CN103313530B - 软硬结合电路板的制作方法 - Google Patents
软硬结合电路板的制作方法 Download PDFInfo
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- CN103313530B CN103313530B CN201210059149.8A CN201210059149A CN103313530B CN 103313530 B CN103313530 B CN 103313530B CN 201210059149 A CN201210059149 A CN 201210059149A CN 103313530 B CN103313530 B CN 103313530B
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- circuit board
- film
- flexible circuit
- conducting wire
- electronic component
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- Production Of Multi-Layered Print Wiring Board (AREA)
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Priority Applications (1)
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CN201210059149.8A CN103313530B (zh) | 2012-03-08 | 2012-03-08 | 软硬结合电路板的制作方法 |
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CN201210059149.8A CN103313530B (zh) | 2012-03-08 | 2012-03-08 | 软硬结合电路板的制作方法 |
Publications (2)
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CN103313530A CN103313530A (zh) | 2013-09-18 |
CN103313530B true CN103313530B (zh) | 2016-03-30 |
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CN201210059149.8A Active CN103313530B (zh) | 2012-03-08 | 2012-03-08 | 软硬结合电路板的制作方法 |
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104768318B (zh) * | 2014-01-06 | 2017-08-22 | 富葵精密组件(深圳)有限公司 | 软硬结合电路板及其制作方法 |
CN105592638B (zh) * | 2014-10-20 | 2018-10-30 | 鹏鼎控股(深圳)股份有限公司 | 刚挠结合板及其制作方法 |
KR20160073766A (ko) * | 2014-12-17 | 2016-06-27 | 삼성전기주식회사 | 연성 인쇄회로기판 및 그 제조 방법 |
CN106211639B (zh) * | 2016-07-28 | 2019-03-08 | 广州杰赛科技股份有限公司 | 器件埋入式刚挠结合板及其制作方法 |
CN106061107B (zh) * | 2016-08-08 | 2019-10-25 | 广州杰赛科技股份有限公司 | 具电磁屏蔽膜的刚挠结合线路板及其制备方法 |
CN108307581A (zh) * | 2017-01-12 | 2018-07-20 | 奥特斯奥地利科技与系统技术有限公司 | 具有嵌入式部件承载件的电子设备 |
CN107613674A (zh) * | 2017-08-01 | 2018-01-19 | 深圳明阳电路科技股份有限公司 | 一种阶梯pcb板的制作方法 |
CN111148337B (zh) * | 2018-11-02 | 2024-09-13 | 深南电路股份有限公司 | 电路板及其制作方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1947475A (zh) * | 2004-04-09 | 2007-04-11 | 大日本印刷株式会社 | 印刷电路板的装配面板、用于封装印刷电路板的单元片材、软硬板以及它们的制造方法 |
CN101170877A (zh) * | 2007-11-21 | 2008-04-30 | 健鼎(无锡)电子有限公司 | 软硬印刷电路板的结合方法 |
CN101990355A (zh) * | 2009-07-30 | 2011-03-23 | 欣兴电子股份有限公司 | 软硬线路板及其工艺 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005340270A (ja) * | 2004-05-24 | 2005-12-08 | Matsushita Electric Works Ltd | 積層板用プリプレグ、積層板並びにそれを用いたフレキシブルプリント配線板及びフレックスリジッドプリント配線板 |
KR100688826B1 (ko) * | 2005-01-20 | 2007-03-02 | 삼성전기주식회사 | 리지드-플렉시블 인쇄회로기판 제조방법 |
US8188372B2 (en) * | 2006-09-21 | 2012-05-29 | Daisho Denshi Co., Ltd. | Flex-rigid printed wiring board and manufacturing method thereof |
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2012
- 2012-03-08 CN CN201210059149.8A patent/CN103313530B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1947475A (zh) * | 2004-04-09 | 2007-04-11 | 大日本印刷株式会社 | 印刷电路板的装配面板、用于封装印刷电路板的单元片材、软硬板以及它们的制造方法 |
CN101170877A (zh) * | 2007-11-21 | 2008-04-30 | 健鼎(无锡)电子有限公司 | 软硬印刷电路板的结合方法 |
CN101990355A (zh) * | 2009-07-30 | 2011-03-23 | 欣兴电子股份有限公司 | 软硬线路板及其工艺 |
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Publication number | Publication date |
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CN103313530A (zh) | 2013-09-18 |
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Effective date of registration: 20170725 Address after: No. 168, Foxconn Road, Huaian Economic Development Zone, Jiangsu, China Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Wang Heng Sheng Electronic Technology (Huaian) Co. Ltd. Address before: 223005 Foxconn Road, Huaian Economic Development Zone, Jiangsu, No. 168 Co-patentee before: Zhending Technology Co., Ltd. Patentee before: Wang Heng Sheng Electronic Technology (Huaian) Co. Ltd. |
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Effective date of registration: 20170830 Address after: 223065, 11, Hon Hai North Road, Huaian economic and Technological Development Zone, Jiangsu Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Qing Ding precision electronic (Huaian) Co., Ltd. Address before: 223005 Foxconn Road, Huaian Economic Development Zone, Jiangsu, No. 168 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Wang Heng Sheng Electronic Technology (Huaian) Co. Ltd. |
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TR01 | Transfer of patent right |