ATE249909T1 - Trägervorrichtung für eine chemisch-mechanische poliervorrichtung, mit einem halterring und einer trägerplatte mit mehrzonaler drucksteuervorrichtung - Google Patents

Trägervorrichtung für eine chemisch-mechanische poliervorrichtung, mit einem halterring und einer trägerplatte mit mehrzonaler drucksteuervorrichtung

Info

Publication number
ATE249909T1
ATE249909T1 AT00919082T AT00919082T ATE249909T1 AT E249909 T1 ATE249909 T1 AT E249909T1 AT 00919082 T AT00919082 T AT 00919082T AT 00919082 T AT00919082 T AT 00919082T AT E249909 T1 ATE249909 T1 AT E249909T1
Authority
AT
Austria
Prior art keywords
wafer
carrier
stop plate
polishing
zone
Prior art date
Application number
AT00919082T
Other languages
English (en)
Inventor
Huey-Ming Wang
Gerard S Moloney
Scott Chin
John J Geraghty
William Dyson Jr
Tanlin K Dickey
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/261,112 external-priority patent/US6231428B1/en
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Application granted granted Critical
Publication of ATE249909T1 publication Critical patent/ATE249909T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
AT00919082T 1999-03-03 2000-02-24 Trägervorrichtung für eine chemisch-mechanische poliervorrichtung, mit einem halterring und einer trägerplatte mit mehrzonaler drucksteuervorrichtung ATE249909T1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/261,112 US6231428B1 (en) 1999-03-03 1999-03-03 Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US09/294,547 US6309290B1 (en) 1999-03-03 1999-04-19 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
US09/390,142 US6368189B1 (en) 1999-03-03 1999-09-03 Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
PCT/IB2000/000508 WO2000054933A2 (en) 1999-03-03 2000-02-24 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control

Publications (1)

Publication Number Publication Date
ATE249909T1 true ATE249909T1 (de) 2003-10-15

Family

ID=27401376

Family Applications (3)

Application Number Title Priority Date Filing Date
AT00919082T ATE249909T1 (de) 1999-03-03 2000-02-24 Trägervorrichtung für eine chemisch-mechanische poliervorrichtung, mit einem halterring und einer trägerplatte mit mehrzonaler drucksteuervorrichtung
AT04007064T ATE333342T1 (de) 1999-03-03 2000-03-01 Eine trägervorrichtung, mit einem direkten pneumatischen drucksystem um ein wafer zu polieren, verwendet in einer vorrichtung und einem verfahren zum chemisch-mechanischen polieren
AT00915318T ATE268247T1 (de) 1999-03-03 2000-03-01 Eine trägervorrichtung mit einem direkten pneumatischen drucksystem, um ein wafer zu polieren, verwendet in einer vorrichtung und einem verfahren zum chemisch-mechanischen polieren

Family Applications After (2)

Application Number Title Priority Date Filing Date
AT04007064T ATE333342T1 (de) 1999-03-03 2000-03-01 Eine trägervorrichtung, mit einem direkten pneumatischen drucksystem um ein wafer zu polieren, verwendet in einer vorrichtung und einem verfahren zum chemisch-mechanischen polieren
AT00915318T ATE268247T1 (de) 1999-03-03 2000-03-01 Eine trägervorrichtung mit einem direkten pneumatischen drucksystem, um ein wafer zu polieren, verwendet in einer vorrichtung und einem verfahren zum chemisch-mechanischen polieren

Country Status (8)

Country Link
US (3) US6368189B1 (de)
EP (5) EP1837122B1 (de)
JP (3) JP4212776B2 (de)
AT (3) ATE249909T1 (de)
DE (3) DE60005270T2 (de)
HK (1) HK1037156A1 (de)
TW (2) TWI243084B (de)
WO (2) WO2000054933A2 (de)

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US7311586B2 (en) 2007-12-25
EP1091829A2 (de) 2001-04-18
US20020077045A1 (en) 2002-06-20
TW534850B (en) 2003-06-01
WO2000051782A1 (en) 2000-09-08
TWI243084B (en) 2005-11-11
EP1837122A3 (de) 2007-10-17
WO2000054933A3 (en) 2001-01-25
EP1437197A1 (de) 2004-07-14
EP1075351A1 (de) 2001-02-14
EP1437197B1 (de) 2006-07-19
US7029382B2 (en) 2006-04-18
DE60005270T2 (de) 2004-09-30
DE60029490T2 (de) 2007-02-08
WO2000051782B1 (en) 2001-05-25
US20060128277A1 (en) 2006-06-15
JP2002538611A (ja) 2002-11-12
JP2004048082A (ja) 2004-02-12
EP1837122B1 (de) 2009-12-02
EP1091829B1 (de) 2003-09-17
ATE268247T1 (de) 2004-06-15
WO2000054933A2 (en) 2000-09-21
US6368189B1 (en) 2002-04-09
JP2002539620A (ja) 2002-11-19
DE60029490D1 (de) 2006-08-31
DE60011193D1 (de) 2004-07-08
EP1371449A2 (de) 2003-12-17
EP1371449A3 (de) 2004-04-21
ATE333342T1 (de) 2006-08-15
DE60011193T2 (de) 2005-07-07
JP3595266B2 (ja) 2004-12-02
EP1075351B1 (de) 2004-06-02
WO2000054933B1 (en) 2001-03-01
HK1037156A1 (en) 2002-02-01
DE60005270D1 (de) 2003-10-23
JP4212776B2 (ja) 2009-01-21
EP1837122A2 (de) 2007-09-26

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