TW200534769A - Assembly panel and mounting unit sheet for printed wiring board, rigid flexible board, and method for manufacturing them - Google Patents

Assembly panel and mounting unit sheet for printed wiring board, rigid flexible board, and method for manufacturing them Download PDF

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Publication number
TW200534769A
TW200534769A TW094111251A TW94111251A TW200534769A TW 200534769 A TW200534769 A TW 200534769A TW 094111251 A TW094111251 A TW 094111251A TW 94111251 A TW94111251 A TW 94111251A TW 200534769 A TW200534769 A TW 200534769A
Authority
TW
Taiwan
Prior art keywords
substrate
flexible substrate
rigid
unit
substrates
Prior art date
Application number
TW094111251A
Other languages
English (en)
Chinese (zh)
Other versions
TWI351246B (enExample
Inventor
Atsushi Kobayashi
Kazuo Umeda
Wataru Gotou
Takahiro Sahara
Susumu Nakazawa
Kiyoshi Takeuchi
Takahiro Terauchi
Original Assignee
Dainippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Printing Co Ltd filed Critical Dainippon Printing Co Ltd
Publication of TW200534769A publication Critical patent/TW200534769A/zh
Application granted granted Critical
Publication of TWI351246B publication Critical patent/TWI351246B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0169—Using a temporary frame during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
TW094111251A 2004-04-09 2005-04-08 Assembly panel and mounting unit sheet for printed wiring board, rigid flexible board, and method for manufacturing them TW200534769A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004116275 2004-04-09
JP2004347175A JP2005322878A (ja) 2004-04-09 2004-11-30 印刷配線基板の組付パネル、印刷配線基板の実装用単位シート、リジッド−フレキシブル基板及びこれらの製造方法

Publications (2)

Publication Number Publication Date
TW200534769A true TW200534769A (en) 2005-10-16
TWI351246B TWI351246B (enExample) 2011-10-21

Family

ID=35125483

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094111251A TW200534769A (en) 2004-04-09 2005-04-08 Assembly panel and mounting unit sheet for printed wiring board, rigid flexible board, and method for manufacturing them

Country Status (6)

Country Link
US (1) US8592686B2 (enExample)
JP (1) JP2005322878A (enExample)
KR (1) KR101263024B1 (enExample)
CN (1) CN1947475B (enExample)
TW (1) TW200534769A (enExample)
WO (1) WO2005099324A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
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TWI458415B (zh) * 2006-07-28 2014-10-21 Dainippon Printing Co Ltd 多層印刷配線板及其製造方法
TWI506748B (zh) * 2012-06-20 2015-11-01 臻鼎科技股份有限公司 封裝基板、其製作方法及封裝結構
TWI645761B (zh) * 2017-05-16 2018-12-21 陽程科技股份有限公司 多層電路板疊合方法及其預先固定裝置

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JP5034289B2 (ja) * 2006-03-28 2012-09-26 大日本印刷株式会社 多層プリント配線板及びその製造方法
KR100761706B1 (ko) * 2006-09-06 2007-09-28 삼성전기주식회사 인쇄회로기판 제조방법
US8071883B2 (en) 2006-10-23 2011-12-06 Ibiden Co., Ltd. Flex-rigid wiring board including flexible substrate and non-flexible substrate and method of manufacturing the same
US7982135B2 (en) 2006-10-30 2011-07-19 Ibiden Co., Ltd. Flex-rigid wiring board and method of manufacturing the same
CN102612264B (zh) * 2007-11-01 2014-11-19 大日本印刷株式会社 内置元件电路板、内置元件电路板的制造方法
FI20070910A0 (fi) * 2007-11-27 2007-11-27 Kimmo Olavi Paananen Menetelmä piirilevyjen panelisointiin
JP5163656B2 (ja) * 2008-01-22 2013-03-13 ソニー株式会社 部品実装用基板の製造方法及び部品実装用基板
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JP5216951B2 (ja) * 2008-01-22 2013-06-19 ソニー株式会社 部品実装用基板の製造方法及び部品実装用基板
CN101658081B (zh) 2008-03-10 2012-05-30 揖斐电株式会社 挠性线路板及其制造方法
DE102008028299B3 (de) 2008-06-13 2009-07-30 Epcos Ag Systemträger für elektronische Komponente und Verfahren für dessen Herstellung
US8963323B2 (en) * 2008-06-20 2015-02-24 Alcatel Lucent Heat-transfer structure
CN101631432B (zh) * 2008-07-14 2011-07-27 富葵精密组件(深圳)有限公司 软硬复合电路板及其制作方法
CN101730385B (zh) * 2008-10-10 2012-07-04 深圳富泰宏精密工业有限公司 电路板结构
US8572839B2 (en) * 2008-11-07 2013-11-05 Ibiden Co., Ltd. Fabrication method for multi-piece board
US8378237B2 (en) 2008-11-10 2013-02-19 Ibiden Co., Ltd. Multi-piece board and fabrication method therefor
US8259467B2 (en) 2008-11-20 2012-09-04 Ibiden Co., Ltd. Multi-piece board and fabrication method therefor
US8921705B2 (en) 2008-11-28 2014-12-30 Ibiden Co., Ltd. Wiring board and fabrication method therefor
CN101692441B (zh) * 2009-04-16 2012-04-11 旭丽电子(广州)有限公司 一种印刷电路板封装结构
WO2010140270A1 (ja) 2009-06-04 2010-12-09 イビデン株式会社 多ピース基板の製造方法、及び多ピース基板
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US8547702B2 (en) * 2009-10-26 2013-10-01 Ibiden Co., Ltd. Multi-piece board and method for manufacturing the same
KR101051491B1 (ko) 2009-10-28 2011-07-22 삼성전기주식회사 다층 경연성 인쇄회로기판 및 다층 경연성 인쇄회로기판의 제조방법
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KR101024602B1 (ko) * 2010-06-28 2011-03-24 권도희 양면 노출 구조의 연성 인쇄 회로 기판에 부품을 실장하는 방법 및 그 부품 실장용 보강판
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Publication number Priority date Publication date Assignee Title
TWI458415B (zh) * 2006-07-28 2014-10-21 Dainippon Printing Co Ltd 多層印刷配線板及其製造方法
TWI506748B (zh) * 2012-06-20 2015-11-01 臻鼎科技股份有限公司 封裝基板、其製作方法及封裝結構
TWI645761B (zh) * 2017-05-16 2018-12-21 陽程科技股份有限公司 多層電路板疊合方法及其預先固定裝置

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KR101263024B1 (ko) 2013-05-09
WO2005099324A1 (ja) 2005-10-20
CN1947475B (zh) 2013-02-06
US8592686B2 (en) 2013-11-26
US20090014205A1 (en) 2009-01-15
KR20060135066A (ko) 2006-12-28
TWI351246B (enExample) 2011-10-21
JP2005322878A (ja) 2005-11-17
CN1947475A (zh) 2007-04-11

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