JP2017224735A - Superposition apparatus, pasting device, superposition method, and pasting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a superposition apparatus, a pasting device, a superposition method and a pasting method which allow for suitable detection of positional deviation in a board and a support, that are brought close to each other while keeping the plane parts in parallel with each other, in a superposition chamber for superposing the board and the support.SOLUTION: Position detectors (27-29) for detecting the position of outer peripheral end of at least one of a board (42) and a support (41), brought close to each other while keeping the mutual plane parts (41b, 42b) in parallel, in a superposition chamber (6a), includes an internal detector (27) imaging the outer peripheral end in the superposition chamber (6a), and external detectors (28, 29) for detecting the outer peripheral end, imaged by the internal detector (27), from the outside of the superposition chamber (6a).SELECTED DRAWING: Figure 1

Description

  The present invention relates to a superimposing apparatus, a pasting apparatus, a superposing method, and a pasting method.

  As mobile phones, digital AV devices, IC cards, etc. have become more sophisticated, there is an increasing demand for higher integration of chips in packages by reducing the size and thickness of semiconductor silicon chips (hereinafter referred to as chips). ing. In order to achieve high integration of chips in the package, it is necessary to reduce the thickness of the chip to a range of 25 to 150 μm.

  However, a semiconductor wafer (hereinafter referred to as a wafer) serving as a base of a chip is thinned by grinding, its strength is weakened, and the wafer is likely to be cracked or warped. Further, since it is difficult to automatically transport a wafer whose strength has been reduced by making it thin, it has to be transported manually, and the handling thereof is complicated.

  Therefore, a wafer support system has been developed that maintains the strength of the wafer and prevents the occurrence of cracks and warpage of the wafer by bonding a plate made of glass or hard plastic, called a support plate, to the wafer to be ground. . Since the strength of the wafer can be maintained by the wafer support system, the transport of the thinned semiconductor wafer can be automated.

  The wafer and the support plate are bonded together using an adhesive tape, an adhesive containing a thermoplastic resin, or the like. After thinning the wafer to which the support plate is attached, the support plate is peeled from the substrate before dicing the wafer.

  Here, the technique which can improve the bonding precision in bonding of a support body and a board | substrate is calculated | required. As such a technique, Patent Document 1 discloses that a position of a wafer is based on the acceleration or position of the wafer holder when a plurality of wafers are stacked while being held by the wafer holder and then transferred to the bonding portion. It is disclosed that the joining is not performed when the displacement is judged and there is a displacement.

JP 2014-57070 A (published March 27, 2014)

  However, the technique described in Patent Document 1 is a technique for dealing with a positional deviation after a plurality of wafers are overlapped.

  On the other hand, misalignment between the substrate and the support may occur before the overlapping. That is, in the superposition chamber in which the substrate and the support are superposed, for the superposition, the substrate and the support are brought close to each other with their flat portions parallel to each other. There is.

  In order to cope with such a positional deviation, the present inventors are considering detecting a positional deviation in a substrate and a support that are close to each other with their planar portions parallel to each other in the superposition chamber. However, it is difficult to detect misalignment from the outside of the substrate and the support that are close to each other with their flat portions parallel to each other in the overlapping chamber. In addition, since the inside of the stacking chamber may be in a vacuum environment, for example, it is difficult to detect a positional shift by introducing an internal camera or the like.

  The present invention has been made in view of the above-mentioned problems, and in a superposition chamber in which a substrate and a support are superposed, a positional shift in a substrate and a support that are close to each other with their flat portions parallel to each other is preferable. It is a main object of the present invention to provide a superimposing apparatus, a pasting apparatus, a superimposing method, and a pasting method that can be detected.

In order to solve the above-described problem, an overlay apparatus according to the present invention
A superposing apparatus for superposing a substrate and a support for supporting the substrate,
An overlapping chamber for overlapping the substrate and the support;
A position detection unit that detects the position of the outer peripheral end of at least one of the substrate and the support that are close to each other in parallel with each other in the overlapping chamber;
The position detector is
In the superposition chamber, an internal detection unit that reflects the outer peripheral end,
And an external detection unit for detecting the outer peripheral end portion reflected by the internal detection unit from the outside of the superposition chamber.

Moreover, the overlaying method according to the present invention includes:
A method of superimposing a substrate and a support that supports the substrate,
A position detection step of detecting a position of an outer peripheral end portion of at least one of the substrate and the support that are close to each other with the planar portions parallel to each other in an overlapping chamber in which the substrate and the support are overlapped; And
In the position detection step, the outer peripheral end portion is projected in the superposition chamber, and the projected outer peripheral end portion is detected from the outside of the superposition chamber.

  ADVANTAGE OF THE INVENTION According to this invention, in the superposition chamber which superimposes a board | substrate and a support body, the superposition apparatus which can detect suitably the position shift in the board | substrate and support body which mutually made the plane part parallel and adjoined, sticking An apparatus, a superimposing method, and a sticking method can be provided.

It is a schematic diagram which shows schematic structure of the sticking system in one Embodiment of this invention. It is a schematic diagram which shows schematic structure of the sticking apparatus which concerns on one Embodiment of this invention. It is a figure which shows schematic structure of the position adjustment part in one Embodiment of this invention, (a) shows a top view, (b) shows a side sectional view. It is a schematic diagram which shows schematic structure of the holding | maintenance part in one Embodiment of this invention. It is a schematic diagram explaining operation | movement of the position detection part in one Embodiment of this invention, (a) shows the state of the superposition apparatus when detecting the position of the outer peripheral end part of a support body, (b) , (A) shows an example of an image taken by the photographing unit, (c) shows the state of the superposition apparatus when detecting the position of the outer peripheral edge of the substrate, and (d) shows (c) ) Shows an example of an image photographed by the photographing unit. It is a schematic diagram explaining operation | movement of the position detection part in one Embodiment of this invention. It is a schematic diagram explaining schematic operation | movement of the internal conveyance part in one Embodiment of this invention. It is a flowchart explaining the flow of the sticking method which concerns on one Embodiment of this invention. It is a schematic diagram which shows the state of the sticking apparatus in one process of the sticking method which concerns on one Embodiment of this invention. It is a schematic diagram which shows the state of the sticking apparatus in one process of the sticking method which concerns on one Embodiment of this invention. It is a schematic diagram which shows the state of the sticking apparatus in one process of the sticking method which concerns on one Embodiment of this invention. It is a schematic diagram which shows the state of the sticking apparatus in one process of the sticking method which concerns on one Embodiment of this invention. It is a schematic diagram which shows the state of the sticking apparatus in one process of the sticking method which concerns on one Embodiment of this invention. It is a schematic diagram which shows the state of the sticking apparatus in one process of the sticking method which concerns on one Embodiment of this invention. It is a schematic diagram which shows the state of the sticking apparatus in one process of the sticking method which concerns on one Embodiment of this invention. It is a schematic diagram which shows the state of the sticking apparatus in one process of the sticking method which concerns on one Embodiment of this invention. It is a schematic diagram which shows the state of the sticking apparatus in one process of the sticking method which concerns on one Embodiment of this invention. It is a schematic diagram which shows the state of the sticking apparatus in one process of the sticking method which concerns on one Embodiment of this invention.

  The present invention provides a superposition device, a sticking device, a superposition method, and a sticking method.

[Overlay device]
An overlay apparatus according to an embodiment of the present invention is an overlay apparatus that superimposes a substrate and a support that supports the substrate, the overlay chamber that overlays the substrate and the support, and the above A position detection unit that detects the position of the outer peripheral end of at least one of the substrate and the support that are close to each other in parallel with each other in the overlapping chamber, and the position detection unit includes: An internal detection unit that reflects the outer peripheral end in the superposition chamber and an external detection unit that detects the outer peripheral end reflected by the internal detection unit from the outside of the superposition chamber.

  According to the above configuration, (i) the inner detection unit projects at least one outer peripheral end of the substrate and the support that are brought close to each other in the superposition chamber, and (ii) the inner detection unit projects from the outside of the superposition chamber. By detecting the outer peripheral end portion, the position of the outer peripheral end portion of at least one of the substrate and the support that are brought close to each other in the overlapping chamber can be suitably detected.

  Accordingly, (i) it is difficult to detect the position of the substrate or the support in the superposition chamber directly from the outside of the superposition chamber, or (ii) the outer peripheral end of the substrate or the support in the superposition chamber Even when it is difficult to dispose a detection unit that directly detects the position of the substrate, it is possible to suitably detect a positional shift in the substrate and the support body in which the planar portions are close to each other in parallel in the superposition chamber.

  In this specification, “superimposing a substrate and a support” means that the substrate and the support are stacked to form a stacked body. In the laminate, the substrate and the support have parallel plane portions. In the laminate, another layer may be interposed between the substrate and the support. The superimposing apparatus according to the present invention is an apparatus that superimposes the substrate and the support by stacking the substrate and the support so that the plane portions of the substrate and the support are close to each other.

  In the present specification, the “outer peripheral end” means an end of the substrate or support in the outer peripheral portion of the flat portion of the substrate or support. Further, “project the outer peripheral edge” means that the image of the outer peripheral edge of the substrate or the support appears at a position different from that of the substrate or the support. The internal detection unit that reflects the outer peripheral end may include, for example, an optical member such as a mirror or a prism that generates an optical phenomenon such as reflection or refraction. Further, “detecting the outer peripheral edge projected by the internal detection unit” means detecting an image of the outer peripheral edge projected by the internal detection unit. Further, “detecting” means detecting at least a position at which the outer peripheral end portion can be specified, and may be, for example, capturing an image of the outer peripheral end portion, but is not limited thereto. Moreover, the external detection part which detects the outer peripheral edge part which the internal detection part projected can be imaging devices, such as a camera, for example.

[Paste device]
A sticking device according to an embodiment of the present invention includes a superimposing device according to an embodiment of the present invention, and a substrate and a support body superposed by the superimposing device outside the superposition chamber of the superimposing device. And an affixing part to be bonded.

  According to said structure, a desired laminated body can be obtained when a sticking part bonds together the board | substrate and support body which the superimposition apparatus superimposed. In particular, the affixing unit bonds the substrate and the support body outside the overlapping chamber, so that the overlapping environment and the adhering environment can be suitable for each purpose. Can be suitably obtained.

[Overlay method]
An overlaying method according to an embodiment of the present invention is an overlaying method in which a substrate and a support that supports the substrate are overlapped with each other in an overlaying chamber in which the substrate and the support are overlapped. Including a position detection step of detecting a position of at least one outer peripheral end of the substrate and the support that are brought close to each other in parallel with each other in the plane portion. The outer peripheral end is projected, and the projected outer peripheral end is detected from the outside of the superposition chamber.

  According to the above configuration, (i) the inner detection unit projects at least one outer peripheral end of the substrate and the support that are brought close to each other in the superposition chamber, and (ii) the inner detection unit projects from the outside of the superposition chamber. By detecting the outer peripheral end portion, the position of the outer peripheral end portion of at least one of the substrate and the support that are brought close to each other in the overlapping chamber can be suitably detected.

  As a result, (i) it is difficult to arrange a detection unit that directly detects the outer peripheral edge of the substrate or the support in the superposition chamber, or (ii) the superposition chamber directly from the outside of the superposition chamber. Even in the case where it is difficult to detect the position of the substrate or the support, it is possible to suitably detect a positional shift between the substrate and the support that are close to each other with their flat portions parallel to each other in the superposition chamber.

[Attaching method]
A pasting method according to an embodiment of the present invention includes a method of superimposing a substrate and a support on each other by the overlaying method according to an embodiment of the present invention, and then stacking the substrate and the support outside the stacking chamber. The combined substrate and support are bonded together.

  According to said method, a desired laminated body can be obtained by bonding together the board | substrate and support body which were piled up by the superimposition method. In particular, since the substrate and the support are bonded to each other outside the stacking chamber, it is possible to make the stacking environment and the bonding environment suitable for each, and to obtain a desired stacked body suitably. it can.

Embodiment 1
Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the following description, the superposition apparatus according to an embodiment of the present invention is incorporated in a pasting apparatus, and the configuration in which the pasting apparatus is incorporated in a pasting system is described. It is not limited.

(Paste system 1)
FIG. 1 is a schematic diagram showing a schematic configuration of the sticking system 1. As shown in FIG. 1, the pasting system 1 includes a pasting device 2, a pre-aligner 3, a first external transport unit 4 and a first external transport unit running path 5, a FOUP opener 50, a spinner 52, a bake plate 51, a second external A transport unit 54, a second external transport unit travel path 55, and a pass line 53 are provided. The sticking device 2 includes a superposition device 6 and a sticking chamber 7.

  The support plate (support) 41 is first transported to the pre-aligner 3 by the first external transport unit 4 moving on the first external transport unit travel path 5, aligned, and then superimposed via the delivery window 9. It is carried into the device 6. The substrate 42 is first transported to the spinner 52, subsequently to the bake plate 51, and finally to the pass line 53 by the second external transport unit 54 moving on the second external transport unit travel path 55. The spinner 52 applies an adhesive to the substrate 42 to be processed to form an adhesive layer. The bake plate 51 cures the adhesive layer formed on the substrate 42. In the pass line 53, the substrate 42 is transferred to the first external transfer unit 4, first transferred to the pre-aligner 3, aligned, and then transferred into the stacking device 6 through the transfer window 9. .

  In the present embodiment, the support plate 41 is first carried into the superposing apparatus 6 and then the substrate 42 is carried. However, this order may be reversed. After both the substrate 42 and the support plate 41 are carried in, the superposing device 6 superimposes the carried support plate 41 and the substrate 42. The affixing device 2 moves the substrate 42 and the support plate 41 (laminated body 40) superimposed by the overlapping device 6 to the affixing chamber 7 via the gate 9, and in the affixing chamber 7, the substrate 42, the support plate 41, Paste together.

(Paste device 2)
FIG. 2 is a schematic diagram illustrating a schematic configuration of the sticking device 2. As shown in FIG. 2, the sticking device 2 includes a superimposing device 6 and a pasting chamber 7, and the superposing device 6 includes a superposing chamber 6a.

  A gate 8 that can be opened and closed is provided between the overlapping chamber 6 a and the pasting chamber 7 in the pasting device 2. The sticking device 2 includes an internal transfer unit 10 for transferring an object via the gate 8 between the overlapping chamber 6a and the sticking chamber 7.

(Superposition device 6)
The superposition device 6 includes a decompression pump (decompression unit) 20, an alignment block (position adjustment unit) 21, a drive unit (position adjustment unit) 22, a spacer (holding unit) 23, a stage unit 24, a superposition chamber 6a. A first support pin (support part) 25, a temporary fixing part 26 and a reflector (mirror part, internal detection part, position detection part) 27 are provided, and a subframe 14 and a camera (photographing part) are provided outside the overlapping chamber 6a. , An external detection unit, a position detection unit 28, a light source (external detection unit, position detection unit) 29, and a controller (image processing unit, external detection unit, position detection unit) 30. The superposition chamber 6a is provided with a window 13 for the camera 28 to photograph the inside of the superposition chamber 6a.

(Decompression pump 20)
The decompression pump 20 is a device that decompresses the inside of the superposition chamber 6a, and may preferably be a device that decompresses the inside of the superposition chamber 6a to a vacuum or a state close to a vacuum. By depressurizing the inside of the overlapping chamber 6a, the laminate 40 can be suitably delivered to and from the pasting chamber 7. Further, bubbles can be prevented from entering between the substrate 42 and the support plate 41 during temporary fixing.

(Alignment block 21, drive unit 22)
3A and 3B are schematic views showing a schematic configuration of the alignment block 21 and the drive unit 22, wherein FIG. 3A is a top view and FIG. 3B is a side sectional view. The substrate 42 and the support plate 41 carried into the overlapping chamber 6a are first placed on the first support pins 25. The alignment block 21 is placed in a direction parallel to the XY plane by the drive unit 22, that is, in a horizontal direction, with the substrate 42 or the support plate 41 to be aligned placed on the first support pins 25. By being driven, the substrate 42 abuts on the support plate and aligns the substrate 42 and the support plate 41 (the positions of the substrate 42 and the support plate 41 are adjusted).

  As shown in FIG. 3A, in the superimposing apparatus 6, the alignment blocks 21 are provided at five locations, and abut against the substrate 42 or the support plate 41 from five directions. More specifically, the superposition apparatus 6 is provided with two sets of alignment blocks 21 arranged at positions facing each other on the substrate 42 or the support plate 41 and one alignment block 21 for determining the notch position. The straight line that connects one set of alignment blocks 21 and the straight line that connects the other set of alignment blocks 21 are orthogonal to each other. However, the number and arrangement of the alignment blocks 21 are not limited to this as long as the positions of the substrate 42 and the support plate 41 can be adjusted.

  As shown in FIG. 3B, a cushion portion (for example, a rubber plate, for preventing the substrate 42 or the support plate 41 from sticking to the portion of the alignment block 21 that contacts the substrate 42 or the support plate 41. Teflon coat etc.) 21b is provided. Moreover, the alignment block 21 may be connected to the drive unit 22 via the spring 21a.

  The alignment block 21 is driven by the drive unit 22. The drive unit 22 aligns the substrate 42 and the support plate 41 by driving the alignment block 21 in the horizontal direction based on information from the pre-aligner 3.

(Spacer 23)
The spacer 23 is a member that holds the aligned support plate 41 (the substrate 42 when the substrate 42 is first aligned) until the overlapping is performed without changing the horizontal position. is there. FIG. 4 is a view of the spacer 23 as viewed from the upper surface side. The spacer 23 stably holds the support plate 41 by supporting a part of the peripheral edge of the support plate 41 from below. The spacer 23 is movable in the XY direction, that is, in the horizontal direction. When the support plate 41 is placed on the stage portion 24 and carried to the upper portion of the spacer 23, the spacer 23 is moved to a position where it does not overlap the support plate 41 at all. In this specification, in this state, the spacer 23 is referred to as being in the “extraction position”. After the support plate 41 is carried above the spacer 23, the spacer 23 is returned to a position overlapping the support plate 41 so that the support plate 41 can be supported by the spacer 23. In this specification, it is called that the spacer 23 is in the “insertion position” in this state. FIG. 4 shows a state where the spacer 23 is in the “insertion position”. When the spacer 23 is in the insertion position, the width d ₃ of the overlap between the support plate 41 and each member that supports the support plate 41 of the spacer 23 is 1-5 mm from the periphery of the support plate 41 to the inside. Can be a degree. It is preferably 5 mm. In addition, the size of the spacer 23 may be, for example, a width d ₄ of 5 mm, but is not limited thereto.

  The material of the spacer 23 is not particularly limited. For example, a material obtained by chamfering stainless steel (SUS) and coating it with polytetrafluoroethylene or the like can be used.

(Stage 24)
A heater (not shown) is built in the stage unit 24, and the adhesive layer applied to the substrate 42 supported by the first support pins 25 can be thermally flowed. The temperature of the stage portion 24 is preferably heated to a temperature of at least room temperature or higher due to, for example, the low-temperature tackiness (tackiness) of the thermoplastic resin that is the adhesive material of the adhesive layer, and the glass transition point (Tg) or higher. It is more preferable to heat until it reaches the temperature. By heating the adhesive layer to a temperature equal to or higher than the glass transition point of the thermoplastic resin, the thermal fluidity of the adhesive layer is improved and the adhesive layer is easily deformed. Although depending on the adhesive layer, that is, the material of the thermoplastic resin as the adhesive material, the temperature of the stage portion 24 is preferably 23 to 220 ° C., and the heating time, that is, the pressing time is 3 to 300 seconds. Preferably, it is 5 to 180 seconds.

(First support pin 25)
The first support pins 25 are provided so as to protrude from the stage portion 24, and individually support the support plate 41 and the substrate 42 from the bottom surface. Then, with the first support pin 25 supporting the support plate 41 or the substrate 42, the support plate 41 or the substrate 42 is adjusted to a predetermined position (for example, alignment) by adjusting the protruding amount of the first support pin 25. It can be moved to a position aligned by the block 21, a position on the spacer 23, or a position close to the support plate 41 or the substrate 42). The material of the first support pin 25 is not particularly limited, but can be made of aluminum having good thermal conductivity, but is not limited thereto, and stainless steel or the like may be used.

(Pressing pin 26)
The pressing pin 26 presses the stacked substrate 42 and support plate 41 (laminated body 40) downward in the Z direction. The distal end portion of the pressing pin 26 is disposed so as to oppose each distal end portion of the first support pin 25. In this way, by arranging the first support pin 25 and the pressing pin 26, the region of the support plate 41 whose position has been adjusted and the partial region of the substrate 42 whose position has been adjusted are overlapped and sandwiched. Can be pressed. For this reason, it is possible to apply a pressing force evenly with the center point of the support plate 41 and the substrate 42 adjusted in position as the center. Therefore, it is possible to prevent the position of the support plate 41 and the substrate 42 from being displaced, and the temporary fixing can be successfully performed.

  When the pressing pin 26 is in contact with the upper surface of the support plate 41 (or the substrate 42), the pressing pin 26 is urged downward in the Z direction by a spring (biasing member) 26a. The plurality of pressing pins 26 can be simultaneously moved up and down in the Z direction by the support shaft 26b. Here, in this specification, the pressing pin 26 is in the “standby position” that the pressing pin 26 is not moved downward and is therefore not in contact with the support plate 41 held by the spacer 23. That is. On the other hand, in the present specification, the pressing pin 26 indicates that the pressing pin 26 moves downward and, as a result, is in a position where the support plate 41 held by the spacer 23 can be urged by the spring 26a. Is in the “pressing position”.

(Reflector 27, camera 28, light source 29 and controller 30)
The reflection plate 27, the camera 28, the light source 29, and the controller 30 constitute a position detection unit that detects the positions of the outer peripheral ends of the substrate 42 and the support plate 41 in the superposition device 6.

  FIG. 5A is a schematic diagram illustrating a state of the superposition device 6 when the position detection unit detects the position of the outer peripheral end portion of the support plate 41. The position detection unit detects the position of the outer peripheral end portion of the support plate 41 in a state where the support plate 41 is held by the spacer 23 in the overlapping chamber 6a. First, the light source 29 illuminates the support plate 41 held by the spacer 23, and projects the outer peripheral end portion of the support plate 41 on the bottom surface portion 41 b side on the reflection plate 27. Then, the camera 28 photographs the outer peripheral end portion of the support plate 41 reflected on the reflecting plate 27 through the window 13 and obtains an image as shown in FIG. The controller 30 can detect the position of the outer peripheral end portion of the support plate 41 by performing image processing (for example, known edge detection processing) on the obtained image. Note that, as in the example illustrated in FIG. 5B, the outer peripheral end portion to be detected may be a portion V including a notch (notch portion) 41 a for specifying the orientation of the support plate 41.

  FIG. 5C is a schematic diagram showing a state of the superposition device 6 when the position of the outer peripheral end portion of the substrate 42 is detected. In the superposition chamber 6a, the position detection unit is configured such that the substrate 42 and the support plate 41 are close to each other with their flat portions (the upper surface portion 42b of the substrate 42 and the bottom surface portion 41b of the support plate 41) in parallel. The position of the outer peripheral end of the substrate 42 is detected. The support plate 41 is the same as the substrate 42 in order to support the substrate 42, but is larger than the substrate 42.

  First, the light source 29 illuminates the substrate 42 and the support plate 41 that are close to each other with their flat portions parallel to each other, and the outer peripheral end of the substrate 42 on the bottom surface portion 42 c side is reflected on the reflection plate 27. Then, the camera 28 captures an image of the outer peripheral end portion of the substrate 42 reflected on the reflecting plate 27 through the window 13 to obtain an image as shown in FIG. The superimposing device 6 can detect the position of the outer peripheral edge of the substrate 42 by performing image processing (for example, known edge detection processing) on the image. Note that, as in the example illustrated in FIG. 5D, the outer peripheral end portion to be detected may be a portion V including a notch (notch portion) 42 a for specifying the orientation of the substrate 42.

  Note that the amount of light from the light source 29 is preferably changed between when the position of the outer peripheral end of the support plate 41 is detected and when the position of the outer peripheral end of the substrate 42 is detected. For example, in one embodiment, when detecting the position of the outer peripheral end portion of the support plate 41, the light amount of the light source 29 is reduced to reduce the light amount of the light source 29, as shown in FIG. A high contrast image can be obtained. Further, when detecting the position of the outer peripheral edge of the substrate 42, the contrast between the substrate 42 and the support plate 41 is high as shown in FIG. 5D by increasing the light amount of the light source 29. An image can be obtained.

  FIG. 6 is a schematic diagram for further explaining the operation of the position detection unit. When the superimposing device 6 detects the position of the outer peripheral end portion of the support plate 41 (or the substrate 42), as shown in FIG. 6, the reflecting plate 27 has the bottom surface portion 41b (or the substrate 42) of the support plate 41 (or the substrate 42). Alternatively, the image S of the outer peripheral end on the bottom surface portion 42c) side is moved. Preferably, at least three reflectors 27 are arranged in the overlapping chamber 6a, and images the images S of at least three portions V at the outer peripheral end of the support plate 41 (or the substrate 42). Then, the image 28 on each reflector 27 is captured by the camera 28 corresponding to each reflector 27 to obtain an image of each part V. And the controller 30 detects the position of each site | part V by image-processing each said image. Further, the controller 30 compares the detected position of each part V with a predetermined reference position, thereby calculating a deviation amount of the position of the outer peripheral end of the support plate 41 (or the substrate 42) from the reference position. Identify. Thereby, the position detection unit can determine whether the position of the support plate 41 (or the substrate 42) is deviated from a predetermined reference position.

  Here, when the support plate 41 and the substrate 42 are circular, by detecting the positions of at least three portions V, the superposition apparatus 6 can suitably specify the positions of the support plate 41 and the substrate 42. At the same time, it can be suitably determined whether or not the positions of the support plate 41 and the substrate 42 are deviated from a predetermined reference position.

  One part V preferably includes a notch 41a (or notch 42a), and the controller 30 preferably detects the position of the notch 41a (or notch 42a). Thereby, the superimposing apparatus 6 can determine whether or not the directions of the support plate 41 and the substrate 42 are shifted.

  As described above, the overlay device 6 can preferably detect the position of the outer peripheral end portion of the support plate 41 or the substrate 42 in the overlay chamber 6a by the position detection unit. Misalignment can be detected. In particular, the superposing device 6 can detect the position of the outer peripheral end portion of the substrate 42 in the superposing chamber 6a in a state where the substrate 42 and the support plate 41 are brought close to each other with their plane portions parallel to each other. it can. As a result, the superposition device 6 can suitably detect a positional shift in the substrate 42 and the support plate 41 in which the flat portions of the superposition chamber 6a are close to each other in the superposition chamber 6a.

  The reflection plate 27 may be an optical member such as a mirror or a prism, but is not particularly limited as long as it reflects the outer peripheral ends of the support plate 41 and the substrate 42. In another embodiment, instead of the reflecting plate 27, an optical member that reflects the outer peripheral ends of the support plate 41 and the substrate 42 using an optical phenomenon such as refraction may be used. By using such an optical member as the internal detection unit, for example, even when the superposition chamber 6a is in a vacuum or a state close to a vacuum and it is difficult to provide an internal camera or the like, The outer peripheral edge of the support plate 41 or the substrate 42 can be detected.

  As shown in FIG. 6, the reflection plate 27 may be provided at a position where each part V can be reflected. In one embodiment, the reflection plate 27 may be attached to the drive unit 22 as shown in FIG. Since the reflection plate 27 is attached to the drive unit 22, each portion V of the aligned support plate 41 (or the substrate 42) can be suitably reflected. Further, a new member for fixing the reflecting plate 27 can be omitted.

  The camera 28 may be any camera as long as it can acquire an image by photographing an object. For example, a CCD camera or the like can be used, but the present invention is not limited to this. The light source 29 may be anything as long as it can illuminate the object. For example, an LED light source or the like can be used, but is not limited thereto. The controller 30 only needs to be able to control the camera 28 and the light source 29 and perform image processing, and may be realized by a logic circuit (hardware) formed in an integrated circuit (IC chip) or the like. However, it may be realized by software using a CPU (Central Processing Unit). The camera 28, the light source 29, and the controller 30 are fixed to the subframe 14, for example.

  Moreover, in one modification, the position detection part may be comprised so that the position of the outer peripheral edge part of both the board | substrate 42 and the support plate 41 may be detected in the state of (c) of FIG. In this case, for example, in the state of FIG. 5C, (i) the light amount of the light source 29 is reduced to obtain an image as shown in FIG. 5B, and (ii) the light amount of the light source 29 5 is acquired, and the controller 30 obtains images as shown in FIG. 5D, and the controller 30 performs image processing on these images, thereby determining the positions of the outer peripheral ends of both the substrate 42 and the support plate 41. It may be detected.

(Paste room 7)
The sticking chamber (sticking part) 7 completes the laminated body 40 by sticking the support plate 41 and the substrate 42 (laminated body 40) superposed by the superposing device 6. The affixing chamber 7 includes a second support pin 31 and press plates 32 and 33. Moreover, it is preferable that the sticking chamber 7 can be depressurized to a vacuum or a state close to vacuum by a decompression pump (not shown).

  The second support pins 31 receive and support the support plate 41 and the substrate 42 superimposed in the superposition chamber 6 from the internal transport unit 10. The second support pins 31 are configured to be arranged at equal intervals on a circle centered on the center point of the support plate 41 and the substrate 42, for example, like the first support pin 25.

  A heater (not shown) is incorporated in the press plates 32 and 33 provided in the sticking chamber 7. As a result, the support plate 41 and the substrate 42 supported by the second support pins 31 can be pressed while being sandwiched between the support plate 41 and the substrate 42 and the press plates 32 and 33 while being heated.

(Internal transfer unit 10)
An internal transfer unit that transfers the temporary-fixed support plate 41 and substrate 42 (laminated body 40) to and from the pasting chamber 7 by being sandwiched between the first support pin 25 and the pressing pin 26 in the overlapping chamber 6. (10 in FIG. 7) is provided.

  The stacking chamber 6 and the sticking chamber 7 can have a structure in which a wall that partitions the inside of one processing chamber into two processing chambers is provided. In addition, the superposition chamber 6 and the sticking chamber 7 may have a structure in which the superposition chamber 6 and the sticking chamber 7 are in contact with each other without a gap on each side surface. A gate 8 for delivering the laminate 40 between the overlapping chamber 6 and the pasting chamber 7 is provided at the boundary between the overlapping chamber 6 and the pasting chamber 7. The gate 8 is controlled to be opened and closed by a shutter. The superposition chamber 6 is provided with an openable / closable delivery window 9 for delivering the support plate 41, the substrate 42 and the laminated body 40 between the sticking device 2 and the first external transport unit 4. . As described above, each of the overlapping chamber 6 and the pasting chamber 7 is provided with a decompression pump, and the state of the internal pressure in each chamber can be controlled independently.

  Since the sticking chamber 7 has a configuration capable of reducing the pressure, the substrate 42 and the support plate 41 can be bonded to each other through an adhesive layer in a reduced pressure atmosphere. By pressure-bonding the substrate 42 to the adhesive layer in a reduced-pressure atmosphere, the adhesive layer can enter the recess in a state where no air is present in the recess of the uneven pattern on the surface of the substrate 42. It is possible to more reliably prevent the generation of bubbles during the interval.

  The gate 8 can move the aligned laminated body 40 from the superposition chamber 6 to the sticking chamber 7 in a state where the shutter is opened. It is formed so that it can be moved to the superposition chamber 6. By opening the shutter in a state where both the superposition chamber 6 and the pasting chamber 7 are decompressed, the laminate 40 before joining can be moved from the superposition chamber 6 to the pasting chamber 7 under reduced pressure. Yes.

  FIG. 7 is a configuration diagram of the internal configuration of the sticking device 2 including the internal conveyance unit 10 as viewed from above. As long as the internal conveyance part 10 is the structure which can move the laminated body 40 between the stacking chamber 6 and the sticking chamber 7, there is no restriction | limiting in particular in a specific mechanism. In the present embodiment, as shown in FIG. 7, the internal transfer unit 10 includes an internal transfer arm 11 and an arm rotation shaft 12. The internal transport unit 10 is a mechanism that moves the stacked body 40 by rotation about the arm rotation shaft 12 of the internal transport arm 11 that can support the stacked body 40 from the lower surface. As will be described in detail later, in the present embodiment, two internal conveyance units 10 having a common rotation axis are provided. The arm rotation shaft 12 is provided on the stacking chamber 6 side, but may be configured on the sticking chamber 7 side. The arm rotation shaft 12 is formed on the side close to the side surface on which the delivery window 9 is formed, from the viewpoint that the delivery stroke between the superposition chamber 6 and the first external transfer unit 4 can be shortened. It is preferable that In FIG. 7, a two-dot chain line indicated by “B” represents a standby position of the internal transfer arm 11, and a two-dot chain line indicated by “C” indicates the position of the internal transfer arm 11 in the sticking chamber 7 (sticking portion). (Delivery position).

  The rotation speed of the internal transfer arm 11 can be set according to the situation. Therefore, when the internal transfer arm 11 holds the stacked body 40, the internal transfer arm 11 can be rotated at a low speed, and when the stacked body 40 is not held, the internal transfer arm 11 rotates at a high speed. Can be made. In addition, acceleration / deceleration can be controlled so that the turning up and stopping of the internal transfer arm 11 is smooth.

  As shown in FIG. 7, the gate 8 has an opening having a width that allows the rotating internal transfer arm 11 to pass through the gate 8 and carry the laminated body 40 to the pasting portion delivery position C when the shutter is opened. It has become. Conventionally known means can be used to open and close the gate 8, and for example, a gate valve structure can be applied.

(Substrate 42)
The substrate 42 is supported (attached) to the support plate 41 and subjected to processes such as thinning, conveyance, and mounting. The substrate 42 is not limited to a wafer substrate, and may be an arbitrary substrate such as a ceramic substrate, a thin film substrate, or a flexible substrate that needs to be supported by the support plate 41, for example.

  The shape of the substrate 42 may be, for example, a circle, but is not limited thereto. Moreover, it is preferable that the board | substrate 42 has the notch 42a which is a notch for pinpointing the direction of the board | substrate 42. FIG.

(Support plate 41)
The support plate 41 is a support that supports the substrate 42 and is attached to the substrate 42 through an adhesive layer. Therefore, the support plate 41 only needs to have a strength necessary to prevent breakage or deformation of the substrate 42 during a process such as thinning, transporting, and mounting of the substrate 42, and is desirably lighter. From the above viewpoint, the support plate 41 is more preferably made of glass, silicon, acrylic resin, ceramic, or the like. The shape of the support plate 41 can be circular, for example, but is not limited thereto.

  The support plate 41 preferably has a notch 41a that is a notch for specifying the orientation of the support plate 41.

(Laminated body 40)
The stacked body 40 is formed by superimposing a substrate 42 and a support plate 41 that supports the substrate 42 via an adhesive layer that is stacked on at least one of the substrate 42 and the support plate 41. In the present embodiment, the adhesive layer is formed on the substrate 42 side.

  The adhesive layer is a layer that adheres the substrate 42 and the support plate 41, and is formed by applying an adhesive to at least one of the substrate 42 and the support plate 41. The adhesive which comprises an adhesive layer should just contain the thermoplastic resin which heat-fluidity improves by heating, for example as an adhesive material. Examples of the thermoplastic resin include acrylic resins, styrene resins, maleimide resins, hydrocarbon resins, thermoplastic elastomers, and polysulfone resins.

  The method for forming the adhesive layer, that is, the method for applying the adhesive to the substrate 42 or the support plate 41, or the method for forming the adhesive tape by applying the adhesive to the base material is not particularly limited. However, examples of the method for applying the adhesive include a spin coating method, a dipping method, a roller blade method, a spray method, and a coating method using a slit nozzle method.

  The thickness of the adhesive layer may be appropriately set according to the types of the substrate 42 and the support plate 41 to be pasted, the processing applied to the substrate after pasting, etc., but within the range of 10 to 150 μm. It is preferable that it is within a range of 15 to 100 μm.

  When the support plate 41 is peeled from the substrate 42, a solvent may be supplied to the adhesive layer to dissolve the adhesive layer. Thereby, the board | substrate 42 and the support plate 41 can be isolate | separated. At this time, if the support plate 41 is formed with a through hole penetrating in the thickness direction, it is more preferable because the solvent can be easily supplied to the adhesive layer through the through hole.

  Further, a layer other than the adhesive layer may be further formed between the substrate 42 and the support plate 41 as long as the attachment of the both is not prevented. For example, a separation layer that is altered by irradiating light may be formed between the support plate 41 and the adhesive layer. By forming the separation layer, the substrate 42 and the support plate 41 can be easily separated by irradiating light after processes such as thinning, transporting, and mounting of the substrate.

[Operation]
FIG. 8 is a flowchart for explaining the flow of the pasting method by the pasting device 2. Note that S <b> 1 to S <b> 13 correspond to a superposition method by the superposition device 6. 9 to 18 are schematic diagrams showing states of the sticking device 2 in each step of the sticking method by the sticking device 2. In addition, in FIGS. 9-18, a part of member with which the sticking apparatus 2 is provided is abbreviate | omitted for the simplification.

(S1: The support plate 41 is carried into the overlapping chamber 6a)
The support plate 41 is carried in through the delivery window 9 of the superposition chamber 6 using the first external transport unit 4. The loaded support plate 41 is placed on the first support pin 25 (see FIG. 9). At this stage, it is preferable that the spacer 23 is in the removal position and the pressing pin 26 is in the standby position.

(S2: Align support plate 41)
Next, the alignment block 21 is moved parallel to the XY plane by the drive unit 22, and the alignment block 21 is brought into contact with the support plate 41 supported on the first support pins 25. The position of the outer peripheral edge aligns the support plate 41 based on information from the pre-aligner 3 (see FIG. 10).

(S3: Move the support plate 41 onto the spacer 23)
Next, the support plate 41 is moved to a position where the first support pin 25 is above the spacer 23 in the Z direction and does not contact the pressing pin 26. And after moving the spacer 23 to an insertion position, the 1st support pin 25 moves below the spacer 23 in a Z direction. Accordingly, the support plate 41 that has been aligned is held by the spacer 23 without changing the horizontal position (holding step, see FIG. 11).

(S4: Detect the position of the outer peripheral edge of the support plate 41)
Next, the position detection unit (reflector 27, camera 28, light source 29, and controller 30) detects the position of the outer peripheral end of the support plate 41 held on the spacer 23 (second position detection step, FIG. 5). (See (a)). As described above, the position detection unit (i) reflects the outer peripheral end of the support plate 41 held on the spacer 23 on the bottom surface 41b side on the reflection plate 27, and (ii) the support reflected on the reflection plate 27. An image of the outer peripheral end of the bottom surface 41b of the plate 41 is taken by the camera 28, and (iii) the controller 30 performs image analysis on the obtained image, whereby the outer peripheral end of the support plate 41 held on the spacer 23 Can be detected.

  At this time, it is preferable that the position detection unit detects the positions of at least two parts in the outer peripheral end of the support plate 41. Further, it is preferable that one of the two parts includes a notch 41 a of the support plate 41.

(S5: Determine whether or not the position of the outer peripheral end of the support plate 41 is shifted)
Next, the position detection unit determines whether or not the detected position of the outer peripheral end portion of the support plate 41 is deviated from a predetermined reference position. For example, the controller 30 identifies the amount of deviation of the detected position of the outer peripheral end of the support plate 41 from the reference position, and determines whether or not the amount of deviation exceeds a threshold value. It is determined whether or not the position of the outer peripheral edge is shifted from the reference position.

  If the detected position of the outer peripheral end of the support plate 41 is deviated from the reference position, the process proceeds to S2, and if not deviated, the process proceeds to S6.

(S6: The substrate 42 is carried into the overlapping chamber 6a)
Next, as in the case of the support plate 41, in this state, the substrate 42 is carried in via the transfer window 9 of the overlapping chamber 6 using the first external transfer unit 4. The loaded support plate 41 is placed on the first support pin 25 (see FIG. 12).

(S7 or S9: Align substrate 42)
Next, the alignment block 21 is moved in parallel to the XY plane by the drive unit 22, and the alignment block 21 is brought into contact with the substrate 42 supported on the first support pins 25, whereby the outer peripheral end of the substrate 42. The position of the part aligns the substrate 42 based on the information from the pre-aligner 3 (see FIG. 13).

(S8: Depressurize the overlapping chamber 6a)
Thereafter, after the delivery window 9 is closed, the decompression pump 20 starts decompressing the overlapping chamber 6a. The depressurization of the superposition chamber 6a may be performed so that the depressurization state of the superposition chamber 6 and the depressurization state of the sticking chamber 7 at the time when the temporary fixing is finished are substantially the same. Preferably, it is 10 Pa or less. In addition, heating of the stage unit 24 is started, and the adhesive layer formed on the upper surface of the substrate 42 is caused to heat flow.

(S10: Move the substrate 42 directly below the support plate 41)
Next, the first support pins 25 bring the upper surface portion 42b of the substrate 42 closer to the bottom surface portion 41b of the support plate 41 held by the spacer 23 in S3 (support step, see FIG. 14). Thereby, the board | substrate 42 and the support plate 41 will be in the state which mutually made the flat part (42b, 41b) parallel.

(S11: Detect the position of the outer peripheral edge of the substrate 42)
Next, the position detection unit (the reflection plate 27, the camera 28, the light source 29, and the controller 30) detects the position of the outer peripheral end of the substrate 42 that is close to the support plate 41 with the flat portions thereof being parallel to each other (see FIG. Position detection step, see FIG. 5 (c)). As described above, the position detection unit (i) projects the outer peripheral end portion on the bottom surface portion 42b side of the substrate 42 close to the support plate 41 in parallel with each other in the plane, and (ii) An image of the outer peripheral end portion of the substrate 42 on the bottom surface portion 42b side reflected on the reflecting plate 27 is taken by the camera 28, and (iii) the obtained image is analyzed by the controller 30 so that the support plate 41 It is possible to detect the position of the outer peripheral end portion of the substrate 42 in which the flat portions of the substrates are brought close to each other in parallel.

  At this time, it is preferable that the position detection unit detects the positions of at least two portions in the outer peripheral end of the substrate 42. Further, it is preferable that one of the two parts includes a notch 42 a of the substrate 42.

(S12: Determine whether or not the position of the outer peripheral edge of the substrate 42 is shifted)
Next, the position detection unit determines whether the detected position of the outer peripheral end of the substrate 42 is deviated from a predetermined reference position. For example, the controller 30 specifies the amount of deviation of the detected position of the outer peripheral edge of the substrate 42 from the reference position, and determines whether or not the amount of deviation exceeds a threshold, thereby detecting the outer peripheral edge of the detected substrate 42. It is determined whether the position of the part is deviated from the reference position.

  If the detected position of the outer peripheral edge of the substrate 42 has deviated from the reference position, the process proceeds to S9, and if not, the process proceeds to S13.

(S13: Temporarily fix the substrate 42 and the support plate 41)
Next, the spacer 23 is moved to the extraction position and the pressing pin 26 is moved from the standby position to the pressing position by the support shaft 26b, so that the support plate 41 supported by the spacer 23 is moved in the Z direction by the spring 26a. Apply force to urge downward. Thus, the support plate 41 and the substrate 42 are pressed by the force applied by the spring 26a of the pressing pin 26 so as to be sandwiched between the first support pin 25 and the pressing pin 26 (see FIG. 15). Thereby, the support plate 41 and the substrate 42 are overlapped and temporarily fixed.

(S14: Transport the laminate 40 to the affixing chamber 7)
After the support plate 41 is overlapped with the substrate 42, the pressing pin 26 is returned to the standby position. Further, the first support pin 25 is moved downward in the Z direction. Thereby, the superposed support plate 41 and the substrate 42 (laminated body 40) are delivered to the internal transport unit 10 (see FIG. 16).

  Next, the shutter of the gate 8 is opened, and the superposed support plate 41 and the substrate 42 are transported from the superposition chamber 6 to the sticking chamber 7 by the internal transport unit 10. Here, the superposed support plate 41 and the substrate 42 are supported on the second support pins 31 in the sticking chamber 7 (see FIG. 17).

(S15: Attaching the substrate 42 and the support plate 41)
Next, in a state where it is supported by the second support pin 31, the press plate 33 is lowered in the Z direction to contact the upper surface of the support plate 41. Subsequently, the second support pin 31 and the press plate 33 are lowered at the same speed. Thus, the support plate 41 and the substrate 42 are sandwiched between the press plates 32 and 33 and heated while being pressed (see FIG. 18). Thereby, the support plate 41 and the board | substrate 42 can be affixed and the laminated body 40 can be completed.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  INDUSTRIAL APPLICABILITY The present invention can improve the accuracy of bonding a substrate and a support in a vacuum, and thus can be widely used in the field of manufacturing industrial products.

DESCRIPTION OF SYMBOLS 1 Pasting system 2 Pasting apparatus 3 Holding chamber 4 1st external conveyance part 5 1st external conveyance part traveling path 6 Superposition apparatus 6a Superposition room 7 Pasting room (paste part)
DESCRIPTION OF SYMBOLS 8 Gate 9 Delivery window 10 Internal conveyance part 11 Internal conveyance arm 12 Arm rotation shaft 13 Window 14 Sub-frame 17a, 17b Imaging part 18a, 18b Area | region 19 Position specification part 20 Decompression pump (decompression part)
21 Alignment block (position adjustment part)
21a Spring 21b Cushion part 22 Drive unit (position adjustment part)
23 Spacer (holding part)
24 Stage unit 25 First support pin (support unit)
26 Pressing pin 26a Spring 26b Support shaft 27 Reflector (mirror part, internal detection part, position detection part)
28 Cameras (shooting unit, external detection unit, position detection unit)
29 Light source (external detector, position detector)
30 controller (image processing unit, external detection unit, position detection unit)
31 Second support pin 32 Press plate 33 Press plate 40 Laminated body 41 Support plate (support body)
41a Notch (notch)
41b Bottom part (flat part)
42 Substrate 42a Notch (Notch)
42b Upper surface part (plane part)
42c Bottom part S image V part

Claims (19)

A superposing apparatus for superposing a substrate and a support for supporting the substrate,
An overlapping chamber for overlapping the substrate and the support;
A position detection unit that detects the position of the outer peripheral end of at least one of the substrate and the support that are close to each other in parallel with each other in the overlapping chamber;
The position detector is
In the superposition chamber, an internal detection unit that reflects the outer peripheral end,
A superposition apparatus comprising: an external detection unit configured to detect the outer peripheral end portion reflected by the internal detection unit from the outside of the superposition chamber. A pressure reducing unit that makes the superposition chamber a reduced pressure environment;
The internal detection part has a mirror part,
The superimposing apparatus according to claim 1, wherein the mirror portion reflects the outer peripheral end portion in the reduced pressure environment. The external detector is
An imaging unit that captures an image of the outer peripheral edge imaged by the internal detection unit;
The superposition apparatus according to claim 1, further comprising: an image processing unit that identifies a position of the outer peripheral end portion from the image. The shape of the substrate and the support in a top view is a circle,
The said position detection part detects the position of the at least 3 site | part in the said outer periphery edge part, and specifies the deviation | shift amount from the reference | standard position of the position of the said at least 3 site | part of Claim 1-3 The superposition apparatus according to any one of the above. At least one outer peripheral end of the substrate and the support is provided with a notch for specifying the orientation of the substrate or the support,
The superposition apparatus according to claim 4, wherein one of the at least three portions includes the cutout portion. A holding portion for holding one of the substrate and the support, and a support portion for supporting the other of the substrate and the support, provided in the superposition chamber,
The support part is adapted to bring the upper surface part of the substrate or the support body supported by the support part close to the bottom surface part of the substrate or the support body held by the holding part,
The superposition according to any one of claims 1 to 5, wherein the internal detection unit reflects an outer peripheral end of the substrate supported by the support or the bottom of the support. apparatus. The position detection unit further detects the position of the substrate or the outer peripheral end of the support held by the holding unit before the support unit brings the substrate and the support close to each other. And
The internal detection unit projects the outer peripheral end of the substrate held by the holding unit or the bottom side of the support before the supporting unit brings the substrate and the support close to each other. The overlay apparatus according to claim 6.   When the position of the outer peripheral end of the substrate or the support detected by the position detection unit is deviated from a reference position, a position adjustment unit is provided for adjusting the position of the substrate or the support that has been deviated. The superposition apparatus according to any one of claims 1 to 7, wherein   The overlay apparatus according to claim 8, wherein the internal detection unit is attached to the position adjustment unit. The superposition device according to any one of claims 1 to 9,
A pasting device, comprising: a pasting unit for pasting the substrate and the support on which the superposing device is superposed outside the superposing chamber. A method of superimposing a substrate and a support that supports the substrate,
A position detection step of detecting a position of an outer peripheral end portion of at least one of the substrate and the support that are close to each other with the planar portions parallel to each other in an overlapping chamber in which the substrate and the support are overlapped; And
In the position detection step, the outer peripheral end portion is projected in the superposition chamber, and the projected outer peripheral end portion is detected from the outside of the superposition chamber. Perform the position detection step with the superposition chamber in a reduced pressure environment,
12. The overlaying method according to claim 11, wherein, in the position detection step, the outer peripheral end is reflected on a mirror in the overlay chamber. The shape of the substrate and the support in a top view is a circle,
The position detection step detects the positions of at least three parts in the outer peripheral end, and specifies the amount of deviation from the reference position of the positions of the at least three parts. The overlay method described. At least one outer peripheral end of the substrate and the support is provided with a notch for specifying the orientation of the substrate or the support,
The superposition method according to claim 13, wherein, in the position detection step, the position of the notch is detected as the position of one of the at least three parts. Before the position detection step, in the superposition chamber, a holding step of holding one of the substrate and the support, and after the holding step and before the position detection step, of the substrate and the support Supporting the other of the substrate, and supporting the substrate or the upper surface of the support close to the bottom of the substrate or the support held in the holding step,
The superposition method according to any one of claims 11 to 14, wherein in the position detection step, an outer peripheral end portion on a bottom surface side of the substrate or the support body supported in the support step is reflected. Before the support step, includes a second position detection step of detecting the position of the outer edge of the substrate or the support held in the holding step,
The overlay apparatus according to claim 15, wherein, in the second position detection step, an outer peripheral end portion on a bottom surface side of the substrate or the support body held in the holding step is reflected.   When the position of the outer peripheral edge of the substrate or the support detected in the second position detection step is shifted from the reference position, the position of the shifted substrate or the support is adjusted, and again, The superposition method according to claim 16, wherein a second position detecting step is performed.   When the position of the outer peripheral edge of the substrate or the support detected in the position detection step is shifted from the reference position, the position of the shifted substrate or the support is adjusted, and the position detection is performed again. The superposition method according to claim 11, wherein a process is performed.   The substrate and the support are superposed by the superposition method according to any one of claims 11 to 18, and then the superposed substrate and the support are bonded to each other outside the superposition chamber. The sticking method characterized by this.

Images