JPWO2018079110A1 - 多層基板 - Google Patents
多層基板 Download PDFInfo
- Publication number
- JPWO2018079110A1 JPWO2018079110A1 JP2018547184A JP2018547184A JPWO2018079110A1 JP WO2018079110 A1 JPWO2018079110 A1 JP WO2018079110A1 JP 2018547184 A JP2018547184 A JP 2018547184A JP 2018547184 A JP2018547184 A JP 2018547184A JP WO2018079110 A1 JPWO2018079110 A1 JP WO2018079110A1
- Authority
- JP
- Japan
- Prior art keywords
- insulating base
- conductor
- base material
- multilayer substrate
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 232
- 239000000758 substrate Substances 0.000 claims abstract description 127
- 239000000463 material Substances 0.000 claims abstract description 121
- 238000010030 laminating Methods 0.000 claims abstract description 13
- 230000003014 reinforcing effect Effects 0.000 claims description 17
- 239000010410 layer Substances 0.000 description 239
- 239000011229 interlayer Substances 0.000 description 38
- 230000000694 effects Effects 0.000 description 14
- 238000005452 bending Methods 0.000 description 10
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 238000004804 winding Methods 0.000 description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/04—Pumps having electric drive
- F04B43/043—Micropumps
- F04B43/046—Micropumps with piezoelectric drive
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B45/00—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
- F04B45/04—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
- F04B45/047—Pumps having electric drive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/323—Insulation between winding turns, between winding layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/06—Electromagnets; Actuators including electromagnets
- H01F7/20—Electromagnets; Actuators including electromagnets without armatures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/206—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using only longitudinal or thickness displacement, e.g. d33 or d31 type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/006—Printed inductances flexible printed inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
Abstract
Description
可撓性を有する第1絶縁基材層および第2絶縁基材層を含んだ複数の絶縁基材層が積層されて形成され、第1領域および第2領域を有する積層体と、
少なくとも前記第1絶縁基材層に形成されるアクチュエータ用導体パターンと、
を備え、
前記第1領域の前記絶縁基材層の積層数は、前記第2領域の前記絶縁基材層の積層数よりも多く、
前記第2絶縁基材層は、前記第1領域と前記第2領域とに亘って形成され、
前記第1領域は、前記第1絶縁基材層および前記第2絶縁基材層を積層して形成され、且つ、前記アクチュエータ用導体パターンを含んで形成されるアクチュエータ機能部を一部に有し、
前記アクチュエータ用導体パターンが形成される前記第1絶縁基材層の厚みは、前記第2絶縁基材層の少なくとも一つの厚みよりも薄いことを特徴とする。
図1は第1の実施形態に係る多層基板101の外観斜視図である。図2は多層基板101の分解斜視図である。図3は多層基板101の断面図である。なお、図3において、各部の厚みは誇張して図示している。このことは、以降に示す各断面図でも同様である。
第2の実施形態では、コイル以外のアクチュエータ機能部を備える多層基板の例を示す。
第3の実施形態では、第2絶縁基材層の構成が異なる多層基板の例を示す。
第4の実施形態では、アクチュエータ機能部(コイル)の構成が第3の実施形態とは異なる多層基板の例を示す。
第5の実施形態では、補強膜を備えた多層基板の例を示す。
第6の実施形態では、ダミー導体を備えた多層基板の例を示す。
以上に示した各実施形態では、積層体が矩形の平板である例を示したが、この構成に限定されるものではない。積層体の平面形状は、本発明の作用・効果を奏する範囲において適宜変更可能であり、例えば多角形、円形、楕円形、L字形、クランク形、T字形、Y字形等であってもよい。
AX…コイルの巻回軸
F1…第1領域
F2…第2領域
P1,P2…外部接続端子
S1…応力
V1,V2,V3,V4,V5,V6,V7,V8,V9,V10…層間接続導体
VS1…第1主面
VS2…第2主面
3…コイル(アクチュエータ機能部)
4…磁石
5…筐体
6A,6B…物品
7…補強膜
10A,10B,10C,10D…積層体
11a,11b,11c,11d,12a,12b,12c,12d,13a,13b,13c,13d…絶縁基材層(第1絶縁基材層)
14a,14b,14c,14d,15a,15b,15c,15d…絶縁基材層(第2絶縁基材層)
21,22,23,24,25,26…導体
31,32,33…コイル導体(アクチュエータ用導体パターン)
41,42,43…平面電極(アクチュエータ用導体パターン)
51…コネクタ
61…レセプタクル
71…ダミー導体
101,101A,102,102A,103,104,105,106…多層基板
201…回路基板
301,302…電子機器
Claims (6)
- 可撓性を有する第1絶縁基材層および第2絶縁基材層を含んだ複数の絶縁基材層が積層されて形成され、第1領域および第2領域を有する積層体と、
少なくとも前記第1絶縁基材層に形成されるアクチュエータ用導体パターンと、
を備え、
前記第1領域の前記絶縁基材層の積層数は、前記第2領域の前記絶縁基材層の積層数よりも多く、
前記第2絶縁基材層は、前記第1領域と前記第2領域とに亘って形成され、
前記第1領域は、前記第1絶縁基材層および前記第2絶縁基材層を積層して形成され、且つ、前記アクチュエータ用導体パターンを含んで形成されるアクチュエータ機能部を一部に有し、
前記アクチュエータ用導体パターンが形成される前記第1絶縁基材層の厚みは、前記第2絶縁基材層の少なくとも一つの厚みよりも薄いことを特徴とする多層基板。 - 前記第2絶縁基材層の数は複数であり、
前記アクチュエータ用導体パターンが形成される前記第1絶縁基材層の厚みは、複数の前記第2絶縁基材層のうち少なくとも一つの厚みよりも薄い、請求項1に記載の多層基板。 - 前記アクチュエータ用導体パターンが形成される前記第1絶縁基材層の厚みは、前記複数の第2絶縁基材層のいずれの厚みよりも薄い、請求項2に記載の多層基板。
- 前記アクチュエータ用導体パターンは、前記第1絶縁基材層のみに形成され、前記第1絶縁基材層と前記第2絶縁基材層との界面以外の層に配置される、請求項1から3のいずれかに記載の多層基板。
- 前記第1絶縁基材層に形成され、前記複数の絶縁基材層よりも弾性率の高い補強膜をさらに備える、請求項1から4のいずれかに記載の多層基板。
- 前記第1絶縁基材層に形成され、前記アクチュエータ用導体パターンに導通しないダミー導体をさらに備える、請求項1から5のいずれかに記載の多層基板。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016207871 | 2016-10-24 | ||
JP2016207871 | 2016-10-24 | ||
PCT/JP2017/032905 WO2018079110A1 (ja) | 2016-10-24 | 2017-09-12 | 多層基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2018079110A1 true JPWO2018079110A1 (ja) | 2019-03-14 |
JP6638825B2 JP6638825B2 (ja) | 2020-01-29 |
Family
ID=62024676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018547184A Active JP6638825B2 (ja) | 2016-10-24 | 2017-09-12 | 多層基板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11043626B2 (ja) |
JP (1) | JP6638825B2 (ja) |
CN (1) | CN209949597U (ja) |
WO (1) | WO2018079110A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6489290B2 (ja) * | 2016-08-03 | 2019-03-27 | 株式会社村田製作所 | 変形検知センサ、電子機器、および変形検知センサの製造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003251741A (ja) * | 2001-12-10 | 2003-09-09 | Mitsui Chemicals Inc | ポリイミド金属積層板およびその製造方法 |
JP2011108929A (ja) * | 2009-11-19 | 2011-06-02 | Murata Mfg Co Ltd | 回路基板および回路基板の製造方法 |
JP2013131642A (ja) * | 2011-12-21 | 2013-07-04 | Asahi Kasei Electronics Co Ltd | 平面コイル、平面コイルの製造方法 |
JP2013232462A (ja) * | 2012-04-27 | 2013-11-14 | Murata Mfg Co Ltd | 樹脂多層基板およびその製造方法 |
JP2014127998A (ja) * | 2012-12-27 | 2014-07-07 | Olympus Imaging Corp | 振動装置及びこれを備えた画像機器 |
WO2015015975A1 (ja) * | 2013-07-30 | 2015-02-05 | 株式会社村田製作所 | 多層基板および多層基板の製造方法 |
WO2015152333A1 (ja) * | 2014-04-03 | 2015-10-08 | 株式会社村田製作所 | 積層型コイル部品およびモジュール部品ならびに積層型コイル部品の製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06334279A (ja) | 1993-05-20 | 1994-12-02 | Minolta Camera Co Ltd | 多層フレキシブル電装基板 |
JP2002246748A (ja) | 2001-02-16 | 2002-08-30 | Nippon Mektron Ltd | フレキシブルプリント基板およびその製造方法 |
JP2005228946A (ja) | 2004-02-13 | 2005-08-25 | Fujikura Ltd | 多層配線板およびその製造方法 |
JP2005322878A (ja) * | 2004-04-09 | 2005-11-17 | Dainippon Printing Co Ltd | 印刷配線基板の組付パネル、印刷配線基板の実装用単位シート、リジッド−フレキシブル基板及びこれらの製造方法 |
JP5168838B2 (ja) | 2006-07-28 | 2013-03-27 | 大日本印刷株式会社 | 多層プリント配線板及びその製造方法 |
US7719167B2 (en) * | 2007-05-14 | 2010-05-18 | Samsung Electronics Co., Ltd. | Electroactive polymer actuator and manufacturing method thereof |
US8035983B2 (en) * | 2007-07-17 | 2011-10-11 | Ibiden Co., Ltd. | Wiring board and method of manufacturing wiring board |
US8178789B2 (en) * | 2007-07-17 | 2012-05-15 | Ibiden Co., Ltd. | Wiring board and method of manufacturing wiring board |
WO2009113202A1 (ja) * | 2008-03-10 | 2009-09-17 | イビデン株式会社 | フレキシブル配線板及びその製造方法 |
US9899591B2 (en) * | 2012-12-17 | 2018-02-20 | Kyocera Corporation | Piezoelectric actuator, piezoelectric vibration apparatus, and portable terminal |
JP5720862B2 (ja) * | 2012-12-29 | 2015-05-20 | 株式会社村田製作所 | 回路基板 |
KR101482404B1 (ko) * | 2013-05-27 | 2015-01-13 | 삼성전기주식회사 | 리지드 플렉시블 인쇄회로기판 및 그 제조방법 |
JP5776867B1 (ja) * | 2013-11-28 | 2015-09-09 | 株式会社村田製作所 | 電磁石、カメラレンズ駆動装置及び電磁石の製造方法 |
WO2015083525A1 (ja) | 2013-12-06 | 2015-06-11 | 株式会社村田製作所 | インダクタ素子及び電子機器 |
KR20150125424A (ko) * | 2014-04-30 | 2015-11-09 | 삼성전기주식회사 | 강연성 인쇄회로기판 및 강연성 인쇄회로기판의 제조 방법 |
-
2017
- 2017-09-12 CN CN201790001271.6U patent/CN209949597U/zh active Active
- 2017-09-12 WO PCT/JP2017/032905 patent/WO2018079110A1/ja active Application Filing
- 2017-09-12 JP JP2018547184A patent/JP6638825B2/ja active Active
-
2019
- 2019-03-07 US US16/294,975 patent/US11043626B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003251741A (ja) * | 2001-12-10 | 2003-09-09 | Mitsui Chemicals Inc | ポリイミド金属積層板およびその製造方法 |
JP2011108929A (ja) * | 2009-11-19 | 2011-06-02 | Murata Mfg Co Ltd | 回路基板および回路基板の製造方法 |
JP2013131642A (ja) * | 2011-12-21 | 2013-07-04 | Asahi Kasei Electronics Co Ltd | 平面コイル、平面コイルの製造方法 |
JP2013232462A (ja) * | 2012-04-27 | 2013-11-14 | Murata Mfg Co Ltd | 樹脂多層基板およびその製造方法 |
JP2014127998A (ja) * | 2012-12-27 | 2014-07-07 | Olympus Imaging Corp | 振動装置及びこれを備えた画像機器 |
WO2015015975A1 (ja) * | 2013-07-30 | 2015-02-05 | 株式会社村田製作所 | 多層基板および多層基板の製造方法 |
WO2015152333A1 (ja) * | 2014-04-03 | 2015-10-08 | 株式会社村田製作所 | 積層型コイル部品およびモジュール部品ならびに積層型コイル部品の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN209949597U (zh) | 2020-01-14 |
WO2018079110A1 (ja) | 2018-05-03 |
JP6638825B2 (ja) | 2020-01-29 |
US11043626B2 (en) | 2021-06-22 |
US20190207077A1 (en) | 2019-07-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10566135B2 (en) | Method of manufacturing stacked body and stacked body | |
US10796837B2 (en) | Electronic component, diaphragm, and electronic device | |
JP6737246B2 (ja) | 多層基板 | |
CN108154991B (zh) | 线圈组件及制造线圈组件的方法 | |
WO2019107131A1 (ja) | 多層基板、多層基板の実装構造、多層基板の製造方法、および電子機器の製造方法 | |
WO2017217308A1 (ja) | 電子部品、振動板、電子機器および電子部品の製造方法 | |
US11439005B2 (en) | Inductor bridge and electronic device | |
JP6516017B2 (ja) | Lc複合デバイス、プロセッサおよびlc複合デバイスの製造方法 | |
JP7082622B2 (ja) | アクチュエータ、およびアクチュエータの製造方法 | |
JP6913155B2 (ja) | アクチュエータ | |
JP6638825B2 (ja) | 多層基板 | |
US10609820B2 (en) | Electronic component module, DC-DC converter, and electronic device | |
JP6562160B2 (ja) | 多層基板およびその製造方法 | |
WO2019026819A1 (ja) | アクチュエータ | |
JP6699805B2 (ja) | インダクタブリッジおよび電子機器 | |
JP2008311553A (ja) | 複合多層プリント配線板の製造方法 | |
US20220141965A1 (en) | Multilayer substrate and method of manufacturing multilayer substrate | |
WO2018008615A1 (ja) | 電子機器 | |
JP6610623B2 (ja) | アクチュエータ | |
JP6673162B2 (ja) | 振動素子および振動板 | |
WO2018199148A1 (ja) | 電気素子、アクチュエータ、および通信装置 | |
JP2014007494A (ja) | アンテナモジュール及びプリント配線板の接続構造 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181112 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181112 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190716 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190909 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191126 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20191209 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6638825 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |