pressing tool 24 is preferably made of a material capable of preventing the wafer from being damaged since it comes into contact with the wafer, and for example, a resin can be used. Among these, a fluororesin such as polytetrafluoroethylene is preferable. Although there is no restriction | limiting in particular in the shape of the temporary holding tool 24, For example, the contact surface with a wafer may be a cylindrical shape with a diameter of 20 mm.

  According to the alignment means having the above-described configuration, the horizontal position of the glass can be adjusted using the outer diameter alignment mechanism 22. Moreover, after the position adjustment of the glass is completed, the glass can be moved upward using the elevating stage 21 and can be held by the spacer mechanism 23 without changing its horizontal position. By passing the aligned glass to the spacer mechanism 23, the wafer can be placed on the elevating stage 21 and the horizontal position of the wafer can be adjusted using the outer diameter adjusting mechanism 22. By raising the elevating stage 21 as it is, the aligned wafer can be transported to the temporary bonding position without changing the horizontal position. Immediately before the glass is superimposed on the wafer with the spacer mechanism 23 in the extraction position, it is possible to press the glass using the temporary pressing tool 24 and press the back surface of the pressed portion against the wafer. Thereby, it is possible to prevent the horizontal position of the glass from changing when the glass is overlapped on the wafer with the spacer mechanism 23 being in the extraction position. Therefore, the wafer and the glass can be accurately superimposed as described above.

[2. (Paste method)
The bonding method according to the present invention is a method of bonding a substrate and a support, wherein the first processing step of aligning the substrate and the support in the first processing chamber, the aligned substrate, and A moving step of moving the support from the first processing chamber to the second processing chamber, and a second processing step of bonding the moved at least one set of substrates and the support in the second processing chamber. It is the composition which is. The alignment in the first processing step is performed in the first processing chamber in a reduced pressure state. Bonding in the second processing step is performed in the second processing chamber in a reduced pressure state. The substrate and the support are moved from the first processing chamber to the second processing chamber under reduced pressure.

  In the present embodiment, the case where the bonding method according to the present invention is performed using the bonding apparatus 1 described above will be described.

  FIG. 7 and FIG. 8 are diagrams for sequentially explaining the state of each step in the bonding method in the present embodiment, and are diagrams showing the internal configuration of the load lock chamber 6. For convenience of explanation, as in FIG. 5, the members for holding or controlling the outer diameter matching mechanism 22, the spacer mechanism 23, and the temporary presser 24 are not shown. Hereinafter, with reference to FIG. 7 and FIG. 8, each process in the bonding method in this Embodiment is demonstrated in order.

(1. Glass loading)
First, the elevating stage 21 is moved to the external transfer means delivery position. Then, the glass 41 is carried into the load lock chamber 6 through the delivery window 9 using the external transfer means 4 and placed on the lifting stage 21 (see FIG. 7A). The outer diameter matching mechanism 22 is left open. At this time, it is preferable that the spacer mechanism 23 is in the removal position and the temporary pressing tool 24 is in the standby position. Therefore, the state of each component in the alignment means at this time is as follows:
-Spacer mechanism 23: Pull-out position-Outer diameter adjusting mechanism 22: Open-Lifting stage 21: External transfer means delivery position-Temporary presser 24: Standby position

(2. Matching glass outer diameter)
Next, the elevating stage 21 on which the glass 41 is placed is moved to the outer diameter matching position. After the elevating stage 21 has moved to the outer diameter adjusting position, the outer diameter adjusting mechanism 22 is closed, the outer diameter of the glass 41 is adjusted, the position in the horizontal direction is adjusted, and the glass 41 is moved to an appropriate position. (See FIG. 7B). The state of each component in the alignment means at this time is as follows:
-Spacer mechanism 23: Extraction position-Outer diameter adjustment mechanism 22: Closed-Lifting stage 21: Outer diameter adjustment position-Temporary presser 24: Standby position

(3. Spacer insertion-Glass delivery)
After the outer diameter adjustment of the glass 41 is completed, the outer diameter adjustment mechanism 22 is returned to the opened state. Next, the elevating stage 21 on which the glass 41 whose outer diameter has been adjusted is placed is raised to the spacer insertion position. After the elevating stage 21 has moved to the spacer insertion position, the spacer mechanism 23 is moved to the insertion position (see FIG. 7C). Thus, the elevating stage 21 can be lowered again by being held by the spacer mechanism 23 without changing the horizontal position of the glass 41 whose outer diameter has been adjusted. The state of each component in the alignment means after moving the spacer mechanism 23 to the insertion position is as follows:
-Spacer mechanism 23: Insertion position-Outer diameter adjustment mechanism 22: Open-Lifting stage 21: Spacer insertion position-Temporary presser 24: Standby position

(4. Wafer loading)
After moving the spacer mechanism 23 to the insertion position, the elevating stage 21 is lowered and moved to the external transfer means delivery position. At this time, the glass 41 whose outer diameter has been matched is in a state of being supported by the spacer mechanism 23 without changing its horizontal position. After the elevating stage 21 is moved to the external transfer means delivery position, the wafer 42 is loaded into the load lock chamber 6 through the delivery window 9 and placed on the elevating stage 21 using the external transfer means 4 ( (Refer FIG.7 (d)). After loading the wafer 42 into the load lock chamber 6 and closing the delivery window 9, the load lock chamber 6 starts to be depressurized. The load lock chamber 6 may be depressurized so that the depressurized state of the load lock chamber 6 and the depressurized state of the bonding chamber 7 at the time when the temporary bonding is completed are substantially the same. Preferably, it is 10 Pa or less. The state of each component in the alignment means after carrying in the wafer 42 is as follows:
-Spacer mechanism 23: Insertion position-Outer diameter matching mechanism 22: Open-Lifting stage 21: External transfer means delivery position-Temporary presser 24: Standby position

(5. Wafer outer diameter matching)
After the wafer 42 is placed, the elevating stage 21 on which the wafer 42 is placed is moved to the outer diameter matching position. After the elevating stage 21 moves to the outer diameter matching position, the outer diameter matching mechanism 22 is closed, the outer diameter of the wafer 42 is adjusted, the position in the horizontal direction is adjusted, and the wafer 42 is moved to an appropriate position. (See FIG. 7E). The state of each component in the alignment means at this time is as follows:
-Spacer mechanism 23: Insertion position-Outer diameter adjustment mechanism 22: Closed-Lifting stage 21: Outer diameter adjustment position-Temporary presser 24: Standby position.

(6. Temporary holding)
After the outer diameter adjustment of the wafer 42 is completed, the outer diameter adjustment mechanism 22 is returned to the opened state. Next, the elevating stage 21 on which the wafers 42 whose outer diameters have been matched is placed is raised to the temporary bonding position. After the elevating stage 21 reaches the temporary joining position, the temporary presser 24 is moved to the joining position. As a result, the bottom surface of the temporary presser 24 (the surface facing the glass 41) is in contact with the surface of the glass 41 and presses the surface of the glass 41. The glass 41 whose surface is pressed is bent around the pressed portion, and is pressed against the wafer 42 at the bent portion (see FIG. 7F). Therefore, when the glass mechanism 41 and the wafer 42 are overlapped with each other by returning the spacer mechanism 23 to the extraction position, it is possible to prevent the relative positions in the horizontal direction from shifting. The state of each component of the positioning means after the temporary holding tool 24 has moved to the joining position is as follows:
-Spacer mechanism 23: Insertion position-Outer diameter matching mechanism 22: Open-Lifting stage 21: Temporary joining position-Temporary presser 24: Joining position

(7. Spacer removal: Temporary joining)
After the glass 41 is pressed against the wafer 42 by the temporary presser 24, the spacer mechanism 23 is returned to the extraction position. Thereby, in the whole part with which the glass 41 and the wafer 42 overlap, both will be in the state superimposed (refer FIG.7 (g)). At this time, since a part of the glass 41 is pressed against the wafer 42, the glass 41 and the wafer 42 can be brought into contact with each other without changing the relative positions in the horizontal direction. Therefore, the glass 41 can be overlapped with the wafer 42 while maintaining the horizontal position as a result of the respective outer diameter matching. The state of each component of the alignment means after the spacer mechanism 23 is returned to the extraction position and the glass 41 is overlapped with the wafer 42 is as follows:
-Spacer mechanism 23: Extraction position-Outer diameter adjustment mechanism 22: Open-Lifting stage 21: Temporary joining position-Temporary presser 24: Joining position

(8. End of temporary joining)
After the glass 41 and the wafer 42 are overlaid, the temporary presser 24 is returned to the standby position. Next, the elevating stage 21 on which the glass laminated wafer 40 in which the glass 41 and the wafer 42 are superposed is lowered and moved to the internal transfer lower arm delivery position. By the above, temporary joining is complete | finished and it will be in the state which can transfer the glass laminated wafer 40 to this joining (refer FIG.7 (h)). The state of each component in the alignment means when the temporary joining operation is completed is as follows:
-Spacer mechanism 23: Extraction position-Outer diameter adjustment mechanism 22: Open-Lifting stage 21: Temporary joining position-Temporary presser 24: Joining position

  In the steps so far, the internal transfer arms 11a and 11b of the two internal transfer units 10a and 10b are both in the standby position. After the temporary bonding, the glass laminated wafer 40 is transferred between the load lock chamber 6 and the bonding chamber 7 using the internal transfer means 10a and 10b.

(9. Internal transfer replacement 1)
After the glass laminated wafer 40 can be transferred to the main bonding (see FIG. 8A), the internal transfer arm 11a is moved to the load lock chamber delivery position (see FIG. 8B). At this time, the shutter of the gate 8 is opened, and the internal transfer arm 11b is moved to the joining chamber delivery position.

(10. Internal transfer replacement 2)
Next, the elevating stage 21 is lowered to the outer diameter matching position. Thereby, the glass laminated wafer 40 leaves | separates from the raising / lowering stage 21, and changes to the state supported by the conveyance arm object holding | maintenance part 14a of the internal conveyance arm 11a (refer FIG.8 (c)). The internal transfer arm 11a itself remains in the load lock chamber delivery position. On the other hand, in the bonding chamber 7, the lift pins 31 holding the glass laminated wafer 40 ′ that has been fully bonded are lowered, and the glass laminated wafer 40 ′ is supported by the transfer arm target holding portion 14 b of the internal transfer arm 11 b. Transition to.

(11. Internal transfer replacement 3)
With the internal transfer arm 11 a holding the glass laminated wafer 40, the internal transfer arm 11 a is rotated to the bonding chamber delivery position of the bonding chamber 7. Prior to this, the elevating pin 31 of the joining chamber 7 is lowered vertically below the position where the transfer by the internal transfer arm 11a is performed. On the other hand, the internal transfer arm 11b holding the glass laminated wafer 40 ′ is rotated from the bonding chamber delivery position to the load lock chamber delivery position. As a result, the glass laminated wafer 40 in the temporarily bonded state is transferred to the bonding chamber 7, and the glass laminated wafer 40 ′ after the final bonding is transferred to the load lock chamber 6 (see FIG. 8D).

(12. Internal transfer replacement 4)
After the glass laminated wafer 40 ′ after the main bonding is transferred to the load lock chamber 6, the elevating stage 21 is raised and moved to the delivery position on the internal transfer. Thereby, glass laminated wafer 40 'leaves | separates from the internal conveyance arm 11b, and switches from the state supported by the internal conveyance arm 11b to the state supported by the raising / lowering stage 21 (refer FIG.8 (e)). On the other hand, in the bonding chamber 7, the elevating pins 31 are raised to make a transition to a state where the glass laminated wafer 40 is supported by the elevating pins 31. Thereby, the glass laminated wafer 40 will be in the state which left | separated from the internal conveyance arm 11a.

(13. End of internal transfer replacement)
After the glass-bonded wafer 40 ′ after the main bonding is placed on the upper surface of the elevating stage 21, the internal transfer arm 11 a is rotated and moved to the standby position. Similarly, after the glass laminated wafer 40 in the temporarily bonded state is placed on the lifting pins 31, the internal transfer arm 11b is rotated and moved to the standby position. After returning the internal transfer arm 11b in the joining chamber delivery position to the standby position, the shutter of the gate 8 is closed again. As described above, the glass laminated wafer 40 in the temporarily bonded state can be finally bonded in the bonding chamber 7, and the glass laminated wafer 40 ′ after the final bonding is in the load lock chamber 6 and can be transferred to the external transfer means 4. The replacement of the glass laminated wafer between the load lock chamber 6 and the bonding chamber 7 is completed (see FIG. 8F).

(14. Delivery of external transport means)
After closing the shutter of the gate 8, the decompression of the load lock chamber 6 is released, and the inside is returned to atmospheric pressure. The elevating stage 21 is lowered and moved to the external transfer means delivery position (see FIG. 8G). After the inside of the load lock chamber 6 returns to the atmospheric pressure, the delivery window 9 is opened, and the glass laminated wafer 40 ′ after the main bonding on the elevating stage 21 is delivered to the external transfer means 4. Thereby, the delivery to the external conveyance means 4 is completed. When continuous processing is performed, the glass 41 is again carried into the load lock chamber 6 by using the external transfer means 4 in this state, and the glass 41 is arranged on the elevating stage 21 in the external transfer means transfer position. The above-described series of processing is repeated. On the other hand, when the glass laminated wafer 40 ′ after the final bonding is delivered to the external transfer means 4 and the processing is terminated, the delivery window 9 is closed, the elevating stage 21 is lowered and moved to the outer diameter adjusting position. Then, the processing is ended (see FIG. 8H).

  In each step of the internal conveyance replacement, the spacer mechanism 23, the outer diameter adjusting mechanism 22 and the temporary pressing tool 24 are not operated, and the spacer mechanism 23: the extraction position, the outer diameter adjusting mechanism 22: open, and the temporary pressing tool 24: standby. In position.

  According to the above bonding method, the wafer 42, the glass 41, and the glass lamination between the bonding unit 2 and the external transfer means 4, and the period of alignment and bonding (bonding) between the wafer 42 and the glass 41 During the transfer period of the wafers 40, 40 ′, the bonding chamber 7 for bonding can be always kept in vacuum. Therefore, the temperature of the bonding means, in particular, the press plate can be kept constant, thereby preventing a decrease in bonding accuracy that may occur due to a temperature change.

  Further, according to the above bonding method, after the wafer 42 and the glass 41 are aligned, when they are overlapped prior to bonding, they can be overlapped while maintaining the horizontal position. it can. Therefore, the bonding accuracy can be further improved.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  INDUSTRIAL APPLICABILITY The present invention can improve the accuracy of bonding a substrate and a support plate in a vacuum, and thus can be widely used in the industrial product manufacturing field.

DESCRIPTION OF SYMBOLS 1 Bonding apparatus 2 Bonding unit 3 Pre-aligner 4 External transfer means 5 External transfer means traveling path 6 Load lock chamber (first processing chamber)
7 Joining chamber (second processing chamber)
8 Gate 9 Delivery window 10, 10a, 10b Internal transport means (transport means)
DESCRIPTION OF SYMBOLS 11, 11a, 11b Inner transfer arm 12 Arm rotation axis 13 Transfer arm main body 14 Transfer arm object holding part 15 Shift prevention member 16 Fall prevention guide 21 Lifting stage (lifting member)
22 Outer diameter matching mechanism (position adjustment means)
23 Spacer mechanism (position fixing means, holding member)
24 Temporary presser (position fixing means, pressing member)
25a, 25b Air cylinder (pressing member)
26a, 26b Stepping motor (pressing member)
28 Air Cylinder 32 Floor 34 Press Plate 40 Glass Laminated Wafer 40 'Glass Laminated Wafer After Main Bonding 41 Glass (Support)
42 Wafer (substrate)
43 notch 50 FOUP opener 51 bake plate 52 spinner 53 pass line 54 second external transfer means B standby position C joining chamber delivery position

Claims (6)

In a laminating apparatus for laminating a substrate and a support,
A first processing chamber capable of being depressurized, having alignment means for aligning the substrate and the support in a depressurized state prior to bonding the substrate and the support;
A second processing chamber capable of being depressurized, comprising a laminating means for laminating the aligned substrate and the support in a depressurized state ;
In the first processing chamber and the second processing chamber, at least one set of the aligned substrate and the support body can be moved from the first processing chamber to the second processing chamber under reduced pressure. The decompression of the first processing chamber and the decompression of the second processing chamber are controlled independently of each other,
The alignment means is
Position adjusting means for adjusting the horizontal position of the substrate and the horizontal position of the support;
Position fixing means for fixing the position of the substrate or the support in the horizontal direction when the substrate and the support whose position in the horizontal direction is adjusted are overlapped,
The position adjusting means has a plurality of pressing members that press the substrate or the support in the horizontal direction from the outer periphery of the substrate or the support,
Among the plurality of pressing members, a certain pressing member and another pressing member form a pair, and the certain pressing member is located at a position opposite to the other pressing member. A bonding apparatus, wherein a straight line connecting members and a straight line connecting another pair of pressing members are arranged so as to be orthogonal to each other.   2. The bonding apparatus according to claim 1, further comprising a transfer unit configured to move the at least one set of the substrate and the support body from the first processing chamber to the second processing chamber. .   The bonding apparatus according to claim 1, wherein each of the plurality of pressing members is movable back and forth in a direction parallel to the pressing direction.   The said position fixing means has a pressing member which presses the surface of one member of the said board | substrate and the said support body, and presses it against the other member. The bonding apparatus according to any one of the above. The alignment means is
An elevating member that moves the substrate or the support body, the position of which is adjusted in the horizontal direction, vertically upward while maintaining the position in the horizontal direction;
A holding member that holds the substrate or the support that has been moved vertically upward;
The position adjusting means adjusts the position of the substrate and the support in the other horizontal direction in a state where the holding member holds the substrate or the support, thereby positioning the substrate and the support. The bonding apparatus according to any one of claims 1 to 4, wherein the bonding is performed. In the laminating method for laminating the substrate and the support,
A first processing step of aligning the substrate and the support in a first processing chamber in a reduced pressure state;
Moving the aligned at least one set of the substrate and the support from the first processing chamber to a second processing chamber in a reduced pressure state under reduced pressure;
A second processing step of bonding the at least one set of the substrate and the support in the second processing chamber in a reduced pressure state independently of the first processing chamber;
Including
In the first processing step,
The position adjusting means adjusts the position in the horizontal direction of one member of the substrate and the support,
The lifting member moves the one member vertically upward while maintaining the position in the horizontal direction,
The position adjusting means adjusts the position of the other member of the substrate and the support in the horizontal direction,
In a state where the position in the horizontal direction of the one member of the substrate and the support is fixed by the position fixing means, the substrate and the support are overlapped,
The position adjusting means has a plurality of pressing members that press the substrate or the support in the horizontal direction from the outer periphery of the substrate or the support,
Among the plurality of pressing members, a certain pressing member and another pressing member form a pair, and the certain pressing member is located at a position opposite to the other pressing member. A bonding method, wherein a straight line connecting members and a straight line connecting another pair of pressing members are arranged so as to be orthogonal to each other.

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