JP4408682B2 - 電子部品装着装置 - Google Patents
電子部品装着装置 Download PDFInfo
- Publication number
- JP4408682B2 JP4408682B2 JP2003371869A JP2003371869A JP4408682B2 JP 4408682 B2 JP4408682 B2 JP 4408682B2 JP 2003371869 A JP2003371869 A JP 2003371869A JP 2003371869 A JP2003371869 A JP 2003371869A JP 4408682 B2 JP4408682 B2 JP 4408682B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- axis
- component
- mounting
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000605 extraction Methods 0.000 claims description 10
- 230000003111 delayed effect Effects 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 3
- 230000003028 elevating effect Effects 0.000 description 15
- 238000012937 correction Methods 0.000 description 14
- 238000012545 processing Methods 0.000 description 7
- 238000001179 sorption measurement Methods 0.000 description 7
- 238000001514 detection method Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0406—Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
- Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
7 装着ヘッド体
9 リニアモータ
9B 可動子
16 装着ヘッド
90 CPU
91 RAM
93 モーションコントロールボード
96 Y2ドライバ
97 Y1ドライバ
100、101 リニアスケール読み取りヘッド
Claims (3)
- 電子部品を供給する部品供給ユニットと、両端部にそれぞれ設けられた駆動源により一方向に移動可能なビームと、このビームに沿って移動可能であって前記部品供給ユニットから電子部品を取出してプリント基板上に装着する装着ヘッドとを備えた電子部品装着装置において、電子部品の取出し位置情報及びプリント基板への電子部品の装着位置情報を記憶する記憶装置と、この記憶装置に記憶された前記取出し位置情報及び装着位置情報に基づいて移動すべき位置を指令するコントローラと、前記ビーム両端部の前記各駆動源に対応してそれぞれ設けられ前記コントローラからの位置指令を受けて前記各駆動源に所定の電流を流すドライバー回路とを備え、この各ドライバー回路に前記ビームの両端部の各軸位置の差分を算出する算出手段と、この算出手段により算出された差分を比較して自軸が遅れている場合には自軸の推力を増加するように制御すると共に自軸が進んでいる場合には自軸の推力を減少するように制御する制御手段を設けたことを特徴とする電子部品装着装置。
- 電子部品を供給する部品供給ユニットと、両端部にそれぞれ設けられた駆動源により一方向に移動可能なビームと、このビームに沿って移動可能であって前記部品供給ユニットから電子部品を取出してプリント基板上に装着する装着ヘッドとを備えた電子部品装着装置において、電子部品の取出し位置情報及びプリント基板への電子部品の装着位置情報を記憶する記憶装置と、この記憶装置に記憶された前記取出し位置情報及び装着位置情報に基づいて移動すべき位置を指令するコントローラと、前記ビーム両端部の前記各駆動源に対応してそれぞれ設けられ前記コントローラからの位置指令を受けて前記各駆動源に所定の電流を流すドライバー回路とを備え、少なくとも一方のドライバー回路に前記ビームの両端部の各軸位置の差分を算出する算出手段と、この算出手段により算出された差分を比較して自軸が遅れている場合には自軸の推力を増加するように制御すると共に自軸が進んでいる場合には自軸の推力を減少するように制御する制御手段を設けたことを特徴とする電子部品装着装置。
- 前記算出手段は、前記ビームの両端部の各軸位置をそれぞれが計測する各リニアスケールからの位置情報に基づいてその差分を算出することを特徴とする請求項1又は2に記載の電子部品装着装置。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003371869A JP4408682B2 (ja) | 2003-10-31 | 2003-10-31 | 電子部品装着装置 |
US10/974,967 US7159305B2 (en) | 2003-10-31 | 2004-10-28 | Electronic component mounting apparatus |
KR1020040086948A KR101122933B1 (ko) | 2003-10-31 | 2004-10-29 | 전자 부품 장착 장치 |
CNB2004100900961A CN100534266C (zh) | 2003-10-31 | 2004-11-01 | 电子零件安装装置 |
CN2008101906554A CN101483994B (zh) | 2003-10-31 | 2004-11-01 | 电子零件安装装置 |
DE602004014330T DE602004014330D1 (de) | 2003-10-31 | 2004-11-02 | Einrichtung zur Montage von elektronischen Bauteilen |
EP04025946A EP1528851B1 (en) | 2003-10-31 | 2004-11-02 | Electronic component mounting apparatus |
EP08010193A EP1965628B1 (en) | 2003-10-31 | 2004-11-02 | Electronic component mounting apparatus |
DE602004025426T DE602004025426D1 (de) | 2003-10-31 | 2004-11-02 | Vorrichtung zur Montage von elektronischen Bauteilen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003371869A JP4408682B2 (ja) | 2003-10-31 | 2003-10-31 | 電子部品装着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005136276A JP2005136276A (ja) | 2005-05-26 |
JP4408682B2 true JP4408682B2 (ja) | 2010-02-03 |
Family
ID=34420229
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003371869A Expired - Lifetime JP4408682B2 (ja) | 2003-10-31 | 2003-10-31 | 電子部品装着装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7159305B2 (ja) |
EP (2) | EP1965628B1 (ja) |
JP (1) | JP4408682B2 (ja) |
KR (1) | KR101122933B1 (ja) |
CN (2) | CN101483994B (ja) |
DE (2) | DE602004014330D1 (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4616694B2 (ja) * | 2005-05-09 | 2011-01-19 | Juki株式会社 | 部品実装装置 |
JP4733499B2 (ja) * | 2005-10-31 | 2011-07-27 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP2008033610A (ja) * | 2006-07-28 | 2008-02-14 | Yokogawa Electric Corp | Xyステージ |
DE112007001476T5 (de) * | 2006-07-31 | 2009-04-30 | Panasonic Corporation, Kadoma-shi | Verfahren zum Bestimmen der Montagebedingungen für Bauelemente |
DE102007005151A1 (de) * | 2007-02-01 | 2008-08-07 | Siemens Ag | Mehrfach-Bestückkopf mit kollektivem Drehantrieb und verfahrbarem Hubantrieb für Bauelement-Halteeinrichtungen |
JP5342159B2 (ja) * | 2008-03-25 | 2013-11-13 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP5241412B2 (ja) * | 2008-09-29 | 2013-07-17 | Juki株式会社 | 表面実装装置 |
CN101842000B (zh) * | 2009-03-19 | 2014-04-30 | 鸿富锦精密工业(深圳)有限公司 | 贴附装置及使用该贴附装置的贴附方法 |
JP2011049504A (ja) * | 2009-08-28 | 2011-03-10 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
JP2012019112A (ja) * | 2010-07-08 | 2012-01-26 | Sony Corp | 部品実装装置、部品実装方法および基板製造方法 |
KR20120096727A (ko) * | 2011-02-23 | 2012-08-31 | 삼성테크윈 주식회사 | 베어 다이를 픽업 및 실장하기 위한 장치 및 방법 |
JP5686321B2 (ja) * | 2011-03-31 | 2015-03-18 | Jukiオートメーションシステムズ株式会社 | 実装装置、電子部品の実装方法及び基板の製造方法 |
NL2007777C2 (nl) * | 2011-11-11 | 2013-05-14 | Assembleon Bv | Component-plaatsingsinrichting voorzien van een machineframe en ten minste twee component-opneemeenheden, alsmede werkwijze voor het aandrijven van een dergelijke component-plaatsingsinrichting. |
JP5996979B2 (ja) * | 2012-09-07 | 2016-09-21 | ヤマハ発動機株式会社 | 電子部品実装装置および実装位置補正データ作成方法 |
CN106797714B (zh) * | 2014-10-03 | 2019-05-21 | 株式会社富士 | 元件装配系统及元件装配装置的异常停止诊断方法 |
CN104965167A (zh) * | 2015-07-21 | 2015-10-07 | 深圳市汉匠自动化科技有限公司 | 电路板自动检测设备 |
ITUB20155868A1 (it) * | 2015-11-05 | 2017-05-05 | Claudio Arrighi | Asse mobile a ponte oscillante spinto da trasmissione a cinghia piatta per macchina posizionatrice automatica di precisione |
KR102482124B1 (ko) * | 2016-01-25 | 2022-12-27 | 한화정밀기계 주식회사 | 칩 부품 마운터의 오차 최소화 방법 |
EP3208192B1 (en) | 2016-02-22 | 2018-04-11 | LEONARDO S.p.A. | Vibration damping device and damping method for a rotor of an aircraft capable of hovering |
JP6949960B2 (ja) * | 2017-07-26 | 2021-10-13 | 株式会社Fuji | 実装装置 |
KR102374227B1 (ko) * | 2017-08-28 | 2022-03-15 | 가부시키가이샤 신가와 | 대상물에 대하여 이동체를 직선 이동시키는 장치 및 방법 |
KR102398966B1 (ko) * | 2017-08-28 | 2022-05-19 | 가부시키가이샤 신가와 | 대상물에 대하여 제1 이동체 및 제2 이동체를 직선 이동시키는 장치 및 방법 |
DE102020116385B3 (de) * | 2020-06-22 | 2021-09-23 | Asm Assembly Systems Gmbh & Co. Kg | Bestückkopf mit zwei Rotoranordnungen mit individuell aktuierbaren Handhabungseinrichtungen, Bestückautomat und Verfahren zum automatischen Bestücken eines Bauelementeträgers |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH081982B2 (ja) * | 1985-04-17 | 1996-01-10 | 株式会社日立製作所 | 電子部品搭載方法及び装置 |
JP3159266B2 (ja) * | 1991-02-14 | 2001-04-23 | 三洋電機株式会社 | 作業装置 |
JP2554431B2 (ja) * | 1992-11-05 | 1996-11-13 | ヤマハ発動機株式会社 | 実装機の部品吸着状態検出装置 |
JP3261770B2 (ja) * | 1992-11-19 | 2002-03-04 | 松下電器産業株式会社 | 部品装着装置 |
JPH09130084A (ja) * | 1995-11-06 | 1997-05-16 | Matsushita Electric Ind Co Ltd | 部品実装装置および部品実装設備 |
EP0897657B1 (en) * | 1996-04-23 | 2002-02-27 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus |
JP4503873B2 (ja) | 2001-03-30 | 2010-07-14 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
US6796022B2 (en) * | 2001-03-30 | 2004-09-28 | Sanyo Electric Co., Ltd. | Electronic component mounting apparatus |
JP4551016B2 (ja) | 2001-03-30 | 2010-09-22 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP2004146661A (ja) | 2002-10-25 | 2004-05-20 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
-
2003
- 2003-10-31 JP JP2003371869A patent/JP4408682B2/ja not_active Expired - Lifetime
-
2004
- 2004-10-28 US US10/974,967 patent/US7159305B2/en active Active
- 2004-10-29 KR KR1020040086948A patent/KR101122933B1/ko active IP Right Grant
- 2004-11-01 CN CN2008101906554A patent/CN101483994B/zh not_active Expired - Lifetime
- 2004-11-01 CN CNB2004100900961A patent/CN100534266C/zh not_active Expired - Fee Related
- 2004-11-02 EP EP08010193A patent/EP1965628B1/en not_active Expired - Lifetime
- 2004-11-02 DE DE602004014330T patent/DE602004014330D1/de not_active Expired - Lifetime
- 2004-11-02 EP EP04025946A patent/EP1528851B1/en not_active Expired - Lifetime
- 2004-11-02 DE DE602004025426T patent/DE602004025426D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR101122933B1 (ko) | 2012-03-20 |
US20050132565A1 (en) | 2005-06-23 |
EP1528851A3 (en) | 2005-05-25 |
KR20050041932A (ko) | 2005-05-04 |
US7159305B2 (en) | 2007-01-09 |
CN100534266C (zh) | 2009-08-26 |
EP1965628B1 (en) | 2010-02-03 |
EP1965628A1 (en) | 2008-09-03 |
CN101483994A (zh) | 2009-07-15 |
DE602004025426D1 (de) | 2010-03-25 |
CN101483994B (zh) | 2011-06-01 |
DE602004014330D1 (de) | 2008-07-24 |
EP1528851A2 (en) | 2005-05-04 |
EP1528851B1 (en) | 2008-06-11 |
JP2005136276A (ja) | 2005-05-26 |
CN1612676A (zh) | 2005-05-04 |
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