SG166065A1 - Semiconductor device and manufacturing method thereof - Google Patents

Semiconductor device and manufacturing method thereof

Info

Publication number
SG166065A1
SG166065A1 SG201002510-4A SG2010025104A SG166065A1 SG 166065 A1 SG166065 A1 SG 166065A1 SG 2010025104 A SG2010025104 A SG 2010025104A SG 166065 A1 SG166065 A1 SG 166065A1
Authority
SG
Singapore
Prior art keywords
semiconductor layer
forming
conductive type
columnar
insulating film
Prior art date
Application number
SG201002510-4A
Other languages
English (en)
Inventor
Fujio Masuoka
Hiroki Nakamura
Shintaro Arai
Tomohiko Kudo
Navab Singh
Kavitha Devi Buddharaju
Shen Nansheng
Rukmani Devi Sayanthan
Original Assignee
Unisantis Electronics Jp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unisantis Electronics Jp Ltd filed Critical Unisantis Electronics Jp Ltd
Publication of SG166065A1 publication Critical patent/SG166065A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7827Vertical transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42356Disposition, e.g. buried gate electrode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/423Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
    • H01L29/42312Gate electrodes for field effect devices
    • H01L29/42316Gate electrodes for field effect devices for field-effect transistors
    • H01L29/4232Gate electrodes for field effect devices for field-effect transistors with insulated gate
    • H01L29/42384Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
    • H01L29/42392Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor fully surrounding the channel, e.g. gate-all-around
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45Ohmic electrodes
    • H01L29/456Ohmic electrodes on silicon
    • H01L29/458Ohmic electrodes on silicon for thin film silicon, e.g. source or drain electrode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66666Vertical transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78642Vertical transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
SG201002510-4A 2009-04-20 2010-04-09 Semiconductor device and manufacturing method thereof SG166065A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009119233A JP4577592B2 (ja) 2009-04-20 2009-04-20 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
SG166065A1 true SG166065A1 (en) 2010-11-29

Family

ID=42272574

Family Applications (2)

Application Number Title Priority Date Filing Date
SG201002510-4A SG166065A1 (en) 2009-04-20 2010-04-09 Semiconductor device and manufacturing method thereof
SG2011081254A SG176456A1 (en) 2009-04-20 2010-04-09 Semiconductor device and manufacturing method thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG2011081254A SG176456A1 (en) 2009-04-20 2010-04-09 Semiconductor device and manufacturing method thereof

Country Status (7)

Country Link
US (2) US8080458B2 (zh)
EP (1) EP2244298B1 (zh)
JP (1) JP4577592B2 (zh)
KR (1) KR101230745B1 (zh)
CN (1) CN101866857B (zh)
SG (2) SG166065A1 (zh)
TW (1) TW201039394A (zh)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8378425B2 (en) * 2008-01-29 2013-02-19 Unisantis Electronics Singapore Pte Ltd. Semiconductor storage device
JP4577592B2 (ja) 2009-04-20 2010-11-10 日本ユニサンティスエレクトロニクス株式会社 半導体装置の製造方法
US8759178B2 (en) 2011-11-09 2014-06-24 Unisantis Electronics Singapore Pte. Ltd. Method for manufacturing semiconductor device and semiconductor device
US10438836B2 (en) 2011-11-09 2019-10-08 Unisantis Electronics Singapore Pte. Ltd. Method for manufacturing a semiconductor device
CN103201842A (zh) * 2011-11-09 2013-07-10 新加坡优尼山帝斯电子私人有限公司 半导体器件的制造方法及半导体器件
US8735971B2 (en) 2011-12-02 2014-05-27 Unisantis Electronics Singapore Pte. Ltd. Method for producing semiconductor device and semiconductor device
US9117690B2 (en) 2011-12-02 2015-08-25 Unisantis Electronics Singapore Pte. Ltd. Method for producing semiconductor device and semiconductor device
WO2013080378A1 (ja) * 2011-12-02 2013-06-06 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置の製造方法と半導体装置
US8664063B2 (en) 2011-12-13 2014-03-04 Unisantis Electronics Singapore Pte. Ltd. Method of producing a semiconductor device and semiconductor device
CN103262234A (zh) * 2011-12-13 2013-08-21 新加坡优尼山帝斯电子私人有限公司 半导体器件的制造方法及半导体器件
US9373675B2 (en) 2012-02-06 2016-06-21 Taiwan Semiconductor Manufacturing Company, Ltd. Capacitor structure and method of forming the same
KR20130104200A (ko) * 2012-03-13 2013-09-25 에스케이하이닉스 주식회사 반도체 장치 및 그 제조 방법
US9252237B2 (en) * 2012-05-09 2016-02-02 Taiwan Semiconductor Manufacturing Company, Ltd. Transistors, semiconductor devices, and methods of manufacture thereof
WO2013171873A1 (ja) * 2012-05-17 2013-11-21 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置
US9012981B2 (en) 2012-05-17 2015-04-21 Unisantis Electronics Singapore Pte. Ltd. Semiconductor device
US9166043B2 (en) 2012-05-17 2015-10-20 Unisantis Electronics Singapore Pte. Ltd. Semiconductor device
US8829601B2 (en) 2012-05-17 2014-09-09 Unisantis Electronics Singapore Pte. Ltd. Semiconductor device
US8877578B2 (en) 2012-05-18 2014-11-04 Unisantis Electronics Singapore Pte. Ltd. Method for producing semiconductor device and semiconductor device
WO2013171908A1 (ja) * 2012-05-18 2013-11-21 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置の製造方法及び半導体装置
US8697511B2 (en) 2012-05-18 2014-04-15 Unisantis Electronics Singapore Pte. Ltd. Method for producing semiconductor device and semiconductor device
JP5595619B2 (ja) * 2012-08-08 2014-09-24 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置の製造方法、及び、半導体装置
US9865716B2 (en) * 2012-08-24 2018-01-09 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for a vertical tunneling field-effect transistor cell
US9041106B2 (en) * 2012-09-27 2015-05-26 Intel Corporation Three-dimensional germanium-based semiconductor devices formed on globally or locally isolated substrates
US9082838B2 (en) * 2012-09-28 2015-07-14 Unisantis Electronics Singapore Pte. Ltd. Method for producing a semiconductor device and semiconductor device
US9159826B2 (en) * 2013-01-18 2015-10-13 Taiwan Semiconductor Manufacturing Company, Ltd. Vertical tunneling field-effect transistor cell and fabricating the same
US9190484B2 (en) * 2013-01-18 2015-11-17 Taiwan Semiconductor Manufacturing Company, Ltd. Vertical tunneling field-effect transistor cell and fabricating the same
US9041095B2 (en) 2013-01-24 2015-05-26 Unisantis Electronics Singapore Pte. Ltd. Vertical transistor with surrounding gate and work-function metal around upper sidewall, and method for manufacturing the same
WO2014115287A1 (ja) * 2013-01-24 2014-07-31 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置の製造方法、及び、半導体装置
WO2014170949A1 (ja) * 2013-04-16 2014-10-23 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置の製造方法、及び、半導体装置
JP5670603B1 (ja) 2013-04-26 2015-02-18 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. 半導体装置の製造方法及び半導体装置
JP5872054B2 (ja) * 2013-06-17 2016-03-01 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. 半導体装置の製造方法、及び、半導体装置
WO2014203304A1 (ja) 2013-06-17 2014-12-24 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置の製造方法、及び、半導体装置
WO2015008387A1 (ja) * 2013-07-19 2015-01-22 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置の製造方法、及び、半導体装置
KR20150020845A (ko) 2013-08-19 2015-02-27 에스케이하이닉스 주식회사 수직 채널을 갖는 반도체 장치, 그를 포함하는 저항 변화 메모리 장치 및 그 제조방법
US9231055B2 (en) * 2013-08-19 2016-01-05 SK Hynix Inc. Semiconductor device having fin gate, resistive memory device including the same, and method of manufacturing the same
WO2015045054A1 (ja) * 2013-09-26 2015-04-02 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置、及び半導体装置の製造方法
WO2015049773A1 (ja) * 2013-10-03 2015-04-09 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置、及び、半導体装置の製造方法
JP5670606B1 (ja) * 2013-11-22 2015-02-18 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. 半導体装置、及び半導体装置の製造方法
JP5657151B1 (ja) * 2014-01-23 2015-01-21 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. 半導体装置、及び半導体装置の製造方法
WO2015121921A1 (ja) * 2014-02-12 2015-08-20 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置、及び半導体装置の製造方法
WO2015125204A1 (ja) * 2014-02-18 2015-08-27 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置の製造方法、及び、半導体装置
WO2015132912A1 (ja) * 2014-03-05 2015-09-11 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置の製造方法、及び、半導体装置
US10026658B2 (en) * 2014-04-14 2018-07-17 Taiwan Semiconductor Manufacturing Company Limited Methods for fabricating vertical-gate-all-around transistor structures
US9614091B2 (en) 2014-06-20 2017-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Gate structure and method for fabricating the same
US9893159B2 (en) 2014-08-15 2018-02-13 Taiwan Semiconductor Manufacturing Co., Ltd. Transistor, integrated circuit and method of fabricating the same
US9985026B2 (en) * 2014-08-15 2018-05-29 Taiwan Semiconductor Manufacturing Co., Ltd. Transistor, integrated circuit and method of fabricating the same
US9865682B2 (en) 2014-09-04 2018-01-09 Globalfoundries Inc. Directed self-assembly material etch mask for forming vertical nanowires
US10186577B2 (en) 2014-09-04 2019-01-22 Globalfoundries Inc. Multiple directed self-assembly material mask patterning for forming vertical nanowires
US9698025B2 (en) * 2014-09-04 2017-07-04 Globalfoundries Inc. Directed self-assembly material growth mask for forming vertical nanowires
JP5926354B2 (ja) * 2014-10-31 2016-05-25 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. 半導体装置
JP5986618B2 (ja) * 2014-12-04 2016-09-06 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. 半導体装置
JP5917673B2 (ja) * 2014-12-17 2016-05-18 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. 半導体装置の製造方法及び半導体装置
US10903210B2 (en) * 2015-05-05 2021-01-26 International Business Machines Corporation Sub-fin doped bulk fin field effect transistor (FinFET), Integrated Circuit (IC) and method of manufacture
JP5926423B2 (ja) * 2015-05-20 2016-05-25 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. 半導体装置
US10141426B2 (en) * 2016-02-08 2018-11-27 International Business Macahines Corporation Vertical transistor device
US11018254B2 (en) * 2016-03-31 2021-05-25 International Business Machines Corporation Fabrication of vertical fin transistor with multiple threshold voltages
JP6230648B2 (ja) * 2016-04-21 2017-11-15 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. 半導体装置
JP6284585B2 (ja) * 2016-07-15 2018-02-28 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. 半導体装置の製造方法及び半導体装置
JP6235662B2 (ja) * 2016-08-05 2017-11-22 ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. 半導体装置
US10199278B2 (en) 2017-05-30 2019-02-05 International Business Machines Corporation Vertical field effect transistor (FET) with controllable gate length
US10672888B2 (en) * 2017-08-21 2020-06-02 International Business Machines Corporation Vertical transistors having improved gate length control
US10297507B2 (en) 2017-10-17 2019-05-21 International Business Machines Corporation Self-aligned vertical field-effect transistor with epitaxially grown bottom and top source drain regions
US10211288B1 (en) 2017-10-20 2019-02-19 International Business Machines Corporation Vertical transistors with multiple gate lengths
US10263122B1 (en) * 2017-11-30 2019-04-16 Globalfoundries Inc. Methods, apparatus, and manufacturing system for self-aligned patterning of contacts in a vertical field effect transistor
US11081569B2 (en) * 2017-12-15 2021-08-03 International Business Machines Corporation Resistor loaded inverter structures
JP7210344B2 (ja) 2019-03-18 2023-01-23 キオクシア株式会社 半導体装置及びその製造方法
US10964792B1 (en) 2019-11-22 2021-03-30 Taiwan Semiconductor Manufacturing Co., Ltd. Dual metal capped via contact structures for semiconductor devices
CN113451133B (zh) * 2020-03-26 2023-03-28 中芯国际集成电路制造(天津)有限公司 半导体结构及其形成方法

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2703970B2 (ja) 1989-01-17 1998-01-26 株式会社東芝 Mos型半導体装置
JP3057661B2 (ja) 1988-09-06 2000-07-04 株式会社東芝 半導体装置
JPH02145761A (ja) 1988-11-28 1990-06-05 Matsushita Electric Ind Co Ltd 薄膜超電導体の製造方法
JP2950558B2 (ja) 1989-11-01 1999-09-20 株式会社東芝 半導体装置
JP2748072B2 (ja) * 1992-07-03 1998-05-06 三菱電機株式会社 半導体装置およびその製造方法
JPH0831576B2 (ja) * 1993-02-05 1996-03-27 株式会社東芝 半導体装置及びその製造方法
JPH07245291A (ja) * 1994-03-03 1995-09-19 Sony Corp シリコン系基板のエッチング方法及びエッチング装置
JPH07263677A (ja) * 1994-03-18 1995-10-13 Mitsubishi Electric Corp 半導体装置およびその製造方法
JPH08227997A (ja) * 1995-02-20 1996-09-03 Hitachi Ltd 半導体装置とその製造方法
DE19711482C2 (de) * 1997-03-19 1999-01-07 Siemens Ag Verfahren zur Herstellung eines vertikalen MOS-Transistors
JPH11297984A (ja) 1998-04-07 1999-10-29 Seiko Epson Corp Ldd型mosトランジスタの構造および形成方法
US6229161B1 (en) * 1998-06-05 2001-05-08 Stanford University Semiconductor capacitively-coupled NDR device and its applications in high-density high-speed memories and in power switches
JP3376302B2 (ja) * 1998-12-04 2003-02-10 株式会社東芝 半導体装置及びその製造方法
KR20010028692A (ko) * 1999-09-22 2001-04-06 이계안 파이프 테스터기
JP2001284598A (ja) 2000-03-31 2001-10-12 Fujitsu Ltd 半導体装置及びその製造方法
US6461900B1 (en) 2001-10-18 2002-10-08 Chartered Semiconductor Manufacturing Ltd. Method to form a self-aligned CMOS inverter using vertical device integration
US7348243B2 (en) 2003-12-27 2008-03-25 Dongbu Electronics Co., Ltd. Semiconductor device and method for fabricating the same
CN100570894C (zh) 2004-01-22 2009-12-16 国际商业机器公司 垂直鳍片场效应晶体管mos器件
JP2005268418A (ja) * 2004-03-17 2005-09-29 Fujio Masuoka 半導体記憶装置及びその製造方法
US7442976B2 (en) 2004-09-01 2008-10-28 Micron Technology, Inc. DRAM cells with vertical transistors
JP4997694B2 (ja) * 2004-10-07 2012-08-08 富士電機株式会社 半導体装置およびその製造方法
JP2006310651A (ja) * 2005-04-28 2006-11-09 Toshiba Corp 半導体装置の製造方法
JP4720307B2 (ja) * 2005-06-15 2011-07-13 富士電機システムズ株式会社 半導体装置の製造方法
KR100739532B1 (ko) 2006-06-09 2007-07-13 삼성전자주식회사 매몰 비트라인 형성 방법
JP2008066562A (ja) * 2006-09-08 2008-03-21 Toshiba Corp 半導体装置およびその製造方法
US8058683B2 (en) 2007-01-18 2011-11-15 Samsung Electronics Co., Ltd. Access device having vertical channel and related semiconductor device and a method of fabricating the access device
JP2008218514A (ja) * 2007-02-28 2008-09-18 Toshiba Corp 磁気ランダムアクセスメモリ及びその製造方法
JP5466816B2 (ja) * 2007-08-09 2014-04-09 ピーエスフォー ルクスコ エスエイアールエル 縦型mosトランジスタの製造方法
JP2009081163A (ja) * 2007-09-25 2009-04-16 Elpida Memory Inc 半導体装置およびその製造方法
JP5317343B2 (ja) 2009-04-28 2013-10-16 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置及びその製造方法
JP4316658B2 (ja) 2008-01-29 2009-08-19 日本ユニサンティスエレクトロニクス株式会社 半導体装置の製造方法
JP4487221B1 (ja) 2009-04-17 2010-06-23 日本ユニサンティスエレクトロニクス株式会社 半導体装置
JP4577592B2 (ja) 2009-04-20 2010-11-10 日本ユニサンティスエレクトロニクス株式会社 半導体装置の製造方法
JP5066590B2 (ja) 2010-06-09 2012-11-07 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置とその製造方法
JP5087655B2 (ja) 2010-06-15 2012-12-05 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体装置及びその製造方法

Also Published As

Publication number Publication date
EP2244298A2 (en) 2010-10-27
CN101866857B (zh) 2012-11-28
SG176456A1 (en) 2011-12-29
TW201039394A (en) 2010-11-01
JP2010251678A (ja) 2010-11-04
EP2244298A3 (en) 2010-12-15
US8080458B2 (en) 2011-12-20
US8519475B2 (en) 2013-08-27
JP4577592B2 (ja) 2010-11-10
US20100264485A1 (en) 2010-10-21
US20120049252A1 (en) 2012-03-01
EP2244298B1 (en) 2015-09-23
KR20100115711A (ko) 2010-10-28
KR101230745B1 (ko) 2013-02-07
CN101866857A (zh) 2010-10-20

Similar Documents

Publication Publication Date Title
SG166065A1 (en) Semiconductor device and manufacturing method thereof
TW201614804A (en) Semiconductor device and method for manufacturing semiconductor device
TW201613111A (en) Semiconductor device and manufacturing method thereof
WO2009041713A3 (en) Method for manufacturing an oxide semiconductor field-effect transistor
EP2755237A3 (en) Trench MOS gate semiconductor device and method of fabricating the same
TW200731530A (en) Semiconductor devices and methods for fabricating the same
TW200629422A (en) Method of manufacturing a capaciotr and a metal gate on a semiconductor device
EP2996154A3 (en) Non-planar germanium quantum well devices
TW200721503A (en) Thin-film transistor, TFT-array substrate, liquid-crystal display device and method of fabricating the same
TW200620489A (en) Strained fully depleted silicon on insulator semiconductor device and manufacturing method therefor
TW200627629A (en) Semiconductor device having ferroelectric capacitor and its manufacture method
WO2013028685A3 (en) Semiconductor device structures including vertical transistor devices, arrays of vertical transistor devices, and methods of fabrication
JP2012084865A5 (ja) 半導体装置の作製方法
TW200616053A (en) A method for making a semiconductor device that includes a metal gate electrode
EP2782138A3 (en) Semiconductor device and method for manufacturing the same
JP2012068627A5 (ja) 半導体装置の作製方法
TW200943421A (en) Method for manufacturing semiconductor device
SG10201804609UA (en) Semiconductor device and manufacturing method thereof
TW201130057A (en) Semiconductor device and manufacturing method thereof
EP2824711A3 (en) Vertical transistors having p-type gallium nitride current barrier layers and methods of fabricating the same
SG151168A1 (en) Multiple gate field effect transistor structure and method for fabricating same
US20150097197A1 (en) Finfet with sigma cavity with multiple epitaxial material regions
EP2131399A3 (en) Insulated gate semiconductor device and method of manufacturing the same
TW200616028A (en) Passive device and method for forming the same
TW200943436A (en) Method for fabricating semiconductor device