KR101057228B1 - 경면연마장치의 가압헤드 - Google Patents
경면연마장치의 가압헤드 Download PDFInfo
- Publication number
- KR101057228B1 KR101057228B1 KR20080103161A KR20080103161A KR101057228B1 KR 101057228 B1 KR101057228 B1 KR 101057228B1 KR 20080103161 A KR20080103161 A KR 20080103161A KR 20080103161 A KR20080103161 A KR 20080103161A KR 101057228 B1 KR101057228 B1 KR 101057228B1
- Authority
- KR
- South Korea
- Prior art keywords
- pressure
- head
- mirror polishing
- wafer
- airbag
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/002—Grinding heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (5)
- 가압헤드의 몸체;상기 몸체의 아랫면의 중앙에 설치되고, 외부로부터 유입된 압축기체에 의하여 팽창되는 에어백; 및상기 몸체의 아랫면의 가장자리를 따라 설치되는 링 형상의 링패드;를 포함하고,상기 압축기체에 의하여 에어백이 팽창되는 정도를 조절함으로써 에어백과 링패드가 웨이퍼에 균일한 압력을 인가하는 것을 특징으로 하는 경면연마장치의 가압헤드.
- 제1항에 있어서,상기 아랫면의 중앙에는 미리 정해진 깊이와 직경의 요홈부가 형성되고, 에어백은 요홈부를 덮도록 설치되어 에어챔버를 형성하며,상기 요홈부에는 외부의 압축기체가 유입되는 유입관 및, 요홈부의 압축기체를 외부로 배출하는 배출관이 연결된 것을 특징으로 하는 경면연마장치의 가압헤드.
- 제2항에 있어서,유입관과 배출관은 몸체의 중심축 내부를 경유하고,유입관에는 에어챔버의 압력에 따라 압축기체의 유입을 조절하는 밸브가 설치되고, 배출관에는 에어챔버의 압력에 따라 압축기체의 배출을 조절하는 밸브가 설치된 것을 특징으로 하는 경면연마장치의 가압헤드.
- 제2항에 있어서,요홈부의 둘레에는 요홈라인이 형성되고, 에어백은 그 테두리가 요홈라인에 끼워져서 고정되는 것을 특징으로 하는 경면연마장치의 가압헤드.
- 제1항 내지 제4항 중 어느 한 항에 있어서,에어백은 평판 형상인 것을 특징으로 하는 경면연마장치의 가압헤드.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20080103161A KR101057228B1 (ko) | 2008-10-21 | 2008-10-21 | 경면연마장치의 가압헤드 |
CN2009801424056A CN102186628A (zh) | 2008-10-21 | 2009-10-21 | 抛光机、抛光机的压力板以及抛光方法 |
JP2011532026A JP5603338B2 (ja) | 2008-10-21 | 2009-10-21 | 鏡面研磨装置、その加圧ヘッド及び鏡面研磨方法 |
EP09822196.3A EP2349644A4 (en) | 2008-10-21 | 2009-10-21 | POLISHERS, PRINTING PLATE OF A POLISHER AND POLISHING METHOD |
PCT/KR2009/006074 WO2010047520A1 (en) | 2008-10-21 | 2009-10-21 | Polisher, pressure plate of the polisher and method of polishing |
US13/124,875 US9073171B2 (en) | 2008-10-21 | 2009-10-21 | Polisher, pressure plate of the polisher and method of polishing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20080103161A KR101057228B1 (ko) | 2008-10-21 | 2008-10-21 | 경면연마장치의 가압헤드 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100043909A KR20100043909A (ko) | 2010-04-29 |
KR101057228B1 true KR101057228B1 (ko) | 2011-08-16 |
Family
ID=42119485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20080103161A KR101057228B1 (ko) | 2008-10-21 | 2008-10-21 | 경면연마장치의 가압헤드 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9073171B2 (ko) |
EP (1) | EP2349644A4 (ko) |
JP (1) | JP5603338B2 (ko) |
KR (1) | KR101057228B1 (ko) |
CN (1) | CN102186628A (ko) |
WO (1) | WO2010047520A1 (ko) |
Families Citing this family (8)
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CN102172885B (zh) * | 2011-01-31 | 2013-05-15 | 北京通美晶体技术有限公司 | 衬底的抛光装置及其抛光的衬底 |
CN103659580A (zh) * | 2013-12-03 | 2014-03-26 | 常州深倍超硬材料有限公司 | 复合片平面研磨工装 |
CN103962927B (zh) * | 2014-05-16 | 2016-01-20 | 厦门大学 | 一种用于气囊抛光的对刀装置 |
CN105710743A (zh) * | 2016-05-06 | 2016-06-29 | 钦州学院 | 一种用于孔内壁的打磨工具 |
CN111975596A (zh) * | 2020-08-23 | 2020-11-24 | 吉林大学 | 一种适用于水下环境的仿形研磨装置 |
CN111958398A (zh) * | 2020-08-31 | 2020-11-20 | 莫一全 | 一种利用气囊夹紧旋转控制打磨时长的光学镜片加工装置 |
CN112476144B (zh) * | 2020-10-23 | 2022-03-29 | 厦门大学深圳研究院 | 一种工业机器人研抛加工系统的抑振气囊工具头 |
CN114310652A (zh) * | 2021-12-30 | 2022-04-12 | 金陵科技学院 | 一种软脆材料柔性研磨装置 |
Citations (2)
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JP2003151931A (ja) | 2001-11-12 | 2003-05-23 | Tokyo Seimitsu Co Ltd | ウェーハ研磨装置 |
KR100814069B1 (ko) * | 2007-03-30 | 2008-03-17 | 티아이씨덕흥 주식회사 | 에어백 방식의 웨이퍼 폴리싱 헤드 |
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2008
- 2008-10-21 KR KR20080103161A patent/KR101057228B1/ko active IP Right Grant
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2009
- 2009-10-21 CN CN2009801424056A patent/CN102186628A/zh active Pending
- 2009-10-21 JP JP2011532026A patent/JP5603338B2/ja active Active
- 2009-10-21 WO PCT/KR2009/006074 patent/WO2010047520A1/en active Application Filing
- 2009-10-21 EP EP09822196.3A patent/EP2349644A4/en not_active Withdrawn
- 2009-10-21 US US13/124,875 patent/US9073171B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003151931A (ja) | 2001-11-12 | 2003-05-23 | Tokyo Seimitsu Co Ltd | ウェーハ研磨装置 |
KR100814069B1 (ko) * | 2007-03-30 | 2008-03-17 | 티아이씨덕흥 주식회사 | 에어백 방식의 웨이퍼 폴리싱 헤드 |
Also Published As
Publication number | Publication date |
---|---|
EP2349644A4 (en) | 2015-04-08 |
JP2012506319A (ja) | 2012-03-15 |
US20110230123A1 (en) | 2011-09-22 |
WO2010047520A1 (en) | 2010-04-29 |
CN102186628A (zh) | 2011-09-14 |
EP2349644A1 (en) | 2011-08-03 |
US9073171B2 (en) | 2015-07-07 |
JP5603338B2 (ja) | 2014-10-08 |
KR20100043909A (ko) | 2010-04-29 |
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