JP6670185B2 - Laminating apparatus, laminating apparatus, laminating method and laminating method - Google Patents

Description

  The present invention relates to a superposing device, a pasting device, a superposing method, and a pasting method.

  As the functions of mobile phones, digital AV equipment, IC cards, and the like have become more sophisticated, the demand for higher integration of chips in packages has been increasing by reducing the size and thickness of semiconductor silicon chips (hereinafter, chips) mounted. ing. In order to realize high integration of the chip in the package, it is necessary to reduce the thickness of the chip to a range of 25 to 150 μm.

  However, a semiconductor wafer (hereinafter, referred to as a wafer) serving as a base of a chip is thinned by grinding, its strength is weakened, and the wafer is liable to crack or warp. Further, since it is difficult to automatically transport a wafer whose strength has been weakened by making it thinner, it has to be transported manually, and the handling is complicated.

  Therefore, a wafer support system has been developed in which a support plate, which is made of glass or hard plastic, is attached to a wafer to be ground, thereby maintaining the strength of the wafer and preventing cracks and wafer warpage. . Since the strength of the wafer can be maintained by the wafer support system, the transfer of the thinned semiconductor wafer can be automated.

  The wafer and the support plate are bonded together using an adhesive tape, an adhesive containing a thermoplastic resin, or the like. After thinning the wafer to which the support plate is attached, the support plate is separated from the substrate before dicing the wafer.

  Here, there is a demand for a technique capable of improving the bonding accuracy in bonding the support and the substrate. As such a technology, Japanese Patent Application Laid-Open No. H11-163873 discloses a method in which a plurality of wafers are stacked while being held by a wafer holder, and then when the stacked wafers are transported to a bonding portion, the position of the wafer is determined based on the acceleration or position of the wafer holder. It discloses that the misalignment is determined, and if there is a misalignment, the joining is not performed.

JP 2014-57070 A (released on March 27, 2014)

  However, the technique described in Patent Literature 1 is a technique for coping with a positional shift after a plurality of wafers are overlapped.

  On the other hand, the displacement between the substrate and the support may occur before the superposition. That is, in a superposition chamber where the substrate and the support are superimposed, the substrate and the support are brought close to each other with the plane portions parallel to each other for the superposition, but a displacement occurs at that time or before that. There is.

  In order to cope with such a positional shift, the present inventors are studying detection of a positional shift between a substrate and a support that have been brought close to each other in a superposition chamber with their plane portions parallel to each other. However, it is difficult to detect a displacement from the outside of the substrate and the support that are brought close to each other in a superposition chamber with their plane portions being parallel to each other. In addition, since the interior of the overlapping room may be in a vacuum environment, for example, it is difficult to detect a positional shift by introducing an internal camera or the like.

  The present invention has been made in view of the above-described problems, and in a superimposition chamber in which a substrate and a support are superimposed, it is preferable to displace the substrate and the support that are close to each other with the plane portions parallel to each other. It is a main object to provide a superposing device, a pasting device, a superposing method, and a pasting method that can be detected at a time.

In order to solve the above-described problems, a superposition apparatus according to the present invention is provided.
A superposition apparatus for superposing a substrate and a support that supports the substrate,
An overlapping chamber for overlapping the substrate and the support,
In the overlapping chamber, a position detecting unit that detects the position of the outer peripheral end of at least one of the substrate and the support body, the plane parts of which are brought close to each other in parallel,
The position detection unit is:
In the overlapping room, an internal detection unit that reflects the outer peripheral end,
An external detection unit is provided for detecting the outer peripheral end reflected by the internal detection unit from the outside of the overlapping chamber.

Further, the superposition method according to the present invention,
A method of superimposing a substrate and a support that supports the substrate,
A position detecting step of detecting a position of an outer peripheral end of at least one of the substrate and the support in which a plane portion of the substrate and the support are brought close to each other in a superimposition chamber in which the substrate and the support are superimposed. And
In the position detecting step, the outer peripheral end is imaged in the overlapping chamber, and the projected outer peripheral end is detected from outside the overlapping chamber.

  ADVANTAGE OF THE INVENTION According to this invention, in the superposition chamber which superposes a board | substrate and a support body, the superposition apparatus which can detect the positional shift in the board | substrate and the support body which made the mutually parallel plane parts parallel, and was able to detect suitably, sticking An apparatus, a superposition method, and a sticking method can be provided.

It is a schematic diagram which shows the schematic structure of the sticking system in one Embodiment of this invention. It is a mimetic diagram showing the schematic structure of the sticking device concerning one embodiment of the present invention. It is a figure which shows schematic structure of the position adjustment part in one Embodiment of this invention, (a) shows a top view, (b) shows a side sectional view. It is a schematic diagram which shows the schematic structure of the holding part in one Embodiment of this invention. It is a schematic diagram explaining operation | movement of the position detection part in one Embodiment of this invention, (a) shows the state of the superposition apparatus at the time of detecting the position of the outer peripheral end part of a support body, (b) is shown. , (A) shows an example of an image photographed by the photographing unit, (c) shows the state of the superposing apparatus when detecting the position of the outer peripheral edge of the substrate, and (d) shows the state of (c) 3) illustrates an example of an image captured by the capturing unit in the state of FIG. It is a schematic diagram explaining operation | movement of the position detection part in one Embodiment of this invention. FIG. 4 is a schematic diagram illustrating a schematic operation of an internal transport unit according to the embodiment of the present invention. It is a flow chart explaining the flow of the pasting method concerning one embodiment of the present invention. It is a mimetic diagram showing the state of the pasting device in one process of the pasting method concerning one embodiment of the present invention. It is a mimetic diagram showing the state of the pasting device in one process of the pasting method concerning one embodiment of the present invention. It is a mimetic diagram showing the state of the pasting device in one process of the pasting method concerning one embodiment of the present invention. It is a mimetic diagram showing the state of the pasting device in one process of the pasting method concerning one embodiment of the present invention. It is a mimetic diagram showing the state of the pasting device in one process of the pasting method concerning one embodiment of the present invention. It is a mimetic diagram showing the state of the pasting device in one process of the pasting method concerning one embodiment of the present invention. It is a mimetic diagram showing the state of the pasting device in one process of the pasting method concerning one embodiment of the present invention. It is a mimetic diagram showing the state of the pasting device in one process of the pasting method concerning one embodiment of the present invention. It is a mimetic diagram showing the state of the pasting device in one process of the pasting method concerning one embodiment of the present invention. It is a mimetic diagram showing the state of the pasting device in one process of the pasting method concerning one embodiment of the present invention.

  The present invention provides a superposing device, a pasting device, a superposing method, and a pasting method.

[Overlay device]
A superposition apparatus according to one embodiment of the present invention is a superposition apparatus that superposes a substrate and a support that supports the substrate, and a superposition chamber that superposes the substrate and the support, In the superposition chamber, a position detection unit that detects the position of the outer peripheral end of at least one of the substrate and the support body, the plane portions of which are brought close to each other in parallel, and the position detection unit includes: In the superimposition chamber, there is provided an internal detection unit that reflects the outer peripheral end, and an external detector that detects the outer peripheral end reflected by the internal detector from outside the superimposition chamber.

  According to the above configuration, (i) the internal detection unit reflects at least one of the outer peripheral ends of the substrate and the support body brought close to each other in the overlapping chamber, and (ii) the internal detection unit reflects from outside the overlapping chamber. By detecting the outer peripheral edge, the position of at least one of the outer peripheral edge of the substrate and the support that are brought close to each other in the overlapping chamber can be suitably detected.

  Accordingly, (i) when it is difficult to directly detect the position of the substrate or the support in the overlay chamber from outside the overlay chamber, or (ii) when the outer peripheral end of the substrate or the support is located in the overlay chamber. Even if it is difficult to dispose a detection unit for directly detecting the position, it is possible to appropriately detect a positional shift between the substrate and the support that are brought close to each other in the overlapping room with their plane portions being parallel to each other.

  In this specification, “overlapping the substrate and the support” means that the substrate and the support are stacked to form a laminate. In the laminate, the substrate and the support have parallel plane portions. In the laminate, another layer may be interposed between the substrate and the support. The overlaying apparatus according to the present invention is an apparatus for overlaying a substrate and a support by stacking the substrate and the support close to each other with their plane portions parallel to each other.

  In the present specification, the “outer peripheral end” means an end of the substrate or the support in the outer peripheral portion of the plane portion of the substrate or the support. Further, "projecting the outer peripheral end" means that an image of the outer peripheral end of the substrate or the support is displayed at a different position from the substrate or the support. The internal detection unit that reflects the outer peripheral end may include, for example, an optical member such as a mirror or a prism that causes an optical phenomenon such as reflection or refraction. Further, “detecting the outer peripheral edge projected by the inner detector” means detecting the image of the outer peripheral edge projected by the inner detector. Further, "detect" means to detect at least the position of the outer peripheral end to an extent that can be specified, and for example, may be to capture an image of the outer peripheral end, but is not limited to this. In addition, the external detection unit that detects the outer peripheral edge projected by the internal detection unit may be, for example, a photographing device such as a camera.

(Paste device)
An attaching device according to an embodiment of the present invention includes a superposing device according to an embodiment of the present invention, and a substrate and a support that are superimposed by the superposing device outside a superposition chamber of the superposing device. And a sticking unit for sticking.

  According to the above configuration, a desired laminated body can be obtained by the laminating unit laminating the substrate and the support that are superimposed by the laminating apparatus. In particular, since the bonding portion bonds the substrate and the support outside the stacking chamber, the stacking environment and the bonding environment can be made suitable for each purpose. Can be suitably obtained.

[Overlay method]
An overlay method according to an embodiment of the present invention is a method of overlaying a substrate and a support that supports the substrate, wherein the overlay is configured to overlap the substrate and the support. A position detecting step of detecting a position of an outer peripheral end of at least one of the substrate and the support, which are brought close to each other with the plane portions being parallel to each other, and the position detecting step includes: The outer peripheral end is projected, and the projected outer peripheral end is detected from outside the overlapping chamber.

  According to the above configuration, (i) the internal detection unit reflects at least one of the outer peripheral ends of the substrate and the support body brought close to each other in the overlapping chamber, and (ii) the internal detection unit reflects from outside the overlapping chamber. By detecting the outer peripheral edge, the position of at least one of the outer peripheral edge of the substrate and the support that are brought close to each other in the overlapping chamber can be suitably detected.

  Thereby, (i) when it is difficult to arrange a detecting unit for directly detecting the outer peripheral end of the substrate or the support in the overlapping chamber, or (ii) directly inside the overlapping chamber from outside the overlapping chamber. Even in the case where it is difficult to detect the position of the substrate or the support, it is possible to appropriately detect the positional deviation between the substrate and the support that are brought close to each other in the overlapping chamber with the plane portions parallel to each other.

(Attaching method)
The sticking method according to one embodiment of the present invention includes, after the substrate and the support are overlapped by the overlapping method according to one embodiment of the present invention, outside the overlapping chamber where the substrate and the support are overlapped. The combined substrate and support are attached.

  According to the above method, a desired laminated body can be obtained by laminating the substrate and the support which are superimposed by the superimposing method. In particular, since the substrate and the support are bonded to each other outside the stacking chamber, the environment for the stacking and the environment for the bonding can be appropriately set, and a desired stacked body can be suitably obtained. it can.

[Embodiment 1]
Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the following, a description is given of a configuration in which the overlaying device according to one embodiment of the present invention is incorporated in an attaching device, and the attaching device is incorporated in an attaching system. Not limited.

(Paste system 1)
FIG. 1 is a schematic diagram illustrating a schematic configuration of the attaching system 1. As shown in FIG. 1, the attaching system 1 includes an attaching device 2, a pre-aligner 3, a first external transport unit 4 and a first external transport unit travel path 5, a FOUP opener 50, a spinner 52, a bake plate 51, and a second external unit. A transport section 54, a second external transport section travel path 55, and a pass line 53 are provided. The sticking device 2 includes a stacking device 6 and a sticking chamber 7.

  The support plate (support) 41 is first transported to the pre-aligner 3 by the first external transport unit 4 moving on the first external transport unit travel path 5, and after being aligned, is overlaid via the delivery window 9. It is carried into the device 6. The substrate 42 is first conveyed to the spinner 52, subsequently to the bake plate 51, and finally to the pass line 53 by the second external conveyance section 54 moving on the second external conveyance section traveling path 55. The spinner 52 forms an adhesive layer by applying an adhesive to the substrate 42 to be processed. The bake plate 51 cures the adhesive layer formed on the substrate 42. Then, in the pass line 53, the substrate 42 is transferred to the first external transfer unit 4, first transferred to the pre-aligner 3, aligned, and then loaded into the overlapping device 6 through the transfer window 9. .

  In the present embodiment, the support plate 41 is first loaded into the overlaying device 6, and then the substrate 42 is loaded. However, this order may be reversed. After both the substrate 42 and the support plate 41 are carried in, the superposing device 6 superposes the carried-in support plate 41 and the substrate 42. The sticking device 2 moves the substrate 42 and the support plate 41 (laminated body 40), which are overlapped by the stacking device 6, to the sticking chamber 7 via the gate 9, and in the sticking chamber 7, the substrate 42 and the support plate 41 Paste.

(Paste device 2)
FIG. 2 is a schematic diagram illustrating a schematic configuration of the attaching device 2. As shown in FIG. 2, the attaching device 2 includes an overlapping device 6 and an attaching chamber 7, and the overlapping device 6 includes an overlapping chamber 6 a.

  A gate 8 that can be opened and closed is provided between the overlapping chamber 6a and the attaching chamber 7 in the attaching device 2. Further, the attaching device 2 includes an internal transport unit 10 for transporting an object via the gate 8 between the overlapping chamber 6a and the attaching chamber 7.

(Overlay device 6)
The superposition device 6 includes a decompression pump (decompression unit) 20, an alignment block (position adjustment unit) 21, a drive unit (position adjustment unit) 22, a spacer (holding unit) 23, a stage unit 24, A first support pin (support portion) 25, a temporary fixing portion 26, and a reflection plate (mirror portion, internal detection portion, position detection portion) 27 are provided, and a sub-frame 14, a camera (photographing portion) is provided outside the overlapping chamber 6a. , An external detection unit, a position detection unit) 28, a light source (external detection unit, position detection unit) 29, and a controller (image processing unit, external detection unit, position detection unit) 30. Further, the overlapping room 6a is provided with a window 13 for the camera 28 to photograph the inside of the overlapping room 6a.

(Decompression pump 20)
The decompression pump 20 is a device that depressurizes the inside of the overlapping chamber 6a, and preferably may be a device that depressurizes the inside of the overlapping chamber 6a to a vacuum or a state close to a vacuum. By reducing the pressure in the stacking chamber 6a, the transfer of the laminate 40 to and from the sticking chamber 7 can be suitably performed. In addition, at the time of the temporary fixing, it is possible to suppress air bubbles from entering between the substrate 42 and the support plate 41.

(Alignment block 21, drive unit 22)
3A and 3B are schematic diagrams showing a schematic configuration of the alignment block 21 and the drive unit 22. FIG. 3A is a top view, and FIG. 3B is a side sectional view. The substrate 42 and the support plate 41 carried into the overlapping chamber 6a are first placed on the first support pins 25. The alignment block 21 is driven by the drive unit 22 in a direction parallel to the XY plane, that is, in a horizontal direction, with the substrate 42 or the support plate 41 to be aligned placed on the first support pins 25. When driven, it comes into contact with the substrate 42 or the support plate, and aligns the substrate 42 and the support plate 41 (adjusts the positions of the substrate 42 and the support plate 41).

  As shown in FIG. 3A, in the overlaying device 6, the alignment blocks 21 are provided at five positions, and come into contact with the substrate 42 or the support plate 41 from five directions. Specifically, the overlaying device 6 is provided with two sets of alignment blocks 21 arranged at positions facing each other on the substrate 42 or the support plate 41 and one alignment block 21 for determining a notch position. The straight line connecting one set of alignment blocks 21 and the straight line connecting the other set of alignment blocks 21 are orthogonal to each other. However, the number and arrangement of the alignment blocks 21 are not limited to this as long as the positions of the substrate 42 and the support plate 41 can be adjusted.

  As shown in FIG. 3B, a cushion portion (for example, a rubber plate, a rubber plate, or the like) for preventing the substrate 42 or the support plate 41 from being scratched is provided at a portion of the alignment block 21 that contacts the substrate 42 or the support plate 41. 21b). Further, the alignment block 21 may be connected to the drive unit 22 via a spring 21a.

  The alignment block 21 is driven by a drive unit 22. The drive unit 22 aligns the substrate 42 and the support plate 41 by driving the alignment block 21 in the horizontal direction based on information from the pre-aligner 3.

(Spacer 23)
The spacer 23 is a member that holds the aligned support plate 41 (the substrate 42 when the substrate 42 is first positioned) without changing its horizontal position until the superposition is performed. is there. FIG. 4 is a diagram of the spacer 23 as viewed from above. The spacer 23 stably holds the support plate 41 by supporting a part of the periphery of the support plate 41 from below. The spacer 23 is movable in the XY directions, that is, in the horizontal direction. When the support plate 41 is carried on the stage section 24 to the upper portion of the spacer 23, the spacer 23 is moved to a position where it does not overlap the support plate 41 at all. In this specification, in this state, the spacer 23 is referred to as being in the “pulling position”. After the support plate 41 is carried above the spacer 23, the spacer 23 is returned to a position overlapping the support plate 41 so that the support plate 41 can be supported by the spacer 23. In this specification, in this state, the spacer 23 is referred to as being at the “insertion position”. FIG. 4 shows a state where the spacer 23 is at the “insertion position”. When the spacer 23 is in the insertion position, the width d ₃ of overlap between the respective members and the support plate 41 for supporting the support plate 41 of the spacer 23 include, but are not limited to, 1 to 5 mm from the peripheral edge of the support plate 41 toward the inner side Degree. Preferably it is 5 mm. The size of the spacer 23 is, for example, the width d ₄ may be 5 mm, but is not limited thereto.

  The material of the spacer 23 is not particularly limited. For example, a material obtained by chamfering stainless steel (SUS) and coating the resin with polytetrafluoroethylene or the like can be used.

(Stage part 24)
The stage section 24 has a built-in heater (not shown), and can thermally flow the adhesive layer applied to the substrate 42 supported by the first support pins 25. The temperature of the stage portion 24 is preferably heated to at least a room temperature or higher due to, for example, low-temperature tackiness (tackiness) of a thermoplastic resin as an adhesive material of the adhesive layer, and is equal to or higher than a glass transition point (Tg). It is more preferable to heat the mixture to the above temperature. By heating the adhesive layer to a temperature equal to or higher than the glass transition point of the thermoplastic resin, the thermal fluidity of the adhesive layer is improved, and the adhesive layer is easily deformed. The temperature of the stage portion 24 is preferably 23 to 220 ° C., and the heating time, that is, the pressing time is preferably 3 to 300 seconds, depending on the adhesive layer, that is, the material of the thermoplastic resin as the adhesive material. More preferably, it is more preferably 5 to 180 seconds.

(First support pin 25)
The first support pins 25 are provided so as to protrude from the stage section 24, and individually support the support plate 41 and the substrate 42 from the bottom surface. In a state where the first support pins 25 support the support plate 41 or the substrate 42, the amount of protrusion of the first support pins 25 is adjusted so that the support plate 41 or the substrate 42 is moved to a predetermined position (for example, alignment). (The position aligned by the block 21, the position on the spacer 23, or the position close to the support plate 41 or the substrate 42). The material of the first support pin 25 is not particularly limited, but can be made of aluminum or the like having good heat conductivity, but is not limited thereto, and stainless steel or the like may be used.

(Pressing pin 26)
The pressing pin 26 presses the substrate 42 and the support plate 41 (laminated body 40) which are superimposed on each other in the Z direction downward. The distal ends of the pressing pins 26 are arranged to face the respective distal ends of the first support pins 25. By arranging the first support pins 25 and the pressing pins 26 in this manner, the region of the support plate 41 whose position has been adjusted and a part of the region of the substrate 42 whose position has been adjusted are overlapped and sandwiched. Can be pressed. For this reason, it is possible to apply a pressing force uniformly around the center point of the support plate 41 and the substrate 42 whose positions have been adjusted. Therefore, it is possible to prevent the support plate 41 and the substrate 42 from being displaced from each other, and to temporarily fix the support plate 41 successfully.

  When the pressing pin 26 is in contact with the upper surface of the support plate 41 (or the substrate 42), the pressing pin 26 is biased downward in the Z direction by a spring (biasing member) 26a. The plurality of pressing pins 26 can be simultaneously moved up and down in the Z direction by the support shaft 26b. Here, in the present specification, it is assumed that the pressing pin 26 is not moved downward and is in a position where it does not contact the support plate 41 held by the spacer 23. There is. On the other hand, in the present specification, the pressing pin 26 moves downward, and as a result, the support plate 41 held by the spacer 23 is located at a position where it can be urged by the spring 26a. Is said to be at the “pressed position”.

(Reflector 27, camera 28, light source 29, and controller 30)
The reflection plate 27, the camera 28, the light source 29, and the controller 30 constitute a position detection unit that detects the positions of the outer peripheral ends of the substrate 42 and the support plate 41 in the superposition device 6.

  FIG. 5A is a schematic diagram illustrating a state of the overlaying device 6 when the position detection unit detects the position of the outer peripheral end of the support plate 41. The position detecting unit detects the position of the outer peripheral end of the support plate 41 in a state where the support plate 41 is held by the spacer 23 in the overlapping chamber 6a. First, the light source 29 illuminates the support plate 41 held by the spacer 23, and reflects the outer peripheral end of the support plate 41 on the side of the bottom surface 41 b on the reflection plate 27. Then, the camera 28 captures an image of the outer peripheral end of the support plate 41 reflected on the reflection plate 27 through the window 13 to obtain an image as shown in FIG. Then, the controller 30 can detect the position of the outer peripheral end of the support plate 41 by performing image processing (for example, known edge detection processing) on the obtained image. Note that, as in the example shown in FIG. 5B, the outer peripheral end to be detected may be a portion V including a notch (notch) 41 a for specifying the direction of the support plate 41.

  FIG. 5C is a schematic diagram illustrating a state of the superposing device 6 when detecting the position of the outer peripheral end of the substrate 42. The position detection unit is configured such that the substrate 42 and the support plate 41 are brought close to each other in the overlapping chamber 6a with the plane portions (the upper surface portion 42b of the substrate 42 and the bottom surface portion 41b of the support plate 41) parallel to each other. The position of the outer peripheral end of the substrate 42 is detected. Note that the support plate 41 is the same as the substrate 42 but is larger than the substrate 42 in order to support the substrate 42.

  First, the light source 29 illuminates the substrate 42 and the support plate 41, which are close to each other with the plane portions parallel to each other, and reflects the outer peripheral end of the substrate 42 on the bottom surface 42 c side on the reflection plate 27. Then, the camera 28 takes an image of the outer peripheral end of the substrate 42 reflected on the reflection plate 27 through the window 13 to obtain an image as shown in FIG. Then, the overlaying device 6 can detect the position of the outer peripheral end of the substrate 42 by performing image processing (for example, known edge detection processing) on this image. Note that, as in the example shown in FIG. 5D, the outer peripheral end to be detected may be a portion V including a notch (notch) 42 a for specifying the orientation of the substrate 42.

  It is preferable that the light amount of the light source 29 be changed between when the position of the outer peripheral end of the support plate 41 is detected and when the position of the outer peripheral end of the substrate 42 is detected. For example, in one embodiment, when detecting the position of the outer peripheral end portion of the support plate 41, the light amount of the light source 29 is reduced, as shown in FIG. An image having a high contrast with the image can be obtained. In addition, when detecting the position of the outer peripheral end of the substrate 42, the contrast between the substrate 42 and the support plate 41 is high as shown in FIG. Images can be obtained.

  FIG. 6 is a schematic diagram further describing the operation of the position detection unit. When the superposing device 6 detects the position of the outer peripheral edge of the support plate 41 (or the substrate 42), as shown in FIG. Alternatively, the image S at the outer peripheral end on the side of the bottom surface 42c) is moved. Preferably, at least three reflecting plates 27 are arranged in the overlapping chamber 6a, and project images S of at least three portions V at the outer peripheral end of the support plate 41 (or the substrate 42). Then, an image S on each reflector 27 is captured by a camera 28 corresponding to each reflector 27 to obtain an image of each part V. Then, the controller 30 detects the position of each part V by performing image processing on each image. Further, the controller 30 compares the detected position of each part V with a predetermined reference position to determine the amount of deviation of the position of the outer peripheral end of the support plate 41 (or the substrate 42) from the reference position. Identify. Accordingly, the position detection unit can determine whether the position of the support plate 41 (or the substrate 42) is shifted from a predetermined reference position.

  Here, when the support plate 41 and the substrate 42 are circular, by detecting the positions of at least three portions V, the overlaying device 6 can suitably identify the positions of the support plate 41 and the substrate 42. At the same time, it is possible to suitably determine whether or not the positions of the support plate 41 and the substrate 42 deviate from a predetermined reference position.

  Preferably, one portion V includes a notch 41a (or notch 42a), and the controller 30 preferably detects the position of the notch 41a (or notch 42a). Thereby, the overlaying device 6 can also determine whether the directions of the support plate 41 and the substrate 42 are shifted.

  As described above, the overlaying device 6 can appropriately detect the position of the outer peripheral end of the support plate 41 or the substrate 42 in the overlaying chamber 6a by the position detection unit. The displacement can be detected. In particular, the superposing device 6 can detect the position of the outer peripheral end of the substrate 42 in a state where the substrate 42 and the support plate 41 are brought close to each other in the superimposition chamber 6a with the plane portions of the substrate 42 and the support plate 41 being parallel to each other. it can. Thereby, the superposing apparatus 6 can suitably detect the positional shift between the substrate 42 and the support plate 41 which are brought close to each other in the superposing chamber 6a with the plane portions thereof being parallel to each other.

  The reflection plate 27 may be, for example, an optical member such as a mirror or a prism, but is not particularly limited as long as it reflects the outer peripheral ends of the support plate 41 and the substrate 42. In another embodiment, instead of the reflection plate 27, an optical member that reflects the outer peripheral edge of the support plate 41 and the substrate 42 using an optical phenomenon such as refraction may be used. By using such an optical member as the internal detection unit, for example, even when the overlapping chamber 6a is in a vacuum or near vacuum state and it is difficult to provide an internal camera or the like, the inside of the overlapping chamber 6a is preferably used. The outer peripheral edge of the support plate 41 or the substrate 42 can be detected.

  As shown in FIG. 6, the reflection plate 27 may be provided at a position where each part V can be projected. In one embodiment, the reflection plate 27 may be attached to the drive unit 22, as shown in FIG. Since the reflection plate 27 is attached to the drive unit 22, each portion V of the aligned support plate 41 (or the substrate 42) can be appropriately projected. Further, a new member for fixing the reflection plate 27 can be omitted.

  The camera 28 may be any camera that can acquire an image by photographing an object. For example, a CCD camera or the like can be used, but the camera 28 is not limited to this. The light source 29 may be any as long as it can illuminate an object, and for example, an LED light source or the like can be used, but is not limited thereto. The controller 30 may control the camera 28 and the light source 29 and perform image processing, and may be realized by a logic circuit (hardware) formed in an integrated circuit (IC chip) or the like. Alternatively, it may be realized by software using a CPU (Central Processing Unit). The camera 28, the light source 29, and the controller 30 are fixed to the subframe 14, for example.

  Further, in a modification, the position detection unit may be configured to detect the positions of the outer peripheral ends of both the substrate 42 and the support plate 41 in the state of FIG. 5C. In this case, for example, in the state of FIG. 5C, (i) the light amount of the light source 29 is reduced to obtain an image as shown in FIG. 5B, and (ii) the light amount of the light source 29. 5D is acquired, and the controller 30 performs image processing on these images to determine the positions of the outer peripheral ends of both the substrate 42 and the support plate 41. It may be detected.

(Paste room 7)
The sticking chamber (sticking unit) 7 completes the stacked body 40 by sticking the support plate 41 and the substrate 42 (the stacked body 40) stacked by the stacking device 6. The sticking chamber 7 includes a second support pin 31 and press plates 32 and 33. Further, it is preferable that the application chamber 7 can be decompressed to a vacuum or a state close to the vacuum by a decompression pump (not shown).

  The second support pins 31 receive and support the support plate 41 and the substrate 42 superimposed in the superimposition chamber 6 from the internal transport unit 10. The second support pins 31 are configured, for example, to be arranged at equal intervals on a circle centered on the center point of the support plate 41 and the substrate 42, similarly to the first support pins 25.

  The press plates 32 and 33 provided in the sticking chamber 7 have built-in heaters (not shown). Thus, the support plate 41 and the substrate 42 can be pressed between the support plate 41 and the substrate 42 supported by the second support pins 31 while being pressed between the support plate 41 and the substrate 42 while being heated.

(Internal transport unit 10)
An internal transport unit that transfers the temporarily fixed support plate 41 and substrate 42 (laminated body 40) between the stacking chamber 6 and the sticking chamber 7 by being sandwiched between the first support pins 25 and the pressing pins 26. (10 in FIG. 7) is provided.

  The stacking chamber 6 and the sticking chamber 7 may have a structure provided with a wall that partitions the inside of one processing chamber into two processing chambers. In addition, the overlapping chamber 6 and the sticking chamber 7 may have a structure in which the overlapping chamber 6 and the sticking chamber 7 are in contact with each other without any gap on their respective side surfaces. A gate 8 for transferring the stacked body 40 between the overlapping chamber 6 and the attaching chamber 7 is provided at a boundary between the overlapping chamber 6 and the attaching chamber 7. The opening and closing of the gate 8 is controlled by a shutter. The stacking chamber 6 is provided with a transfer window 9 that can be opened and closed for transferring the support plate 41, the substrate 42, and the stacked body 40 between the attaching device 2 and the first external transport unit 4. . As described above, the decompression pump is provided in each of the overlapping chamber 6 and the sticking chamber 7, and the state of the internal pressure in each chamber can be controlled independently.

  Since the bonding chamber 7 is configured to be capable of reducing the pressure, the substrate 42 and the support plate 41 can be bonded to each other via the adhesive layer under a reduced pressure atmosphere. By pressing the substrate 42 onto the adhesive layer under a reduced pressure atmosphere, the adhesive layer can be inserted into the depression of the concave / convex pattern on the surface of the substrate 42 in a state where air is not present in the depression. Can be more reliably prevented from occurring.

  The gate 8 is configured to move the aligned laminated body 40 from the overlapping chamber 6 to the sticking chamber 7 with the shutter open, and to move the laminated body 40 after bonding from the sticking chamber 7. It is formed so that it can be moved to the overlapping chamber 6. By opening the shutter in a state where both the stacking chamber 6 and the sticking chamber 7 are decompressed, the laminated body 40 before bonding is moved from the stacking chamber 6 to the sticking chamber 7 under reduced pressure. I have.

  FIG. 7 is a configuration diagram of the internal configuration of the attaching device 2 including the internal transport unit 10 as viewed from above. There is no particular limitation on the specific mechanism of the internal transport section 10 as long as the internal transport section 10 can move the stacked body 40 between the overlapping chamber 6 and the sticking chamber 7. In the present embodiment, as shown in FIG. 7, the internal transfer section 10 includes an internal transfer arm 11 and an arm rotation shaft 12. The internal transport unit 10 is a mechanism that moves the laminate 40 by rotating the internal transport arm 11 that can support the laminate 40 from its lower surface around the arm rotation shaft 12. As will be described later in detail, in the present embodiment, two internal transport units 10 having a common rotation axis are provided. The arm rotation shaft 12 is provided on the overlapping chamber 6 side, but may be provided on the sticking chamber 7 side. From the viewpoint that the transfer stroke between the overlapping chamber 6 and the first external transfer section 4 can be shortened, the arm rotation shaft 12 is formed on the side close to the side surface where the transfer window 9 is formed. It is preferred that In FIG. 7, the two-dot chain line indicated by “B” indicates the standby position of the internal transfer arm 11, and the two-dot chain line indicated by “C” indicates the position of the internal transfer arm 11 in the sticking chamber 7 (sticking unit). (Delivery position).

  The rotation speed of the internal transfer arm 11 can be set to a speed according to the situation. Therefore, when the internal transfer arm 11 is holding the stacked body 40, the internal transfer arm 11 can be rotated at a low speed. When the internal transfer arm 11 is not holding the stacked body 40, the internal transfer arm 11 is rotated at a high speed. Can be done. Further, the acceleration / deceleration can be controlled so that the rising and stopping of the rotation of the internal transfer arm 11 become smooth.

  As shown in FIG. 7, the gate 8 has an opening having such a width that the rotating internal transfer arm 11 can pass the gate 8 and transport the stacked body 40 to the attaching portion transfer position C when the shutter is opened. Has become. Conventionally known means can be used to open and close the gate 8, and for example, a gate valve structure can be applied.

(Substrate 42)
The substrate 42 is subjected to processes such as thinning, transport, and mounting while being supported (attached) to the support plate 41. The substrate 42 is not limited to a wafer substrate, and may be any substrate such as a ceramic substrate, a thin film substrate, and a flexible substrate that need to be supported by the support plate 41.

  The shape of the substrate 42 may be, for example, a circle, but is not limited thereto. Further, the substrate 42 preferably has a notch 42a which is a cutout for specifying the orientation of the substrate 42.

(Support plate 41)
The support plate 41 is a support that supports the substrate 42, and is attached to the substrate 42 via an adhesive layer. Therefore, the support plate 41 only needs to have a strength necessary to prevent breakage or deformation of the substrate 42 during processes such as thinning, transporting, and mounting of the substrate 42, and it is desirable that the support plate 41 be lighter. From the above viewpoint, the support plate 41 is more preferably made of glass, silicon, acrylic resin, ceramic, or the like. The shape of the support plate 41 may be, for example, circular, but is not limited thereto.

  Further, the support plate 41 preferably has a notch 41a which is a cutout for specifying the direction of the support plate 41.

(Laminate 40)
The stacked body 40 is formed by stacking a substrate 42 and a support plate 41 supporting the substrate 42 via an adhesive layer stacked on at least one of the substrate 42 and the support plate 41. In this embodiment, the adhesive layer is formed on the substrate 42 side.

  The adhesive layer is a layer that bonds the substrate 42 and the support plate 41, and is formed by applying an adhesive to at least one of the substrate 42 and the support plate 41. The adhesive constituting the adhesive layer may include, for example, a thermoplastic resin whose thermal fluidity is improved by heating as an adhesive material. Examples of the thermoplastic resin include an acrylic resin, a styrene resin, a maleimide resin, a hydrocarbon resin, a thermoplastic elastomer, and a polysulfone resin.

  The method for forming the adhesive layer, that is, the method for applying the adhesive to the substrate 42 or the support plate 41, or the method for forming the adhesive tape by applying the adhesive to the base material is not particularly limited. However, examples of the method for applying the adhesive include a spin coating method, a dipping method, a roller blade method, a spray method, and a coating method using a slit nozzle method.

  The thickness of the adhesive layer may be appropriately set according to the type of the substrate 42 and the support plate 41 to be attached, the treatment performed on the substrate after the attachment, and the like, but within the range of 10 to 150 μm. Preferably, it is within a range of 15 to 100 μm.

  When the support plate 41 is separated from the substrate 42, a solvent may be supplied to the adhesive layer to dissolve the adhesive layer. Thereby, the substrate 42 and the support plate 41 can be separated. At this time, it is more preferable that the support plate 41 be formed with a through-hole penetrating in the thickness direction, because the solvent can be easily supplied to the adhesive layer through the through-hole.

  In addition, a layer other than the adhesive layer may be further formed between the substrate 42 and the support plate 41 as long as the attachment of the two is not prevented. For example, between the support plate 41 and the adhesive layer, a separation layer that changes in quality when irradiated with light may be formed. Since the separation layer is formed, the substrate 42 and the support plate 41 can be easily separated from each other by irradiating light after processes such as thinning, transporting, and mounting the substrate.

〔motion〕
FIG. 8 is a flowchart illustrating the flow of the attaching method by the attaching device 2. Note that S1 to S13 correspond to a superposition method using the superposition device 6. 9 to 18 are schematic diagrams showing the state of the attaching device 2 in each step of the attaching method by the attaching device 2. 9 to 18, some of the members included in the attaching device 2 are omitted for simplification.

(S1: The support plate 41 is carried into the overlapping room 6a)
The support plate 41 is carried in through the delivery window 9 of the overlapping chamber 6 using the first external transport unit 4. The loaded support plate 41 is placed on the first support pins 25 (see FIG. 9). Note that, at this stage, it is preferable that the spacer 23 be at the extraction position and the pressing pin 26 be at the standby position.

(S2: Align support plate 41)
Next, the alignment block 21 is moved in parallel to the XY plane by the drive unit 22, and the alignment block 21 is brought into contact with the support plate 41 supported on the first support pins 25. The position of the outer peripheral end aligns the support plate 41 based on the information from the pre-aligner 3 (see FIG. 10).

(S3: Support plate 41 is moved onto spacer 23)
Next, the first support pin 25 moves the support plate 41 to a position above the spacer 23 in the Z direction and not in contact with the pressing pin 26. Then, after moving the spacer 23 to the insertion position, the first support pin 25 moves below the spacer 23 in the Z direction. As a result, the support plate 41 that has been aligned is held by the spacers 23 without changing the horizontal position (holding step, see FIG. 11).

(S4: Detect the position of the outer peripheral end of the support plate 41)
Next, the position of the outer peripheral end of the support plate 41 held on the spacer 23 is detected by the position detection unit (the reflection plate 27, the camera 28, the light source 29, and the controller 30) (second position detection step, FIG. 5). (A)). As described above, the position detection unit reflects (i) the outer peripheral end of the support plate 41 held on the spacer 23 on the bottom surface 41b side on the reflection plate 27, and (ii) the support reflected on the reflection plate 27. An image of the outer peripheral end of the plate 41 on the side of the bottom surface 41b is taken by the camera 28, and (iii) the obtained image is analyzed by the controller 30, whereby the outer peripheral end of the support plate 41 held on the spacer 23 is obtained. Can be detected.

  At this time, it is preferable that the position detecting section detects the positions of at least two parts on the outer peripheral end of the support plate 41. Preferably, one of the two parts includes a notch 41a of the support plate 41.

(S5: It is determined whether the position of the outer peripheral end of the support plate 41 is shifted).
Next, the position detection unit determines whether the detected position of the outer peripheral end of the support plate 41 is deviated from a predetermined reference position. For example, the controller 30 specifies the amount of deviation of the detected outer peripheral end position of the support plate 41 from the reference position, and determines whether or not the amount of deviation exceeds a threshold value. It is determined whether or not the position of the outer peripheral end is shifted from the reference position.

  If the detected position of the outer peripheral end of the support plate 41 is shifted from the reference position, the process proceeds to S2, and if not, the process proceeds to S6.

(S6: The substrate 42 is carried into the overlapping room 6a)
Next, as in the case of the support plate 41, in this state, the substrate 42 is carried in through the delivery window 9 of the overlapping chamber 6 using the first external transport unit 4. The loaded support plate 41 is placed on the first support pins 25 (see FIG. 12).

(S7 or S9: Align substrate 42)
Next, the alignment block 21 is moved in parallel with the XY plane by the drive unit 22 and the alignment block 21 is brought into contact with the substrate 42 supported on the first support pins 25, whereby the outer peripheral edge of the substrate 42 is The position of the part aligns the substrate 42 based on the information from the pre-aligner 3 (see FIG. 13).

(S8: Decompression of the overlapping chamber 6a)
Then, after closing the delivery window 9, the decompression pump 20 starts depressurizing the overlapping chamber 6a. The decompression of the overlapping chamber 6a may be performed so that the depressurized state of the overlapping chamber 6 and the depressurized state of the sticking chamber 7 at the time when the temporary fixing is completed are substantially the same. Preferably, it is 10 Pa or less. Further, the heating of the stage unit 24 is started, and the adhesive layer formed on the upper surface of the substrate 42 is caused to flow.

(S10: Move the substrate 42 directly below the support plate 41)
Next, the first support pins 25 bring the upper surface portion 42b of the substrate 42 close to the bottom surface portion 41b of the support plate 41 held by the spacer 23 in S3 (supporting process, see FIG. 14). As a result, the substrate 42 and the support plate 41 are brought close to each other with the plane portions (42b, 41b) parallel to each other.

(S11: Detect the position of the outer peripheral edge of the substrate 42)
Next, the position of the outer peripheral end of the substrate 42 that is brought close to the support plate 41 with the plane portions parallel to each other is detected by the position detection unit (the reflection plate 27, the camera 28, the light source 29, and the controller 30) ( Position detection step, see FIG. 5 (c)). As described above, the position detection unit (i) reflects the outer peripheral end on the bottom surface 42b side of the substrate 42, which has been brought close to the support plate 41 with the plane portions parallel to each other, on the reflection plate 27, and (ii) The camera 28 captures an image of the outer peripheral edge of the substrate 42 on the bottom surface portion 42b side, which is reflected on the reflection plate 27, and (iii) the controller 30 performs image analysis on the obtained image. It is possible to detect the position of the outer peripheral end of the substrate 42 which is brought close to the substrate 42 by making the plane portions parallel to each other.

  At this time, it is preferable that the position detecting section detects the positions of at least two parts on the outer peripheral end of the substrate 42. Preferably, one of the two parts includes a notch 42a of the substrate 42.

(S12: It is determined whether the position of the outer peripheral end of the substrate 42 is shifted).
Next, the position detection unit determines whether or not the detected position of the outer peripheral end of the substrate 42 is shifted from a predetermined reference position. For example, the controller 30 specifies the amount of deviation of the detected outer edge of the substrate 42 from the reference position, and determines whether the amount of deviation exceeds a threshold value. It is determined whether or not the position of the unit is deviated from the reference position.

  If the detected position of the outer peripheral end of the substrate 42 is shifted from the reference position, the process proceeds to S9, and if not, the process proceeds to S13.

(S13: The substrate 42 and the support plate 41 are temporarily fixed)
Next, the support plate 41 supported by the spacer 23 is moved in the Z direction by the spring 26a by moving the spacer 23 to the removal position and moving the pressing pin 26 from the standby position to the pressing position by the support shaft 26b. Apply force so that it is biased downward. Accordingly, the support plate 41 and the substrate 42 are pressed by the force applied by the spring 26a of the pressing pin 26 so as to be sandwiched between the first support pin 25 and the pressing pin 26 (see FIG. 15). Thus, the support plate 41 and the substrate 42 are overlapped and temporarily fixed.

(S14: The laminate 40 is transported to the application chamber 7)
After the support plate 41 is overlaid on the substrate 42, the pressing pins 26 are returned to the standby position. Further, the first support pin 25 is moved downward in the Z direction. Thereby, the superposed support plate 41 and substrate 42 (laminated body 40) are transferred to the internal transport section 10 (see FIG. 16).

  Next, the shutter of the gate 8 is opened, and the superposed support plate 41 and the substrate 42 are transported from the overlay chamber 6 to the application chamber 7 by the internal transport unit 10. Here, the superposed support plate 41 and substrate 42 are supported by the second support pins 31 in the application chamber 7 (see FIG. 17).

(S15: Affixing the substrate 42 and the support plate 41)
Next, in a state where the press plate 33 is supported by the second support pins 31, the press plate 33 is moved down in the Z direction to make contact with the upper surface of the support plate 41. Subsequently, the second support pins 31 and the press plate 33 are lowered at the same speed. Thus, the support plate 41 and the substrate 42 are sandwiched between the press plates 32 and 33, and are heated while being pressed (see FIG. 18). As a result, the support plate 41 and the substrate 42 are attached to each other, and the laminate 40 can be completed.

  The present invention is not limited to the embodiments described above, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  INDUSTRIAL APPLICABILITY The present invention can improve the accuracy of bonding a substrate and a support in a vacuum, and thus can be widely used in the field of manufacturing industrial products.

REFERENCE SIGNS LIST 1 pasting system 2 pasting device 3 holding room 4 first external transport section 5 first external transport section traveling path 6 superposition device 6a superposition chamber 7 pasting chamber (pasting section)
Reference Signs List 8 Gate 9 Delivery window 10 Internal transfer section 11 Internal transfer arm 12 Arm rotation axis 13 Window 14 Subframe 17a, 17b Imaging section 18a, 18b Area 19 Position specifying section 20 Decompression pump (decompression section)
21 Alignment block (position adjustment unit)
21a Spring 21b Cushion 22 Drive unit (position adjustment unit)
23 Spacer (holding part)
24 Stage part 25 First support pin (support part)
26 Pressing pin 26a Spring 26b Support shaft 27 Reflector (mirror, internal detector, position detector)
28 Camera (Shooting unit, external detection unit, position detection unit)
29 Light source (external detector, position detector)
30 controller (image processing unit, external detection unit, position detection unit)
31 second support pin 32 press plate 33 press plate 40 laminate 41 support plate (support)
41a Notch (Notch)
41b Bottom part (flat part)
42 substrate 42a notch (notch)
42b Upper surface part (flat part)
42c Bottom part S image V part

Claims (17)

A superposition apparatus for superposing a substrate and a support that supports the substrate,
An overlapping chamber for overlapping the substrate and the support,
In the overlapping chamber, a position detecting unit that detects the position of the outer peripheral end of at least one of the substrate and the support body, the plane parts of which are brought close to each other in parallel,
The position detection unit is:
In the overlapping room, an internal detection unit that reflects the outer peripheral end,
An external detection unit that detects the outer peripheral edge reflected by the internal detection unit from outside the overlapping chamber ,
The shape of the substrate and the support in a top view is a circle,
The overlay apparatus according to claim 1, wherein the position detection unit detects positions of at least three parts on the outer peripheral end, and specifies a shift amount of the positions of the at least three parts from a reference position . At least one outer peripheral end of the substrate and the support is provided with a notch for specifying the orientation of the substrate or the support,
It said one of at least three sites, device overlay according to claim 1, characterized in that it comprises the notch. A holding portion that holds one of the substrate and the support, and a support portion that supports the other of the substrate and the support, are provided in the overlapping chamber,
The support portion is adapted to bring the top surface of the substrate or the support supported by the support close to the bottom surface of the substrate or the support held by the holding portion,
3. The apparatus according to claim 1, wherein the internal detection unit reflects an outer peripheral end of the substrate or the support supported by the support unit on a bottom surface side. 4. A superposition apparatus for superposing a substrate and a support that supports the substrate,
An overlapping chamber for overlapping the substrate and the support,
In the overlapping chamber, a position detecting unit that detects the position of the outer peripheral end of at least one of the substrate and the support body, the plane parts of which are brought close to each other in parallel,
The position detection unit is:
In the overlapping room, an internal detection unit that reflects the outer peripheral end,
An external detection unit that detects the outer peripheral edge reflected by the internal detection unit from outside the overlapping chamber,
A holding portion that holds one of the substrate and the support, and a support portion that supports the other of the substrate and the support, are provided in the overlapping chamber,
The support portion is adapted to bring the top surface of the substrate or the support supported by the support close to the bottom surface of the substrate or the support held by the holding portion,
The internal detection unit reflects an outer peripheral end of the substrate or the support that is supported by the support unit on the bottom surface side,
The position detection unit further detects a position of an outer peripheral end of the substrate or the support held by the holding unit before the support approaches the substrate and the support. And
The internal detection unit is characterized in that, before the support unit brings the substrate and the support close to each other, an outer peripheral edge of the bottom surface side of the substrate or the support held by the holding unit is reflected. heavy I combined apparatus you. When the position of the outer peripheral end of the substrate or the support detected by the position detection unit is shifted from a reference position, a position adjustment unit that adjusts the position of the shifted substrate or the support is provided. The overlapping device according to any one of claims 1 to 4 , wherein the overlapping device is provided. A superposition apparatus for superposing a substrate and a support that supports the substrate,
An overlapping chamber for overlapping the substrate and the support,
In the overlapping chamber, a position detecting unit that detects the position of the outer peripheral end of at least one of the substrate and the support body, the plane parts of which are brought close to each other in parallel,
The position detection unit is:
In the overlapping room, an internal detection unit that reflects the outer peripheral end,
An external detection unit that detects the outer peripheral edge reflected by the internal detection unit from outside the overlapping chamber,
When the position of the outer peripheral end of the substrate or the support detected by the position detection unit is shifted from a reference position, a position adjustment unit that adjusts the position of the shifted substrate or the support is provided. Yes,
To the position adjustment unit, overlaid one you wherein said inner detecting portion is attached device. It further includes a decompression unit that makes the superimposition chamber a decompression environment,
The internal detection unit has a mirror unit,
The overlay apparatus according to any one of claims 1 to 6, wherein the mirror unit reflects the outer peripheral end portion under the reduced pressure environment. The external detection unit,
A photographing unit for photographing an image of the outer peripheral end portion reflected by the internal detection unit,
The superposition apparatus according to any one of claims 1 to 7 , further comprising: an image processing unit configured to specify a position of the outer peripheral end from the image. A superposition apparatus for superposing a substrate and a support that supports the substrate,
An overlapping chamber for overlapping the substrate and the support,
In the overlapping chamber, a position detecting unit that detects the position of the outer peripheral end of at least one of the substrate and the support body, the plane parts of which are brought close to each other in parallel,
The position detection unit is:
In the overlapping room, an internal detection unit that reflects the outer peripheral end,
From the outside of the superposition chamber, a superposition device including an external detection unit that detects the outer peripheral edge reflected by the internal detection unit ,
A sticking device, comprising: a sticking part for sticking the substrate and the support that are stacked by the stacking device outside the stacking chamber. A method of superimposing a substrate and a support that supports the substrate,
A position detecting step of detecting a position of an outer peripheral end of at least one of the substrate and the support in which a plane portion of the substrate and the support are brought close to each other in a superimposition chamber in which the substrate and the support are superimposed. And
In the position detecting step, in the indoor superimposed above, reflects the outer peripheral edge portion, from the outside of the superimposed chambers, the outer peripheral end portion which reflects and examined knowledge,
The shape of the substrate and the support in a top view is a circle,
In the position detecting step, the method overlay and detecting the position of at least three sites in the peripheral edge, characterized that you identify the amount of deviation from the at least positions of the three sites, the reference position. At least one outer peripheral end of the substrate and the support is provided with a notch for specifying the orientation of the substrate or the support,
The method according to claim 10 , wherein in the position detecting step, the position of the notch is detected as the position of one of the at least three parts. Before the position detection step, a holding step of holding one of the substrate and the support in the overlapping chamber, and after the holding step, before the position detection step, of the substrate and the support Supporting the other of the above, the upper surface of the substrate or the support that is supported, the supporting step of bringing the substrate or the support held in the holding step close to the bottom part,
12. The superposition method according to claim 10 , wherein in the position detecting step, an outer peripheral end of the substrate or the support supported on the supporting step in the bottom side is projected. A method of superimposing a substrate and a support that supports the substrate,
A position detecting step of detecting a position of an outer peripheral end of at least one of the substrate and the support in which a plane portion of the substrate and the support are brought close to each other in a superimposition chamber in which the substrate and the support are superimposed. And
In the position detection step, in the overlapping room, the outer peripheral edge is projected, and from the outside of the overlapping chamber, the projected outer peripheral edge is detected.
Before the position detection step, a holding step of holding one of the substrate and the support in the overlapping chamber, and after the holding step, before the position detection step, of the substrate and the support Supporting the other of the above, the upper surface of the substrate or the support that is supported, the supporting step of approaching the bottom part of the substrate or the support that is held in the holding step,
In the position detection step, the outer peripheral edge of the bottom surface side of the substrate or the supporter supported in the support step is projected,
Before the supporting step, it includes a second position detecting step of detecting the position of the outer peripheral end of the substrate or the support held in the holding step,
Above the second position detecting step, combined I heavy characterized in that mirrors the outer peripheral edge portion of the bottom surface side of the substrate or the support held in the holding step device. When the position of the outer peripheral end of the substrate or the support detected in the second position detection step is shifted from a reference position, adjust the position of the shifted substrate or the support, and again, 14. The method according to claim 13 , wherein a second position detecting step is performed. In the depressurized environment in the overlapping room, perform the position detection step,
The superposition method according to any one of claims 10 to 14, wherein, in the position detection step, the outer peripheral end is reflected on a mirror in the superposition chamber. If the position of the outer peripheral edge of the substrate or the support detected in the position detection step is shifted from a reference position, adjust the position of the shifted substrate or the support and re-detect the position. The method according to any one of claims 10 to 15 , wherein a step is performed. A method of superimposing a substrate and a support that supports the substrate,
A position detecting step of detecting a position of an outer peripheral end of at least one of the substrate and the support in which a plane portion of the substrate and the support are brought close to each other in a superimposition chamber in which the substrate and the support are superimposed. And
In the position detecting step, the outer peripheral edge is projected in the overlapping chamber, and the substrate and the support are overlapped by an overlapping method of detecting the projected outer peripheral edge from outside the overlapping chamber . After that, the superimposed substrate and the support are laminated outside the lamination chamber.

Images