JP2014072459A - Transfer method, bonding method, and bonding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer method that suppresses generation of warpage at a laminate of a substrate and a support body.SOLUTION: In the transfer method for transferring a glass lamination wafer 20 between an overlapping room 2 and a bonding room 3, the glass lamination wafer 20 is transferred by using holding means for holding while suppressing a temperature difference generated in the glass lamination wafer 20 during transferring.

Description

  The present invention relates to a transport method used for transporting a laminated body of a superposed substrate and a support, and a pasting method and a pasting apparatus for pasting the laminate to a substrate and a support.

  As mobile phones, digital AV devices, IC cards, etc. have become more sophisticated, there is an increasing demand for higher integration of chips in packages by reducing the size and thickness of semiconductor silicon chips (hereinafter referred to as chips). ing. In order to achieve high integration of chips in the package, it is necessary to reduce the thickness of the chip to a range of 25 to 150 μm.

  However, a semiconductor wafer (hereinafter referred to as a wafer) serving as a base of a chip is thinned by grinding, its strength is weakened, and the wafer is likely to be cracked or warped. Further, since it is difficult to automatically transport a wafer whose strength has been reduced by making it thin, it has to be transported manually, and the handling thereof is complicated.

  Therefore, a wafer support system has been developed that maintains the strength of the wafer and prevents the occurrence of cracks and warpage of the wafer by bonding a plate made of glass or hard plastic, called a support plate, to the wafer to be ground. . Since the strength of the wafer can be maintained by the wafer support system, the transport of the thinned semiconductor wafer can be automated.

  The wafer and the support plate are bonded together using an adhesive tape, a thermoplastic resin, an adhesive, or the like. After thinning the wafer to which the support plate is attached, the support plate is peeled from the substrate before dicing the wafer.

  As a means for bonding the support plate to the wafer, there is a bonding apparatus. This bonding apparatus includes a coating unit that applies an adhesive to a wafer, a baking unit that heats and cures the adhesive, a bonding unit that bonds the wafer and a support plate, and the like. Further, Patent Document 1 discloses a bonding apparatus including an overlapping unit that overlaps a wafer and a support plate at a predetermined position before bonding the wafer and the support plate. In Patent Document 2, a load lock chamber for aligning a wafer and glass, a bonding chamber for bonding the wafer and glass, and a glass laminated wafer are moved from the load lock chamber to the bonding chamber under reduced pressure. A laminating apparatus provided with an internal conveying means is disclosed.

JP 2008-182127 A (released on August 7, 2008) JP 2012-59758 A (published March 22, 2012) JP 2009-212196 A (published September 17, 2009)

  As a result of studies by the present inventors, as an internal transfer means for carrying out internal transfer of a glass laminated wafer in which a wafer and glass are laminated, a part of the internal transfer means covers a diameter of the glass laminated wafer. It has been found that when the internal transfer means is used, the glass laminated wafer is warped during the transfer. Specifically, the warpage occurred in such a manner that the vicinity of the circumferential portion of the glass laminated wafer that is further away from the portion supported by the internal transfer means is lowered vertically (or raised vertically). .

  Accordingly, the present invention has been made in view of the above-described problems, and a main object thereof is to provide a transport method that suppresses warping that occurs in a transport target.

  In order to solve the above-described problem, the transport method according to the present invention includes an overlapping chamber that overlaps a substrate and a support, and an adhesive chamber that adheres the overlapped substrate and the support. A transport method for transporting the laminated body of the superposed substrate and the support between the above, using holding means for holding while suppressing a temperature difference generated in the laminated body during transportation, It has the structure which conveys a laminated body.

  Further, the sticking method according to the present invention is a sticking method for sticking a substrate to a support, wherein the substrate and the support are superposed in the superposition chamber, and the above-mentioned obtained by the superposition step. A transporting step of transporting the laminate of the substrate and the support to a pasting chamber for pasting the substrate and the support, and a pasting step for pasting the substrate and the support in the pasting chamber In the said conveyance process, it has the structure which conveys the said laminated body using the above-mentioned conveyance method.

  The pasting apparatus according to the present invention includes a superposition chamber for superimposing a substrate and a support, a pasting chamber for pasting the superposed substrate and the support, and the superposition chamber and the above A transporting means for transporting the stacked body of the superposed substrate and the support body between the pasting chamber, the transporting means comprising a support part for supporting the stacked body from below; And holding means having an arm portion for fixing the support portion from above, and the arm portion has a frame shape forming an opening.

  In the transport method according to the present invention, since the stacked body is transported using the holding means that holds while suppressing the temperature difference generated in the stacked body during transport, it is possible to suppress the warp generated in the stacked body.

It is a figure which shows schematic structure of the sticking apparatus of this invention in one Embodiment. It is a figure which shows the structure of the internal conveyance arm in one Embodiment. It is a figure which shows the structure of another aspect of the internal conveyance arm in one Embodiment. It is a figure which shows the result of having measured the temperature in the glass laminated wafer at the time of glass laminated wafer conveyance using the holding means of the conventional structure. It is a figure which shows the structure of the internal conveyance arm in another embodiment. It is a figure which shows the result of having measured the temperature in the glass laminated wafer at the time of glass laminated wafer conveyance in another embodiment. It is a figure which shows the structure of the conventional holding means.

  In the embodiment of the present invention described below, an example of a process of temporarily bonding a wafer (substrate) to glass (support plate) which is a support plate for a wafer support system will be described. It is not limited to this. In the present specification, a superposition of a wafer and glass is referred to as a “glass laminated wafer”.

  One embodiment of a transfer method according to the present invention is to transfer a glass-laminated wafer between an overlap chamber for stacking a wafer and glass and an affixing chamber for attaching the overlapped wafer and glass. This is a method for transporting a glass laminated wafer using a holding means for holding the glass laminated wafer while suppressing a temperature difference generated during the transportation.

  In this specification, “suppressing the temperature difference generated in the glass laminated wafer during conveyance” means that the glass laminated wafer is compared with the case of holding and conveying the glass laminated wafer using the holding means of the conventional configuration. This means that the temperature difference that occurs inside is reduced. An example of a conventional holding means is shown in FIG. FIG. 7A illustrates the top surface, and FIG. 7B illustrates the side surface. The holding means 111 having a conventional configuration includes two transfer arm target holding portions 114 that support the glass laminated wafer 20 from its lower surface, and a transfer arm main body 113 that fixes each transfer arm target holding portion 114 from above. have. The arm portion of the transfer arm main body 113 has a flat plate structure having no opening. In a state where the holding unit 111 holds the glass laminated wafer 20, the arm portion of the transfer arm main body 113 is positioned above the glass laminated wafer 20 and straddles it so as to completely cover one diameter of the glass laminated wafer 20. It is out.

  There is no restriction | limiting in particular in the method of suppressing the temperature difference which arises in the glass laminated wafer 20 during conveyance, Any method can be used if it is a method which can suppress a temperature difference. For example, a method using a holding means including an arm portion having a shape capable of suppressing a temperature difference generated in the glass laminated wafer 20, a method of providing a heater on the arm portion, and heat transmission more easily than a conventional arm portion. A method using a holding means having an arm portion formed using a material (for example, quartz glass that transmits infrared rays), or the arm portion and the surface of the glass laminated wafer 20 when the glass laminated wafer 20 is held For example, there is a method of using a holding unit that makes the distance of the distance larger than that in the case of using a conventional arm portion. Hereinafter, specific embodiments of the present invention will be described.

[Embodiment 1]
First, a sticking apparatus in which the conveyance method of the present embodiment is used will be described with reference to FIG.

  FIG. 1 shows a schematic configuration of a sticking device 1 in the present embodiment. As shown in FIG. 1, the sticking device 1 includes an overlapping chamber 2 and a sticking chamber 3. Both the stacking chamber 2 and the pasting chamber 3 can be depressurized. The stacking chamber 2 and the pasting chamber 3 have a structure in which a wall that partitions the inside of one processing chamber into two processing chambers is provided. A gate 4 for delivering the glass laminated wafer 20 between the overlapping chamber 2 and the pasting chamber 3 is provided at the boundary between the superposing chamber 2 and the pasting chamber 3. The opening and closing of the gate 4 is controlled by a shutter. The superposition chamber 2 is provided with an openable / closable delivery window 5 for delivering the glass, the wafer, and the glass laminated wafer 20 between the pasting device 1 and an external conveying means outside the pasting device 1. ing. Each of the overlapping chamber 2 and the pasting chamber 3 is provided with a known decompression means (not shown), and the internal pressure state of each chamber can be controlled independently.

  Since the affixing chamber 3 has a configuration capable of reducing the pressure, the wafer and the glass can be bonded together via an adhesive layer in a reduced pressure atmosphere. By pressure bonding the wafer to the adhesive layer in a reduced pressure atmosphere, the adhesive layer can enter the recess in a state where there is no air in the recess of the uneven pattern on the wafer surface. It is possible to more reliably prevent the generation of bubbles during the interval.

  The gate 4 can move the aligned glass laminated wafer 20 from the stacking chamber 2 to the pasting chamber 3 with the shutter opened, and the pasted glass laminated wafer 20 is pasted to the pasting chamber. It is formed so that it can be moved from 3 to the superposition chamber 2. By opening the shutter in a state where both the superposition chamber 2 and the pasting chamber 3 are depressurized, the glass laminated wafer 20 before pasting can be moved from the superposition chamber 2 to the pasting chamber 3 under reduced pressure. ing.

  The stacking chamber 2 is a chamber for stacking the wafer and the glass, and has alignment means (not shown) for aligning the wafer and the glass. The affixing chamber 3 is a chamber for affixing the wafer and the glass, which have been aligned and aligned, and has an affixing means (not shown) for affixing. As the attaching means, a configuration in which the wafer and the glass are attached by thermocompression bonding through an adhesive layer is possible. The sticking chamber 3 is provided with heaters at the upper and lower parts, and radiant heat is released from the heaters.

  The sticking apparatus 1 is further provided with an internal transfer means 10 for transferring the glass laminated wafer 20 between the superposition chamber 2 and the sticking chamber 3 via the gate 4. As long as the internal conveyance means 10 is a structure which can move the glass laminated wafer 20 between the lamination | stacking chamber 2 and the sticking chamber 3, there is no restriction | limiting in particular in a specific mechanism. In the present embodiment, as shown in FIG. 1, the internal transfer means 10 includes an internal transfer arm (holding means) 11 and an arm pivot shaft 12. The internal transfer means 10 is a mechanism for moving the glass laminated wafer 20 by turning about the arm rotation shaft 12 of the internal transfer arm 11 that can support the glass laminated wafer 20 from the lower surface thereof. The arm turning shaft 12 is provided on the stacking chamber 2 side, but may be configured on the sticking chamber 3 side. In FIG. 1, the two-dot chain line indicated by “B” represents the standby position of the internal transfer arm 11, and the two-dot chain line indicated by “C” represents the position of the internal transfer arm 11 in the sticking chamber 3. Yes.

  2A and 2B are diagrams showing the internal transfer arm 11, in which FIG. 2A shows the upper surface, and FIG. 2B shows the side surface. As shown in FIG. 2, the internal transfer arm 11 is formed by a transfer arm main body 13 and transfer arm target holding portions 14 a and 14 b provided at the lower part of the transfer arm main body 13. The internal transfer arm 11 is configured to hold the glass laminated wafer 20 by supporting the glass laminated wafer 20 from its lower surface by the transfer arm target holding portions 14a and 14b. Further, in a state where the glass laminated wafer 20 is held, the transfer arm main body 13 is located above the glass laminated wafer 20.

  The transfer arm body 13 of the internal transfer arm 11 has a frame shape that forms an opening, as shown in FIG. More specifically, a portion of the transfer arm body 13 that overlaps the glass laminated wafer 20 is configured by a hexagonal outer frame 21 that is hollowed out inside and a reinforcing portion 22 that imparts strength to the outer frame 21. Yes. The reinforcing portion 22 is formed integrally with the outer frame 21 so as to connect the two points of the outer frame 21. These are connected to the arm turning shaft 12 by the arm portion 23.

  As described above, heaters are attached to the upper and lower portions of the sticking chamber 3, and radiant heat is released from the heaters. The conventional holding means 111 having the transfer arm main body 113 as shown in FIG. 7 is configured so that the transfer arm main body 113 having a flat plate structure completely covers one diameter of the glass laminated wafer 20 while the glass laminated wafer 20 is being transferred. Thus, the heat to the glass laminated wafer 20 is shielded in this portion, and a temperature difference is generated in the glass laminated wafer 20. On the other hand, the transfer arm main body 13 has a frame shape in which the portion overlapping the glass laminated wafer 20 has an opening. Therefore, the portion that shields heat from above toward the glass laminated wafer 20 is the conventional holding means 111. Compared with the transfer arm main body 113, the size is small and distributed. Therefore, compared with the transfer arm main body 113 of the conventional holding means 111, the heat from above can reach the glass laminated wafer 20 more uniformly. Therefore, in the sticking apparatus 1 including the internal transfer arm 11, the temperature difference in the glass laminated wafer 20 that occurs during transfer can be reduced. And generation | occurrence | production of the curvature of the glass laminated wafer 20 is suppressed by the temperature difference in the glass laminated wafer 20 becoming small.

  The transfer arm main body 13 has a shape that can suppress a temperature difference generated in the glass laminated wafer 20 during transfer, that is, heat from above the transfer arm main body 113 of the conventional holding unit 111 reaches the glass laminated wafer 20. The shape is not limited to the above shape as long as it has a shape that can be easily formed. As another aspect of the transfer arm body 13 in the present embodiment, as shown in FIG. 3, a part of the hexagonal outer frame 21 of the transfer arm body 13 (corresponding to one side of the hexagon) is removed. Examples include a configuration ((a) in FIG. 3), a configuration without the reinforcing portion 22 ((b) in FIG. 3), and the like. In addition, any shape can be used as long as the shape allows the heat to reach the glass laminated wafer 20 more easily than the transfer arm main body 113 of the conventional holding unit 111 and functions as the transfer arm main body.

  The internal transfer arm 11 has a configuration in which the transfer arm target holding portions 14a and 14b support and hold the glass laminated wafer 20 at three points. In this embodiment, although it supports at three points, it should just be supported at at least three points, for example, the structure supported at four points may be sufficient.

  In the present embodiment, the two transfer arm target holding portions 14a and 14b have different shapes. Of the two transfer arm target holding portions, the transfer arm target holding portion 14a located on the side closer to the arm pivot 12 is a flat plate member having a square shape when viewed from above, and the glass laminated wafer 20 is attached to the transfer arm target holding portion 14a. One supporting point 19 is provided. On the other hand, among the two transfer arm target holding portions, the transfer arm target holding portion 14b located on the side far from the arm turning shaft 12 is a so-called arch-shaped member as viewed from above, and both tip portions of the arch shape are respectively provided. Is provided with a support point 19. The support point 19 is a part that contacts the glass laminated wafer 20 in the transfer arm target holding portions 14a and 14b. Each support point 19 is provided at a position that does not overlap the transfer arm body 13 in the vertical direction.

  The internal transfer arm that supports and holds the glass laminated wafer 20 at three points as compared with the conventional holding means 111 having a configuration in which the transfer arm target holding unit 114 holds the surface from the lower surface of the glass laminated wafer 20 at two locations. By using 11, the degree of warpage of the glass laminated wafer 20 caused by holding can be suppressed.

  Next, an effect | action at the time of conveying the glass laminated wafer 20 using the internal conveyance arm 11 of the sticking apparatus 1 is demonstrated. First, in each of a case where the glass laminated wafer 20 is transferred using the internal transfer arm 11 and a case where the arm portion is transferred using the holding means 111 having a conventional structure having a flat plate structure having no opening, a transfer process is performed. During this, temperatures at a plurality of points in the glass laminated wafer 20 were measured. The result is shown in FIG. FIG. 4 shows a temperature profile in the glass laminated wafer 20 when the conventional holding means 111 is used for conveyance. As described above, when the conventional holding unit 111 is used, the heat from the upper side is shielded at the position overlapping the transfer arm main body 113 in the glass laminated wafer 20, and therefore compared with the position not overlapping the transfer arm main body 113. , The temperature goes down. Therefore, as shown in FIG. 4, a temperature difference occurs in the glass laminated wafer 20. When transporting is performed using the conventional holding unit 111, the temperature difference between the points in the glass laminated wafer 20 is 4 ° C. before transport and increases to 12 ° C. after transport.

  On the other hand, when the internal transfer arm 11 is used, the temperature difference between the points in the glass laminated wafer 20 is smaller than when the conventional holding means 111 is used. When the internal transfer arm 11 is used, the temperature difference in the glass laminated wafer 20 is 1 ° C. before transfer and remains at 4 ° C. even after transfer.

  Further, as a result of measuring the warpage amount of these glass laminated wafers 20, the warp amount was 535 μm when transported using the conventional holding means 111, whereas the internal transport arm 11 was used for transport. In this case, the warping amount was suppressed to 103.1 μm. In addition, the result of the measurement of the temperature profile and the measurement of the amount of warpage is a result of measuring the glass laminated wafer 20 having a diameter of 300 mm.

  By the way, the internal transfer arm 11 in the present embodiment also has a configuration different from the conventional holding unit 111 with respect to the transfer arm target holding unit 14. That is, the transfer arm target holding portion 114 of the conventional holding means 111 is configured to hold the glass laminated wafer 20 from the lower surface thereof at two locations, whereas in the internal transfer arm 11, the transfer arm target holding portion. Reference numeral 14 denotes a configuration for supporting and holding the glass laminated wafer 20 at three points. Therefore, the conventional holding unit 111 (also referred to as a normal hand in this paragraph) or the transfer arm target holding unit 114 of the conventional holding unit 111 is laminated with glass like the transfer arm target holding unit 14 of the internal transfer arm 11. Using the holding means 111 ′ (also referred to as a three-point hand in this paragraph) replaced with the transfer arm target holding portion 114 ′ that supports the wafer 20 at three points, the glass laminated wafer 20 is transferred and glass stacking is performed. The amount of warpage generated on the wafer 20 was measured. In both cases, the transfer arm body is a flat plate-like member. As a result of measurement, when the normal hand was used, the amount of warpage generated in the glass laminated wafer 20 was 590.8 μm, whereas when the three-point hand was used, the amount of warpage was 269.6 μm. It was reduced to. Thus, the curvature which arises in the glass laminated wafer 20 can also be suppressed by changing the support method of the glass laminated wafer 20 to three-point support. Accordingly, the configuration of the transfer arm target holding unit 14 also contributes to the reduction in the amount of warping when the transfer is performed using the internal transfer arm 11.

  As described above, by carrying using the internal transfer arm 11 including the transfer arm main body having a shape that allows heat to reach the glass laminated wafer 20 more easily than the transfer arm main body 113 of the conventional holding unit 111, The amount of warpage that occurs can be suppressed. Further, by supporting and holding the glass laminated wafer 20 at at least three points, it is possible to further suppress the amount of warpage that occurs during conveyance.

  The transfer method in the present embodiment is a method in which the glass laminated wafer 20 is internally transferred via the gate 4 between the overlapping chamber 2 and the adhesive chamber 3 in the above-described application device 1. Is used to carry the glass laminated wafer 20 internally. The conveyance method in the present embodiment is the same as the conventional conveyance method (for example, the method described in Patent Document 2) except that the internal conveyance arm 11 is used as the internal conveyance means in the sticking device 1. . Further, the sticking method in the present embodiment is such that the wafer and the glass are superposed in the superposition chamber 2 of the sticking device 1, and the glass laminated wafer 20 obtained thereby is transferred to the sticking chamber 3 of the sticking device 1, In this method, the wafer and the glass are attached in the attaching chamber 3, and the internal transfer arm 11 is used to internally transfer the glass laminated wafer 20 to the attaching chamber 3. The pasting method in the present embodiment is the same as the conventional pasting method (for example, the method described in Patent Document 2) except that the internal transport arm 11 is used as the internal transport means in the pasting apparatus 1. . Further, the configuration of the pasting device 1 in the present embodiment other than the above-described points can be the same as that of a conventionally known pasting device (for example, the pasting device described in Patent Document 2). .

[Embodiment 2]
A second embodiment of the transport method according to the present invention will be described. For convenience of explanation, members having the same functions as those used in the above-described embodiment are denoted by the same reference numerals, and description thereof is omitted. The transfer method in the present embodiment is different from the internal transfer arm 11 in the above-described embodiment in the configuration of the internal transfer arm that holds the glass laminated wafer 20 during transfer. About another structure, it is the same as the structure in the above-mentioned embodiment.

  FIG. 5 shows a side surface of the internal transfer arm 15 used in the transfer method in the present embodiment. In the transfer method in the present embodiment, as holding means for holding while suppressing the temperature difference generated in the glass laminated wafer 20 during transfer, two transfer arm object holding units 17 that support the glass laminated wafer 20 from the lower surface thereof, An internal transfer arm 15 including a transfer arm main body 16 that fixes each transfer arm target holding unit 17 from above is used. A heater 18 is provided on the upper surface of the portion of the transfer arm body 16 that overlaps the glass laminated wafer 20. Unlike the transfer arm main body 13 in the above-described embodiment, the shape of the portion of the transfer arm main body 16 that overlaps the glass laminated wafer 20 is a flat plate structure having no opening. According to the transfer method in the present embodiment, the glass laminated wafer 20 can be transferred while heating the transfer arm body 16 in the portion overlapping the glass laminated wafer 20 during the transfer of the glass laminated wafer 20. Thereby, the part in the glass laminated wafer 20 where heat is shielded by the transfer arm body 16 having a flat plate structure can be forcibly heated. Therefore, as shown below, the temperature difference generated in the glass laminated wafer 20 can be reduced as compared with the case where the conveyance is performed using the conventional holding unit 111. In the transfer method of this embodiment, unlike the transfer method in the first embodiment, the glass laminated wafer 20 is supported and held at two points.

  In each of the case where the glass laminated wafer 20 is transferred using the internal transfer arm 15 having the heater 18 and the case where the glass holding wafer 111 is transferred using the conventional holding means 111 provided with no heater, the glass laminated wafer 20 is transferred during the transfer process. The temperature at a plurality of points was measured. The results are shown in FIG. 6A shows a temperature profile in the glass laminated wafer 20 when the conventional holding means 111 is used for transfer, and FIG. 6B shows a transfer method according to the present embodiment using the heater 18. The temperature profile of the glass laminated wafer 20 at the time of conveying by is shown. As shown in FIG. 6, when the glass laminated wafer 20 is conveyed using the internal conveyance arm 15 having the heater 18, the glass laminated wafer 20 is contained in the glass laminated wafer 20 as compared with the case where the glass laminated wafer 20 is conveyed using the conventional holding unit 111. The resulting temperature difference is reduced. This is because the heater 18 is provided in the transfer arm body 16 and the transfer arm body 16 is heated, so that heat is more applied to the portion of the glass laminated wafer 20 overlapping the transfer arm body 16 than in the case where the heater 18 is not provided. This is to convey a lot. In addition, when it conveys using the conventional holding means 111, the temperature difference between each point in the glass laminated wafer 20 is 4 degreeC before conveyance, and has risen to 12 degreeC after conveyance. On the other hand, when transported by the transport method of the present embodiment, the temperature difference between the points in the glass laminated wafer 20 is 0.6 ° C. before transport and remains at 4.2 ° C. even after transport.

  Furthermore, as a result of measuring the amount of warpage of these glass laminated wafers 20, when the conventional holding means 111 was used for transport, the amount of warpage was 500 μm, whereas the amount of warpage was transported by the transport method of this embodiment. In this case, the warping amount was suppressed to 100 μm.

  As described above, by performing the transfer using the internal transfer arm 11 including the transfer arm body 16 that can reduce the temperature difference generated in the glass laminated wafer 20 by heating using the heater 18, The amount of warpage that occurs can be suppressed.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately modified within the scope of the claims are also included in the technical scope of the present invention.

  INDUSTRIAL APPLICATION Since this invention can suppress the curvature which arises when conveying the laminated body of a board | substrate and a support body, it can utilize widely in the manufacture field | area of an industrial product.

DESCRIPTION OF SYMBOLS 1 Pasting apparatus 2 Stacking chamber 3 Pasting chamber 4 Gate 10 Internal transport means 11, 15 Internal transport arm 12 Arm pivot shaft 13, 16 Transport arm main body 14a, 14b, 17 Transport arm object holding portion 18 Heater 19 Support point 20 Glass lamination Wafer 21 Outer frame 22 Reinforcement part 23 Arm part

Claims (9)

Lamination of the superposed substrate and the support between a superposition chamber for superimposing the substrate and the support, and a pasting chamber for attaching the superposed substrate and the support A transport method for transporting a body,
A transport method characterized by transporting the laminate using a holding means that holds while suppressing a temperature difference generated in the laminate during transport. The holding means includes a support portion that supports the laminate from below, and an arm portion that fixes the support portion from above.
The transport method according to claim 1, wherein the arm portion has a shape capable of suppressing a temperature difference generated in the stacked body during transport.   The transport method according to claim 2, wherein the arm portion has a frame shape that forms an opening.   4. The transport method according to claim 2, wherein a portion of the support portion that contacts the stacked body is provided at a position that does not overlap the arm portion in the vertical direction.   The transport method according to claim 1, wherein the holding unit supports and holds the laminated body at at least three points. A method of attaching a substrate to a support,
A superposition step of superposing the substrate and the support in the superposition chamber;
A transporting step of transporting the laminate of the substrate and the support obtained by the superimposing step to a pasting chamber for pasting the substrate and the support;
A pasting step of pasting the substrate and the support in the pasting chamber,
In the said conveyance process, the said laminated body is conveyed using the conveying method of any one of Claims 1-5, The sticking method characterized by the above-mentioned. A superposition chamber for superposing the substrate and the support,
A pasting chamber for pasting the superposed substrate and the support, and
A transport means for transporting the stacked body of the stacked substrate and the support body between the overlapping chamber and the pasting chamber;
The transport means has a holding means having a support part for supporting the laminated body from below and an arm part for fixing the support part from above,
The above-mentioned arm part has a frame shape which forms an opening, A pasting device characterized by things.   The pasting device according to claim 7, wherein a portion of the support portion that contacts the stacked body is provided at a position that does not overlap the arm portion in the vertical direction.   The sticking device according to claim 7 or 8, wherein the holding means supports and holds the laminated body at at least three points.