JP5990037B2 - Superposition device and superposition method - Google Patents

Description

  The present invention relates to a superimposing apparatus and a superimposing method for superimposing a substrate and a support.

  As mobile phones, digital AV devices, IC cards, etc. have become more sophisticated, there is an increasing demand for higher integration of chips in packages by reducing the size and thickness of semiconductor silicon chips (hereinafter referred to as chips). ing. In order to achieve high integration of chips in the package, it is necessary to reduce the thickness of the chip to a range of 25 to 150 μm.

  However, a semiconductor wafer (hereinafter referred to as a wafer) serving as a base of a chip is thinned by grinding, its strength is weakened, and the wafer is likely to be cracked or warped. Further, since it is difficult to automatically transport a wafer whose strength has been reduced by making it thin, it has to be transported manually, and the handling thereof is complicated.

  Therefore, a wafer support system has been developed that maintains the strength of the wafer and prevents the occurrence of cracks and warpage of the wafer by bonding a plate made of glass or hard plastic, called a support plate, to the wafer to be ground. . Since the strength of the wafer can be maintained by the wafer support system, the transport of the thinned semiconductor wafer can be automated.

  The wafer and the support plate are bonded together using an adhesive tape, an adhesive containing a thermoplastic resin, or the like. After thinning the wafer to which the support plate is attached, the support plate is peeled from the substrate before dicing the wafer.

  Here, when the support plate is bonded to the wafer, first, the wafer and the support plate are overlapped with each other using the overlapping device, and then the overlapped wafer and the support plate are transferred to the bonding device. Patent Documents 1 and 2 describe a technique for bonding together.

JP 2008-182127 A (released on August 7, 2008) JP 2012-059758 A (published September 17, 2012)

  However, in the prior art, when the wafer and the support plate that are overlapped by the overlapping device are transported to the attaching device, there is a possibility that the relative position between the wafer and the support plate is displaced. If a deviation occurs in the relative position between the wafer and the support plate, the subsequent processing of the wafer is adversely affected.

  The present invention has been made in view of the above problems, and when transferring the wafer and the support plate superimposed in the overlaying apparatus and the overlaying method to the sticking apparatus, the relative position between the wafer and the support plate is displaced. The main purpose is to provide technology to prevent the occurrence.

  In order to solve the above-described problems, an overlaying apparatus according to the present invention includes a substrate and a support that supports the substrate via an adhesive layer that is stacked on at least one of the substrate and the support. A superimposing device for superimposing, wherein a temporary fixing means for temporarily fixing the support to the substrate by pressing and heating a partial region of the support superimposed on the substrate toward the substrate. It is characterized by having.

  The superposition method according to the present invention is a superposition method of superposing a substrate and a support supporting the substrate via an adhesive layer laminated on at least one of the substrate and the support, The method includes a temporary fixing step of temporarily fixing the support to the substrate by pressing and heating a partial region of the support superimposed on the substrate toward the substrate. .

  According to the present invention, since the superimposed wafer and support plate can be temporarily fixed, when the wafer and the support plate are transported to the attaching device, the relative position between the wafer and the support plate is shifted. Can be prevented.

It is a top view which shows typically the whole structure of the bonding system in one Embodiment. It is a top view which shows typically the structure of the holding | maintenance part in one Embodiment. (A) is a front view which shows typically the structure of the overlap part in one Embodiment, (b) is the figure which simplified (a). It is a top view which shows typically the structure of the position adjustment means in one Embodiment. It is a top view which shows typically the structure of the latching member in one Embodiment. It is a figure which shows the structure of the bonding unit in one Embodiment. It is a figure explaining operation | movement of the superimposition apparatus in one Embodiment.

<Overlay device>
The superposing apparatus according to the present invention superimposes a substrate and a support plate (support) supporting the substrate via an adhesive layer laminated on at least one of the substrate and the support plate. And the structure which is equipped with the temporary fixing means which temporarily fixes the said support plate to the said board | substrate by pressing and heating the one part area | region of the said support plate superimposed on the said board | substrate toward a board | substrate. is there.

[Laminate]
The stacking apparatus forms a stacked body by stacking a substrate and a support supporting the substrate via an adhesive layer stacked on at least one of the substrate and the support. That is, the laminate is formed by laminating a substrate, an adhesive layer containing, for example, a thermoplastic resin, and a support plate (support) that supports the substrate in this order. The adhesive layer can be formed by applying an adhesive to any one of the substrate and the support plate, or by attaching an adhesive tape to which the adhesive is applied. And the board | substrate and a support plate can be bonded together by mounting (setting) the formed laminated body in the predetermined position of a sticking apparatus, for example with conveyance apparatuses, such as a robot arm, and applying a pressing force.

  In addition, the formation method and formation apparatus which form a laminated body, ie, the formation method of an adhesive layer, an adhesive layer formation apparatus, etc. are not specifically limited, A various method and apparatus are employable.

  Moreover, the said board | substrate is used for processes, such as thinning, conveyance, mounting, in the state supported (attached) by the support plate. The substrate is not limited to a wafer substrate, and may be any substrate such as a ceramic substrate, a thin film substrate, or a flexible substrate that needs to be supported by a support plate.

  The support plate is a support that supports the substrate, and is attached to the substrate via an adhesive layer. Therefore, the support plate only needs to have a strength necessary to prevent breakage or deformation of the substrate during a process such as thinning, transporting, and mounting of the substrate, and is desirably lighter. From the above viewpoint, the support plate is more preferably made of glass, silicon, acrylic resin, ceramic, or the like.

  The adhesive which comprises the said contact bonding layer should just contain the thermoplastic resin which heat fluidity improves by heating, for example as an adhesive material. Examples of the thermoplastic resin include acrylic resins, styrene resins, maleimide resins, hydrocarbon resins, and the like.

  The method for forming the adhesive layer, that is, the method for applying the adhesive to the substrate or the support plate, or the method for forming the adhesive tape by applying the adhesive to the substrate is not particularly limited. Examples of the method for applying the adhesive include a spin coating method, a dipping method, a roller blade method, a spray method, and a coating method using a slit nozzle method.

  The thickness of the adhesive layer may be set as appropriate according to the type of substrate to be pasted and the type of support plate, the treatment applied to the substrate after pasting, etc., but within the range of 10 to 150 μm. Is preferable, and it is more preferable that it exists in the range of 15-100 micrometers.

  Note that when peeling the support plate from the substrate, a solvent may be supplied to the adhesive layer to dissolve the adhesive layer. Thereby, a board | substrate and a support plate can be isolate | separated. At this time, if the support plate has a through-hole penetrating in the thickness direction, it is more preferable because the solvent can be easily supplied to the adhesive layer through the through-hole.

  Further, a layer other than the adhesive layer may be further formed between the substrate and the support plate as long as the attachment of the both is not hindered. For example, a separation layer that is altered by irradiation with light may be formed between the support plate and the adhesive layer. Since the separation layer is formed, the substrate and the support plate can be easily separated by irradiating light after processes such as thinning, transporting, and mounting of the substrate.

[Lamination system]
In one embodiment, the superimposing apparatus according to the present invention can be incorporated into a bonding system for bonding the substrate 42 and the support plate 41 together.

  FIG. 1 is a configuration diagram showing a bonding system 1 in the present embodiment, and shows a schematic configuration when the bonding system 1 is viewed from directly above. As shown in FIG. 1, the bonding system 1 includes a bonding unit 2, a holding unit 3, a first external transport unit 4, and a first external transport unit travel path 5. The laminating unit 2 includes an overlapping portion 6 that can be decompressed and a pasting portion 7 that can be decompressed. Among these, the holding unit 3 and the superimposing unit 6 constitute the superimposing device according to the present embodiment, and the pasting unit 7 constitutes the pasting device according to the present embodiment.

  1 further includes a FOUP opener 50 provided in the bonding system 1, a spinner 52 that applies an adhesive layer to the substrate 42, a bake plate 51 that cures the applied adhesive layer, a second external transport unit 54, and A pass line 53 for transferring the substrate 42 to the first external transfer means 4 is shown.

  The external transport means 4 has a configuration that can carry the support plate 41, the substrate 42, and the laminated body 40, and can exchange the support plate 41, the substrate 42, and the laminated body 40 with the bonding unit 2. It has a configuration. The external transport unit 4 moves on the external transport unit travel path 5. The external conveying means 4 and the external conveying means traveling path 5 that bear such a function can be prepared by a conventionally known technique.

(Holding part)
FIG. 2 is a diagram illustrating a schematic configuration of the holding unit 3. As shown in FIG. 2, the holding unit 3 includes imaging units (first imaging unit and second imaging unit) 17 a and 17 b and a center position detection unit 19, and the substrate 42 or the support before being superimposed. The plate 41 is held (note that FIG. 2 shows the case where the support plate 41 is held).

  The imaging units 17a and 17b respectively capture areas 18a and 18b including different end surfaces (first end surface and second end surface) of the substrate 42 or the support plate 41 held by the holding unit 3. . The regions 18a and 18b are preferably set, for example, approximately on a diagonal line of the substrate 42 or the support plate 41 held by the holding unit 3. The imaging units 17a and 17b can be, for example, CCD cameras.

  The center position detection unit 19 detects the center position of the substrate 42 or the support plate 41 held by the holding unit 3 based on a plurality of images taken by the imaging units 17a and 17b. The center position detector 19 only needs to calculate a virtual circle based on the image of the end face of the disk and detect the center position. The technique for detecting the center position based on the image of the end face is not particularly limited as long as known image processing is used.

(Overlapping part)
FIG. 3A is a diagram showing a schematic configuration of the overlapping portion 6, and FIG. 3B is a simplified diagram of FIG. 3A. As shown in FIG. 3A, the overlapping portion 6 includes an elevating stage (support means) 21, a position adjusting portion (position adjusting means) 22, a latch member 23, a temporary fixing portion (temporary fixing means) 24, a heater. 25 and the pressing part 26 are provided. As shown in FIG. 3B, the position adjusting unit 22 and the latching member 23 are moved in the horizontal direction, and the elevating stage 21 and the temporary fixing unit 24 are moved in the vertical direction. ing. The support plate 41 and the substrate 42 are separately carried into the overlapping portion 6.

  The elevating stage 21 is a member that holds the support plate 41 or the substrate 42 or the stacked body 40 in which the support plate 41 or the substrate 42 is stacked from the bottom surface. It can be a chuck that holds by suction. The elevating stage 21 can be moved up and down in the vertical direction, whereby the support plate 41, the substrate 42 and the stacked body 40 to be held can be moved up and down in the vertical direction.

  The mounting surface 21a such as the support plate 41 in the elevating stage 21 is preferably formed of a resin such as polytetrafluoroethylene or PEEK so as not to wrinkle the mounted object. Moreover, it is preferable to form a groove in the mounting surface 21a. By forming a groove in the mounting surface 21a, when the inside of the overlapping portion 6 is decompressed, gas remains between the support plate 41, the substrate 42, the stacked body 40, and the mounting surface 21a. Can be prevented.

  The position adjustment unit 22 is a member that adjusts the position in the horizontal direction of the support plate 41 and the substrate 42 to be aligned for alignment. The position adjustment unit 22 is based on the center positions of the support plate 41 and the substrate 42 detected by the center position detection unit 19 so that the center positions of the support plate 41 and the substrate 42 overlap each other. The position in one in-plane direction is adjusted. For example, as shown in FIG. 4, the center positions of the support plate 41 and the substrate 42 may be adjusted so as to overlap a predetermined center axis O.

  As described above, the position adjustment unit 22 determines the position of at least one of the substrate 42 and the support plate 41 in the in-plane direction so that the center positions of the substrate 42 and the support plate 41 detected by the center position detection unit 19 overlap each other. adjust. Thereby, in the superposition part 6, the center position of the board | substrate and support body which the center position detection part 19 detected can be piled up.

  In addition, as long as the position in the horizontal direction of the support plate 41 and the board | substrate 42 can be adjusted appropriately, ie, as long as the support plate 41 and the board | substrate 42 can be moved to a desired horizontal position, the specific mechanism of the position adjustment part 22 is demonstrated. Is not particularly limited. In the present embodiment, as shown in FIG. 4, the position adjusting unit 22 is pressed by the pressing units 26 a to 26 d and abuts against the support plate 41 or the substrate 42, whereby the support plate 41 and the substrate 42 are positioned in the horizontal direction. To be adjusted. The pressing portions 26a to 26d can be configured by, for example, a stepping motor, an air cylinder, or the like.

  In addition, as shown by A and B in FIG. 3A, the position where the position adjusting unit 22 contacts the support plate 41 or the substrate 42 is two steps in one example. Thereby, for example, the substrate 42 having two types of sizes can be processed.

The retaining member 23 holds the aligned support plate 41 (or the substrate 42 when the substrate 42 is first aligned) until it is overlapped without changing its horizontal position. It is a member. FIG. 5 is a view of the latch member 23 as seen from the upper surface side. The latch member 23 supports the support plate 41 stably by supporting a part of the peripheral edge portion of the support plate 41 from below. The latch member 23 is movable in the horizontal direction. When the support plate 41 is placed on the elevating stage 21 and carried to the upper part of the latching member 23, the latching member 23 is moved to a position where it does not overlap the support plate 41 at all. In this specification, in this state, the latch member 23 is referred to as being in the “extraction position”. After the support plate 41 is brought into the spacer insertion position, the latch member 23 is returned to a position overlapping the support plate 41 so that the support plate 41 can be supported by the latch member 23. In this specification, it is said that the latch member 23 is in the “insertion position” in this state. FIG. 5 shows a state in which the latch member 23 is in the “insertion position”. When latch member 23 is in the insertion position, the width D ₃ of overlap between the respective members and the support plate 41 for supporting the support plate 41 of the latch member 23 include, but are not limited to, inward from the peripheral edge of the support plate 41 It may be about 1 to 5 mm. It is preferably 5 mm. The size of the hook member 23 is, for example, the width d ₄ may be 5 mm, but is not limited thereto.

  The material of the latch member 23 is not particularly limited. For example, a material obtained by chamfering stainless steel (SUS) and coating it with polytetrafluoroethylene or the like can be used.

  The method for holding the support plate 41 is not limited to the method using the locking member 23. For example, the temporary fixing portion 24 may have an electrostatic adsorption function, and the support plate 41 after the alignment may be adsorbed to the temporary fixing portion 24 and held. At this time, the lifting / lowering stage 21 on which the support plate 41 is placed may be moved upward and the support plate 41 may be attracted to the temporary fixing portion 24. Thereby, the temporary fix | stop part 24 can hold | maintain the support plate 41, without changing the horizontal position.

  When the support plate 41 and the substrate 42 are overlapped, the temporary fixing portion 24 presses a part of the support plate 41 overlapped with the substrate 42 toward the substrate 42 and heats the substrate 42. This is a member for temporarily fixing the support plate 41. That is, the support plate 41 and the substrate 42 can be temporarily fixed by softening a part of the adhesive layer sandwiched between the support plate 41 and the substrate 42 by pressing and heating the partial region. it can.

  As described above, according to the present embodiment, the support plate 41 and the substrate 42 can be temporarily fixed. Therefore, when the stacked laminate 40 is transported to the attaching unit 7, the substrate 42 and the support plate 41 are used. It is possible to successfully prevent a deviation from occurring in the relative position with respect to.

  The temporary fixing portion 24 is paired with the elevating stage 21 so as to be sandwiched between the support plate 41 and the substrate 42, and the area of the contact surface 24a of the temporary fixing portion 24 with respect to the support plate 41 is not particularly limited. What is necessary is just to set suitably in view of the intensity | strength of the temporary fixing of the plate 41 and the board | substrate 42, generation | occurrence | production of the void etc. between the support plate 41 and the board | substrate 42, etc.

  In addition, it is preferable that the area | region on the support plate 41 which the contact surface 24a contacts is a center part of the support plate 41. FIG. Thereby, the support plate 41 and the board | substrate 42 can be temporarily fixed with sufficient balance.

  Further, the temporary fixing portion 24 includes a heater (heating means) 25 for heating the contact surface 24a. The material of the temporary fixing part 24 is not particularly limited, but can be made of aluminum having good thermal conductivity, but is not limited thereto, and stainless steel or the like may be used. Moreover, the temporary fix | stop part 24 can take the method of pressing with a spring mechanism, and the method of driving with a stepping motor and controlling the pressing force to the support plate 41 with the torque concerning a stepping motor, for example.

  The temporary fixing portion 24 is provided vertically above the hooking member 23 and is configured to be movable up and down. In the present specification, the temporary fixing portion 24 is referred to as a “standby position” that the temporary fixing portion 24 is not moved downward and is therefore not in contact with the support plate 41 held by the latching member 23. It is said that. In contrast, in the present specification, the temporary fixing portion 24 indicates that the temporary fixing portion 24 moves downward and, as a result, is in a position where the surface of the support plate 41 held by the hooking member 23 is pressed. Is at the “joining position”. The temporary fixing portion 24 is provided so as to come into contact with the central portion of the surface of the support plate 41 when the temporary fixing portion 24 is in the joining position.

(Attached part)
The affixing unit 7 has an affixing unit that affixes the substrate 42 and the support plate 41 that have been aligned and aligned. As the bonding means, a configuration is possible in which the substrate 42 and the support plate 41 are bonded together by thermocompression bonding via an adhesive layer. For example, it is possible to provide a configuration in which press plates are provided above and below the sticking portion 7 and the laminate 40 before joining is sandwiched between the upper and lower press plates.

(Internal transfer means)
The overlapping portion 6 and the pasting portion 7 can have a structure in which a wall that partitions the inside of one processing chamber into two processing chambers is provided. In addition to this, the overlapping portion 6 and the pasting portion 7 may have a structure in which the overlapping portion 6 and the pasting portion 7 are in contact with each other without a gap on each side surface. At the boundary between the overlapping portion 6 and the pasting portion 7, a gate 8 for delivering the laminate 40 between the overlapping portion 6 and the pasting portion 7 is provided. The gate 8 is controlled to be opened and closed by a shutter. The overlapping portion 6 is provided with an openable / closable delivery window 9 for delivering the support plate 41, the substrate 42 and the laminated body 40 between the bonding unit 2 and the external transport means 4. Each of the overlapping portion 6 and the pasting portion 7 is provided with a known pressure reducing means (not shown), and the internal pressure state of each chamber can be controlled independently.

  Since the affixing portion 7 has a configuration capable of reducing the pressure, the substrate 42 and the support plate 41 can be bonded to each other through the adhesive layer in a reduced pressure atmosphere. By bonding the substrate 42 to the adhesive layer in a reduced-pressure atmosphere, the adhesive layer can enter the recess in a state where no air is present in the recess of the uneven pattern on the surface of the substrate 42. It is possible to prevent the generation of bubbles between the substrate 42 more reliably.

  The gate 8 can move the aligned laminated body 40 from the overlapping portion 6 to the attaching portion 7 in a state where the shutter is opened. It is formed so that it can be moved to the overlapping portion 6. By opening the shutter in a state where both the overlapping portion 6 and the pasting portion 7 are decompressed, the laminated body 40 before joining can be moved from the overlapping portion 6 to the pasting portion 7 under reduced pressure. Yes.

  The laminating unit 2 is further provided with an internal conveying means (10 in FIG. 6) for delivering the laminated body 40 between the overlapping portion 6 and the affixing portion 7 via the gate 8.

  FIG. 6 is a configuration diagram of the internal configuration of the bonding unit 2 including the internal conveyance means 10 as viewed from above. As long as the internal conveyance means 10 is the structure which can move the laminated body 40 between the superimposition part 6 and the sticking part 7, there is no restriction | limiting in particular in a specific mechanism. In the present embodiment, as shown in FIG. 6, the internal transfer means 10 includes an internal transfer arm 11 and an arm pivot shaft 12. The internal conveyance means 10 is a mechanism for moving the multilayer body 40 by rotation about the arm turning shaft 12 of the internal conveyance arm 11 that can support the multilayer body 40 from the lower surface. As will be described in detail later, in the present embodiment, two internal conveyance means 10 having a common pivot axis for rotation are provided. The arm turning shaft 12 is provided on the overlapping portion 6 side, but may be configured on the sticking portion 7 side. The arm pivot shaft 12 is formed on the side close to the side surface on which the delivery window 9 is formed from the viewpoint that the delivery stroke between the overlapping portion 6 and the external conveying means 4 can be shortened. It is preferable. In FIG. 6, the two-dot chain line indicated by “B” represents the standby position of the internal transfer arm 11, and the two-dot chain line indicated by “C” indicates the position (the sticking part) of the internal transfer arm 11 at the sticking part 7. (Delivery position).

  The rotation speed of the internal transfer arm 11 can be set according to the situation. Therefore, when the internal transfer arm 11 holds the stacked body 40, the internal transfer arm 11 can be rotated at a low speed, and when the stacked body 40 is not held, the internal transfer arm 11 rotates at a high speed. Can be made. In addition, acceleration / deceleration can be controlled so that the turning up and stopping of the internal transfer arm 11 is smooth.

  As shown in FIG. 6, the gate 8 has an opening with a width that allows the rotating internal transfer arm 11 to pass through the gate 8 and carry the laminated body 40 to the pasting portion delivery position C when the shutter is opened. It has become. Conventionally known means can be used to open and close the gate 8, and for example, a gate valve structure can be applied.

[Operation of the overlay device]
Next, a schematic operation of the superposition apparatus (holding unit 3 and superposition unit 6) according to the present embodiment will be described.

  FIG. 7 is a diagram for explaining the operation of the superposition apparatus according to the present embodiment, based on the state inside the superposition unit 6. For convenience of explanation, as in FIG. 3B, the members for holding or controlling the position adjusting unit 22, the hooking member 23, and the temporary fixing unit 24 are not shown.

(1. Loading the support plate 41 into the holding unit 3)
The support plate 41 is carried into the holding unit 3 using the external conveyance means 4. Then, the center position detection unit 19 detects the center position of the support plate 41.

(2. Loading of the support plate 41 into the overlapping portion 6)
The support plate 41 is carried into the overlapping portion 6 through the delivery window 9 using the external transfer means 4 and placed on the lifting stage 21 (see FIG. 7A). At this time, it is preferable that the latching member 23 is in the removal position and the temporary fixing portion 24 is in the standby position.

(3. Alignment of support plate 41)
Next, the elevating stage 21 on which the support plate 41 is placed is moved to a position where the position adjusting unit 22 exists. Then, the position adjustment unit 22 adjusts the position of the support plate 41 in the horizontal direction so that the center position of the support plate 41 detected in (1) overlaps the predetermined center axis (FIG. 7B). reference).

(4. Insertion of the retaining member 23-delivery of the support plate 41)
After the alignment of the support plate 41 is completed, the elevating stage 21 on which the support plate 41 is placed is raised to a position where the latch member 23 is inserted. And the latching member 23 is moved to an insertion position (refer FIG.7 (c)). As a result, the support plate 41 that has been aligned can be held by the retaining member 23 without changing the horizontal position, and the elevating stage 21 can be lowered again.

(5. Loading of the support plate 41 into the holding unit 3)
The substrate 42 is carried into the holding unit 3 using the external conveyance means 4. Then, the center position detection unit 19 detects the center position of the substrate 42.

(6. Loading the substrate 42)
The board | substrate 42 is carried in into the superimposition part 6 via the delivery window 9, and is arrange | positioned on the raising / lowering stage 21 using the external conveyance means 4 (refer FIG.7 (d)). After loading the substrate 42 into the superposition unit 6 and closing the transfer window 9, decompression of the superposition unit 6 is started. The superposition part 6 may be depressurized so that the depressurization state of the superposition part 6 and the depressurization state of the sticking part 7 at the time when the temporary fixing is finished are substantially the same. Preferably, it is 10 Pa or less.

(7. Substrate 42 alignment)
Next, the elevating stage 21 on which the substrate 42 is placed is moved to a position where the position adjusting unit 22 exists. Then, the position adjustment unit 22 adjusts the position of the substrate 42 in the horizontal direction so that the center position of the substrate 42 detected in (5) overlaps a predetermined center axis (see FIG. 7E). .

(8. Temporary fixing and latching member removal)
The elevating stage 21 on which the aligned substrate 42 is placed is raised to a position where it is overlapped with the support plate 41. After the elevating stage 21 reaches the position, the temporary fixing part 24 is moved onto the support plate 41. Thereby, the contact surface 24a of the temporary fix | stop part 24 contact | connects the surface of the support plate 41, and will be in the state which pressed the surface of the support plate 41 (refer FIG.7 (f)). At the same time, the contact surface 24 a is heated by the heater 25. As a result, the adhesive layer between the substrate 42 and the support plate 41 is thermally fluidized and temporarily fixed.

  Note that the temperature of the contact surface 24a is preferably heated to a temperature of at least room temperature or higher due to, for example, the low-temperature tackiness (tackiness) of the thermoplastic resin that is the adhesive material of the adhesive layer, and the glass transition point (Tg ) It is more preferable to heat until it becomes the above temperature. By heating the adhesive layer to a temperature equal to or higher than the glass transition point of the thermoplastic resin, the thermal fluidity of the adhesive layer is improved and the adhesive layer is easily deformed. Although it depends on the material of the adhesive layer, that is, the thermoplastic resin as the adhesive material, the temperature of the contact surface 24a is preferably 23 to 220 ° C., and the heating time, that is, the pressing time is 3 to 300 seconds. Preferably, it is 5 to 180 seconds.

  Further, after the support plate 41 is pressed against the substrate 42 by the temporary fixing portion 24, the hooking member 23 is returned to the extraction position. Thereby, in the whole part where the support plate 41 and the board | substrate 42 overlap, both will be in the state overlaid (refer FIG.7 (g)).

(9. End of overlay)
After the support plate 41 is overlapped with the substrate 42, the temporary fixing portion 24 is returned to the standby position. Next, the elevating stage 21 on which the stacked body 40 in which the support plate 41 and the substrate 42 are superimposed is lowered. Thus, the superposition is completed (see FIG. 7 (h)).

(10. Laminate 40 conveyance)
The shutter of the gate 8 is opened, and the internal conveyance means 10 is moved to the overlapping portion 6 to hold the stacked body 40 (see FIG. 8B). And the internal conveyance means 10 conveys the laminated body 40 to the sticking part 7 (refer FIG.8 (b)).

  Further, as a method of holding the support plate 41, when using the temporary fixing portion 24 having an electrostatic attraction function, after the positioning of the support plate 41 is finished, the lifting stage 21 on which the support plate is placed is temporarily attached. What is necessary is just to raise to the position made to adsorb | suck to the stop part 24. FIG. Then, by adsorbing the support plate 41 to the temporary fixing portion 24, the support plate 41 that has been aligned can be held by the temporary fixing portion 24 without changing the horizontal position. The electrostatic adsorption of the support plate 41 may be canceled when the substrate 42 and the support plate 41 are temporarily fixed or after being overlapped.

  As described above, in the superimposing apparatus according to the present embodiment, the temporary fixing portion 24 presses and heats a part of the support plate 41 superimposed on the substrate 41 toward the substrate 42, thereby Since the support plate 41 is temporarily fixed to 41, it is possible to prevent the relative position between the substrate 41 and the support plate 41 from being shifted when the stacked laminate is transported.

<Overlay method>
The superposition method according to the present invention is a superposition method of superposing a substrate and a support supporting the substrate via an adhesive layer laminated on at least one of the substrate and the support, The method includes a temporary fixing step of temporarily fixing the support to the substrate by pressing and heating a partial region of the support superimposed on the substrate toward the substrate. . In one embodiment, the temporary fixing step of the overlapping method can be performed using the temporary fixing means of the overlapping device according to the present invention described above. Moreover, since one Embodiment of the superimposition method based on this invention is based on description of the superposition apparatus mentioned above, the detailed description is abbreviate | omitted.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  INDUSTRIAL APPLICABILITY The present invention can improve the accuracy of bonding a substrate and a support plate in a vacuum, and thus can be widely used in the industrial product manufacturing field.

DESCRIPTION OF SYMBOLS 1 Bonding system 2 Bonding unit 3 Holding part 4 External conveyance means (conveyance means)
5 External transport means travel path 6 Overlapping unit (first processing chamber)
7 Pasting part (second processing room)
8 Gate 9 Delivery window 10 Internal transfer means 11 Internal transfer arm 12 Arm pivot axis 17a, 17b Image pickup unit (first image pickup means, second image pickup means)
18a, 18b Imaging region 19 Center position detector 21 Lifting stage (supporting means)
22 Position adjustment part (position adjustment means)
23 Holding member 24 Temporary fixing part (temporary fixing means)
25 Heater (heating means)
26 Pressing part 40 Laminate 41 Support plate (support)
42 Substrate 50 FOUP Opener 51 Bake Plate 52 Spinner 53 Pass Line 54 Second External Transport Means

Claims (5)

An apparatus for superimposing a substrate and a support supporting the substrate via an adhesive layer stacked on at least one of the substrate and the support,
A latching member for latching the support;
By heating with pressing towards the partial region of the support superimposed on the substrate in a substrate provided with a, a temporary fixing means for temporarily fixing the support member to the substrate,
The temporary fixing means includes a contact surface that contacts the partial area, and a heating means that heats the contact surface,
After the support body is latched by the latch member, the substrate is overlapped with the support body latched by the latch member, and the temporary fastening means presses and heats the partial area. when and, superimposed characterized that you have adapted to release the locking of the support by the latching member device. A position adjusting means for adjusting a relative position between the substrate and the support;
2. The superimposing apparatus according to claim 1, wherein the substrate and the support whose relative positions are adjusted by the position adjusting means are superposed. Comprising support means for supporting the substrate;
The superimposing apparatus according to claim 1 or 2, wherein the temporary fixing means sandwiches the substrate and the support body in a pair with the support means.   The superimposing apparatus according to claim 1, wherein the partial area is a central portion of the support. A method of superimposing a substrate and a support supporting the substrate via an adhesive layer laminated on at least one of the substrate and the support,
Including a temporary fixing step of temporarily fixing the support to the substrate by pressing and heating a partial region of the support superimposed on the substrate toward the substrate ;
In the temporary fixing step, pressing and heating are performed by a temporary fixing means including a contact surface that contacts the partial area and a heating means that heats the contact surface,
After the support body is latched by the latch member, the substrate is overlapped with the support body latched on the latch member, and the temporary fixing means presses and heats the partial area. And a latching method for releasing the latching of the support by the latching member .

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