KR970032352A - 부품시장장치 및 방법과 부품실장장비 - Google Patents

부품시장장치 및 방법과 부품실장장비 Download PDF

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KR970032352A
KR970032352A KR1019960052338A KR19960052338A KR970032352A KR 970032352 A KR970032352 A KR 970032352A KR 1019960052338 A KR1019960052338 A KR 1019960052338A KR 19960052338 A KR19960052338 A KR 19960052338A KR 970032352 A KR970032352 A KR 970032352A
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mounting
component
substrate
parts
head portion
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KR1019960052338A
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KR100296485B1 (ko
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간지 하타
노리아키 요시다
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모리시타 요이찌
마쓰시타 덴키 산교 가부시키가이사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53061—Responsive to work or work-related machine element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)

Abstract

헤드부를 실장한 다음 기판위치 조정부에 위치한 기판에 부품을 실장함으로써 다수의 부품을 흡입하기 위한 다수의 부품실장장치가 제공되어 있다. 서로 나란히 부품실장장치를 배열함으로써 기판이송통로가 부품실장장치를 통과하도록 제공된다. 기판에 실장해야할 부품수가 증가할지라도 부품은 분배시 부품실장장치의 부품공급 테이블에 실장되어 전체장치가 크기에서 증가한다. 부품공급 테이블은 진동없이 고정적으로 실장되고 실장헤드부는 다수의 부품의 흡입 및 실장을 실행한다. 따라서, 부품실장 작동실장이 크게 증가한다.

Description

부품실장장치 및 방법과 부품실장장비
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예의 부품실장장비를 도시한 개략적인 평면도.
제2도는 본 발명의 부품실장장치의 실시예의 사시도.
제3도는 상기 장치의 작동 매카니즘의 평면도.
제4도는 상기 장치의 흐름도.
제5도는 장치의 제어작동을 수행하기 위한 구조를 도시한 블록도.

Claims (14)

  1. 부품(34)이 수용되고 기판(37)이 위치한 기판실장위치의 양쪽에 배열된 한쌍이 부품공급 테이블(28A)∼(28D)와; 부품공급 테이블 중 하나의 테이블이 부품을 연속적으로 잡은 다음, 잡힌 부품을 기판에 연속적으로 실장하는 제1실장헤드부(31,59)와; 나머지 부품공급 테이블의 부품을 연속적으로 잡은 다음 이 잡힌 부품을 기판에 연속적으로 실장하는 제2실장헤드부(31,59)를 구비하여서, 제1 및 제2실장헤드부가 독자적으로 작동하는 부품실장장치.
  2. 제1항에 있어서, 제1 및 제2실장헤드부는 이들 중 하나가 부품공급 테이블로부터 부품을 잡기위해 부품잡기 작동을 수행하고, 나머지 잡힌 부품을 기판에 실장하기 위해 부품실장 작동을 수행하는 시간에 따라 작동이 서로 제어되는 부품실장장치.
  3. 제1항에 있어서, 제1 및 제2실장헤드부 중 하나가 한 번에 부품을 흡입하는 부품흡입노즐(33)을 지닌 부품실장장치.
  4. 제2항에 있어서, 제1 및 제2실장헤드부 중 하나가 한 번에 부품을 흡입하는 부품흡입노즐(33)을 지닌 부품실장장치.
  5. 제1항에 청구된 다수의 부품실장장치에서, 기판이 상기 장치의 기판실장위치에 공급되고 기판이송장치(22)에 의해 상기 장치의 기판실장위치로부터 배출된 기판이송통로(21)는 기판이송통로가 부품실장장치의 기판실장위치를 연결하고 부품실장장치의 부품공급 테이블이 기판이송통로의 기판실장위치에 양측에 배열되게 제공된 부품실장장비.
  6. 제2항에 청구된 다수의 부품실장장치에서, 기판이 상기 장치의 기판실장위치에 공급되고 기판이송장치(22)에 의해 상기 장치의 기판실장위치로부터 배출되는 기판이송통로(21)는 기판이송통로가 부품실장장치의 기판실장위치를 연결하고 부품실장장치의 부품공급 테이블이 기판이송통로의 기판실장위치에 양측에 배열되도록 제공된 부품실장장비.
  7. 제5항에 있어서, 단일기판에 실장될 부품은 형태에 의해 그룹으로 분배되고, 이 그룹의 성분은 할당시 부품실장장치의 부품공급 테이블에 수용되는 부품실장장비.
  8. 제6항에 있어서, 단일부품에 실장될 부품은 형태에 의해 그룹으로 분배되고, 이 그룹의 부품은 할당시 부품실장장치의 부품공급 테이블에 수용된 부품실장장비.
  9. 제1실장헤드부(31,59)에 의해 부품(34)가 수용되고 기판(37)이 위치한 기판실장위치의 양쪽에 배열된 한쌍의 부품공급 테이블(28A∼28D) 중 하나로 부터 부품(34)을 선택하는 단계를, 포함하고 상기 제1실장헤드부(31,59)는 부품공급 테이블 중 하나에서 부품을 연속적으로 잡고; 또한, 이후 제1실장헤드부에 의해 잡힌 부품을 기판에 연속적으로 실장하는 단계와; 제2실장헤드부(31,59)에 의해 한쌍의 부품공급 테이블(28A∼28D) 중 나머지로 부터 부품(34)를 선택하는 단계를 구비하고, 제2실장헤드부(31,59)는 나머지 부품공급 테이블에서 연속적으로 부품을 잡고; 이후, 제2실장헤드부에 의해 잡힌 부품을 기판에 연속적으로 실장하는 단계를 포함하고, 제1실장헤드부의 잡음 및 실장단계와 제2실장헤드부의 잡음 및 실장단계는 독립적으로 수행되는 부품실장방법.
  10. 제9항에 있어서, 제1실장헤드부의 잡는 단계와 제2실장헤드부의 실장단계는 동시에 수행되고, 제1실장헤드부의 실장단계와 제2실장헤드부의 잡는 단계는 동시에 수행되는 부품실장방법.
  11. 제9항에 있어서, 다수의 부품실장장치를 포함하는 부품실장장비에서 각각의 부품실장장치는 제1 및 제2실장헤드부와 쌍의 부품공급 테이블을 포함하며, 이 부품공급 테이블 사이에 기판이 장치의 기판실장위치에 공급되고 기판이송장치(22)에 의해 장치의 기판실장위치로부터 배출된 기판이송통로(21)는 기판이송통로가 부품실장장치의 기판실장위치를 연결하고 부품실장장치의 부품공급 테이블이 기판이송통로의 기판실장위치의 양쪽에 배열되도록 제공되고, 제1실장헤드부의 잡고 실장하는 단계와, 제2실장헤드부의 잡고 실장하는 단계는 연속적으로 수행되는 부품실장방법.
  12. 제11항에 있어서, 각각의 제1실장헤드부의 잡는 단계와, 각각의 이에 해당하는 제2실장헤드부의 실장단계는 동시에 수행되는 각각의 제1실장헤드부의 실장단계와 각각의 이에 해당하는 제2실장헤드부의 잡는 단계는 동시에 수행되는 부품실장방법.
  13. 제11항에 있어서, 단일기판에 실장되어야 할 부품은 형태에 의해 그룹으로 분배되는 이 그룹의 부품은 할당시 부품실장장치의 부품공급 테이블에 수용되는 부품실장방법.
  14. 제12항에 있어서, 단일기판에 실장되어야 할 부품은 형태에 의해 분배되는 이 그룹의 부품은 할당시 부품실장장치의 부품공급 테이블에 수용되는 부품실장방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960052338A 1995-11-06 1996-11-06 부품장착장치및방법과부품장착설비 KR100296485B1 (ko)

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JP95-286969 1995-11-06
JP7286969A JPH09130084A (ja) 1995-11-06 1995-11-06 部品実装装置および部品実装設備

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KR970032352A true KR970032352A (ko) 1997-06-26
KR100296485B1 KR100296485B1 (ko) 2001-10-24

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US (2) US5778525A (ko)
JP (1) JPH09130084A (ko)
KR (1) KR100296485B1 (ko)
CN (5) CN1096223C (ko)
SG (1) SG71685A1 (ko)

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US7100278B2 (en) 1995-11-06 2006-09-05 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus and method
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CN1735334A (zh) 2006-02-15
US5778525A (en) 1998-07-14
CN1096223C (zh) 2002-12-11
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CN1223257C (zh) 2005-10-12
US20060200975A1 (en) 2006-09-14
CN1154058A (zh) 1997-07-09
CN1345178A (zh) 2002-04-17
CN100521904C (zh) 2009-07-29
KR100296485B1 (ko) 2001-10-24
CN100531549C (zh) 2009-08-19
CN1345179A (zh) 2002-04-17
US7356919B2 (en) 2008-04-15
CN1214700C (zh) 2005-08-10
CN1897807A (zh) 2007-01-17

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