TW200712098A - Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto - Google Patents

Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto

Info

Publication number
TW200712098A
TW200712098A TW095128230A TW95128230A TW200712098A TW 200712098 A TW200712098 A TW 200712098A TW 095128230 A TW095128230 A TW 095128230A TW 95128230 A TW95128230 A TW 95128230A TW 200712098 A TW200712098 A TW 200712098A
Authority
TW
Taiwan
Prior art keywords
polyimide
films
compositions
methods
perfluorinated
Prior art date
Application number
TW095128230A
Other languages
English (en)
Chinese (zh)
Inventor
Christopher Dennis Simone
Brian C Auman
Peter Francis Carcia
Richard Alan Wessel
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW200712098A publication Critical patent/TW200712098A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/258—Alkali metal or alkaline earth metal or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/259—Silicic material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/269—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension including synthetic resin or polymer layer or component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW095128230A 2005-08-03 2006-08-02 Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto TW200712098A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/195,902 US7550194B2 (en) 2005-08-03 2005-08-03 Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto

Publications (1)

Publication Number Publication Date
TW200712098A true TW200712098A (en) 2007-04-01

Family

ID=37076307

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128230A TW200712098A (en) 2005-08-03 2006-08-02 Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto

Country Status (4)

Country Link
US (1) US7550194B2 (enExample)
EP (1) EP1749850A1 (enExample)
JP (1) JP2007046054A (enExample)
TW (1) TW200712098A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102159628A (zh) * 2008-09-26 2011-08-17 可隆工业株式会社 聚酰亚胺薄膜
CN101959935B (zh) * 2008-02-25 2012-08-22 日立化成杜邦微系统股份有限公司 聚酰亚胺前体组合物、聚酰亚胺薄膜及透明挠性薄膜
CN103660458A (zh) * 2012-09-24 2014-03-26 新日铁住金化学株式会社 聚酰亚胺层叠体及其制造方法
CN104015466A (zh) * 2013-02-28 2014-09-03 新日铁住金化学株式会社 层叠部件的制造方法
TWI567135B (zh) * 2014-02-14 2017-01-21 旭化成電子材料股份有限公司 A polyimide precursor and a resin composition containing the same
CN109734907A (zh) * 2018-12-04 2019-05-10 株洲时代新材料科技股份有限公司 聚酰亚胺前驱体、前驱体组合物、聚酰亚胺、耐高温透明聚酰亚胺薄膜及其制备方法
CN114763436A (zh) * 2021-01-15 2022-07-19 达迈科技股份有限公司 一种低介电损失之聚酰亚胺膜

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5086526B2 (ja) * 2004-09-24 2012-11-28 富士フイルム株式会社 ポリマー、該ポリマーの製造方法、光学フィルムおよび画像表示装置
KR101227317B1 (ko) * 2007-07-31 2013-01-28 코오롱인더스트리 주식회사 열안정성이 개선된 폴리이미드 필름
TWI435902B (zh) * 2007-08-20 2014-05-01 Kolon Inc 聚亞醯胺膜
KR101225842B1 (ko) * 2007-08-27 2013-01-23 코오롱인더스트리 주식회사 무색투명한 폴리이미드 필름
JP5383343B2 (ja) * 2008-06-26 2014-01-08 新日鉄住金化学株式会社 白色ポリイミドフィルム
JP5383286B2 (ja) * 2009-03-31 2014-01-08 新日鉄住金化学株式会社 白色ポリイミドの製造方法
KR101064816B1 (ko) * 2009-04-03 2011-09-14 주식회사 두산 폴리아믹산 용액, 폴리이미드 수지 및 이를 이용한 연성 금속박 적층판
WO2010131442A1 (ja) * 2009-05-12 2010-11-18 株式会社カネカ ポリアミド酸溶液の製造方法及びポリイミドフィルム
US9631054B2 (en) 2010-07-23 2017-04-25 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US8574720B2 (en) 2009-08-03 2013-11-05 E.I. Du Pont De Nemours & Company Matte finish polyimide films and methods relating thereto
US11203192B2 (en) 2009-08-03 2021-12-21 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US9926415B2 (en) 2010-08-05 2018-03-27 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US8541107B2 (en) * 2009-08-13 2013-09-24 E. I. Du Pont De Nemours And Company Pigmented polyimide films and methods relating thereto
KR101075481B1 (ko) * 2009-09-29 2011-10-21 경희대학교 산학협력단 용액공정을 이용한 플렉서블 기판의 제조방법
WO2011086627A1 (ja) * 2010-01-15 2011-07-21 株式会社カネカ ポリイミドフィルム及びその製造方法
JP5598086B2 (ja) * 2010-05-21 2014-10-01 株式会社カネカ ガスバリアフィルム
JP5834573B2 (ja) * 2010-12-02 2015-12-24 宇部興産株式会社 ２，３，３’，４’−ビフェニルテトラカルボン酸二無水物粉末の精製方法、粉末、及びそれを用いたポリイミド
US8853723B2 (en) 2010-08-18 2014-10-07 E. I. Du Pont De Nemours And Company Light emitting diode assembly and thermal control blanket and methods relating thereto
DE112011102726B4 (de) 2010-08-18 2022-02-03 E.I. Du Pont De Nemours And Co. Leuchtdioden-Baugruppe und thermische Sicherungsdecke
JP5667392B2 (ja) * 2010-08-23 2015-02-12 株式会社カネカ 積層体、及びその利用
US8288471B2 (en) * 2010-10-18 2012-10-16 Taimide Technology, Inc. White polyimide film and manufacture thereof
KR101543478B1 (ko) * 2010-12-31 2015-08-10 코오롱인더스트리 주식회사 투명 폴리이미드 필름 및 그 제조방법
TWI462952B (zh) * 2011-09-02 2014-12-01 Taimide Technology Inc 低色度聚醯亞胺膜及其製法
US20130083540A1 (en) * 2011-09-30 2013-04-04 Taimide Technology Incorporation Polymer film and its application in a lighting assembly
KR101459178B1 (ko) * 2011-09-30 2014-11-07 코오롱인더스트리 주식회사 공중합 폴리아마이드-이미드 필름 및 공중합 폴리아마이드-이미드의 제조방법
TWI512011B (zh) * 2011-10-17 2015-12-11 Asia Electronic Material Co Polyimide copolymer and its preparation and coating film
KR101688173B1 (ko) * 2011-12-26 2016-12-21 코오롱인더스트리 주식회사 플라스틱 기판
KR101646283B1 (ko) * 2011-12-27 2016-08-08 코오롱인더스트리 주식회사 폴리아믹산 용액
KR101339664B1 (ko) 2011-12-30 2013-12-10 웅진케미칼 주식회사 저열팽창성 투명 폴리이미드
KR101339673B1 (ko) 2011-12-30 2013-12-10 웅진케미칼 주식회사 저열팽창성 투명 폴리이미드
CN102634021B (zh) * 2012-03-30 2013-12-25 中国科学院宁波材料技术与工程研究所 一种热塑性聚酰亚胺树脂及其制备方法
WO2013191180A1 (ja) 2012-06-19 2013-12-27 新日鉄住金化学株式会社 表示装置及びその製造方法、並びに、表示装置支持基材用ポリイミドフィルム及びその製造方法
JP6580808B2 (ja) * 2012-06-19 2019-09-25 日鉄ケミカル＆マテリアル株式会社 表示装置及びその製造方法
CN104663004B (zh) * 2012-06-22 2018-12-18 E.I.内穆尔杜邦公司 电路板
EP2865251A1 (en) * 2012-06-22 2015-04-29 E. I. Du Pont de Nemours and Company Circuit board
JP5946348B2 (ja) * 2012-07-20 2016-07-06 新日鉄住金化学株式会社 透明導電性フィルム及びその製造用ポリイミドフィルム
KR20140049382A (ko) * 2012-10-17 2014-04-25 에스케이씨 주식회사 폴리이미드 필름 및 이의 제조방법
KR20200105976A (ko) 2012-11-16 2020-09-09 닛산 가가쿠 가부시키가이샤 폴리이미드 수지필름 및 폴리이미드 수지필름으로 이루어지는 전자디바이스용 기판
JP5478701B2 (ja) * 2012-11-30 2014-04-23 新日鉄住金化学株式会社 ポリイミドフィルム
JP5985977B2 (ja) * 2012-12-18 2016-09-06 株式会社カネカ ポリイミド樹脂溶液
KR101721555B1 (ko) * 2013-02-22 2017-03-30 (주)아이피아이테크 폴리이미드 수지의 제조방법
US9493614B2 (en) * 2013-02-26 2016-11-15 Toray Industries, Inc. Polyimide precursor, polyimide, flexible substrate prepared therewith, color filter and production method thereof, and flexible display device
JP2014172978A (ja) * 2013-03-08 2014-09-22 Sumitomo Bakelite Co Ltd 共重合ポリイミド前駆体および共重合ポリイミド
KR101928598B1 (ko) * 2013-09-30 2018-12-12 주식회사 엘지화학 폴리이미드 필름 및 그 제조방법
KR101548597B1 (ko) 2013-10-25 2015-08-31 연세대학교 산학협력단 덴드라이트 형태의 징크옥사이드를 분산시킨 폴리아믹산 조성물 및 이를 이용한 고기능성 폴리이미드
KR102206028B1 (ko) 2013-11-25 2021-01-21 삼성전자주식회사 신규 화합물, 상기 화합물을 이용하여 제조된 폴리(이미드-아미드) 코폴리머, 및 상기 폴리(이미드-아미드)를 포함하는 성형품
TWI726845B (zh) * 2014-06-04 2021-05-11 日商宇部興產股份有限公司 聚醯亞胺膜之製造方法
KR102225509B1 (ko) 2014-07-24 2021-03-08 삼성전자주식회사 폴리이미드-무기입자 복합체 제조용 조성물, 폴리이미드-무기입자 복합체, 및 상기 복합체를 포함하는 성형품
TWI490274B (zh) 2014-10-29 2015-07-01 Mortech Corp 聚醯亞胺基聚合物、應用聚醯亞胺基聚合物之聚醯亞胺膜與應用聚醯亞胺基聚合物之聚醯亞胺積層板
KR102269701B1 (ko) 2015-03-13 2021-06-25 아사히 가세이 가부시키가이샤 폴리이미드 전구체 수지 조성물
JP6672815B2 (ja) * 2015-04-14 2020-03-25 Jsr株式会社 液晶配向剤、液晶配向膜及び液晶素子
JP6206446B2 (ja) * 2015-05-26 2017-10-04 日立化成デュポンマイクロシステムズ株式会社 フレキシブルデバイス基板形成用ポリイミド前駆体樹脂組成物及びそれを用いたフレキシブルデバイスの製造方法、フレキシブルデバイス
KR20170012123A (ko) 2015-07-24 2017-02-02 주식회사 엘지화학 가요성 기판의 제조방법
CN105131286B (zh) * 2015-09-28 2017-07-14 中国科学院化学研究所 一种聚酰亚胺薄膜及其制备方法和柔性基板与应用
KR102529151B1 (ko) * 2016-01-27 2023-05-08 삼성전자주식회사 폴리이미드 또는 폴리(아미드-이미드) 코폴리머를 포함하는 성형품 제조용 조성물, 상기 조성물로부터 얻어지는 성형품, 및 상기 성형품을 포함하는 디스플레이 장치
CN108699270B (zh) * 2016-03-03 2022-05-27 大日本印刷株式会社 聚酰亚胺膜、聚酰亚胺膜的制造方法和聚酰亚胺前体树脂组合物
TWI625226B (zh) * 2016-04-01 2018-06-01 律勝科技股份有限公司 可撓性透明聚醯亞胺積層板及其製造方法
JP6461860B2 (ja) * 2016-05-30 2019-01-30 日鉄ケミカル＆マテリアル株式会社 透明導電性フィルムの製造方法
JPWO2017208793A1 (ja) * 2016-05-31 2019-03-22 パナソニックＩｐマネジメント株式会社 太陽電池モジュール及びその製造方法
US10212821B2 (en) * 2016-08-04 2019-02-19 Taimide Technology Incorporation Flexible substrate assembly and its application for fabricating flexible printed circuits
US11260636B2 (en) 2016-08-31 2022-03-01 Kaneka Corporation Polyamide acid, polyamide acid solution, polyimide, polyimide film, laminate, flexible device, and method of manufacturing polyimide film
JP6288227B2 (ja) * 2016-12-05 2018-03-07 日立化成デュポンマイクロシステムズ株式会社 フレキシブルデバイス基板形成用ポリイミド前駆体樹脂組成物及びそれを用いたフレキシブルデバイスの製造方法、フレキシブルデバイス
JP6495229B2 (ja) * 2016-12-21 2019-04-03 日鉄ケミカル＆マテリアル株式会社 基材フィルムの製造方法
JP6878948B2 (ja) * 2017-02-22 2021-06-02 三菱瓦斯化学株式会社 ポリイミドフィルム積層体
US20200283625A1 (en) * 2017-04-07 2020-09-10 I.S.T Corporation Polyimide film
JP6990987B2 (ja) * 2017-04-28 2022-01-12 日東電工株式会社 フレキシブル配線回路基板、その製造方法および撮像装置
JP7304338B2 (ja) 2018-03-30 2023-07-06 株式会社カネカ ポリイミド膜の製造方法および電子デバイスの製造方法
CN108898073A (zh) * 2018-06-12 2018-11-27 武汉天马微电子有限公司 显示面板及其制备方法和显示装置
CN109134858B (zh) * 2018-07-27 2020-09-15 深圳瑞华泰薄膜科技股份有限公司 一种透明聚酰亚胺薄膜及其制备方法
JPWO2020067558A1 (ja) * 2018-09-29 2021-09-24 日鉄ケミカル＆マテリアル株式会社 ポリイミド前駆体及びそれから生じるポリイミド並びにフレキシブルデバイス
US11260622B2 (en) 2018-11-13 2022-03-01 Dupont Electronics, Inc. Multilayer polymer film
US11254094B2 (en) * 2018-11-13 2022-02-22 Dupont Electronics, Inc. Multilayer polymer film
KR102164463B1 (ko) * 2018-11-20 2020-10-13 피아이첨단소재 주식회사 저유전율 및 저흡습성을 가지는 폴리이미드 필름 및 그 제조방법
TWI862552B (zh) * 2019-02-22 2024-11-21 美商杜邦電子股份有限公司 聚醯亞胺膜及電子裝置
KR102224503B1 (ko) * 2019-07-05 2021-03-09 피아이첨단소재 주식회사 폴리아믹산 조성물, 폴리아믹산 조성물의 제조 방법, 이를 포함하는 폴리이미드 및 이를 포함하는 피복물
JP7398934B2 (ja) * 2019-11-22 2023-12-15 エルジー・ケム・リミテッド 表示装置用支持基板、有機ｅｌ表示装置、および有機ｅｌ表示装置の製造方法
CN111499894A (zh) * 2019-12-27 2020-08-07 长沙新材料产业研究院有限公司 一种高强高透光聚酰亚胺薄膜及其制备方法
US11827749B2 (en) 2020-04-07 2023-11-28 Rayitek Hi-Tech Film Company, Ltd., Shenzhen Colorless transparent copolyamide-imide films with high modulus and low coefficient of thermal expansion and preparation thereof
US12065551B2 (en) 2020-10-05 2024-08-20 Dupont Electronics, Inc. Consolidated polymer film
KR20230092934A (ko) 2020-10-22 2023-06-26 가부시키가이샤 가네카 폴리아미드산, 폴리아미드산 용액, 폴리이미드, 폴리이미드막, 적층체, 전자 디바이스 및 폴리이미드막의 제조 방법

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4912197A (en) 1987-08-14 1990-03-27 E. I. Du Pont De Nemours And Company Highly soluble clear polyimides
US4851505A (en) 1988-04-13 1989-07-25 E. I. Du Pont De Nemours And Company Highly soluble aromatic polyimides
US5071997A (en) 1989-07-20 1991-12-10 University Of Akron Polyimides comprising substituted benzidines
JP2823931B2 (ja) * 1990-03-26 1998-11-11 日本電信電話株式会社 導電性透明フィルム及びその製造方法
JPH048733A (ja) * 1990-04-27 1992-01-13 Nippon Telegr & Teleph Corp <Ntt> 透明ポリイミドフィルム
US5166308A (en) * 1990-04-30 1992-11-24 E. I. Du Pont De Nemours And Company Copolyimide film with improved properties
JP2866155B2 (ja) * 1990-06-15 1999-03-08 日本電信電話株式会社 ポリイミド‐金属複合フィルム
EP0474054B1 (en) 1990-08-27 1995-12-06 E.I. Du Pont De Nemours And Company Flexible multi-layer polyimide film laminates and preparation thereof
US5145999A (en) 1991-04-04 1992-09-08 E. I. Du Pont De Nemours And Company Perfluoroalkylated amines, and polymers made therefrom
US5175367A (en) 1991-08-27 1992-12-29 E. I. Du Pont De Nemours And Company Fluorine-containing diamines, polyamides, and polyimides
US5177176A (en) 1991-10-29 1993-01-05 E. I. Du Pont De Nemours And Company Soluble pseudo rod-like polyimides having low coefficient of thermal expansion
US5344916A (en) 1993-04-21 1994-09-06 The University Of Akron Negative birefringent polyimide films
US5580950A (en) 1993-04-21 1996-12-03 The University Of Akron Negative birefringent rigid rod polymer films
WO1994024191A1 (en) 1993-04-21 1994-10-27 The University Of Akron Negative birefringent polyimide films
JP3216849B2 (ja) * 1993-11-26 2001-10-09 セントラル硝子株式会社 ポリイミド前駆体組成物、ポリイミド組成物およびその製造法
US5520845A (en) 1993-12-02 1996-05-28 E. I. Du Pont De Nemours And Company Poly(2,6-piperazinedione) alignment layer for liquid crystal displays
US5649045A (en) * 1995-12-13 1997-07-15 Amoco Corporation Polymide optical waveguide structures
CN1106788C (zh) * 1996-02-13 2003-04-23 日东电工株式会社 电路基片
TW587185B (en) * 1997-06-26 2004-05-11 Du Pont Multi-domain STN LCD comprising fluorinated polyimide alignment layers
US6139926A (en) 1998-05-21 2000-10-31 E. I. Du Pont De Nemours And Company Polyimide photo alignment film from 3,3,4,4-benzophenone tetracarboxylic dianhydride and ortho-substituted aromatic diamines for liquid crystal displays
TW200420616A (en) * 2003-01-10 2004-10-16 Nitto Denko Corp Polyimide film and process for producing the same
JP4406764B2 (ja) * 2003-02-28 2010-02-03 東レ・デュポン株式会社 ガスバリアー性ポリイミドフィルムおよびそれを用いた金属積層体
US7026032B2 (en) * 2003-11-05 2006-04-11 E. I. Du Pont De Nemours And Company Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating thereto

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8796411B2 (en) 2008-02-25 2014-08-05 Hitachi Chemical Dupont Microsystems, Ltd. Polyimide precursor composition, polyimide film, and transparent flexible film
CN101959935B (zh) * 2008-02-25 2012-08-22 日立化成杜邦微系统股份有限公司 聚酰亚胺前体组合物、聚酰亚胺薄膜及透明挠性薄膜
CN105646919B (zh) * 2008-09-26 2020-11-03 可隆工业株式会社 聚酰亚胺薄膜
CN105646919A (zh) * 2008-09-26 2016-06-08 可隆工业株式会社 聚酰亚胺薄膜
CN102159628A (zh) * 2008-09-26 2011-08-17 可隆工业株式会社 聚酰亚胺薄膜
CN107253376A (zh) * 2012-09-24 2017-10-17 新日铁住金化学株式会社 聚酰亚胺层叠体及其制造方法
TWI656026B (zh) * 2012-09-24 2019-04-11 日商日鐵化學材料股份有限公司 聚亞醯胺積層體及其製造方法
CN103660458A (zh) * 2012-09-24 2014-03-26 新日铁住金化学株式会社 聚酰亚胺层叠体及其制造方法
CN110077065A (zh) * 2012-09-24 2019-08-02 日铁化学材料株式会社 聚酰亚胺层叠体及其制造方法
TWI656025B (zh) * 2012-09-24 2019-04-11 日商日鐵化學材料股份有限公司 聚亞醯胺積層體及其製造方法
CN104015466B (zh) * 2013-02-28 2018-06-05 新日铁住金化学株式会社 层叠部件的制造方法
TWI639637B (zh) * 2013-02-28 2018-11-01 日商新日鐵住金化學股份有限公司 基材薄膜的製造方法
CN107264003A (zh) * 2013-02-28 2017-10-20 新日铁住金化学株式会社 基材膜的制造方法
CN104015466A (zh) * 2013-02-28 2014-09-03 新日铁住金化学株式会社 层叠部件的制造方法
CN107264003B (zh) * 2013-02-28 2021-05-04 日铁化学材料株式会社 基材膜的制造方法
TWI567135B (zh) * 2014-02-14 2017-01-21 旭化成電子材料股份有限公司 A polyimide precursor and a resin composition containing the same
CN109734907A (zh) * 2018-12-04 2019-05-10 株洲时代新材料科技股份有限公司 聚酰亚胺前驱体、前驱体组合物、聚酰亚胺、耐高温透明聚酰亚胺薄膜及其制备方法
CN109734907B (zh) * 2018-12-04 2021-08-17 株洲时代华鑫新材料技术有限公司 聚酰亚胺前驱体、前驱体组合物、聚酰亚胺、耐高温透明聚酰亚胺薄膜及其制备方法
CN114763436A (zh) * 2021-01-15 2022-07-19 达迈科技股份有限公司 一种低介电损失之聚酰亚胺膜
CN114763436B (zh) * 2021-01-15 2024-02-20 达迈科技股份有限公司 一种低介电损失之聚酰亚胺膜

Also Published As

Publication number Publication date
JP2007046054A (ja) 2007-02-22
EP1749850A1 (en) 2007-02-07
US20080138537A1 (en) 2008-06-12
US7550194B2 (en) 2009-06-23

Similar Documents

Publication Publication Date Title
TW200712098A (en) Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto
JP5392247B2 (ja) ポリイミド前駆体組成物、ポリイミドフィルム及び透明フレキシブルフィルム
US12104017B2 (en) Polyamic acid and method for producing same, polyamic acid solution, polyimide, polyimide film, laminate and method for producing same, and flexible device and method for producing same
CN113136103B (zh) 聚酰亚胺前体树脂组合物
CN107001662B (zh) 聚酰亚胺膜、聚酰亚胺前体和聚酰亚胺
TWI730946B (zh) 聚醯亞胺前驅體、聚醯亞胺及聚醯亞胺膜
JP7126311B2 (ja) ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法
TW201942201A (zh) 聚醯胺酸、聚醯胺酸溶液、聚醯亞胺、聚醯亞胺膜、積層體及可撓性裝置、與聚醯亞胺膜之製造方法
CN111936553A (zh) 聚酰亚胺树脂、聚酰亚胺清漆及聚酰亚胺薄膜
JP7349253B2 (ja) ポリアミド酸、ポリアミド酸溶液、ポリイミド、ポリイミド膜、積層体およびフレキシブルデバイス、ならびにポリイミド膜の製造方法。
JP2021172734A (ja) ポリイミド前駆体、ポリイミド樹脂組成物、並びにポリイミド樹脂フィルム及びその製造方法
JP6974956B2 (ja) ポリイミド前駆体及びポリイミド
JP6786861B2 (ja) ポリイミド前駆体、ポリイミド、ポリイミドフィルム、ポリイミド積層体、ポリイミド／ハードコート積層体
KR20160079679A (ko) 폴리이미드 필름 적층체
KR102188949B1 (ko) 폴리이미드 전구체 및 이를 이용하는 폴리이미드 필름
KR101284397B1 (ko) 폴리아믹산 용액 및 표시소자
TWI874708B (zh) 聚醯亞胺類聚合物膜、使用其之顯示元件基板以及光學元件
JP6846148B2 (ja) ポリイミド前駆体溶液及びその製造方法並びにポリイミドフィルムの製造方法及び積層体の製造方法
JP2024014746A (ja) ポリアミック酸樹脂及びこれを用いた透明なポリイミドフィルム
JP7184043B2 (ja) 仮接着層形成用組成物及び仮接着層
CN117120515A (zh) 聚酰亚胺前体组合物和聚酰亚胺膜
KR20170085777A (ko) 폴리이미드 전구체 조성물 및 이로부터 제조된 투명 폴리이미드 필름
TW202413488A (zh) 聚醯亞胺前驅體組合物、聚醯亞胺膜及聚醯亞胺膜/基材積層體
KR20140091893A (ko) 폴리아믹산 용액 및 이를 포함하는 폴리이미드 필름