RU2010138584A - Осаждение и селективное удаление электропроводного вспомогательного слоя для обработки наноструктуры - Google Patents
Осаждение и селективное удаление электропроводного вспомогательного слоя для обработки наноструктуры Download PDFInfo
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- RU2010138584A RU2010138584A RU2010138584/28A RU2010138584A RU2010138584A RU 2010138584 A RU2010138584 A RU 2010138584A RU 2010138584/28 A RU2010138584/28 A RU 2010138584/28A RU 2010138584 A RU2010138584 A RU 2010138584A RU 2010138584 A RU2010138584 A RU 2010138584A
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- electrically conductive
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- conductive auxiliary
- nanostructures
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
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- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
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- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B82Y40/00—Manufacture or treatment of nanostructures
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- C01B32/15—Nano-sized carbon materials
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/503—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using DC or AC discharges
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
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- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
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- H10D30/014—Manufacture or treatment of FETs having zero-dimensional [0D] or one-dimensional [1D] channels, e.g. quantum wire FETs, single-electron transistors [SET] or Coulomb blockade transistors
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- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
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- H10P14/271—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials characterised by the preparation of substrate for selective deposition
- H10P14/274—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials characterised by the preparation of substrate for selective deposition using seed materials
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
- H10P14/3202—Materials thereof
- H10P14/3241—Materials thereof being conductive materials
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3451—Structure
- H10P14/3452—Microstructure
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- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
- H10W20/042—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers the barrier, adhesion or liner layers being seed or nucleation layers
- H10W20/045—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers the barrier, adhesion or liner layers being seed or nucleation layers for deposition from the gaseous phase, e.g. for chemical vapour deposition [CVD]
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- H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
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- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
- H10W20/057—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches by selectively depositing, e.g. by using selective CVD or plating
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- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
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- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
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- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3451—Structure
- H10P14/3452—Microstructure
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- H10W20/0554—Manufacture or treatment of conductive parts of the interconnections of nanotubes or nanowires
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
- Recrystallisation Techniques (AREA)
- Laminated Bodies (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3133308P | 2008-02-25 | 2008-02-25 | |
| US61/031,333 | 2008-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| RU2010138584A true RU2010138584A (ru) | 2012-04-10 |
Family
ID=41016331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| RU2010138584/28A RU2010138584A (ru) | 2008-02-25 | 2009-02-20 | Осаждение и селективное удаление электропроводного вспомогательного слоя для обработки наноструктуры |
Country Status (8)
| Country | Link |
|---|---|
| US (5) | US8508049B2 (enExample) |
| EP (1) | EP2250661B1 (enExample) |
| JP (4) | JP5474835B2 (enExample) |
| KR (2) | KR20160078517A (enExample) |
| CN (2) | CN102007571B (enExample) |
| RU (1) | RU2010138584A (enExample) |
| TW (1) | TWI465389B (enExample) |
| WO (1) | WO2009108101A1 (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7777291B2 (en) | 2005-08-26 | 2010-08-17 | Smoltek Ab | Integrated circuits having interconnects and heat dissipators based on nanostructures |
| RU2010114227A (ru) * | 2007-09-12 | 2011-10-20 | Смольтек Аб (Se) | Соединение и связывание соседних слоев наноструктурами |
| KR20160078517A (ko) | 2008-02-25 | 2016-07-04 | 스몰텍 에이비 | 나노구조 프로세싱을 위한 도전성 보조층의 증착과 선택적 제거 |
| US20110076841A1 (en) * | 2009-09-30 | 2011-03-31 | Kahen Keith B | Forming catalyzed ii-vi semiconductor nanowires |
| CN102110624B (zh) * | 2009-12-23 | 2012-05-30 | 中芯国际集成电路制造(上海)有限公司 | 检测镍铂去除装置的方法 |
| WO2012074271A2 (ko) * | 2010-12-01 | 2012-06-07 | Lee Choonrae | 전계방출 표시장치와 그 제조방법 |
| CN102299058B (zh) * | 2011-05-10 | 2013-02-27 | 吉林大学 | 通过多级异质结构纳米材料构筑微电子器件的方法 |
| EP2541581A1 (en) * | 2011-06-29 | 2013-01-02 | Khalid Waqas | Device comprising nanostructures and method of manufacturing thereof |
| RU2497319C1 (ru) * | 2012-02-28 | 2013-10-27 | Федеральное государственное автономное образовательное учреждение высшего профессионального образования "Национальный исследовательский университет "Высшая школа экономики" | Печатная плата для бортовой радиоэлектронной аппаратуры космических аппаратов |
| US9711263B2 (en) * | 2012-05-18 | 2017-07-18 | 3M Innovative Properties Company | Corona patterning of overcoated nanowire transparent conducting coatings |
| CN103456677A (zh) * | 2012-06-05 | 2013-12-18 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其制造方法 |
| CN103487143B (zh) * | 2012-06-12 | 2015-07-29 | 清华大学 | 光强分布的检测系统 |
| FR2997551B1 (fr) * | 2012-10-26 | 2015-12-25 | Commissariat Energie Atomique | Procede de fabrication d'une structure semiconductrice et composant semiconducteur comportant une telle structure |
| KR101938010B1 (ko) | 2012-11-22 | 2019-01-14 | 전북대학교산학협력단 | 다이오드의 제조방법 |
| US9006095B2 (en) | 2013-02-19 | 2015-04-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor devices and methods of manufacture thereof |
| TWI518756B (zh) | 2013-08-16 | 2016-01-21 | 財團法人工業技術研究院 | 圖案化的導電薄膜及其製造方法與應用 |
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-
2009
- 2009-02-20 KR KR1020167016883A patent/KR20160078517A/ko not_active Ceased
- 2009-02-20 KR KR1020107018053A patent/KR101638463B1/ko active Active
- 2009-02-20 WO PCT/SE2009/000098 patent/WO2009108101A1/en not_active Ceased
- 2009-02-20 CN CN200980106183.2A patent/CN102007571B/zh active Active
- 2009-02-20 CN CN201510831456.7A patent/CN105441903B/zh active Active
- 2009-02-20 JP JP2010548640A patent/JP5474835B2/ja active Active
- 2009-02-20 EP EP09715679.8A patent/EP2250661B1/en active Active
- 2009-02-20 RU RU2010138584/28A patent/RU2010138584A/ru unknown
- 2009-02-23 TW TW098105596A patent/TWI465389B/zh active
- 2009-02-24 US US12/392,017 patent/US8508049B2/en active Active
-
2013
- 2013-08-07 US US13/961,532 patent/US8866307B2/en active Active
-
2014
- 2014-02-04 JP JP2014019438A patent/JP5943947B2/ja active Active
- 2014-09-18 US US14/489,903 patent/US9114993B2/en active Active
-
2015
- 2015-07-09 US US14/795,598 patent/US20150318085A1/en not_active Abandoned
-
2016
- 2016-05-24 JP JP2016103110A patent/JP6126725B2/ja active Active
-
2017
- 2017-04-05 JP JP2017074919A patent/JP2017152716A/ja active Pending
- 2017-11-02 US US15/801,734 patent/US20180155824A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20180155824A1 (en) | 2018-06-07 |
| TWI465389B (zh) | 2014-12-21 |
| EP2250661B1 (en) | 2020-04-08 |
| KR101638463B1 (ko) | 2016-07-11 |
| US9114993B2 (en) | 2015-08-25 |
| JP6126725B2 (ja) | 2017-05-10 |
| EP2250661A1 (en) | 2010-11-17 |
| US20130334704A1 (en) | 2013-12-19 |
| JP5474835B2 (ja) | 2014-04-16 |
| CN105441903B (zh) | 2018-04-24 |
| KR20100117075A (ko) | 2010-11-02 |
| TW200944474A (en) | 2009-11-01 |
| WO2009108101A1 (en) | 2009-09-03 |
| JP2016195257A (ja) | 2016-11-17 |
| US20150318085A1 (en) | 2015-11-05 |
| CN102007571B (zh) | 2016-01-20 |
| KR20160078517A (ko) | 2016-07-04 |
| EP2250661A4 (en) | 2011-09-07 |
| US8866307B2 (en) | 2014-10-21 |
| JP2014140039A (ja) | 2014-07-31 |
| JP2011517366A (ja) | 2011-06-02 |
| US8508049B2 (en) | 2013-08-13 |
| JP5943947B2 (ja) | 2016-07-05 |
| JP2017152716A (ja) | 2017-08-31 |
| US20150004092A1 (en) | 2015-01-01 |
| CN105441903A (zh) | 2016-03-30 |
| US20090233124A1 (en) | 2009-09-17 |
| CN102007571A (zh) | 2011-04-06 |
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