KR940023328A - 히트싱크 및 그 장착구조 - Google Patents

히트싱크 및 그 장착구조 Download PDF

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KR940023328A
KR940023328A KR1019940005187A KR19940005187A KR940023328A KR 940023328 A KR940023328 A KR 940023328A KR 1019940005187 A KR1019940005187 A KR 1019940005187A KR 19940005187 A KR19940005187 A KR 19940005187A KR 940023328 A KR940023328 A KR 940023328A
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heat sink
mounting structure
integrated circuit
circuit package
support post
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KR1019940005187A
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KR100190426B1 (ko
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다다시 가쓰이
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세끼자와 다다시
후지쓰 가부시끼가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

프린트회로판위에 장착되는 집적회로패키지위에 히트싱크를 장착하는 구조에 있어서, 프레임부와 지지포스트부들을 갖는 가이드부재가 프린트회로판에 고정되고 히트싱크가 집적회로패키지와 밀접될 수 있게 가이드부재의 내연부위에 놓이고 커버가 히트싱크의 상면의 외주연단부들위를 덮도록 가이드부재에 고정되게 되어 있다. 이 구성은 냉각효과가 높고 장착이 용이하다.

Description

히트싱크 및 그 장착구조
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예를 나타낸 히트싱크 장착구조의 분해사시도. 제2도는 본 발명을 실행하는데 적합한 히트싱크의 일예를 나타낸 분해사시도.

Claims (22)

  1. 프리트회로판위에 장착되는 집적회로 패키지위에 히트싱크를 장착하기 위한 히트싱크의 장착구조에 있어서, 상기 집적회로의 외연부에 대응하는 프레임부와 상기 프레임부로부터 돌출된 지지포스트부를 갖고 상기 프린트회로판에 고정되고 상기 집적회로패키지의 상면에 상기 히트싱크의 하면이 밀접되게 상기 히트 싱크가 그 내연부에 올려놓이는 가이드 부재와 상기 히트싱크의 상면의 외연단부들을 덮도록 상기 지지포스트부들에게 상기 가이드부재에 고정되는 커버를 구비한 히트싱크의 장착구조.
  2. 제1항에 있어서, 상기 지지포스트부들이 상기 가이드부재의 상하 방향으로 돌출되고, 상기 지지포스트부들의 하면이 상기 프린트회로판에 직접 고정되고 상기 집적회로패키지의 외연부가 실질적으로 상기 프레임의 내연부와 동일한 히트싱크의 장착구조.
  3. 제2항에 있어서, 상기 지지포스트부들이 상기 프레임부와 일체로된 히트싱크의 장착구조.
  4. 제2항에 있어서, 상향방향으로 돌출된 상기 지지포스트부들의 부분들이 상기 프레임과 일체로 되고 한편 하향방향으로 돌출된 상기 지지포스트들의 다른 부분들이 상기 프레임부로부터 별개의 부재들로 형성되어 있는 히트싱크의 장착구조.
  5. 제1항에 있어서, 상기 지지포스트부들은 상기 가이드부재의 상향방향으로만 돌출되고, 상기 집적회로패키지의 외연부는 상기 프레임부의 외연부와 실질적으로 동일하고 상기 가이드부재가 그 저면에서 상기 집적회로패키지에 접착되어 상기 가이드부재가 상기 프린트회로판에 고정된 히트싱크의 장착구조.
  6. 제1항에 있어서, 상기 히트싱크가 상기 베이스부재의 강제공냉을 위하여 방열핀들과 송풍수단을 포함하는 히트싱크의 장착구조.
  7. 제1항에 있어서, 상기 커버가 상기 지지포스트부들에 대응하는 부분들간에 상기 히트싱크쪽을 향해 만곡된 형태를 갖는 탄성판으로 형성된 히트싱크된 장착구조.
  8. 제1항에 있어서, 상기 커버가 상기 지지포스트부들의 상면에 나사맞춤된 히트싱크의 장착구조.
  9. 제1항에 있어서, 상기 커버가 상기 지지포스트부들에 대응하는 부분에 걸림편들을 갖고 상기 지지포스트부들이 상기 걸림편들에 의해서 걸어채워지는 형태를 갖는 히트싱크의 장착구조.
  10. 제1항에 있어서, 상기 지지포스트부들 위에서의 선회운동을 위하여 상기 커버의 일단부를 선회가능하게 장착하는 수단과 상기 커버의 다른 단부를 상기 지지포스트부들에서 착탈가능하게 채우는 수단을 더 포함하는 히트싱크의 장착구조.
  11. 제1항에 있어서, 상기 가이드부재와 상기 집적회로패키지의 핀을 착탈가능하게 장착하기 위한 소켓 구조를 더 포함하고 상기 소켓구조가 상기 핀과 끼워맞추어지는 접촉제를 갖고 리드가 상기 접촉제에 연결되고 프린트회로판위에 장착된 히트싱크의 장착구조.
  12. 제1항에 있어서, 상기 가이드부재와 상기 히트싱크가 높은 열전도율을 갖는 재료로 각각 제조된 히트싱크의 장착구조.
  13. 프린트회로판, 상기 프린트회로판위에 장착된 집적회로패키지, 상기 집적회로패키지위에 놓인 히트싱크 및, 상기 집적회로패키지에 대해서 상기 히트싱크를 눌러내리기 위하여 상기 프린트회로판과 상기 집적회로패키지간의 틈을 거쳐서 상기 집적회로패키지와 상기 히트싱크둘레에 설비되는 벨트부재를 구비한 히트 싱크의 장착구조.
  14. 제13항에 있어서, 상기 벨트부재가 벨트몸체, 상기 벨트몸체의 단부에 상기 벨트몸체와 일체로 설비되고 걸어채우는 걸림편이 그안으로 연장되어 있는 개구부를 갖는 헤드부를 포함하고 상기 벨트몸체가 상기 개구부내로 끼워질 때 상기 걸어채우는 걸림편과 걸리게 하기 위하여 벨트몸체위에 형성된 걸리는 홈을 갖는 히트싱크의 장착구조.
  15. 제14항에 있어서, 상기 집적회로패키지의 저면에 해당하는 상기 벨트몸체의 부분이 줄여진 두께로 형성된 히트싱크의 장착구조.
  16. 제13항에 있어서, 상기 히트싱크가 방열핀들을 갖는 베이스부재와 상기 베이스부재를 강제공냉시키는 수단을 포함하는 히트싱크의 장착구조.
  17. 제13항에 있어서, 상기 히트싱크의 저면의 크기가 상기 집적회로패키지의 상면의 크기보다도 작고, 상기 히트싱크의 측면들의 하부들을 끼워 고정하기 위하여 상기 집적회로패키지의 상면위에 올려놓인 프레임형태의 가이드를 더 포함하는 히트싱크의 장착구조.
  18. 제13항에 있어서,상기 벨트부재가 성형후에 탄성한계를 초과하게 늘어나게 한 수지벨트로 구성된 히트싱크의 장착구조.
  19. 성형후에 탄성한계를 초과하게 늘어나게 한 수지벨트로 되고 프린트회로판위에 장착된 집적회로패키지위에 히트싱크를 장착하는데 사용하는 벨트부재.
  20. 집적회로패키지의 상면과 밀접되는 하면과 복수의 방열핀이 연장설비된 상면을 갖는 베이스부재, 상기 베이스부재에 고정되고 상기 베이스부재의 상부를 덮는 커버 및 상기 커버에 설비되어 상기 방열핀들에 의해서 공기순환을 행하는 송풍수단을 구비하고 상기 송풍수단에 대응하는 부분에 상기 복수의 방열핀들중의 방열핀들이 다른 부분에 있는 방열핀들보다도 짧은 히트싱크.
  21. 제20항에 있어서, 상기 송풍수단이 상기 베이스부재의 두께방향으로 회전축을 갖는 상기 커버에 고정되어 있는 전동기, 상기 전동기에 의해서 회전되는 날개, 및 상기 전동기를 구동시키는 구동회로를 포함하고 상기 날개의 회전 궤적에 연하여 상기 베이스로부터 연장된 원통부로 형성된 세파레이터를 더 포함하는 히트싱크.
  22. 제20항에 있어서, 상기 송풍수단이 복수개 설비된 히트싱크.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940005187A 1993-03-19 1994-03-16 히트싱크 및 그 장착구조 KR100190426B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP93-60004 1993-03-19
JP6000493 1993-03-19
JP22565093 1993-09-10
JP93-225650 1993-09-10
JP94-28413 1994-02-25
JP6028413A JP2901867B2 (ja) 1993-03-19 1994-02-25 ヒートシンク及びヒートシンクの取付構造

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Publication Number Publication Date
KR940023328A true KR940023328A (ko) 1994-10-22
KR100190426B1 KR100190426B1 (ko) 1999-06-01

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US (4) US5559674A (ko)
EP (3) EP0908949B1 (ko)
JP (1) JP2901867B2 (ko)
KR (1) KR100190426B1 (ko)
DE (3) DE69433878T2 (ko)

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KR100310391B1 (ko) * 1998-05-27 2001-09-29 가타오카 마사타카 전자기기
KR100693168B1 (ko) * 2001-05-10 2007-03-13 엘지전자 주식회사 인쇄회로기판 및 그 제조방법

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GB2298520B (en) * 1995-03-03 1999-09-08 Hong Chen Fu In Heat sink device for integrated circuit
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US6222731B1 (en) 2001-04-24
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US5953208A (en) 1999-09-14
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US6487079B2 (en) 2002-11-26
EP0908949A1 (en) 1999-04-14
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US20010010624A1 (en) 2001-08-02
US5559674A (en) 1996-09-24

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