NO981399L - Smelteanordning for agglomerasjon av et silisid - Google Patents

Smelteanordning for agglomerasjon av et silisid

Info

Publication number
NO981399L
NO981399L NO981399A NO981399A NO981399L NO 981399 L NO981399 L NO 981399L NO 981399 A NO981399 A NO 981399A NO 981399 A NO981399 A NO 981399A NO 981399 L NO981399 L NO 981399L
Authority
NO
Norway
Prior art keywords
resistance
silicide
silicon layer
agglomeration
layer
Prior art date
Application number
NO981399A
Other languages
English (en)
Norwegian (no)
Other versions
NO981399D0 (no
Inventor
Mark Bohr
Mohsen Alavi
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of NO981399D0 publication Critical patent/NO981399D0/no
Publication of NO981399L publication Critical patent/NO981399L/no

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
NO981399A 1995-09-29 1998-03-27 Smelteanordning for agglomerasjon av et silisid NO981399L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/537,283 US5708291A (en) 1995-09-29 1995-09-29 Silicide agglomeration fuse device
PCT/US1996/015717 WO1997012401A1 (en) 1995-09-29 1996-09-30 A silicide agglomeration fuse device

Publications (2)

Publication Number Publication Date
NO981399D0 NO981399D0 (no) 1998-03-27
NO981399L true NO981399L (no) 1998-05-27

Family

ID=24142006

Family Applications (1)

Application Number Title Priority Date Filing Date
NO981399A NO981399L (no) 1995-09-29 1998-03-27 Smelteanordning for agglomerasjon av et silisid

Country Status (14)

Country Link
US (3) US5708291A (pt)
EP (1) EP0857357A4 (pt)
JP (1) JPH11512879A (pt)
KR (1) KR100307779B1 (pt)
CN (1) CN1202277A (pt)
AU (1) AU7250896A (pt)
BR (1) BR9610726A (pt)
CA (1) CA2233317A1 (pt)
HU (1) HUP9802695A3 (pt)
IL (1) IL123752A (pt)
MX (1) MX9802299A (pt)
NO (1) NO981399L (pt)
PL (1) PL325837A1 (pt)
WO (1) WO1997012401A1 (pt)

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IL123752A (en) 2001-04-30
US5708291A (en) 1998-01-13
US5969404A (en) 1999-10-19
BR9610726A (pt) 1999-07-13
MX9802299A (es) 1998-08-30
IL123752A0 (en) 1998-10-30
KR100307779B1 (ko) 2002-03-08
EP0857357A1 (en) 1998-08-12
US6258700B1 (en) 2001-07-10
NO981399D0 (no) 1998-03-27
CN1202277A (zh) 1998-12-16
WO1997012401A1 (en) 1997-04-03
PL325837A1 (en) 1998-08-03
JPH11512879A (ja) 1999-11-02
HUP9802695A3 (en) 2000-01-28
AU7250896A (en) 1997-04-17
KR19990063840A (ko) 1999-07-26
HUP9802695A2 (hu) 1999-03-29
EP0857357A4 (en) 1999-03-17
CA2233317A1 (en) 1997-04-03

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