JP6638825B2 - 多層基板 - Google Patents
多層基板 Download PDFInfo
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- JP6638825B2 JP6638825B2 JP2018547184A JP2018547184A JP6638825B2 JP 6638825 B2 JP6638825 B2 JP 6638825B2 JP 2018547184 A JP2018547184 A JP 2018547184A JP 2018547184 A JP2018547184 A JP 2018547184A JP 6638825 B2 JP6638825 B2 JP 6638825B2
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- 239000004020 conductor Substances 0.000 claims description 228
- 239000000758 substrate Substances 0.000 claims description 108
- 239000000463 material Substances 0.000 claims description 82
- 230000003014 reinforcing effect Effects 0.000 claims description 16
- 238000010030 laminating Methods 0.000 claims description 11
- 238000003475 lamination Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 242
- 239000011229 interlayer Substances 0.000 description 38
- 238000005452 bending Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 13
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- 238000004804 winding Methods 0.000 description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/04—Pumps having electric drive
- F04B43/043—Micropumps
- F04B43/046—Micropumps with piezoelectric drive
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B45/00—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
- F04B45/04—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
- F04B45/047—Pumps having electric drive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/323—Insulation between winding turns, between winding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/06—Electromagnets; Actuators including electromagnets
- H01F7/20—Electromagnets; Actuators including electromagnets without armatures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/206—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using only longitudinal or thickness displacement, e.g. d33 or d31 type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/006—Printed inductances flexible printed inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
可撓性を有する第1絶縁基材層および第2絶縁基材層を含んだ複数の絶縁基材層が積層されて形成され、第1領域および第2領域を有する積層体と、
少なくとも前記第1絶縁基材層に形成されるアクチュエータ用導体パターンと、
を備え、
前記第1領域の前記絶縁基材層の積層数は、前記第2領域の前記絶縁基材層の積層数よりも多く、
前記第2絶縁基材層は、前記第1領域と前記第2領域とに亘って形成され、
前記第1領域は、前記第1絶縁基材層および前記第2絶縁基材層を積層して形成され、且つ、前記アクチュエータ用導体パターンを含んで形成されるアクチュエータ機能部を一部に有し、
前記アクチュエータ用導体パターンが形成される前記第1絶縁基材層の厚みは、前記第2絶縁基材層の少なくとも一つの厚みよりも薄いことを特徴とする。
図1は第1の実施形態に係る多層基板101の外観斜視図である。図2は多層基板101の分解斜視図である。図3は多層基板101の断面図である。なお、図3において、各部の厚みは誇張して図示している。このことは、以降に示す各断面図でも同様である。
第2の実施形態では、コイル以外のアクチュエータ機能部を備える多層基板の例を示す。
第3の実施形態では、第2絶縁基材層の構成が異なる多層基板の例を示す。
第4の実施形態では、アクチュエータ機能部(コイル)の構成が第3の実施形態とは異なる多層基板の例を示す。
第5の実施形態では、補強膜を備えた多層基板の例を示す。
第6の実施形態では、ダミー導体を備えた多層基板の例を示す。
以上に示した各実施形態では、積層体が矩形の平板である例を示したが、この構成に限定されるものではない。積層体の平面形状は、本発明の作用・効果を奏する範囲において適宜変更可能であり、例えば多角形、円形、楕円形、L字形、クランク形、T字形、Y字形等であってもよい。
AX…コイルの巻回軸
F1…第1領域
F2…第2領域
P1,P2…外部接続端子
S1…応力
V1,V2,V3,V4,V5,V6,V7,V8,V9,V10…層間接続導体
VS1…第1主面
VS2…第2主面
3…コイル(アクチュエータ機能部)
4…磁石
5…筐体
6A,6B…物品
7…補強膜
10A,10B,10C,10D…積層体
11a,11b,11c,11d,12a,12b,12c,12d,13a,13b,13c,13d…絶縁基材層(第1絶縁基材層)
14a,14b,14c,14d,15a,15b,15c,15d…絶縁基材層(第2絶縁基材層)
21,22,23,24,25,26…導体
31,32,33…コイル導体(アクチュエータ用導体パターン)
41,42,43…平面電極(アクチュエータ用導体パターン)
51…コネクタ
61…レセプタクル
71…ダミー導体
101,101A,102,102A,103,104,105,106…多層基板
201…回路基板
301,302…電子機器
Claims (5)
- 可撓性を有する第1絶縁基材層および可撓性を有する複数の第2絶縁基材層を含んだ複数の絶縁基材層が積層されて形成され、第1領域および第2領域を有する積層体と、
少なくとも前記第1絶縁基材層に形成されるアクチュエータ用導体パターンと、
を備え、
前記第1領域の前記絶縁基材層の積層数は、前記第2領域の前記絶縁基材層の積層数よりも多く、
前記複数の第2絶縁基材層は、前記第1領域と前記第2領域とに亘って形成され、
前記第1領域は、前記第1絶縁基材層および前記複数の第2絶縁基材層を積層して形成され、且つ、前記アクチュエータ用導体パターンを含んで形成されるアクチュエータ機能部を一部に有し、
前記アクチュエータ用導体パターンが形成される前記第1絶縁基材層の厚みは、前記複数の第2絶縁基材層の少なくとも一つの厚みよりも薄く、
前記アクチュエータ機能部の導体厚みの合計は、前記第2領域の導体厚みの合計よりも厚いことを特徴とする多層基板。 - 前記アクチュエータ用導体パターンが形成される前記第1絶縁基材層の厚みは、前記複数の第2絶縁基材層のいずれの厚みよりも薄い、請求項1に記載の多層基板。
- 前記アクチュエータ用導体パターンは、前記第1絶縁基材層のみに形成され、前記第1絶縁基材層と前記第2絶縁基材層との界面以外の層に配置される、請求項1または2に記載の多層基板。
- 前記第1絶縁基材層に形成され、前記複数の絶縁基材層よりも弾性率の高い補強膜をさらに備える、請求項1から3のいずれかに記載の多層基板。
- 前記第1絶縁基材層に形成され、前記アクチュエータ用導体パターンに導通しないダミー導体をさらに備える、請求項1から4のいずれかに記載の多層基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016207871 | 2016-10-24 | ||
JP2016207871 | 2016-10-24 | ||
PCT/JP2017/032905 WO2018079110A1 (ja) | 2016-10-24 | 2017-09-12 | 多層基板 |
Publications (2)
Publication Number | Publication Date |
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JPWO2018079110A1 JPWO2018079110A1 (ja) | 2019-03-14 |
JP6638825B2 true JP6638825B2 (ja) | 2020-01-29 |
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Country Status (4)
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US (1) | US11043626B2 (ja) |
JP (1) | JP6638825B2 (ja) |
CN (1) | CN209949597U (ja) |
WO (1) | WO2018079110A1 (ja) |
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JP6489290B2 (ja) | 2016-08-03 | 2019-03-27 | 株式会社村田製作所 | 変形検知センサ、電子機器、および変形検知センサの製造方法 |
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JPH06334279A (ja) | 1993-05-20 | 1994-12-02 | Minolta Camera Co Ltd | 多層フレキシブル電装基板 |
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JP5962184B2 (ja) * | 2012-04-27 | 2016-08-03 | 株式会社村田製作所 | 樹脂多層基板 |
US9899591B2 (en) * | 2012-12-17 | 2018-02-20 | Kyocera Corporation | Piezoelectric actuator, piezoelectric vibration apparatus, and portable terminal |
JP2014127998A (ja) | 2012-12-27 | 2014-07-07 | Olympus Imaging Corp | 振動装置及びこれを備えた画像機器 |
CN204425813U (zh) * | 2012-12-29 | 2015-06-24 | 株式会社村田制作所 | 电路基板 |
KR101482404B1 (ko) * | 2013-05-27 | 2015-01-13 | 삼성전기주식회사 | 리지드 플렉시블 인쇄회로기판 및 그 제조방법 |
WO2015015975A1 (ja) | 2013-07-30 | 2015-02-05 | 株式会社村田製作所 | 多層基板および多層基板の製造方法 |
JP5776867B1 (ja) * | 2013-11-28 | 2015-09-09 | 株式会社村田製作所 | 電磁石、カメラレンズ駆動装置及び電磁石の製造方法 |
JP5765507B1 (ja) * | 2013-12-06 | 2015-08-19 | 株式会社村田製作所 | インダクタ素子及び電子機器 |
JP6075505B2 (ja) | 2014-04-03 | 2017-02-08 | 株式会社村田製作所 | 積層型コイル部品およびモジュール部品 |
KR20150125424A (ko) * | 2014-04-30 | 2015-11-09 | 삼성전기주식회사 | 강연성 인쇄회로기판 및 강연성 인쇄회로기판의 제조 방법 |
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2017
- 2017-09-12 WO PCT/JP2017/032905 patent/WO2018079110A1/ja active Application Filing
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