JP4733499B2 - 電子部品装着装置 - Google Patents
電子部品装着装置 Download PDFInfo
- Publication number
- JP4733499B2 JP4733499B2 JP2005317304A JP2005317304A JP4733499B2 JP 4733499 B2 JP4733499 B2 JP 4733499B2 JP 2005317304 A JP2005317304 A JP 2005317304A JP 2005317304 A JP2005317304 A JP 2005317304A JP 4733499 B2 JP4733499 B2 JP 4733499B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- electronic component
- suction
- motor
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Description
7 装着ヘッド体
8 ビーム
15 吸着ノズル
16 装着ヘッド
23 ヘッド昇降装置
37 ラインセンサユニット
50 ノズル昇降装置
70 ノズル選択装置
89 部品認識カメラ
90 CPU(主制御装置)
91 部品認識処理装置
96 CRT
110 第1のモータコントローラ(モータ制御装置)
112 第2のモータコントローラ(モータ制御装置)
117 CPU
118 RAM
Claims (1)
- 部品吸着位置に電子部品を送る複数の部品供給ユニットと、この部品供給ユニットから電子部品を吸着してプリント基板上に装着する吸着ノズルを有した装着ヘッドと、前記吸着ノズルを回転させる回転モータと、前記吸着ノズルを昇降させる昇降モータと、前記装着ヘッドをビームに沿って移動させるX軸モータと、前記ビームをビームの長手方向と直交する方向に移動させるY軸モータと、前記昇降モータの起動インターロックの信号を出力すると共に、前記部品供給ユニットの前記電子部品の送り、及び前記X軸モータ及び前記Y軸モータの運転状態を監視し、前記部品供給ユニットでの前記電子部品の送りを条件とする前記起動インターロックの解除条件が成立したときに前記起動インターロックの解除信号を出力し、前記吸着ノズルのXY方向の移動完了を条件とする前記起動インターロックの解除条件が成立したときに前記起動インターロックの解除信号を出力する主制御装置と、前記主制御装置から前記起動インターロックの信号が入力されると共に、前記起動インターロックの解除信号が入力されるモータ制御装置とを備え、このモータ制御装置は、前記起動インターロックの解除信号に基づいて起動インターロック解除情報を格納する記憶手段を有し、この記憶手段に格納された前記起動インターロック解除情報による前記吸着ノズルの前記XY方向の移動及び前記部品供給ユニットの前記電子部品の送りについての解除条件成立に基づいて前記昇降モータを起動することを特徴とする電子部品装着装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005317304A JP4733499B2 (ja) | 2005-10-31 | 2005-10-31 | 電子部品装着装置 |
KR1020060105451A KR101227234B1 (ko) | 2005-10-31 | 2006-10-30 | 전자 부품 장착 장치 |
CN2006101366186A CN1972590B (zh) | 2005-10-31 | 2006-10-31 | 电子零件装配装置 |
EP06022677A EP1781078B1 (en) | 2005-10-31 | 2006-10-31 | Electronic component mounting apparatus |
US11/589,987 US20070094868A1 (en) | 2005-10-31 | 2006-10-31 | Electronic component mounting apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005317304A JP4733499B2 (ja) | 2005-10-31 | 2005-10-31 | 電子部品装着装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007123762A JP2007123762A (ja) | 2007-05-17 |
JP4733499B2 true JP4733499B2 (ja) | 2011-07-27 |
Family
ID=37708339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005317304A Active JP4733499B2 (ja) | 2005-10-31 | 2005-10-31 | 電子部品装着装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070094868A1 (ja) |
EP (1) | EP1781078B1 (ja) |
JP (1) | JP4733499B2 (ja) |
KR (1) | KR101227234B1 (ja) |
CN (1) | CN1972590B (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7322981B2 (en) * | 2003-08-28 | 2008-01-29 | Jackson Roger P | Polyaxial bone screw with split retainer ring |
JP5074334B2 (ja) * | 2008-09-22 | 2012-11-14 | 株式会社日立ハイテクインスツルメンツ | 部品装着装置、部品装着設定算出装置、プログラム及び部品装着設定算出方法 |
KR101519602B1 (ko) * | 2010-03-03 | 2015-05-14 | 삼성테크윈 주식회사 | 헤드 노즐 유닛, 전자 부품 실장 장치 및 전자 부품 실장 방법 |
JP2014038946A (ja) * | 2012-08-16 | 2014-02-27 | Sony Corp | 実装装置、部材の配置方法及び基板の製造方法 |
TW201432319A (zh) * | 2013-02-05 | 2014-08-16 | Hon Hai Prec Ind Co Ltd | 光纖連接器組裝裝置 |
WO2015063934A1 (ja) * | 2013-10-31 | 2015-05-07 | 富士機械製造株式会社 | 部品装着機 |
JP6998113B2 (ja) * | 2016-12-05 | 2022-01-18 | 株式会社Fuji | 電子部品装着機 |
JP6906158B2 (ja) * | 2017-02-15 | 2021-07-21 | パナソニックIpマネジメント株式会社 | 部品搭載装置および部品搭載方法 |
CN112658643B (zh) * | 2020-12-30 | 2022-07-01 | 中国科学院自动化研究所 | 接插件装配方法 |
CN113510470B (zh) * | 2021-08-31 | 2022-05-13 | 苏州朗科智能制造有限公司 | 一种具有自动对位的纺丝组件拆装器 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004265946A (ja) * | 2003-02-24 | 2004-09-24 | Matsushita Electric Ind Co Ltd | 部品実装装置及び部品実装方法 |
JP2005228992A (ja) * | 2004-02-13 | 2005-08-25 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2568623B2 (ja) * | 1988-04-12 | 1997-01-08 | 松下電器産業株式会社 | 電子部品の実装方法 |
US5271139A (en) * | 1989-04-04 | 1993-12-21 | Walter Sticht | Production installation |
JP3159266B2 (ja) * | 1991-02-14 | 2001-04-23 | 三洋電機株式会社 | 作業装置 |
JP2554431B2 (ja) * | 1992-11-05 | 1996-11-13 | ヤマハ発動機株式会社 | 実装機の部品吸着状態検出装置 |
JPH09130084A (ja) * | 1995-11-06 | 1997-05-16 | Matsushita Electric Ind Co Ltd | 部品実装装置および部品実装設備 |
SG52900A1 (en) * | 1996-01-08 | 1998-09-28 | Matsushita Electric Ind Co Ltd | Mounting apparatus of electronic components and mounting methods of the same |
US6868603B2 (en) * | 1996-08-27 | 2005-03-22 | Matsushita Electric Industrial Co., Ltd. | Method of mounting component on circuit board |
JP3739218B2 (ja) * | 1998-04-02 | 2006-01-25 | 松下電器産業株式会社 | 部品装着方法及び装置 |
JP2002050896A (ja) * | 2000-08-03 | 2002-02-15 | Sony Corp | 部品把持位置補正装置および補正方法 |
CN1248565C (zh) * | 2000-09-19 | 2006-03-29 | 松下电器产业株式会社 | 元件吸附装置、元件安装装置和元件安装方法 |
JP2002271093A (ja) * | 2001-03-07 | 2002-09-20 | Fuji Mach Mfg Co Ltd | 電気部品装着システム |
US6796022B2 (en) * | 2001-03-30 | 2004-09-28 | Sanyo Electric Co., Ltd. | Electronic component mounting apparatus |
JP2002368495A (ja) * | 2001-06-08 | 2002-12-20 | Matsushita Electric Ind Co Ltd | 部品実装装置及び部品実装方法 |
US6931176B2 (en) * | 2002-11-21 | 2005-08-16 | Tropic Networks Inc. | Reconfigurable optical add/drop multiplexer with buried dispersion compensation module |
US7350289B2 (en) * | 2002-12-02 | 2008-04-01 | Matsushita Electric Industrial Co., Ltd. | Component feeding head apparatus, for holding a component arrayed |
JP4387745B2 (ja) * | 2003-09-30 | 2009-12-24 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
JP4408682B2 (ja) * | 2003-10-31 | 2010-02-03 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
-
2005
- 2005-10-31 JP JP2005317304A patent/JP4733499B2/ja active Active
-
2006
- 2006-10-30 KR KR1020060105451A patent/KR101227234B1/ko active IP Right Grant
- 2006-10-31 US US11/589,987 patent/US20070094868A1/en not_active Abandoned
- 2006-10-31 CN CN2006101366186A patent/CN1972590B/zh active Active
- 2006-10-31 EP EP06022677A patent/EP1781078B1/en not_active Not-in-force
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004265946A (ja) * | 2003-02-24 | 2004-09-24 | Matsushita Electric Ind Co Ltd | 部品実装装置及び部品実装方法 |
JP2005228992A (ja) * | 2004-02-13 | 2005-08-25 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
Also Published As
Publication number | Publication date |
---|---|
EP1781078A2 (en) | 2007-05-02 |
CN1972590A (zh) | 2007-05-30 |
KR20070046735A (ko) | 2007-05-03 |
US20070094868A1 (en) | 2007-05-03 |
EP1781078A3 (en) | 2008-01-16 |
EP1781078B1 (en) | 2011-12-07 |
JP2007123762A (ja) | 2007-05-17 |
CN1972590B (zh) | 2010-06-23 |
KR101227234B1 (ko) | 2013-01-28 |
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