TW302528B - - Google Patents

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Publication number
TW302528B
TW302528B TW085100065A TW85100065A TW302528B TW 302528 B TW302528 B TW 302528B TW 085100065 A TW085100065 A TW 085100065A TW 85100065 A TW85100065 A TW 85100065A TW 302528 B TW302528 B TW 302528B
Authority
TW
Taiwan
Prior art keywords
substrate
hole
bonding
item
recess
Prior art date
Application number
TW085100065A
Other languages
English (en)
Chinese (zh)
Original Assignee
Mitsubishi Electric Corp
Reden Semiconductor System Engineering Kk
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Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Reden Semiconductor System Engineering Kk filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of TW302528B publication Critical patent/TW302528B/zh

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    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
TW085100065A 1995-10-04 1996-01-03 TW302528B (enExample)

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JP25767195A JP3292798B2 (ja) 1995-10-04 1995-10-04 半導体装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104094405A (zh) * 2012-02-07 2014-10-08 株式会社尼康 拍摄单元及拍摄装置

Families Citing this family (196)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6013948A (en) 1995-11-27 2000-01-11 Micron Technology, Inc. Stackable chip scale semiconductor package with mating contacts on opposed surfaces
US6734545B1 (en) * 1995-11-29 2004-05-11 Hitachi, Ltd. BGA type semiconductor device and electronic equipment using the same
US6861290B1 (en) 1995-12-19 2005-03-01 Micron Technology, Inc. Flip-chip adaptor package for bare die
JPH09266268A (ja) 1996-03-28 1997-10-07 Mitsubishi Electric Corp 半導体装置の製造方法および半導体装置のパッケージ
KR19990072029A (ko) * 1996-10-10 1999-09-27 윤종용 마이크로웨이브 하이브리드 집적회로
JPH10150069A (ja) * 1996-11-21 1998-06-02 Sony Corp 半導体パッケージ及びその製造方法
US6078101A (en) * 1996-12-04 2000-06-20 Samsung Electronics Co., Ltd. High-power microwave-frequency hybrid integrated circuit
US6160705A (en) * 1997-05-09 2000-12-12 Texas Instruments Incorporated Ball grid array package and method using enhanced power and ground distribution circuitry
TW449844B (en) * 1997-05-17 2001-08-11 Hyundai Electronics Ind Ball grid array package having an integrated circuit chip
JP3012555B2 (ja) * 1997-05-29 2000-02-21 神戸日本電気ソフトウェア株式会社 多面体ｉｃパッケージ
US5981312A (en) * 1997-06-27 1999-11-09 International Business Machines Corporation Method for injection molded flip chip encapsulation
KR100255476B1 (ko) * 1997-06-30 2000-05-01 김영환 볼 그리드 어레이 패키지
JP3622435B2 (ja) * 1997-08-06 2005-02-23 富士通株式会社 半導体装置とその製造方法
JP3638771B2 (ja) * 1997-12-22 2005-04-13 沖電気工業株式会社 半導体装置
JP3859340B2 (ja) * 1998-01-06 2006-12-20 三菱電機株式会社 半導体装置
JPH11289023A (ja) * 1998-04-02 1999-10-19 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP3097653B2 (ja) 1998-04-17 2000-10-10 日本電気株式会社 半導体装置用パッケージおよびその製造方法
USRE43112E1 (en) 1998-05-04 2012-01-17 Round Rock Research, Llc Stackable ball grid array package
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US7332375B1 (en) 1998-06-24 2008-02-19 Amkor Technology, Inc. Method of making an integrated circuit package
US7112474B1 (en) 1998-06-24 2006-09-26 Amkor Technology, Inc. Method of making an integrated circuit package
US7030474B1 (en) 1998-06-24 2006-04-18 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6143981A (en) 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
JP2000031343A (ja) * 1998-07-09 2000-01-28 Texas Instr Japan Ltd 半導体装置
TW399309B (en) * 1998-09-30 2000-07-21 World Wiser Electronics Inc Cavity-down package structure with thermal via
US6753922B1 (en) 1998-10-13 2004-06-22 Intel Corporation Image sensor mounted by mass reflow
US5999415A (en) * 1998-11-18 1999-12-07 Vlsi Technology, Inc. BGA package using PCB and tape in a die-down configuration
US6448633B1 (en) 1998-11-20 2002-09-10 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
JP2002533926A (ja) * 1998-12-21 2002-10-08 インテル・コーポレーション 埋込みフレームを有する窓付き非セラミック・パッケージ
US6396143B1 (en) * 1999-04-30 2002-05-28 Mitsubishi Gas Chemical Company, Inc. Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring board
US6146749A (en) * 1999-05-03 2000-11-14 Jsr Corporation Low dielectric composition, insulating material, sealing material, and circuit board
JP2000331835A (ja) * 1999-05-21 2000-11-30 Taiyo Yuden Co Ltd 積層電子部品及び回路モジュール
JP3368870B2 (ja) * 1999-06-25 2003-01-20 日本電気株式会社 パッケージ基板及びこれを備えた半導体装置
JP3619395B2 (ja) * 1999-07-30 2005-02-09 京セラ株式会社 半導体素子内蔵配線基板およびその製造方法
KR100379089B1 (ko) 1999-10-15 2003-04-08 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지
KR100403142B1 (ko) 1999-10-15 2003-10-30 앰코 테크놀로지 코리아 주식회사 반도체패키지
KR20010037247A (ko) 1999-10-15 2001-05-07 마이클 디. 오브라이언 반도체패키지
JP4245754B2 (ja) * 1999-11-02 2009-04-02 パナソニック株式会社 半導体装置
US6580159B1 (en) 1999-11-05 2003-06-17 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
KR100421774B1 (ko) 1999-12-16 2004-03-10 앰코 테크놀로지 코리아 주식회사 반도체패키지 및 그 제조 방법
KR100583494B1 (ko) 2000-03-25 2006-05-24 앰코 테크놀로지 코리아 주식회사 반도체패키지
US7042068B2 (en) 2000-04-27 2006-05-09 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
TW511409B (en) * 2000-05-16 2002-11-21 Hitachi Aic Inc Printed wiring board having cavity for mounting electronic parts therein and method for manufacturing thereof
US6790760B1 (en) * 2000-07-21 2004-09-14 Agere Systems Inc. Method of manufacturing an integrated circuit package
US6509642B1 (en) * 2000-07-28 2003-01-21 Agere Systems Inc. Integrated circuit package
US6809424B2 (en) * 2000-12-19 2004-10-26 Harris Corporation Method for making electronic devices including silicon and LTCC and devices produced thereby
KR20020058209A (ko) 2000-12-29 2002-07-12 마이클 디. 오브라이언 반도체패키지
KR100731007B1 (ko) * 2001-01-15 2007-06-22 앰코 테크놀로지 코리아 주식회사 적층형 반도체 패키지
US6545345B1 (en) 2001-03-20 2003-04-08 Amkor Technology, Inc. Mounting for a package containing a chip
US6967395B1 (en) 2001-03-20 2005-11-22 Amkor Technology, Inc. Mounting for a package containing a chip
KR100393448B1 (ko) 2001-03-27 2003-08-02 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조 방법
KR100369393B1 (ko) 2001-03-27 2003-02-05 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지와 그 제조 방법
US7064009B1 (en) 2001-04-04 2006-06-20 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7045883B1 (en) 2001-04-04 2006-05-16 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
KR100396796B1 (ko) * 2001-07-27 2003-09-02 삼성전기주식회사 고성능 ｂｇａ 기판의 제조방법 및 상기 방법에 적용되는지그
US6790710B2 (en) 2002-01-31 2004-09-14 Asat Limited Method of manufacturing an integrated circuit package
US6900527B1 (en) 2001-09-19 2005-05-31 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US7485952B1 (en) 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
US6630726B1 (en) 2001-11-07 2003-10-07 Amkor Technology, Inc. Power semiconductor package with strap
US20030150641A1 (en) * 2002-02-14 2003-08-14 Noyan Kinayman Multilayer package for a semiconductor device
US6977436B2 (en) * 2002-02-14 2005-12-20 Macronix International Co. Ltd. Semiconductor packaging device
JP2003258141A (ja) * 2002-02-27 2003-09-12 Nec Compound Semiconductor Devices Ltd 電子部品及びその製造方法
US20030178719A1 (en) * 2002-03-22 2003-09-25 Combs Edward G. Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package
US6608376B1 (en) * 2002-03-25 2003-08-19 Lsi Logic Corporation Integrated circuit package substrate with high density routing mechanism
US6608366B1 (en) 2002-04-15 2003-08-19 Harry J. Fogelson Lead frame with plated end leads
US6818973B1 (en) 2002-09-09 2004-11-16 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US6919620B1 (en) 2002-09-17 2005-07-19 Amkor Technology, Inc. Compact flash memory card with clamshell leadframe
JP3908148B2 (ja) * 2002-10-28 2007-04-25 シャープ株式会社 積層型半導体装置
US7723210B2 (en) 2002-11-08 2010-05-25 Amkor Technology, Inc. Direct-write wafer level chip scale package
US6905914B1 (en) 2002-11-08 2005-06-14 Amkor Technology, Inc. Wafer level package and fabrication method
US7361533B1 (en) 2002-11-08 2008-04-22 Amkor Technology, Inc. Stacked embedded leadframe
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
US6798047B1 (en) 2002-12-26 2004-09-28 Amkor Technology, Inc. Pre-molded leadframe
JP2004214249A (ja) * 2002-12-27 2004-07-29 Renesas Technology Corp 半導体モジュール
KR100701378B1 (ko) * 2002-12-30 2007-03-28 동부일렉트로닉스 주식회사 반도체 소자 패키징 방법
US6847099B1 (en) 2003-02-05 2005-01-25 Amkor Technology Inc. Offset etched corner leads for semiconductor package
US6750545B1 (en) 2003-02-28 2004-06-15 Amkor Technology, Inc. Semiconductor package capable of die stacking
US6927483B1 (en) 2003-03-07 2005-08-09 Amkor Technology, Inc. Semiconductor package exhibiting efficient lead placement
AU2003901146A0 (en) * 2003-03-12 2003-03-27 Cochlear Limited Feedthrough assembly
US6794740B1 (en) 2003-03-13 2004-09-21 Amkor Technology, Inc. Leadframe package for semiconductor devices
US7001799B1 (en) 2003-03-13 2006-02-21 Amkor Technology, Inc. Method of making a leadframe for semiconductor devices
US6879034B1 (en) 2003-05-01 2005-04-12 Amkor Technology, Inc. Semiconductor package including low temperature co-fired ceramic substrate
US7095103B1 (en) 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
US7116557B1 (en) * 2003-05-23 2006-10-03 Sti Electronics, Inc. Imbedded component integrated circuit assembly and method of making same
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US6897550B1 (en) 2003-06-11 2005-05-24 Amkor Technology, Inc. Fully-molded leadframe stand-off feature
US7315000B2 (en) * 2003-07-27 2008-01-01 Sandisk Il Ltd. Electronic module with dual connectivity
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US7138707B1 (en) 2003-10-21 2006-11-21 Amkor Technology, Inc. Semiconductor package including leads and conductive posts for providing increased functionality
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7948069B2 (en) * 2004-01-28 2011-05-24 International Rectifier Corporation Surface mountable hermetically sealed package
US8395253B2 (en) * 2004-01-28 2013-03-12 International Rectifier Corporation Hermetic surface mounted power package
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US8742944B2 (en) * 2004-06-21 2014-06-03 Siemens Energy, Inc. Apparatus and method of monitoring operating parameters of a gas turbine
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method
TW200612345A (en) * 2004-10-07 2006-04-16 Advanced Flash Memory Card Technology Co Ltd Structure of memory card and producing method thereof
US7405474B1 (en) * 2004-10-12 2008-07-29 Cypress Semiconductor Corporation Low cost thermally enhanced semiconductor package
US7217991B1 (en) 2004-10-22 2007-05-15 Amkor Technology, Inc. Fan-in leadframe semiconductor package
TWI321342B (en) * 2004-11-05 2010-03-01 Altus Technology Inc An integrate circuit chip encapsulation and the method of manufacturing it
TWM266539U (en) * 2004-11-05 2005-06-01 Altus Technology Inc Integrate circuit chip encapsulation
US7683393B2 (en) * 2004-12-07 2010-03-23 Ngk Spark Plug Co., Ltd. Wiring substrate for mounting light emitting element
JP4426482B2 (ja) 2005-02-28 2010-03-03 Ｏｋｉセミコンダクタ株式会社 パッケージ基台およびその製造方法、並びにそのパッケージ基台を備えた半導体パッケージ
US7408244B2 (en) * 2005-03-16 2008-08-05 Advanced Semiconductor Engineering, Inc. Semiconductor package and stack arrangement thereof
EP1720386B1 (en) * 2005-04-25 2015-06-03 NGK Spark Plug Company Limited Wiring board
KR100702970B1 (ko) * 2005-07-06 2007-04-03 삼성전자주식회사 이원 접속 방식을 가지는 반도체 패키지 및 그 제조 방법
JP4904769B2 (ja) * 2005-10-21 2012-03-28 富士通セミコンダクター株式会社 半導体装置
EP1949770B1 (en) * 2005-11-09 2018-12-12 Koninklijke Philips N.V. Method of manufacturing a package carrier for enclosing at least one microelectronic element and method of manufacturing a diagnostic device
US7507603B1 (en) 2005-12-02 2009-03-24 Amkor Technology, Inc. Etch singulated semiconductor package
US7572681B1 (en) 2005-12-08 2009-08-11 Amkor Technology, Inc. Embedded electronic component package
US9713258B2 (en) * 2006-04-27 2017-07-18 International Business Machines Corporation Integrated circuit chip packaging
DE102006023165B4 (de) * 2006-05-17 2008-02-14 Infineon Technologies Ag Verfahren zur Herstellung eines akustischen Spiegels aus alternierend angeordneten Schichten hoher und niedriger akustischer Impedanz
US7902660B1 (en) 2006-05-24 2011-03-08 Amkor Technology, Inc. Substrate for semiconductor device and manufacturing method thereof
US7968998B1 (en) 2006-06-21 2011-06-28 Amkor Technology, Inc. Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package
US20080032454A1 (en) * 2006-08-07 2008-02-07 Matthew Romig Thermally Enhanced BGA Package Substrate Structure and Methods
US7687893B2 (en) 2006-12-27 2010-03-30 Amkor Technology, Inc. Semiconductor package having leadframe with exposed anchor pads
US7829990B1 (en) 2007-01-18 2010-11-09 Amkor Technology, Inc. Stackable semiconductor package including laminate interposer
US8159828B2 (en) * 2007-02-23 2012-04-17 Alpha & Omega Semiconductor, Inc. Low profile flip chip power module and method of making
US7982297B1 (en) 2007-03-06 2011-07-19 Amkor Technology, Inc. Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same
US7977774B2 (en) 2007-07-10 2011-07-12 Amkor Technology, Inc. Fusion quad flat semiconductor package
US20090032926A1 (en) * 2007-07-31 2009-02-05 Advanced Micro Devices, Inc. Integrated Support Structure for Stacked Semiconductors With Overhang
US7687899B1 (en) 2007-08-07 2010-03-30 Amkor Technology, Inc. Dual laminate package structure with embedded elements
US7777351B1 (en) 2007-10-01 2010-08-17 Amkor Technology, Inc. Thin stacked interposer package
US8089159B1 (en) 2007-10-03 2012-01-03 Amkor Technology, Inc. Semiconductor package with increased I/O density and method of making the same
DE102007056269A1 (de) * 2007-10-22 2009-04-23 Rohde & Schwarz Gmbh & Co. Kg Gekühltes Multichipmodul
US20090112975A1 (en) * 2007-10-31 2009-04-30 Microsoft Corporation Pre-fetching in distributed computing environments
US7847386B1 (en) 2007-11-05 2010-12-07 Amkor Technology, Inc. Reduced size stacked semiconductor package and method of making the same
US7956453B1 (en) 2008-01-16 2011-06-07 Amkor Technology, Inc. Semiconductor package with patterning layer and method of making same
US7723852B1 (en) 2008-01-21 2010-05-25 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8067821B1 (en) 2008-04-10 2011-11-29 Amkor Technology, Inc. Flat semiconductor package with half package molding
US7768135B1 (en) 2008-04-17 2010-08-03 Amkor Technology, Inc. Semiconductor package with fast power-up cycle and method of making same
US7808084B1 (en) 2008-05-06 2010-10-05 Amkor Technology, Inc. Semiconductor package with half-etched locking features
US20090296310A1 (en) * 2008-06-03 2009-12-03 Azuma Chikara Chip capacitor precursors, packaged semiconductors, and assembly method for converting the precursors to capacitors
US8188379B2 (en) * 2008-07-04 2012-05-29 Unimicron Technology Corp. Package substrate structure
US8125064B1 (en) 2008-07-28 2012-02-28 Amkor Technology, Inc. Increased I/O semiconductor package and method of making same
US8184453B1 (en) 2008-07-31 2012-05-22 Amkor Technology, Inc. Increased capacity semiconductor package
US8076587B2 (en) * 2008-09-26 2011-12-13 Siemens Energy, Inc. Printed circuit board for harsh environments
US7847392B1 (en) 2008-09-30 2010-12-07 Amkor Technology, Inc. Semiconductor device including leadframe with increased I/O
US7989933B1 (en) 2008-10-06 2011-08-02 Amkor Technology, Inc. Increased I/O leadframe and semiconductor device including same
US8008758B1 (en) 2008-10-27 2011-08-30 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe
US8089145B1 (en) 2008-11-17 2012-01-03 Amkor Technology, Inc. Semiconductor device including increased capacity leadframe
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US7875963B1 (en) 2008-11-21 2011-01-25 Amkor Technology, Inc. Semiconductor device including leadframe having power bars and increased I/O
US7982298B1 (en) 2008-12-03 2011-07-19 Amkor Technology, Inc. Package in package semiconductor device
US8487420B1 (en) 2008-12-08 2013-07-16 Amkor Technology, Inc. Package in package semiconductor device with film over wire
US8680656B1 (en) 2009-01-05 2014-03-25 Amkor Technology, Inc. Leadframe structure for concentrated photovoltaic receiver package
US20170117214A1 (en) 2009-01-05 2017-04-27 Amkor Technology, Inc. Semiconductor device with through-mold via
US8058715B1 (en) 2009-01-09 2011-11-15 Amkor Technology, Inc. Package in package device for RF transceiver module
US8026589B1 (en) 2009-02-23 2011-09-27 Amkor Technology, Inc. Reduced profile stackable semiconductor package
US7960818B1 (en) 2009-03-04 2011-06-14 Amkor Technology, Inc. Conformal shield on punch QFN semiconductor package
US8575742B1 (en) 2009-04-06 2013-11-05 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including power bars
US20110001230A1 (en) * 2009-07-02 2011-01-06 Conexant Systems, Inc. Systems and Methods of Improved Heat Dissipation with Variable Pitch Grid Array Packaging
US20110051352A1 (en) * 2009-09-02 2011-03-03 Kim Gyu Han Stacking-Type USB Memory Device And Method Of Fabricating The Same
US9875911B2 (en) * 2009-09-23 2018-01-23 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming interposer with opening to contain semiconductor die
US8796561B1 (en) 2009-10-05 2014-08-05 Amkor Technology, Inc. Fan out build up substrate stackable package and method
KR20110041313A (ko) * 2009-10-15 2011-04-21 에스티에스반도체통신 주식회사 적층형 고상 드라이브 및 그 제조 방법
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9691734B1 (en) 2009-12-07 2017-06-27 Amkor Technology, Inc. Method of forming a plurality of electronic component packages
US20110147069A1 (en) * 2009-12-18 2011-06-23 International Business Machines Corporation Multi-tiered Circuit Board and Method of Manufacture
JP5442424B2 (ja) 2009-12-25 2014-03-12 新光電気工業株式会社 半導体装置
WO2011089936A1 (ja) * 2010-01-22 2011-07-28 日本電気株式会社 機能素子内蔵基板及び配線基板
US8324511B1 (en) 2010-04-06 2012-12-04 Amkor Technology, Inc. Through via nub reveal method and structure
US8294276B1 (en) 2010-05-27 2012-10-23 Amkor Technology, Inc. Semiconductor device and fabricating method thereof
US8440554B1 (en) 2010-08-02 2013-05-14 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US8487445B1 (en) 2010-10-05 2013-07-16 Amkor Technology, Inc. Semiconductor device having through electrodes protruding from dielectric layer
US8791501B1 (en) 2010-12-03 2014-07-29 Amkor Technology, Inc. Integrated passive device structure and method
US8390130B1 (en) 2011-01-06 2013-03-05 Amkor Technology, Inc. Through via recessed reveal structure and method
TWI557183B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 矽氧烷組成物、以及包含其之光電裝置
US8648450B1 (en) 2011-01-27 2014-02-11 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands
US8552548B1 (en) 2011-11-29 2013-10-08 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9704725B1 (en) 2012-03-06 2017-07-11 Amkor Technology, Inc. Semiconductor device with leadframe configured to facilitate reduced burr formation
JP5768745B2 (ja) * 2012-03-08 2015-08-26 日立化成株式会社 感光性樹脂組成物からなる接着剤
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9048298B1 (en) 2012-03-29 2015-06-02 Amkor Technology, Inc. Backside warpage control structure and fabrication method
KR101311707B1 (ko) * 2013-03-26 2013-09-25 주식회사 심텍 다이스택 패키지 및 제조 방법
JP2014207388A (ja) * 2013-04-15 2014-10-30 株式会社東芝 半導体パッケージ
KR101486790B1 (ko) 2013-05-02 2015-01-28 앰코 테크놀로지 코리아 주식회사 강성보강부를 갖는 마이크로 리드프레임
KR101563911B1 (ko) 2013-10-24 2015-10-28 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US9596751B2 (en) * 2014-04-23 2017-03-14 Kyocera Corporation Substrate for mounting electronic element and electronic device
US9673122B2 (en) 2014-05-02 2017-06-06 Amkor Technology, Inc. Micro lead frame structure having reinforcing portions and method
US9693445B2 (en) * 2015-01-30 2017-06-27 Avago Technologies General Ip (Singapore) Pte. Ltd. Printed circuit board with thermal via
CN106803500B (zh) * 2016-11-28 2019-02-22 深兰科技（上海）有限公司 裸芯片与印制电路板连接和保护结构及其制造方法
CN106847719B (zh) * 2016-11-28 2019-08-13 西安科锐盛创新科技有限公司 应用于测试的裸芯片结构及其制造方法
CN106856177B (zh) * 2016-11-28 2019-07-02 嘉兴鹏武电子科技有限公司 应用于测试的裸芯片结构及其制造方法
US20190355700A1 (en) * 2016-12-28 2019-11-21 Intel Corporation Techniques for windowed substrate integrated circuit packages
JP6955460B2 (ja) * 2018-02-27 2021-10-27 京セラ株式会社 電子素子実装用基板、電子素子実装用母基板、電子装置および電子モジュール
US10916529B2 (en) 2018-03-29 2021-02-09 Taiwan Semiconductor Manufacturing Company, Ltd. Electronics card including multi-chip module
CN111863739B (zh) * 2020-07-29 2022-04-08 深圳市邦测检测技术有限公司 一种rf射频通信模块及其制造方法
JP7574620B2 (ja) * 2020-11-19 2024-10-29 富士電機株式会社 モジュール型半導体装置およびモジュール型半導体装置の製造方法
KR102708838B1 (ko) * 2022-12-08 2024-09-24 한국전자기술연구원 Rf 전치단 모듈 패키지
WO2024246986A1 (ja) * 2023-05-26 2024-12-05 株式会社Fuji 回路形成方法、および回路形成装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4922324A (en) * 1987-01-20 1990-05-01 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device
JPH06103731B2 (ja) * 1987-08-25 1994-12-14 日本電気株式会社 半導体パッケ−ジ
US5008734A (en) * 1989-12-20 1991-04-16 National Semiconductor Corporation Stadium-stepped package for an integrated circuit with air dielectric
CA2047486C (en) * 1990-07-21 2002-03-05 Shigeru Katayama Semiconductor device and method for manufacturing the same
JPH04107958A (ja) * 1990-08-29 1992-04-09 Toshiba Corp 半導体パッケージ
JPH04245459A (ja) * 1991-01-31 1992-09-02 Nec Corp 半導体装置
JPH04303955A (ja) * 1991-03-30 1992-10-27 Shinko Electric Ind Co Ltd 半導体装置
US5491362A (en) * 1992-04-30 1996-02-13 Vlsi Technology, Inc. Package structure having accessible chip
US5521332A (en) * 1992-08-31 1996-05-28 Kyocera Corporation High dielectric layer-containing alumina-based wiring substrate and package for semiconductor device
US5422615A (en) * 1992-09-14 1995-06-06 Hitachi, Ltd. High frequency circuit device
AU6582294A (en) * 1993-04-23 1994-11-21 Nihon Micron Kabushiki Kaisha Ic package and method of its manufacture
JPH0722645A (ja) * 1993-06-17 1995-01-24 Matsushita Electric Ind Co Ltd 非線形光学素子の製造方法
US5455456A (en) * 1993-09-15 1995-10-03 Lsi Logic Corporation Integrated circuit package lid
US5463250A (en) * 1994-04-29 1995-10-31 Westinghouse Electric Corp. Semiconductor component package
US5541450A (en) * 1994-11-02 1996-07-30 Motorola, Inc. Low-profile ball-grid array semiconductor package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104094405A (zh) * 2012-02-07 2014-10-08 株式会社尼康 拍摄单元及拍摄装置
CN104094405B (zh) * 2012-02-07 2019-05-17 株式会社尼康 拍摄单元及拍摄装置
US10304752B2 (en) 2012-02-07 2019-05-28 Nikon Corporation Imaging unit and imaging apparatus
US11887839B2 (en) 2012-02-07 2024-01-30 Nikon Corporation Imaging unit and imaging apparatus

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