TWI726111B - An overlapping apparatus, a bonding apparatus, an overlapping method and a bonding method - Google Patents

Abstract

Provided is a superimposing device, an attaching device, a superimposing method, and an adhering method, which can appropriately detect the positional deviation between the substrate and the support that make the planar portions parallel and close to each other in the superimposing chamber where the substrate and the support are overlapped .

The position detection unit (27~) that detects the position of the outer peripheral end of at least one of the substrate (42) and the support (41) in the overlap chamber (6a) so that the flat surfaces (41b, 42b) are parallel and close to each other. 29), provided with: inside the overlap chamber (6a), an internal detection unit (27) that reflects the outer peripheral end, and a detection unit (27) that detects the outer peripheral end reflected by the internal detection unit (27) from outside the overlap chamber (6a) External detection unit (28, 29).

Description

Overlapping device, attaching device, overlapping method and attaching method

The invention relates to a superposition device, an attachment device, a superposition method and an attachment method.

As mobile phones, digital AV equipment, and IC cards have become more functional, the semiconductor silicon chips (hereinafter, chips) mounted on them have been miniaturized and thinner, and the demand for higher integration of the chips in the package has increased. In order to achieve high integration of the chip in the package, the thickness of the chip needs to be as thin as 25 to 150 μm.

However, a semiconductor wafer (hereinafter, wafer) used as a wafer base is thinned by grinding, its strength becomes weak, and cracks or bends are likely to occur in the wafer. In addition, since it is difficult to automatically transport wafers whose strength is weakened due to thinning, manual transport is required, and the processing method is complicated.

Therefore, by attaching a flat plate made of glass or hard plastic called a support plate to the polished wafer, the strength of the wafer is maintained. A wafer support system was developed to prevent the occurrence of cracks and warpage of the wafer. Because the wafer support system can maintain the strength of the wafer, it is possible to automate the transfer of thinned semiconductor wafers.

The wafer and the support plate are bonded together using adhesive tape, thermoplastic resin, and the like. After thinning the wafer to which the support plate is attached, the support plate is peeled from the substrate before the wafer is diced.

Here, a technology capable of improving the bonding accuracy in bonding the support and the substrate is required. As this kind of technology, Patent Document 1 discloses that after stacking a plurality of wafers while being held in a wafer holder, when the stacked wafers are transported to the bonding part, the judgment is based on the acceleration or position of the wafer holder. The position of the wafer is shifted, and when there is a shift, the bonding is not performed.

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2014-57070 A (published on March 27, 2014)

However, the technique described in Patent Document 1 deals with the positional shift after overlapping a plurality of wafers.

On the other hand, the positional deviation between the substrate and the support may occur before the overlap. In other words, making the substrate and the support In the superimposed superimposing chamber, the mutual flat surfaces of the substrate and the support are approached in parallel for superimposing, but the position shift may occur at or before this point in time.

In order to cope with such positional deviation, the inventors examined a method of detecting the positional deviation between the substrate and the support that are parallel and close to each other in the overlap chamber. However, in the superposition chamber, it is difficult to detect from the outside the positional deviation of the substrate and the support that are parallel and close to each other with their flat surfaces. In addition, in the overlap room, for example, it may become a vacuum environment, and it is also difficult to detect the position shift by introducing an internal camera or the like.

In view of the foregoing problems, the main purpose of the present invention is to provide a superimposing device, an attaching device, a superimposing method, and an attachment method, which can appropriately detect in the superimposed chamber where the substrate and the support are overlapped, so that the mutual planes are parallel and The position between the approaching substrate and the support is shifted.

In order to solve the above-mentioned problems, the superposition device of the present invention is a superposition device that superimposes a substrate and a support that supports the substrate, and includes a superposition chamber that superimposes the substrate and the support; A position detection unit for the position of the outer peripheral end of at least one of the substrate and the support whose planar portions are parallel and close to each other; wherein the position detection unit includes: In the overlap chamber, the internal detection part of the outer peripheral end is reflected; from the outside of the overlap chamber, the external detection part of the outer peripheral end reflected by the internal detection part is detected.

In addition, the superposition method of the present invention is a method of superimposing a substrate and a support that supports the substrate, including detecting that the flat surfaces of the substrate and the support are parallel and close to each other in the superposition chamber in which the substrate and the support are superimposed. A position detection process for the position of the outer peripheral end of at least one of the substrate and the support; wherein, in the position detection process, the outer peripheral end is reflected in the overlap chamber, and the reflection is detected from outside the overlap chamber Out of the above-mentioned outer peripheral end.

According to the present invention, it is possible to provide a superimposing device, an attaching device, a superimposing method, and an attachment method, which can appropriately detect the substrate and the support that are parallel and close to each other in the superimposing chamber where the substrate and the support are overlapped. Position offset between bodies.

1‧‧‧Attaching system

2‧‧‧Attaching device

3‧‧‧Holding room

4‧‧‧The first external transport department

5‧‧‧The first external transport department walks

6‧‧‧Coincidence device

6a‧‧‧Coincidence Room

7‧‧‧Attaching Room (Attaching Department)

8‧‧‧Gate

9‧‧‧Receiving Window

10‧‧‧Internal Transport Department

11‧‧‧Internal transfer arm

12‧‧‧Arm rotation axis

13‧‧‧Window

14‧‧‧Sub-frame

17a, 17b‧‧‧Camera Department

18a, 18b‧‧‧ area

19‧‧‧Location Designation Department

20‧‧‧Reducing pump (reducing part)

21‧‧‧Alignment block (position adjustment part)

21a‧‧‧Spring

21b‧‧‧Buffer

22‧‧‧Drive unit (position adjustment part)

23‧‧‧Interstitial objects (holding part)

24‧‧‧Stage Department

25‧‧‧First Support Pin (Support Department)

26‧‧‧Press the latch

26a‧‧‧Spring

26b‧‧‧Support axis

27‧‧‧Reflective plate (mirror part, internal detection part, position detection part)

28‧‧‧Camera (Photography Department, External Detection Department, Position Detection Department)

29‧‧‧Light source (external detection unit, position detection unit)

30‧‧‧Controller (image processing unit, external detection unit, position detection unit)

31‧‧‧Second Support Pin

32‧‧‧Pressure Plate

33‧‧‧Pressure Plate

40‧‧‧Laminated body

41‧‧‧Support board (support)

41a‧‧‧Gap (Gap)

41b‧‧‧Bottom face (flat part)

42‧‧‧Substrate

42a‧‧‧Gap (Gap)

42b‧‧‧Upper face (flat part)

42c‧‧‧Bottom face

S‧‧‧like

V‧‧‧Location

[Fig. 1] A schematic diagram showing the schematic configuration of an application system according to an embodiment of the present invention.

[FIG. 2] Shows the outline of the sticking device related to an embodiment of the present invention Slightly constituted schematic diagram.

[Fig. 3] A diagram showing a schematic configuration of a position adjustment unit according to an embodiment of the present invention, (a) is a plan view, and (b) is a side cross-sectional view.

[Fig. 4] A schematic diagram showing a schematic configuration of a holding portion according to an embodiment of the present invention.

[Fig. 5] is a schematic diagram for explaining the operation of the position detection unit in an embodiment of the present invention, (a) shows the state of the superimposing device when detecting the position of the outer peripheral end of the support, and (b) shows the state in (a) An example of the image taken by the imaging section in the state of ), (c) shows the state of the superimposing device when detecting the position of the outer peripheral end of the substrate, and (d) shows one of the images taken by the imaging section in the state of (c) example.

Fig. 6 is a schematic diagram for explaining the operation of the position detection unit according to an embodiment of the present invention.

[Fig. 7] A schematic diagram for explaining the outline operation of the internal conveyance unit according to an embodiment of the present invention.

[Fig. 8] is a flowchart illustrating the flow of the attaching method according to an embodiment of the present invention.

Fig. 9 is a schematic diagram showing the state of the sticking device in one process of the sticking method according to one embodiment of the present invention.

Fig. 10 is a schematic diagram showing the state of the sticking device in one process of the sticking method according to one embodiment of the present invention.

Fig. 11 is a schematic diagram showing the state of the sticking device in one process of the sticking method according to one embodiment of the present invention.

[FIG. 12] shows an example of an attachment method related to an embodiment of the present invention A schematic diagram of the state of the attaching device in each project.

Fig. 13 is a schematic diagram showing the state of the sticking device in one process of the sticking method according to one embodiment of the present invention.

Fig. 14 is a schematic diagram showing the state of the sticking device in one process of the sticking method according to one embodiment of the present invention.

Fig. 15 is a schematic diagram showing the state of the sticking device in one process of the sticking method according to one embodiment of the present invention.

Fig. 16 is a schematic diagram showing the state of the sticking device in one process of the sticking method according to one embodiment of the present invention.

Fig. 17 is a schematic diagram showing the state of the sticking device in one process of the sticking method according to one embodiment of the present invention.

Fig. 18 is a schematic diagram showing the state of the sticking device in one process of the sticking method according to one embodiment of the present invention.

The invention provides a superposition device, an attachment device, a superposition method and an attachment method

[Coincidence device]

A superimposing device according to an embodiment of the present invention is a superimposing device that superimposes a substrate and a support that supports the substrate, and includes a superimposition chamber that superimposes the substrate and the support; A position detecting section for the position of the outer peripheral end of at least one of the substrate and the support that are parallel and close to each other; wherein the position detecting The unit includes: an internal detection unit that reflects the outer peripheral end in the superimposition chamber; and an external detection unit that detects the outer peripheral end reflected by the internal detection unit from the outside of the superimposition chamber.

According to the above configuration, (i) the outer peripheral end of at least one of the substrate and the support that is approaching in the overlap chamber is reflected by the internal detection unit, and (ii) from the outside of the overlap chamber, the detection reflected by the internal detection unit This outer peripheral end can appropriately detect the position of the outer peripheral end of at least one of the substrate and the support that are approaching in the superimposing chamber.

With this, it is difficult to directly detect the position of the substrate or support in the superimposing chamber even from the outside of the superimposing chamber, or (ii) it is difficult to arrange a detection unit that directly detects the outer peripheral end of the substrate or the support in the superimposing chamber In the case of this, it is possible to appropriately detect the positional deviation between the substrate and the support that are parallel and close to each other in the overlap chamber.

In the present specification, "to align the substrate and the support" means that the substrate and the support are laminated to form a laminate. In this laminate, the mutual plane portions of the substrate and the support are parallel. In addition. In this laminate, other layers may exist between the substrate and the support. Regarding the overlapping device of the present invention, the substrate and the support are stacked to overlap the substrate and the support in order to make the planar portions of the substrate and the support parallel and close to each other.

In this specification, the "outer peripheral end" refers to the end of the substrate or the support located on the outer peripheral part of the flat portion of the substrate or the support. In addition, "reflecting the outer peripheral end portion" means that the image of the outer peripheral end portion of the substrate or the support is presented at a position different from the substrate or the support. The internal detection part that reflects the outer peripheral end, for example, may include reflection, refraction, etc. Optical components such as mirrors and prisms of optical phenomena. In addition, "detecting the outer peripheral end reflected by the internal detection unit" refers to detecting the image of the outer peripheral end reflected by the internal detection unit. In addition, "detection" refers to detecting the position of the outer peripheral end at least to a certain degree of possibility. For example, it may be an image of the outer peripheral end, but it is not limited to this. In addition, the external detection unit that detects the outer peripheral end portion reflected by the internal detection unit may be, for example, a photographing device such as a camera.

[Attaching device]

A sticking device according to an embodiment of the present invention includes: a superimposing device according to an embodiment of the present invention; and a sticking device that is located outside the superimposing chamber of the superimposing device, and sticks a substrate and a support on which the superimposing device is superimposed. unit.

According to the above-mentioned structure, the substrate and the support body superimposed by the superimposing device are bonded together by the bonding part, and a desired laminate can be obtained. In particular, because the sticking part sticks the substrate and the support outside the stacking chamber, the overlapping environment and the sticking environment can be adapted to each purpose, and the desired laminate can be appropriately obtained.

[Coincidence method]

The superposition method according to one embodiment of the present invention is a superposition method of superimposing a substrate and a support that supports the substrate, and includes detecting that in the superposition chamber in which the substrate and the support are superimposed, the mutual flat surfaces are parallel and close to each other. The outer peripheral end of at least one of the above-mentioned substrate and the above-mentioned support Position detection process; wherein, in the position detection process, the outer peripheral end portion is reflected in the overlapping chamber, and the reflected outer peripheral end portion is detected from the outside of the overlapping chamber.

According to the above configuration, (i) the outer peripheral end of at least one of the substrate and the support that is approaching in the overlap chamber is reflected by the internal detection unit, and (ii) from the outside of the overlap chamber, the detection reflected by the internal detection unit This outer peripheral end can appropriately detect the position of the outer peripheral end of at least one of the substrate and the support that are approaching in the superimposing chamber.

This makes it difficult to directly detect the position of the substrate or the support in the superimposing chamber even in (i) it is difficult to arrange the detection unit that directly detects the outer peripheral end of the substrate or the support in the superimposing chamber, or (ii) from the outside of the superimposing chamber. In the case of the superposition chamber, it is possible to appropriately detect the positional deviation between the substrate and the support that make the flat surfaces parallel and close to each other.

[Attaching method]

Regarding the attaching method of one embodiment of the present invention, after the substrate and the support are combined by the superimposing method of one embodiment of the present invention, the superimposed substrate and the support are superimposed on the outside of the superimposing chamber in which the substrate and the support are superimposed. Support body fit.

According to the above method, the desired laminate can be obtained by bonding the substrate and the support stacked by the stacking method. In particular, since the substrate and the support are bonded outside the superimposing chamber, the superimposed environment and the bonding environment can be adapted to each purpose, and the desired laminate can be appropriately obtained.

[Embodiment 1]

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In addition, in the following, a configuration in which the overlapping device of one embodiment of the present invention is incorporated into the sticking device and the sticking device is incorporated into the sticking system will be described, but the present invention is not limited to this.

(Attach system 1)

FIG. 1 is a schematic diagram showing the schematic configuration of the sticking system 1. As shown in Fig. 1, the sticking system 1 includes: sticking device 2, pre-aligner 3, first external transport unit 4 and first external transport unit 5, FOUP opener 50, rotator 52, baking The flat plate 51, the second external transport unit 54, the second external transport unit walk 55, and the passing line 53. The attaching device 2 includes a superimposing device 6 and an attaching chamber 7.

The support plate (support) 41 is first conveyed to the pre-aligner 3 by the first outer conveying part 4 moved by walking on the first outer conveying part 5, and after being aligned, it is conveyed into the superposition through the receiving window 9装置6内。 In the device 6. The substrate 42 is first conveyed to the rotator 52 by the second outer conveying unit 54 that moves along the second outer conveying unit 55, then conveyed to the baking plate 51, and finally conveyed to the passing line 53. The spinner 52 applies an adhesive to the substrate 42 to be processed to form an adhesive layer. The flat plate 51 is baked to harden the adhesive layer formed on the substrate 42. Next, the substrate 42 is moved to the first external conveyance section 4 through the line 53, is first conveyed to the pre-aligner 3, and after the alignment, is conveyed into the superimposing device 6 through the receiving window 9.

In this embodiment, in the superposition device 6, the support plate 41 is first carried in, and then the substrate 42 is carried in. However, the order can also be reversed. After carrying in both the substrate 42 and the support plate 41, the superimposing device 6 superimposes the carried support plate 41 and the substrate 42. The attaching device 2 moves the substrate 42 and the supporting plate 41 (laminated body 40) overlapped by the overlapping device 6 to the attaching chamber 7 through the gate 9 where the substrate 42 and the supporting plate 41 are attached.

(Attaching device 2)

FIG. 2 is a schematic diagram showing the schematic configuration of the sticking device 2. As shown in Fig. 2, the sticking device 2 includes a superimposing device 6 and an sticking chamber 7, and the superimposing device 6 includes a superimposing chamber 6a.

Between the overlapping chamber 6a and the attaching chamber 7 in the attaching device 2, a gate 8 capable of opening and closing is provided. In addition, the sticking device 2 is provided with an internal conveying part 10 that conveys an object through a gate 8 between the overlapping chamber 6 a and the sticking chamber 7.

(Coincidence device 6)

The superposition device 6 is provided in the superposition chamber 6a with: a pressure reducing pump (decompression part) 20, an alignment block (position adjustment part) 21, a drive unit (position adjustment part) 22, a spacer (holding part) 23, and a stage The part 24, the first support pin (support part) 25, the temporary fixing part 26, and the reflecting plate (mirror part, internal detection part, position detection part) 27, and outside the overlap chamber 6a are equipped with: a sub-frame 14, a camera (photograph Section, external detection section, position detection section) 28, light source (external detection section, position detection section) 29, and controller (image processing section, external detection section, position detection section) 30. In addition, the overlap room 6a is provided for the camera 28 to take pictures. Window 13 in room 6a.

(Reducing pump 20)

The decompression pump 20 is a device that decompresses the pressure in the superimposing chamber 6a, and is preferably a device that decompresses the pressure in the superimposing chamber 6a to a vacuum or a state close to a vacuum. By reducing the pressure in the overlapping chamber 6a, the transfer of the laminated body 40 between the application chambers 7 can be appropriately performed. In addition, at the time of temporary fixing, air bubbles entering between the substrate 42 and the support plate 41 can be suppressed.

(Align block 21, drive unit 22)

FIG. 3 is a schematic diagram showing a schematic configuration of the alignment block 21 and the driving unit 22, (a) is a plan view, and (b) is a side cross-sectional view. The substrate 42 and the supporting plate 41 carried into the superimposing chamber 6 a are first placed on the first supporting pin 25. The alignment block 21 is placed on the first support pin 25 by the drive unit 22 in a state in which the substrate 42 or the support plate 41 to be the object of alignment is in a direction parallel to the XY plane, that is, the horizontal direction It is driven to abut on the substrate 42 or the support plate, and align the substrate 42 and the support plate 41 (adjust the positions of the substrate 42 and the support plate 41).

As shown in Fig. 3(a), in the superimposing device 6, the alignment blocks 21 are provided at five positions and abut the substrate 42 or the support plate 41 from five directions. In detail, in the superimposing device 6, there are two sets of alignment blocks 21 arranged on the substrate 42 or the supporting plate 41 at positions facing each other, and one alignment block 21 for determining the position of the notch is provided. , The straight line connecting one set of alignment blocks 21 and the straight line connecting another set of alignment blocks 21 are perpendicular to each other. But yes The number and arrangement of the quasi-blocks 21 are not limited if the positions of the substrate 42 and the support plate 41 can be adjusted.

As shown in FIG. 3(b), at the position abutting the substrate 42 or the support plate 41 in the alignment block 21, there is provided a buffer portion (for example, a rubber plate, Teflon coating, etc.) 21b. In addition, the alignment block 21 may be connected to the driving unit 22 through a spring 21a.

In addition, the alignment block 21 is driven by the driving unit 22. The driving unit 22 aligns the substrate 42 and the support plate 41 by driving the alignment block 21 in the horizontal direction according to the information from the pre-aligner 3.

(Spacer 23)

The spacer 23 is a member that first holds the aligned support plate 41 (the substrate 42 when the substrate 42 is aligned first) so as not to change its horizontal position until the overlap is performed. FIG. 4 is a view of the spacer 23 viewed from the upper surface side. The spacer 23 stably holds the support plate 41 by supporting a part of the peripheral edge of the support plate 41 from the lower side. The spacer 23 can move in the XY direction, that is, in the horizontal direction. When the support plate 41 is mounted on the stage portion 24 and transported to the upper part of the spacer 23, the spacer 23 is first moved to a position where it does not overlap the support plate 41 at all. In this specification, in this state, it is said that the spacer 23 is located at the "withdrawal position". After the support plate 41 is transported above the spacer 23, the spacer 23 is returned to a position overlapping the support plate 41 so that the support plate 41 can be supported by the spacer 23. In this specification, in this state, it is said that the spacer 23 is located at the "insertion position". FIG. 4 shows a state where the spacer 23 is in the "insertion position". _{When the spacer 23 is at the insertion position, the width d 3} of the spacer 23 that each member supporting the support plate 41 overlaps the support plate 41 may be about 1 to 5 mm from the periphery of the support plate 41 to the inner side without limitation. Preferably it is 5 mm. In addition, the size of the spacer 23, for example, the lateral width d ₄ may be 5 mm, but it is not limited thereto.

The material of the spacer 23 is not particularly limited. For example, stainless steel (SUS) is chamfered and polytetrafluoroethylene or the like is used as a resin coating.

(Carrier 24)

In the stage portion 24, a heater (not shown in the figure) is built-in to enable the adhesive layer coated on the substrate 42 supported by the first support pins 25 to flow heat. The temperature of the stage portion 24 is preferably heated to a temperature above room temperature due to the low-temperature adhesiveness (adhesiveness) of the thermoplastic resin, which is the adhesive material of the adhesive layer, preferably, and more preferably heated to a glass transition. The temperature above the point (Tg). By heating the adhesive layer to a temperature above the glass transition point of the thermoplastic resin, the thermal fluidity of the adhesive layer is improved and becomes easy to deform. Although it will also depend on the bonding layer, that is, it will depend on the material of the bonding material, that is, the thermoplastic resin, but the temperature of the stage part 24 is preferably 23~220℃, and the heating time, that is, the pressing time is 3~300 The second is better, more preferably 5 to 180 seconds.

(First support pin 25)

The first support pins 25 are provided so as to protrude from the stage portion 24, and respectively support the support plate 41 and the substrate 42 from the bottom surface. Then, with the first support pin 25 supporting the support plate 41 or the base plate 42, by adjusting the first support The protruding amount of the pin 25 can move the support plate 41 or the substrate 42 to a predetermined position (for example, the position aligned by the alignment block 21, the position on the spacer 23, or close to the support plate 41 or the substrate 42). s position). Although the material of the first support pin 25 is not particularly limited, it may be made of aluminum or the like with high thermal conductivity, but it is not limited to this, and stainless steel or the like may be used.

(Press latch 26)

The pressing pins 26 are those that press the stacked substrate 42 and the support plate 41 (laminated body 40) downward in the Z direction. The front ends of the pressing pins 26 are arranged to face the front ends of the first support pins 25, respectively. In this case, by arranging the first support pin 25 and the pressing pin 26, the area of the support plate 41 after the position adjustment and a part of the area of the substrate 42 after the position adjustment are overlapped, and it can be pressed by clamping. Therefore, it is possible to apply an even pressing force with the center points of the position-adjusted support plate 41 and the base plate 42 as the center. Therefore, the positional deviation of the support plate 41 and the substrate 42 can be prevented, and the head and tail can be temporarily fixed well.

In addition, when the pressing pin 26 abuts against the upper surface of the support plate 41 (or the base plate 42), it is urged downward in the Z direction by the spring (elastic member) 26a. In addition, the plurality of pressing pins 26 can simultaneously move up and down in the Z direction by supporting the shaft 26b. Among them, the pressing pin 26 does not move downward. Therefore, in this specification, when the pressing pin 26 is in a position not in contact with the support plate 41 held by the spacer 23, it is referred to as the pressing pin 26 being in the "standby position". In contrast, the pressing pin 26 moves downward. Therefore, in this specification, the pressing pin 26 is positioned on the support plate 41 held by the spacer 23. When the position can be urged by the spring 26a, it is said that the pressing pin 26 is at the "pressing position".

(Reflector 27, camera 28, light source 29, and controller 30)

The reflecting plate 27, the camera 28, the light source 29, and the controller 30 constitute a position detection unit that detects the positions of the outer peripheral ends of the substrate 42 and the support plate 41 in the superimposing device 6.

FIG. 5(a) is a schematic diagram showing the state of the superimposing device 6 when the position detection unit detects the position of the outer peripheral end of the support plate 41. FIG. The position detection unit detects the position of the outer peripheral end of the support plate 41 in the state where the support plate 41 is held by the spacer 23 in the overlap chamber 6a. First, the light source 29 irradiates the support plate 41 held by the spacer 23 to reflect the outer peripheral end of the support plate 41 on the bottom surface 41 b side to the reflection plate 27. Next, the camera 28 passes through the window 13 to capture images of the outer peripheral end of the support plate 41 of the reflecting plate 27, and obtain the image shown in FIG. 5(b). Then, the controller 30 performs image processing (for example, a conventional edge detection process) on the obtained image, so that the position of the outer peripheral end of the support plate 41 can be detected. In addition, as shown in the example shown in FIG. 5(b), the detected outer peripheral end may be a part V including a notch (notch) 41a for specifying the direction of the support plate 41.

FIG. 5(c) is a schematic diagram showing the state of the superimposing device 6 when the position of the outer peripheral end portion of the substrate 42 is detected. The position detection unit detects the outer periphery of the substrate 42 in the overlap chamber 6a in a state where the substrate 42 and the support plate 41 are parallel and close to each other's flat surfaces (the upper surface 42b of the substrate 42 and the bottom surface 41b of the support plate 41). The position of the end. In addition, the support plate 41 is The board 42 supports it, and although it is the same as the board 42, it becomes larger than the board 42.

First, the light source 29 irradiates the substrate 42 and the support plate 41 so that their flat surfaces are parallel and close to each other, and the outer peripheral end of the substrate 42 on the bottom surface 42c side is reflected on the reflector 27. Next, the camera 28 passes through the window 13 and photographs the outer peripheral end of the substrate 42 reflected on the reflector 27 to obtain the image shown in FIG. 5(d). Next, the superimposing device 6 can detect the position of the outer peripheral end of the substrate 42 by performing image processing (for example, a conventional edge detection processing) on the obtained image. In addition, as shown in the example shown in FIG. 5(d), the detected outer peripheral end may be a part V including a notch (notch) 42a for specifying the direction of the substrate 42.

In addition, it is preferable to change the amount of light of the light source 29 when detecting the position of the outer peripheral end of the support plate 41 and when detecting the position of the outer peripheral end of the substrate 42. For example, in one embodiment, when detecting the position of the outer peripheral end of the support plate 41, by reducing the amount of light of the light source 29, as shown in FIG. 5(b), a high contrast between the support plate 41 and the background can be obtained. image. In addition, when detecting the position of the outer peripheral end of the substrate 42, by increasing the light amount of the light source 29, as shown in FIG. 5(d), a high-contrast image between the substrate 42 and the support plate 41 can be obtained.

Fig. 6 is a schematic diagram illustrating the operation of the position detection unit again. When the superposition device 6 detects the position of the outer peripheral end of the support plate 41 (or the base plate 42), as shown in FIG. 6, the reflector plate 27 reflects the bottom surface portion 41b (or bottom surface portion 42c) of the support plate 41 (or base plate 42) Image S of the outer peripheral end of the side. It is preferable that at least three reflector plates 27 are arranged in the overlapping chamber 6a and reflect images S of at least three locations V in the outer peripheral end of the support plate 41 (or the base plate 42). Then, by corresponding to each The camera 28 of the reflecting plate 27 photographs the image S on each reflecting plate 27 and obtains the image of each part V. As shown in FIG. Next, the controller 30 performs image processing on each image to detect the position of each part V. Then, the controller 30 compares the detected position of each part V with a predetermined reference position to specify the offset of the position of the outer peripheral end of the support plate 41 (or the base plate 42) from the reference position . Thereby, the position detection unit can determine whether the position of the support plate 41 (or the substrate 42) is shifted from the predetermined reference position.

Among them, when the supporting plate 41 and the base plate 42 are circular, by detecting the positions of at least three parts V, the superimposing device 6 can appropriately specify the positions of the supporting plate 41 and the base plate 42 and also appropriately determine the supporting plate. Are the positions of 41 and the substrate 42 shifted from a predetermined reference position?

In addition, it is better for a part V to include a notch 41a (or notch 42a), and it is better for the controller 30 to detect the position of the notch 41a (or notch 42a). Thereby, the superposition device 6 can collectively determine whether the directions of the support plate 41 and the substrate 42 are shifted.

Thereby, because the superposition device 6 can appropriately detect the positions of the outer peripheral ends of the support plate 41 and the substrate 42 in the superposition chamber 6a by the position detection unit, the position deviation of the support plate 41 and the substrate 42 can be detected. In particular, the superimposing device 6 can detect the position of the outer peripheral end of the substrate 42 in the superimposing chamber 6a in a state where the mutual flat portions of the substrate 42 and the support plate 41 are parallel and close to each other. Thereby, the superimposing device 6 can appropriately detect the positional deviation between the substrate 42 and the support plate 41 that make the flat surfaces parallel and close to each other in the superimposing chamber 6a.

The reflector 27, for example, may be a mirror, a mirror, or other optical Although it is a member, if it can reflect the outer peripheral edge part of the support board 41 and the board|substrate 42, it is not specifically limited. In other embodiments, instead of the reflecting plate 27, optical phenomena such as refraction may be used, and optical members that reflect the outer peripheral ends of the support plate 41 and the substrate 42 may be used. By using such an optical member as an internal detection unit, for example, when the overlap chamber 6a is in a vacuum or close to a vacuum state, even in situations where it is difficult to install an internal camera, etc., it is possible to appropriately detect the support in the overlap chamber 6a. The outer peripheral end of the plate 41 or the base plate 42.

The reflector 27 may be provided at a position where each part V can be reflected as shown in FIG. 6. In one embodiment, the reflector 27 may be attached to the drive unit 22 as shown in FIG. 3. By attaching the reflecting plate 27 to the drive unit 22, each part V of the aligned support plate 41 (or substrate 42) can be appropriately reflected. In addition, a new member for fixing the reflector 27 can be omitted.

The camera 28 only needs to be a person who can obtain an image from a photographed object. For example, a CCD camera or the like can be used, but it is not limited to this. The light source 29 only needs to be capable of illuminating the object. For example, an LED light source or the like can be used, but it is not limited to this. The controller 30 only needs to be a person who can perform image processing while controlling the camera 28 and the light source 29. It can be realized by a logic circuit (hardware) formed by an integrated circuit (IC chip) or the like, or it can be realized by a CPU (Central Processing). Unit) is realized by software. The camera 28, the light source 29, and the controller 30 are fixed to the sub-frame 14, for example.

In addition, in a modified example, the position detection unit may be configured to detect the positions of the outer peripheral end portions of both the substrate 42 and the support plate 41 in the state shown in FIG. 5(c). At this time, for example, in the state of FIG. 5(c), (i) the light quantity of the light source 29 is reduced, and while the image shown in FIG. 5(b) is obtained, (ii) the light source The amount of light at 29 is increased to obtain an image as shown in FIG. 5(d), and the controller 30 may perform image processing on the image to detect the positions of the outer peripheral ends of both the substrate 42 and the support plate 41.

(Attachment Room 7)

The sticking chamber (sticking part) 7 sticks the support plate 41 and the substrate 42 (layered body 40) superimposed by the superimposing device 6 to complete the laminated body 40. The attaching chamber 7 includes a second support pin 31 and pressure plates 32 and 33. In addition, it is preferable that the attaching chamber 7 be decompressed to a vacuum or close to a vacuum state by a pressure reducing pump not shown.

The second support pins 31 are received from the internal conveying unit 10 and support the support plate 41 and the substrate 42 overlapped in the overlap chamber 6. In addition, the second support pins 31, for example, like the first support pins 25, are arranged at equal intervals on a circle centered on the center points of the support plate 41 and the base plate 42.

The pressure plates 32 and 33 provided in the application chamber 7 contain heaters (not shown). Thereby, between the support plate 41 and the substrate 42 supported by the second support pin 31 and the pressure plates 32 and 33, the support plate 41 and the substrate 42 can be heated while being clamped and pressed.

(Internal Transport Department 10)

In the superimposing chamber 6, an internal conveying part (10 in FIG. 7) is provided, and the supporting plate 41 and the substrate 42 (laminated body 40) temporarily fixed by the first supporting pin 25 and the pressing pin 26 are clamped in Accept and teach with the attachment room 7.

The overlapping chamber 6 and the attaching chamber 7 may be configured to partition the inner section of one processing chamber into walls of two processing chambers. In addition, coincident The chamber 6 and the sticking chamber 7 may have a structure in which the overlapping chamber 6 and the sticking chamber 7 are adjacent to each other without a gap on the respective side surfaces. At the boundary of the superimposing room 6 and the attaching room 7, a gate 8 for receiving and receiving the laminated body 40 between the superimposing room 6 and the attaching room 7 is provided. The gate 8 is controlled by the gate to open and close. In addition, in the overlapping room 6, between the sticking device 2 and the first external conveying unit 4, there is provided a receiving window 9 capable of opening and closing for receiving and receiving the support plate 41, the substrate 42, and the laminate 40. As described above, pressure reducing pumps can be installed in the overlapping chamber 6 and the application chamber 7 to independently control the internal pressure of each chamber.

Because the attaching chamber 7 is a structure capable of reducing pressure, the substrate 42 and the supporting plate 41 can be attached through an adhesive layer under a reduced pressure environment. By pressing the substrate 42 to the adhesive layer under a reduced pressure environment, in a state where there is no air in the recesses of the uneven pattern on the surface of the substrate 42, the adhesive layer can be made to carry out the recesses, and the adhesive layer can be reliably prevented. Air bubbles between the substrate 42 and the substrate 42 occur.

The gate 8 is formed to be able to move the aligned laminated body 40 from the superposition chamber 6 to the attaching chamber 7 when the gate 8 is open, and to move the bonded laminated body 40 from the adhesion chamber 7 to the superposition chamber 7 Room 6. In a state where both the superposition chamber 6 and the attachment chamber 7 are decompressed, by opening the gate, the laminated body 40 before joining can be moved from the superposition chamber 6 to the attachment chamber 7 under reduced pressure. structure.

FIG. 7 is a configuration diagram of the internal structure of the sticking device 2 including the internal conveying unit 10 viewed from above. As long as the internal conveyance part 10 is a structure which can move the laminated body 40 between the superposition chamber 6 and the attachment chamber 7, it is not specifically limited to a specific mechanism. In this embodiment, as shown in FIG. 7, the internal conveyance section 10 is constituted by the internal conveyance arm 11 and the arm rotation shaft 12. The internal conveyance section 10 has an internal conveyance arm 11 that can support the laminated body 40 from below. The rotation of the arm rotation shaft 12 as the center of rotation becomes a mechanism for moving the laminated body 40. Although the details will be described later, in this embodiment, two internal conveying parts 10 common to the rotating shaft are provided. Although the arm rotation shaft 12 is provided on the side of the overlapping chamber 6, it may be provided on the side of the sticking chamber 7. From the viewpoint of shortening the transfer stroke between the overlapping chamber 6 and the first external conveying portion 4, it is preferable that the arm rotation shaft 12 is formed on the side close to the side surface where the transfer window 9 is formed. In Fig. 7, the two-dot chain line shown by "B" represents the standby position of the internal transport arm 11, and the two-dot chain line shown by "C" represents the position of the internal transport arm 11 in the application room 7 (the application part receives Position).

The rotation speed of the internal transfer arm 11 can be set to a speed corresponding to the situation. Therefore, when the internal transport arm 11 holds the laminated body 40, the internal transport arm 11 can be rotated at a low speed, and when the laminated body 40 is not held, the internal transport arm 11 can be rotated at a high speed. In addition, the acceleration and deceleration can be controlled so that the lifting and stopping of the rotation of the internal transfer arm 11 are smoothly performed.

As shown in FIG. 7, in the state where the gate 8 is opened, the internal transfer arm 11 that can rotate is opened through the gate 8 to transport the laminated body 40 to the attaching portion receiving position C. As shown in FIG. The gate 8 can be opened and closed by a conventionally known method, for example, a gate valve structure can be applied.

(Substrate 42)

The substrate 42 is supported (attached) by the support plate 41 and provided to processes such as thinning, transportation, and mounting. The substrate 42 is not limited to a wafer substrate. For example, it may be any substrate such as a ceramic substrate, a thin film substrate, and a flexible substrate necessary for the support of the support plate 41.

The shape of the substrate 42 may be circular, for example, but is not limited to this. In addition, it is preferable that the substrate 42 has a notch 42a for specifying the direction of the substrate 42.

(Support board 41)

The support plate 41 is a support that supports the substrate 42 and is attached to the substrate 42 by an adhesive layer. Therefore, the support plate 41 can have the strength necessary to prevent damage or deformation of the substrate 42 during processes such as thinning, transportation, and mounting of the substrate 42, and it is desired to be more lightweight. From the above viewpoints, the support plate 41 is preferably composed of glass, silicon, acrylic resin, ceramic, or the like. The shape of the support plate 41, for example, may be a circle, but it is not limited to this.

In addition, it is preferable that the supporting plate 41 has a notch 41a for specifying the direction of the supporting plate 41.

(Laminated body 40)

The laminate 40 is formed by stacking the substrate 42 and the support plate 41 supporting the substrate 42 by laminating an adhesive layer on either the substrate 42 and the support plate 41. In addition, in this embodiment, the adhesive layer is formed on the side of the substrate 42.

The adhesive layer is a layer for bonding the substrate 42 and the support plate 41, and is formed by coating an adhesive on at least any one of the substrate 42 and the support plate 41. The adhesive constituting the adhesive layer preferably contains, for example, a thermoplastic resin whose thermal fluidity is improved by heating as the adhesive material. As the thermoplastic resin, for example, acrylic resin, styrene resin, maleimide resin, hydrocarbon resin, thermoplastic elastomer, and polycure resin Wait.

The method of forming the adhesive layer, that is, the method of applying an adhesive on the substrate 42 or the support plate 41, or the method of forming an adhesive tape by applying an adhesive on the substrate, is not particularly limited. The coating method of the adhesive may be, for example, a spin coating method, a dipping method, a roller blade method, a spray method, a coating method by a slit nozzle method, and the like.

Although the thickness of the adhesive layer can be appropriately set according to the types of the substrate 42 and the support plate 41 to be attached, the processing to be applied to the attached substrate, etc., it is preferably in the range of 10 to 150 μm, and more preferably It is in the range of 15~100μm.

In addition, when the support plate 41 is peeled from the substrate 42, a solvent can be supplied to the adhesive layer to dissolve the adhesive layer. Thereby, the substrate 42 and the support plate 41 can be separated. At this time, if a through hole penetrating the thickness direction of the support plate 41 is formed, it is more preferable because the through hole can easily supply the solvent to the adhesive layer.

In addition, between the substrate 42 and the support plate 41, as long as they do not hinder the attachment of the two, a layer other than the adhesive layer may be formed. For example, between the support plate 41 and the adhesive layer, a separation layer that is altered by light irradiation may be formed. Because the separation layer is formed, the substrate 42 and the support plate 41 can be easily separated by irradiating light after the substrate thinning, transportation, and mounting process.

[action]

FIG. 8 is a flowchart illustrating the flow of the attaching method using the attaching device 2. In addition, S1 to S13 correspond to the superposition method using the superposition device 6. 9 to 18 are schematic diagrams showing the state of the sticking device 2 in each process of the sticking method using the sticking device 2. In addition, in FIGS. 9 to 18, for simplification, a part of the member including the sticking device 2 is omitted.

(S1: Move the support plate 41 into the overlap room 6a)

The support plate 41 is carried in through the receiving window 9 of the overlapping room 6 by the first external conveying unit 4. The loaded support plate 41 is placed on the first support pin 25 (refer to FIG. 9). In addition, at this stage, it is better to first set the spacer 23 at the withdrawn position, and set the pressing pin 26 at the standby position.

(S2: Align the support plate 41)

Then, the alignment block 21 is moved in parallel with the XY plane by the drive unit 22, and by abutting the alignment block 21 on the support plate 41 supported on the first support pin 25, the outer periphery of the support plate 41 The position of the end is aligned with the support plate 41 based on the information from the pre-aligner 3 (refer to FIG. 10).

(S3: Move the support plate 41 to the spacer 23)

Next, the first support pin 25 moves the support plate 41 to a position above the spacer 23 in the Z direction and does not touch the pressing plug 26. Next, after the spacer 23 is moved to the insertion position, the first support pin 25 moves to a lower side than the spacer 23 in the Z direction. Thereby, without changing the horizontal position of the support plate 41 which finished the alignment, it is hold|maintained by the spacer 23 (holding process, refer to FIG. 11).

(S4: Detect the position of the outer peripheral end of the support plate 41)

Next, the position detection unit (reflector plate 27, camera 28, light source 29, and controller 30) detects the position of the outer peripheral end of the support plate 41 held on the spacer 23 (second position detection process, refer to Figure 5(a)). As described above, the position detection unit (i) reflects the outer peripheral end on the bottom 41b side of the support plate 41 held on the spacer 23 to the reflector 27, and (ii) captures the image on the reflector 27 by the camera 28, The image of the outer peripheral end of the bottom 41b side of the support plate 41, (iii) the obtained image is analyzed by the controller 30 to detect the position of the outer peripheral end of the support plate 41 held on the spacer 23 .

In this case, it is preferable that the position detection unit detects the positions of at least two locations of the outer peripheral end of the support plate 41. In addition, it is preferable that one of the two parts includes the notch 41a of the support plate 41.

(S5: Determine whether the position of the outer peripheral end of the support plate 41 is shifted)

Next, the position detection unit determines whether the detected position of the outer peripheral end of the support plate 41 is shifted from a predetermined reference position. For example, the controller 30 specifies the amount of deviation from the reference position of the position of the outer peripheral end of the detected support plate 41, and determines whether the position of the outer peripheral end of the support plate 41 is detected by determining whether the deviation exceeds a threshold value. Whether the position is offset from the reference position.

Next, when the detected position of the outer peripheral end of the support plate 41 is shifted from the reference position, it proceeds to S2, and when it is not shifted, it proceeds to S6.

(S6: Carry the substrate 42 into the overlapping room 6a)

Next, as in the case of the support plate 41, in this state, the substrate 42 is carried in through the receiving window 9 of the superimposing chamber 6 by the first external transport unit 4. The loaded support plate 41 is placed on the first support pin 25 (refer to FIG. 12).

(S7 or S9: align the substrate 42)

Next, the alignment block 21 is moved in parallel on the XY plane by the drive unit 22, and the alignment block 21 is abutted against the substrate 42 supported on the first support pin 25, and the outer peripheral end of the substrate 42 The position aligns the substrate 42 based on the information from the pre-aligner 3 (refer to FIG. 13).

(S8: Decompress the overlap chamber 6a)

After that, after closing the receiving window 9, the pressure reducing pump 20 starts the pressure reduction of the overlapping chamber 6 a. The pressure reduction of the superposition chamber 6a can be performed when the pressure reduction state of the superposition chamber 6 and the pressure reduction state of the application chamber 7 at the time when the temporary fixation ends are almost the same. Preferably it is 10 Pa or less. In addition, the heating of the stage portion 24 is started, and the adhesive layer formed on the upper surface of the substrate 42 is caused to flow heat.

(S10: Move the base plate 42 to just below the support plate 41)

Next, the first support pin 25 brings the upper surface 42b of the substrate 42 close to the bottom surface 41 of the support plate 41 held by the spacer 23 in S3 (supporting process, refer to FIG. 14). Thereby, the board|substrate 42 and the support board 41 make mutual flat parts (42b, 41b) a parallel and close state.

(S11: Detect the position of the outer peripheral end of the substrate 42)

Next, the position detection unit (reflector plate 27, camera 28, light source 29, and controller 30) detects the position of the outer peripheral end of the substrate 42 that makes the flat surfaces parallel to and close to each other to the support plate 41 (position detection Engineering, refer to Figure 5(c)). As described above, the position detection unit (i) mirrors the outer peripheral end of the upper surface 42b side of the substrate 42 that makes the mutual flat surfaces parallel to and close to the support plate 41 to the reflector 27, and (ii) uses the camera 28 to capture the image. The image of the outer peripheral end portion of the upper surface 42b side of the substrate 42 of the reflector plate 27, and (iii) the obtained image is analyzed by the controller 30, so that it can be detected that the planes of the support plate 41 are parallel and close to each other. The position of the outer peripheral end of the substrate 42.

In this case, it is preferable that the position detection unit detects the positions of at least two locations of the outer peripheral end portion of the substrate 42. In addition, it is preferable that one of the two locations includes the notch 42a of the substrate 42.

(S12: Determine whether the position of the outer peripheral end of the substrate 42 is shifted)

Next, the position detection unit determines whether the detected position of the outer peripheral end of the substrate 42 is shifted from a predetermined reference position. For example, the controller 30 specifies the offset from the reference position of the detected position of the outer peripheral end of the substrate 42 and determines whether the detected position of the outer peripheral end of the substrate 42 is greater than a threshold value. Offset from the reference position.

Next, when the detected position of the outer peripheral end of the substrate 42 is shifted from the reference position, the process proceeds to S9, and when there is no shift, the process proceeds to S13.

(S13: Temporarily fix the base plate 42 and the support plate 41)

Then, while moving the spacer 23 to the withdrawn position, press the The latch 26 is moved from the standby position to the pressing position by the support shaft 26b, and the support plate 41 supported by the spacer 23 is biased by the spring 26a toward the lower side in the Z direction. Thereby, the force applied by the spring 26a of the pressing pin 26 is clamped by the first support pin 25 and the pressing pin 26, and the support plate 41 and the substrate 42 are pressed (refer to FIG. 15). Thereby, the support plate 41 and the base plate 42 are overlapped and temporarily fixed.

(S14: Transport the laminated body 40 to the application room 7)

After the support plate 41 and the base plate 42 are overlapped, the pressing pin 26 is returned to the standby position. In addition, the first support pin 25 is moved downward in the Z direction. Thereby, the superimposed support plate 41 and the substrate 42 (layered body 40) are transferred to the internal conveyance part 10 (refer to FIG. 16).

Next, the shutter of the shutter 8 is opened, and the overlapping support plate 41 and the substrate 42 are transferred from the overlapping chamber 6 to the attaching chamber 7 by the internal transfer unit 10. Among them, the overlapped support plate 41 and the substrate 42 are supported by the second support pins 31 in the attaching chamber 7 (refer to FIG. 17).

(S15: Attach the base plate 42 and the support plate 41)

Next, in a state of being supported by the second supporting pin 31, the pressing plate 33 is lowered in the Z direction to contact the upper surface of the supporting plate 41. Next, the second support pin 31 and the pressure plate 33 are lowered at the same speed. Thereby, between the pressing plates 32 and 33, the support plate 41 and the substrate 42 are sandwiched, pressed and heated at the same time (refer to FIG. 18). Thereby, the support plate 41 and the substrate 42 are attached, and the laminate 40 can be completed.

The present invention is not limited to the above-mentioned embodiments, and various modifications are possible within the scope shown in the claims. Embodiments obtained by appropriately combining the technical means disclosed in the different embodiments are also included in the technology of the present invention. Within range.

[Industrial Utilization Possibility]

Since the present invention can improve the bonding accuracy of the substrate and the support in a vacuum, it can be widely used in the manufacturing field of industrial products.

1‧‧‧Attaching system

2‧‧‧Attaching device

3‧‧‧Holding room

5‧‧‧The first external transport department walks

6‧‧‧Coincidence device

7‧‧‧Attaching Room (Attaching Department)

8‧‧‧Gate

9‧‧‧Receiving Window

50‧‧‧FOUP opener

51‧‧‧Baking plate

52‧‧‧Rotator

53‧‧‧Passing the line

54‧‧‧Second External Transport Department

55‧‧‧The second external transport department walks

Claims (17)

A superimposing device is a superimposing device for superimposing a substrate and a support that supports the substrate, comprising: a superimposing chamber for superimposing the substrate and the support; and detecting in the superimposing chamber, the flat surfaces are parallel and close to each other A position detection unit for the position of the outer peripheral end of at least one of the substrate and the support; wherein the position detection unit includes: an internal detection unit that reflects the outer peripheral end in the overlap chamber; Externally, an external detection unit that detects the outer peripheral end reflected by the internal detection unit; the plan view shape of the substrate and the support is circular; the position detection unit detects the positions of at least three locations of the outer peripheral end, And specify the offset of the position of the at least three parts from the reference position. The superimposing device according to claim 1, further comprising: a decompression part that puts the superposition chamber in a decompression environment; wherein the internal detection part has a mirror part; and the mirror part reflects the outer periphery in the decompression environment Ends. The coincidence device described in claim 1 or 2, wherein the external detection unit includes: A photographing unit that photographs the image of the outer peripheral end reflected by the internal detection unit; an image processing unit that specifies the position of the outer peripheral end from the image. The superposition device according to claim 1, wherein a notch for specifying the direction of the substrate or the support is provided at the outer peripheral end of at least one of the substrate and the support; One, including the notch. The superimposing device according to claim 1 or 2, wherein a holding part for holding one of the substrate and the support, and a support for supporting the other of the substrate and the support are located in the superimposing chamber; The support portion makes the upper surface of the substrate or the support supported by the support approach close to the bottom surface of the substrate or the support held by the holding portion; the internal detection portion reflects the support supported by the support The outer peripheral end portion on the bottom surface side of the substrate or the support. The superposition device according to claim 5, wherein the position detection unit further detects the position of the outer peripheral end of the substrate or the support held by the holding part before the support part brings the substrate and the support closer to each other. Position; the above-mentioned internal detection part, the above-mentioned substrate and the above-mentioned support part in the above-mentioned support part Before the holding body approaches, the outer peripheral end part of the bottom surface side of the substrate or the support body held by the holding part is reflected. The superimposing device according to claim 1 or 2, comprising: when the position of the outer peripheral end of the substrate or the support detected by the position detection unit deviates from a reference position, the substrate or the substrate that is shifted is adjusted The position adjustment part of the position of the support. The superposition device according to claim 7, wherein the position adjustment unit is equipped with the internal detection unit. A sticking device comprising: the superimposing device as described in any one of claims 1 to 8; and a sticking part that is located outside the superimposing chamber and glues the substrate and the support on which the superimposing device is superimposed. A superposition method is a method of superimposing a substrate and a support that supports the substrate, comprising: detecting the substrate and the support that are parallel and close to each other in the superposition chamber where the substrate and the support are superimposed. The position detection process of the position of the outer peripheral end of at least one of the bodies; wherein, in the position detection process, the outer peripheral end is reflected in the overlap chamber, and the reflected outer circumference is detected from the outside of the overlap chamber Ends; Wherein, at the outer peripheral end of at least one of the substrate and the support, a notch for specifying the direction of the substrate or the support is provided; in the position detection process, the position of the notch is detected as the The location of at least one of the three locations. The superposition method according to claim 10, wherein the position detection process is performed by placing the superposition chamber in a reduced pressure environment; in the position detection process, the outer peripheral end is mirrored to the mirror portion in the superposition chamber. The superposition method according to claim 10 or 11, wherein the plan view shape of the substrate and the support is a circle; in the position detection process, the positions of at least three locations of the outer peripheral end are detected and specified The offset of the positions of the at least three parts from the reference position. The overlap method described in claim 10 or 11 includes: before the position detection process, in the overlap chamber, a holding process of holding one of the substrate and the support; after the holding process, the position Before the inspection process, support the other of the substrate and the support so that the supported substrate or the upper surface of the support is close to the support of the substrate or the bottom surface of the support held in the holding process Project; Among them, in the above-mentioned location detection project, the above-mentioned supporting project is reflected The outer peripheral end part of the bottom surface side of the said board|substrate or the said support body supported. The superposition method described in claim 13, including: prior to the support process, a second position detection process of detecting the position of the outer peripheral end of the substrate or the support body held in the holding process; wherein, in the first In the second position detection process, the outer peripheral end on the bottom surface side of the substrate or the support body held in the holding process is reflected. The superposition method according to claim 14, wherein when the position of the outer peripheral end of the substrate or the support detected in the second position detection process is shifted from a reference position, the shifted substrate is adjusted Or the position of the above-mentioned support, and the above-mentioned second position detection process is performed again. The superposition method according to claim 10 or 11, wherein when the position of the outer peripheral end of the substrate or the support detected in the position detection process is shifted from the reference position, the shifted substrate is adjusted Or the position of the above-mentioned support body, and the above-mentioned position detection process is performed again. A method of attaching, by the overlapping method as described in any one of claims 11 to 16, after the substrate and the support are combined, the overlapped substrate and the support are attached to the outside of the overlap chamber Together.

Images