SG123604A1 - Substrate processing apparatus and substrate processing method - Google Patents

Substrate processing apparatus and substrate processing method

Info

Publication number
SG123604A1
SG123604A1 SG200401390A SG200401390A SG123604A1 SG 123604 A1 SG123604 A1 SG 123604A1 SG 200401390 A SG200401390 A SG 200401390A SG 200401390 A SG200401390 A SG 200401390A SG 123604 A1 SG123604 A1 SG 123604A1
Authority
SG
Singapore
Prior art keywords
substrate processing
processing apparatus
processing method
substrate
processing
Prior art date
Application number
SG200401390A
Other languages
English (en)
Inventor
Issei Ueda
Shinichi Hayashi
Naruaki Iida
Yuji Matsuyama
Yoichi Deguchi
Original Assignee
Tokyo Electron Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Electron Ltd filed Critical Tokyo Electron Electron Ltd
Publication of SG123604A1 publication Critical patent/SG123604A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • GPHYSICS
    • G07CHECKING-DEVICES
    • G07CTIME OR ATTENDANCE REGISTERS; REGISTERING OR INDICATING THE WORKING OF MACHINES; GENERATING RANDOM NUMBERS; VOTING OR LOTTERY APPARATUS; ARRANGEMENTS, SYSTEMS OR APPARATUS FOR CHECKING NOT PROVIDED FOR ELSEWHERE
    • G07C9/00Individual registration on entry or exit
    • G07C9/20Individual registration on entry or exit involving the use of a pass
    • G07C9/28Individual registration on entry or exit involving the use of a pass the pass enabling tracking or indicating presence
    • GPHYSICS
    • G08SIGNALLING
    • G08GTRAFFIC CONTROL SYSTEMS
    • G08G3/00Traffic control systems for marine craft
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/6715Apparatus for applying a liquid, a resin, an ink or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00Cleaning and liquid contact with solids
    • Y10S134/902Semiconductor wafer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/14Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ocean & Marine Engineering (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Robotics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Weting (AREA)
SG200401390A 1999-10-19 2000-10-18 Substrate processing apparatus and substrate processing method SG123604A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29639599 1999-10-19

Publications (1)

Publication Number Publication Date
SG123604A1 true SG123604A1 (en) 2006-07-26

Family

ID=17832999

Family Applications (4)

Application Number Title Priority Date Filing Date
SG200006014A SG90184A1 (en) 1999-10-19 2000-10-18 Substrate processing apparatus and substrate processing method
SG200401389A SG123603A1 (en) 1999-10-19 2000-10-18 Substrate processing apparatus and substrate processing method
SG200401388A SG123602A1 (en) 1999-10-19 2000-10-18 Substrate processing apparatus and substrate processing method
SG200401390A SG123604A1 (en) 1999-10-19 2000-10-18 Substrate processing apparatus and substrate processing method

Family Applications Before (3)

Application Number Title Priority Date Filing Date
SG200006014A SG90184A1 (en) 1999-10-19 2000-10-18 Substrate processing apparatus and substrate processing method
SG200401389A SG123603A1 (en) 1999-10-19 2000-10-18 Substrate processing apparatus and substrate processing method
SG200401388A SG123602A1 (en) 1999-10-19 2000-10-18 Substrate processing apparatus and substrate processing method

Country Status (6)

Country Link
US (3) US6402401B1 (zh)
EP (5) EP1094501B9 (zh)
KR (1) KR100634122B1 (zh)
DE (3) DE60033613T2 (zh)
SG (4) SG90184A1 (zh)
TW (1) TW480555B (zh)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771152B2 (en) * 2001-03-21 2004-08-03 Leviton Manufacturing Co., Inc. Pivot point reset lockout mechanism for a ground for fault circuit interrupter
JP3950299B2 (ja) * 2001-01-15 2007-07-25 東京エレクトロン株式会社 基板処理装置及びその方法
US6790286B2 (en) * 2001-01-18 2004-09-14 Dainippon Screen Mfg. Co. Ltd. Substrate processing apparatus
KR100848772B1 (ko) * 2001-02-22 2008-07-28 도쿄엘렉트론가부시키가이샤 기판처리장치
JP3916468B2 (ja) * 2002-01-11 2007-05-16 東京エレクトロン株式会社 基板処理装置および基板処理方法
KR100516134B1 (ko) * 2002-08-17 2005-09-23 주식회사 테라세미콘 Simox soi 웨이퍼 제조용 장치
CN1711369B (zh) * 2002-11-15 2011-07-13 欧瑞康日光特吕巴赫股份公司 用于真空处理两维加长基片的装置及加工这种基片的方法
JP4522139B2 (ja) * 2003-09-19 2010-08-11 大日本スクリーン製造株式会社 基板処理ユニット、基板載置状態検出方法および基板処理装置
KR20070008533A (ko) * 2003-11-10 2007-01-17 블루쉬프트 테크놀로지스, 인코포레이티드. 진공-사용 반도체 핸들링 시스템에서 작업 편을 핸들링하기위한 방법 및 시스템
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20050103267A1 (en) * 2003-11-14 2005-05-19 Hur Gwang H. Flat panel display manufacturing apparatus
JP4381121B2 (ja) * 2003-12-11 2009-12-09 大日本スクリーン製造株式会社 基板処理装置
KR100577582B1 (ko) * 2004-06-09 2006-05-08 삼성전자주식회사 반도체 포토 스피너 설비 및 이를 이용한 웨이퍼 티칭불량방지방법
KR100583730B1 (ko) * 2004-06-29 2006-05-26 삼성전자주식회사 기판 이송 시스템 및 상기 시스템의 프레임 내 압력을조절하는 방법
SG121907A1 (en) * 2004-10-21 2006-05-26 Systems On Silicon Mfg Company Detection method and system for non-coating of photoresist
JP5008280B2 (ja) * 2004-11-10 2012-08-22 株式会社Sokudo 基板処理装置および基板処理方法
JP5154007B2 (ja) 2004-12-06 2013-02-27 株式会社Sokudo 基板処理装置
JP4926433B2 (ja) * 2004-12-06 2012-05-09 株式会社Sokudo 基板処理装置および基板処理方法
JP4794232B2 (ja) * 2004-12-06 2011-10-19 株式会社Sokudo 基板処理装置
KR101074388B1 (ko) * 2004-12-22 2011-10-17 엘지디스플레이 주식회사 액정표시장치용 제조 장비
US20060182535A1 (en) * 2004-12-22 2006-08-17 Mike Rice Cartesian robot design
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7798764B2 (en) * 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7255747B2 (en) 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
JP4955977B2 (ja) * 2005-01-21 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4955976B2 (ja) * 2005-01-21 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4356936B2 (ja) * 2005-01-21 2009-11-04 東京エレクトロン株式会社 塗布、現像装置及びその方法
US7520287B2 (en) * 2005-01-28 2009-04-21 Kozy David M Aqueous tube cleaning apparatus and method
JP4459831B2 (ja) * 2005-02-01 2010-04-28 東京エレクトロン株式会社 塗布、現像装置
JP4414909B2 (ja) * 2005-02-14 2010-02-17 東京エレクトロン株式会社 塗布、現像装置
JP4414921B2 (ja) * 2005-03-23 2010-02-17 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像方法
JP4761907B2 (ja) * 2005-09-28 2011-08-31 株式会社Sokudo 基板処理装置
JP4450784B2 (ja) * 2005-10-19 2010-04-14 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4771816B2 (ja) * 2006-01-27 2011-09-14 大日本スクリーン製造株式会社 基板処理装置
JP4889331B2 (ja) * 2006-03-22 2012-03-07 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
WO2007112454A2 (en) * 2006-03-28 2007-10-04 Stratusys Inc. Apparatus and method for processing substrates using one or more vacuum transfer chamber units
US20070254493A1 (en) * 2006-04-28 2007-11-01 Applied Materials, Inc. Integrated thermal unit having vertically arranged bake and chill plates
JP4796889B2 (ja) * 2006-05-08 2011-10-19 Nec液晶テクノロジー株式会社 パネル洗浄機及び洗浄方法
JP2008034746A (ja) * 2006-07-31 2008-02-14 Tokyo Electron Ltd 塗布、現像装置、その方法及び記憶媒体
JP4664264B2 (ja) * 2006-10-26 2011-04-06 東京エレクトロン株式会社 検出装置及び検出方法
US20080145191A1 (en) * 2006-11-15 2008-06-19 Sokudo Co., Ltd. Actively chilled substrate transport module
TWI327258B (en) * 2006-12-29 2010-07-11 Au Optronics Corp Developing apparatus with macroscopic inspection
KR100855733B1 (ko) * 2006-12-29 2008-09-03 세메스 주식회사 기판 처리 장치
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7950407B2 (en) 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
KR101157157B1 (ko) * 2007-03-28 2012-06-20 삼성테크윈 주식회사 인쇄회로기판 얼라인 유니트 및 이를 갖는 표면 실장장치
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Sokudo 基板処理装置
JP4979079B2 (ja) * 2007-07-09 2012-07-18 東京エレクトロン株式会社 基板処理装置
JP5160204B2 (ja) * 2007-11-30 2013-03-13 株式会社Sokudo 基板処理装置
JP5128918B2 (ja) * 2007-11-30 2013-01-23 株式会社Sokudo 基板処理装置
JP5005770B2 (ja) * 2007-12-27 2012-08-22 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Sokudo 基板処理装置
JP5001828B2 (ja) * 2007-12-28 2012-08-15 株式会社Sokudo 基板処理装置
KR101166109B1 (ko) * 2009-01-30 2012-07-23 세메스 주식회사 기판 처리 설비
JP5410212B2 (ja) * 2009-09-15 2014-02-05 株式会社Sokudo 基板処理装置、基板処理システムおよび検査周辺露光装置
JP5562759B2 (ja) * 2009-11-04 2014-07-30 東京エレクトロン株式会社 基板処理装置
JP4948587B2 (ja) * 2009-11-13 2012-06-06 東京エレクトロン株式会社 フォトレジスト塗布現像装置、基板搬送方法、インターフェイス装置
KR101147305B1 (ko) * 2010-10-12 2012-05-18 나노씨엠에스(주) 나노 금속성 은의 침착에 의한 나노 은 박막 형성장치
CN102651328B (zh) * 2011-02-23 2014-11-19 技鼎股份有限公司 提升晶圆快速热处理产能的设备与操作方法
US9530676B2 (en) * 2011-06-01 2016-12-27 Ebara Corporation Substrate processing apparatus, substrate transfer method and substrate transfer device
JP6151080B2 (ja) * 2013-04-26 2017-06-21 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置
JP2016023939A (ja) * 2014-07-16 2016-02-08 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
US9902415B2 (en) * 2016-02-15 2018-02-27 Lam Research Corporation Universal service cart for semiconductor system maintenance
JP6934732B2 (ja) * 2016-03-31 2021-09-15 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
TWI676584B (zh) * 2018-03-02 2019-11-11 台灣愛司帝科技股份有限公司 晶片取放裝置及晶片取放與檢測系統
JP6942660B2 (ja) 2018-03-09 2021-09-29 株式会社Screenホールディングス 基板処理装置及び基板処理方法
CN112424922A (zh) 2018-07-17 2021-02-26 Asml荷兰有限公司 粒子束检查装置
KR102387088B1 (ko) 2019-10-31 2022-04-15 세메스 주식회사 기판 처리 장치
CN114535201B (zh) * 2022-04-27 2022-08-02 沈阳和研科技有限公司 旋转承载台、半导体材料清洗机及划片机

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05304196A (ja) * 1992-04-27 1993-11-16 Mitsubishi Electric Corp ウエハ搬送装置
DE69304038T2 (de) * 1993-01-28 1996-12-19 Applied Materials Inc Vorrichtung für ein Vakuumverfahren mit verbessertem Durchsatz
US5826129A (en) 1994-06-30 1998-10-20 Tokyo Electron Limited Substrate processing system
JP3143702B2 (ja) 1994-10-05 2001-03-07 東京エレクトロン株式会社 熱処理装置
US5620560A (en) * 1994-10-05 1997-04-15 Tokyo Electron Limited Method and apparatus for heat-treating substrate
JP3592771B2 (ja) * 1994-12-07 2004-11-24 大日本スクリーン製造株式会社 基板処理装置
JPH08264618A (ja) * 1995-03-27 1996-10-11 Toshiba Corp 半導体製造装置及び半導体装置の製造方法
TW317644B (zh) * 1996-01-26 1997-10-11 Tokyo Electron Co Ltd
US6198074B1 (en) * 1996-09-06 2001-03-06 Mattson Technology, Inc. System and method for rapid thermal processing with transitional heater
JP3202929B2 (ja) 1996-09-13 2001-08-27 東京エレクトロン株式会社 処理システム
TW353777B (en) * 1996-11-08 1999-03-01 Tokyo Electron Ltd Treatment device
JPH10149984A (ja) * 1996-11-20 1998-06-02 Ulvac Japan Ltd 多結晶シリコンの形成方法及び形成装置
US6099643A (en) * 1996-12-26 2000-08-08 Dainippon Screen Mfg. Co., Ltd. Apparatus for processing a substrate providing an efficient arrangement and atmospheric isolation of chemical treatment section
JPH10289940A (ja) * 1997-04-15 1998-10-27 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3926890B2 (ja) * 1997-06-11 2007-06-06 東京エレクトロン株式会社 処理システム
US6089763A (en) * 1997-09-09 2000-07-18 Dns Korea Co., Ltd. Semiconductor wafer processing system
JPH11168131A (ja) * 1997-12-04 1999-06-22 Nec Kyushu Ltd ウエハ搬送チャック
KR19990074935A (ko) * 1998-03-16 1999-10-05 윤종용 웨이퍼의 이동 경로에 설치된 가열 장치를 갖춘 반도체 소자 제조 장치
JPH11296395A (ja) 1998-04-07 1999-10-29 Fuji Electric Co Ltd 二重化システムにおける等値化方法、二重化システムにおける等値化装置、及び記録媒体
JP2000040731A (ja) * 1998-07-24 2000-02-08 Tokyo Electron Ltd 処理装置
US6292250B1 (en) * 1998-08-10 2001-09-18 Tokyo Electron Limited Substrate process apparatus
JP3442669B2 (ja) * 1998-10-20 2003-09-02 東京エレクトロン株式会社 基板処理装置
JP3442686B2 (ja) * 1999-06-01 2003-09-02 東京エレクトロン株式会社 基板処理装置
JP3416078B2 (ja) * 1999-06-09 2003-06-16 東京エレクトロン株式会社 基板処理装置
KR20010019206A (ko) * 1999-08-25 2001-03-15 윤종용 반도체 제조공정에 사용되는 웨이퍼 운송장치

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