DE69433878D1 - Kühlkörper - Google Patents

Kühlkörper

Info

Publication number
DE69433878D1
DE69433878D1 DE69433878T DE69433878T DE69433878D1 DE 69433878 D1 DE69433878 D1 DE 69433878D1 DE 69433878 T DE69433878 T DE 69433878T DE 69433878 T DE69433878 T DE 69433878T DE 69433878 D1 DE69433878 D1 DE 69433878D1
Authority
DE
Germany
Prior art keywords
heatsink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69433878T
Other languages
English (en)
Other versions
DE69433878T2 (de
Inventor
Tadashi Katsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE69433878D1 publication Critical patent/DE69433878D1/de
Publication of DE69433878T2 publication Critical patent/DE69433878T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69433878T 1993-03-19 1994-03-10 Kühlkörper Expired - Lifetime DE69433878T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP6000493 1993-03-19
JP22565093 1993-09-10
JP6028413A JP2901867B2 (ja) 1993-03-19 1994-02-25 ヒートシンク及びヒートシンクの取付構造

Publications (2)

Publication Number Publication Date
DE69433878D1 true DE69433878D1 (de) 2004-08-05
DE69433878T2 DE69433878T2 (de) 2004-10-21

Family

ID=27286188

Family Applications (3)

Application Number Title Priority Date Filing Date
DE69433878T Expired - Lifetime DE69433878T2 (de) 1993-03-19 1994-03-10 Kühlkörper
DE69434411T Expired - Lifetime DE69434411T2 (de) 1993-03-19 1994-03-10 Montageanordnung für Kühlkörper und Verfahren zur Herstellung der Montageanordnung
DE69431011T Expired - Lifetime DE69431011T2 (de) 1993-03-19 1994-03-10 Kühlkörper und zugehörige Montageanordnung

Family Applications After (2)

Application Number Title Priority Date Filing Date
DE69434411T Expired - Lifetime DE69434411T2 (de) 1993-03-19 1994-03-10 Montageanordnung für Kühlkörper und Verfahren zur Herstellung der Montageanordnung
DE69431011T Expired - Lifetime DE69431011T2 (de) 1993-03-19 1994-03-10 Kühlkörper und zugehörige Montageanordnung

Country Status (5)

Country Link
US (4) US5559674A (de)
EP (3) EP0908949B1 (de)
JP (1) JP2901867B2 (de)
KR (1) KR100190426B1 (de)
DE (3) DE69433878T2 (de)

Families Citing this family (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3069819B2 (ja) * 1992-05-28 2000-07-24 富士通株式会社 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
GB2298520B (en) * 1995-03-03 1999-09-08 Hong Chen Fu In Heat sink device for integrated circuit
JP3058818B2 (ja) * 1995-10-05 2000-07-04 山洋電気株式会社 電子部品冷却用ヒートシンク
JPH09149598A (ja) * 1995-11-20 1997-06-06 Seiko Epson Corp 冷却ファンおよび冷却ファン組立体
US5896917A (en) 1996-02-22 1999-04-27 Lemont Aircraft Corporation Active heat sink structure with flow augmenting rings and method for removing heat
GB2312324B (en) * 1996-04-19 2000-11-15 Hong Chen Fu In Fan/pins seat assembly for an integrated circuit
JP3217265B2 (ja) * 1996-06-05 2001-10-09 株式会社ピーエフユー ヒートシンク装置
JP3206436B2 (ja) * 1996-07-03 2001-09-10 松下電器産業株式会社 ヒートシンク装置
JP2959506B2 (ja) * 1997-02-03 1999-10-06 日本電気株式会社 マルチチップモジュールの冷却構造
JP4290232B2 (ja) * 1997-02-24 2009-07-01 富士通株式会社 ヒートシンクとそれを使用する情報処理装置
US6501652B2 (en) 1997-02-24 2002-12-31 Fujitsu Limited Heat sink and information processor using it
JP3488060B2 (ja) 1997-11-12 2004-01-19 株式会社Ｐｆｕ 薄型電子装置の放熱装置
US6114761A (en) * 1998-01-20 2000-09-05 Lsi Logic Corporation Thermally-enhanced flip chip IC package with extruded heatspreader
US5978219A (en) * 1998-03-09 1999-11-02 Lin; Liken Heat dissipating device
JP3619670B2 (ja) * 1998-05-27 2005-02-09 アルプス電気株式会社 電子機器
US6109890A (en) * 1998-07-02 2000-08-29 Sunonwealth Electric Machine Industry Co., Ltd. Miniature blower assembly for outputting air in a certain direction
US7584780B1 (en) 1998-12-09 2009-09-08 Lemont Aircraft Corporation Active heat sink structure with flow augmenting rings and method for removing heat
JP3255133B2 (ja) * 1999-01-07 2002-02-12 松下電器産業株式会社 Ｄｃブラシレスファン
US6069794A (en) * 1999-02-08 2000-05-30 Chuang; Wen-Hao Bushing for combining fan and heat sink
US6219238B1 (en) 1999-05-10 2001-04-17 International Business Machines Corporation Structure for removably attaching a heat sink to surface mount packages
JP4144972B2 (ja) 1999-05-31 2008-09-03 山洋電気株式会社 一軸受型永久磁石電動機及び一軸受型ファンモータ
EP1239359A4 (de) * 1999-06-11 2007-12-12 Jiung-Jung Wang Die wärmestrahlung eines tragbaren rechners cpu
US6552464B1 (en) * 1999-11-09 2003-04-22 Siemens Canada Limited Totally integrated engine cooling module for DC motors
TWI222344B (en) * 1999-12-09 2004-10-11 Advanced Rotary Systems Llc Cooler for electronic devices
US6659169B1 (en) 1999-12-09 2003-12-09 Advanced Rotary Systems, Llc Cooler for electronic devices
JP4386219B2 (ja) 2000-03-31 2009-12-16 富士通株式会社 放熱機構及び当該放熱機構を有する電子機器
JP2001284865A (ja) 2000-03-31 2001-10-12 Fujitsu Ltd ヒートシンク及びその製造方法、並びに、当該ヒートシンクを有する電子機器
JP4441978B2 (ja) * 2000-04-27 2010-03-31 パナソニック株式会社 送風装置
US6441485B1 (en) * 2000-05-11 2002-08-27 Amkor Technology, Inc. Apparatus for electrically mounting an electronic device to a substrate without soldering
US6434002B1 (en) * 2000-07-31 2002-08-13 Wen-Chen Wei Structure computer heat dissipater
US6657131B2 (en) * 2000-12-08 2003-12-02 Intel Corporation I/C package / thermal-solution retention mechanism with spring effect
JP3503822B2 (ja) * 2001-01-16 2004-03-08 ミネベア株式会社 軸流ファンモータおよび冷却装置
KR100693168B1 (ko) * 2001-05-10 2007-03-13 엘지전자 주식회사 인쇄회로기판 및 그 제조방법
US6429513B1 (en) 2001-05-25 2002-08-06 Amkor Technology, Inc. Active heat sink for cooling a semiconductor chip
US6653755B2 (en) * 2001-05-30 2003-11-25 Intel Corporation Radial air flow fan assembly having stator fins surrounding rotor blades
US6640882B2 (en) * 2001-07-31 2003-11-04 Agilent Technologies, Inc. Removable mounting clip attaches a motorized fan to an active heat sink and then the entire assembly to a part to be cooled
KR100422037B1 (ko) * 2001-08-09 2004-03-12 삼성전기주식회사 광경로 변환형 가변 광학 감쇠기
US7252139B2 (en) * 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
US6606246B2 (en) * 2001-09-21 2003-08-12 Intel Corporation Method and apparatus for retaining cooling apparatus and bus bar
US6705795B2 (en) 2001-10-15 2004-03-16 Hewlett-Packard Development Company, L.P. Attachment mechanism
AT413163B (de) * 2001-12-18 2005-11-15 Fotec Forschungs Und Technolog Kühlvorrichtung für einen chip sowie verfahren zur herstellung
TW511885U (en) * 2002-01-30 2002-11-21 Hon Hai Prec Ind Co Ltd Assembly of heat dissipation apparatus
US6639796B2 (en) * 2002-01-24 2003-10-28 Agilent Technologies, Inc. Fastenerless clip for quick installation and removal of system components in a computer system
US6570763B1 (en) * 2002-02-12 2003-05-27 Hon Hai Precision Ind. Co., Ltd. Heat sink securing means
US6638033B2 (en) * 2002-03-28 2003-10-28 Chin-Wen Wang Magnetic-levitated cooling circulatory mechanism
US6600661B1 (en) * 2002-04-08 2003-07-29 Hewlett-Packard Development Company, L.P. Method and apparatus for supporting a circuit component
US6611427B1 (en) * 2002-06-03 2003-08-26 Accton Technology Corporation Flexible fan module
US6600650B1 (en) * 2002-06-11 2003-07-29 Cheng-Ping Lee Fastening device of CPU heat sink
TW590243U (en) * 2002-06-28 2004-06-01 Hon Hai Prec Components Co Ltd Lateral slide resisting structure for heat sink
TW540988U (en) * 2002-10-04 2003-07-01 Hon Hai Prec Ind Co Ltd A heat dissipating assembly
TW545885U (en) * 2002-11-29 2003-08-01 Hon Hai Prec Ind Co Ltd Heat dissipation assembly
US7539017B2 (en) * 2003-03-27 2009-05-26 Kuo Ta Chang Heat dissipating device for central processor
CN100378975C (zh) * 2003-05-07 2008-04-02 富士通株式会社 冷却部件、基板和电子设备
CN1578614B (zh) 2003-06-30 2010-04-21 山洋电气株式会社 轴流风扇装置和发热体冷却装置
US6958909B2 (en) * 2003-09-19 2005-10-25 Matsushita Electric Industrial Co., Ltd. Electronic apparatus
TWI241382B (en) * 2003-10-27 2005-10-11 Sunonwealth Electr Mach Ind Co Airflow guiding structure for a heat dissipating fan
DE102004037656B4 (de) * 2004-08-03 2009-06-18 Infineon Technologies Ag Elektronikmodul mit optimierter Montagefähigkeit und Bauteilanordnung mit einem Elektronikmodul
JP4197668B2 (ja) * 2004-08-17 2008-12-17 株式会社東芝 インターフェイスモジュール付ｌｓｉパッケージとインターフェイスモジュール及び接続保持機構
TWI305612B (en) * 2004-08-27 2009-01-21 Delta Electronics Inc Heat-dissipating fan
CN2757508Y (zh) * 2004-12-04 2006-02-08 鸿富锦精密工业（深圳）有限公司 散热装置
CN2875001Y (zh) * 2005-12-23 2007-02-28 鸿富锦精密工业（深圳）有限公司 散热器
JP2007281100A (ja) * 2006-04-04 2007-10-25 Nippon Densan Corp ヒートシンクファンユニット
DE102006025453B4 (de) * 2006-05-31 2009-12-24 Infineon Technologies Ag Halbleiterschaltungsanordnung
US7733659B2 (en) * 2006-08-18 2010-06-08 Delphi Technologies, Inc. Lightweight audio system for automotive applications and method
JP4678554B2 (ja) * 2006-10-13 2011-04-27 株式会社安川電機 制御装置
US20080089031A1 (en) * 2006-10-17 2008-04-17 Hon Hai Precision Industry Co., Ltd. Heat sink assembly
JP2008053745A (ja) * 2007-10-24 2008-03-06 Furukawa Electric Co Ltd:The ファン付きヒートシンク
US7836583B2 (en) * 2007-12-28 2010-11-23 Hitachi Global Storage Technologies, Netherlands, B.V. Integrated circuit dismounter
CN101583263A (zh) * 2008-05-16 2009-11-18 鸿富锦精密工业（深圳）有限公司 便携式电子装置
US7982477B2 (en) * 2008-08-01 2011-07-19 Aes Technologies, Inc. Universal test fixture for high-power packaged transistors and diodes
US20100071877A1 (en) * 2008-09-19 2010-03-25 Nitin Goel Reducing accumulation of dust particles on a heat dissipating arrangement
KR101563303B1 (ko) * 2009-03-06 2015-10-27 한화테크윈 주식회사 착탈식 방열 장치
JP4801758B2 (ja) * 2009-06-02 2011-10-26 富士通株式会社 電子機器および補強部品
JP5589588B2 (ja) * 2010-06-17 2014-09-17 株式会社リコー パネル固定構造及び情報処理装置
CN102467190A (zh) * 2010-11-05 2012-05-23 鸿富锦精密工业（深圳）有限公司 风扇固定架及使用该风扇固定架的散热装置
TW201227244A (en) * 2010-12-27 2012-07-01 Hon Hai Prec Ind Co Ltd Heat dissipation device
TW201228543A (en) * 2010-12-31 2012-07-01 Hon Hai Prec Ind Co Ltd Mounting apparatus for fan
US8496689B2 (en) 2011-02-23 2013-07-30 Farzad Massoudi Spinal implant device with fusion cage and fixation plates and method of implanting
US8437138B2 (en) * 2011-02-25 2013-05-07 Hon Hai Precision Industry Co., Ltd. Lower profile heat dissipating system embedded with springs
US9039362B2 (en) * 2011-03-14 2015-05-26 Minebea Co., Ltd. Impeller and centrifugal fan using the same
JP2013089733A (ja) * 2011-10-17 2013-05-13 Sumitomo Electric Ind Ltd 半導体レーザモジュール、半導体レーザ装置
JP2013123294A (ja) * 2011-12-09 2013-06-20 Sumitomo Wiring Syst Ltd ワイヤハーネス及び配線具
CN103186205A (zh) * 2011-12-28 2013-07-03 鸿富锦精密工业（深圳）有限公司 风扇模组固定装置
US9420715B2 (en) * 2012-06-07 2016-08-16 Intal Tech Ltd. Electrononic equipment building blocks for rack mounting
JP2014036187A (ja) * 2012-08-10 2014-02-24 Stanley Electric Co Ltd 放熱構造及びこの放熱構造が設けられた発熱素子装置
JP5998890B2 (ja) * 2012-12-06 2016-09-28 富士通株式会社 バネ付座金及び固定具
CN103092298B (zh) * 2013-01-23 2015-10-14 加弘科技咨询(上海)有限公司 导风部件
CN104156044A (zh) * 2013-05-14 2014-11-19 鸿富锦精密工业（深圳）有限公司 风扇模组及应用于该风扇模组中的基座
TWI512444B (zh) * 2014-03-27 2015-12-11 Quanta Comp Inc 具熱阻絕效果的電子裝置
US10692798B2 (en) * 2014-04-10 2020-06-23 Advanced Thermal Solutions, Inc. Multiple flow entrance heat sink
DE102015001148B4 (de) 2015-01-30 2019-04-11 e.solutions GmbH Anordnung und Verfahren zur elektromagnetischen Abschirmung
US10436221B2 (en) * 2015-02-19 2019-10-08 Hewlett Packard Enterprise Development Lp Fan guard with flexible compression member
DE102016220555B4 (de) * 2016-10-20 2019-07-11 Harman Becker Automotive Systems Gmbh Kühlkörperbefestigungssystem und -verfahren
EP3318358B1 (de) * 2016-11-07 2021-06-23 Nanjing Chervon Industry Co., Ltd. Elektrowerkzeug
WO2018131473A1 (ja) * 2017-01-16 2018-07-19 三菱電機株式会社 半導体装置
JP6958438B2 (ja) * 2018-03-08 2021-11-02 株式会社デンソー 電子部品用放熱装置
DE102018216602A1 (de) * 2018-09-27 2020-04-02 Zf Friedrichshafen Ag Versteifungselement für Leiterplatten und Bauteilanordnung
WO2020068112A1 (en) * 2018-09-28 2020-04-02 Hewlett-Packard Development Company, L.P. Circuit board holders

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3801882A (en) * 1973-01-11 1974-04-02 Us Navy Thermo-electric mounting method for rf silicon power transistors
US3904262A (en) * 1974-09-27 1975-09-09 John M Cutchaw Connector for leadless integrated circuit packages
US4072188A (en) * 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
US4063791A (en) * 1976-12-27 1977-12-20 Cutchaw John M Connector for leadless integrated circuit packages
JPS54110065U (de) * 1978-01-20 1979-08-02
JPS5525369U (de) * 1978-08-07 1980-02-19
US4345267A (en) * 1980-03-31 1982-08-17 Amp Incorporated Active device substrate connector having a heat sink
US4461524A (en) * 1982-06-07 1984-07-24 Teledyne Industries, Inc. Frame type electrical connector for leadless integrated circuit packages
DE3335377A1 (de) * 1983-09-29 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum festhalten eines kuehlkoerpers auf einem integrierten baustein
JP2548124B2 (ja) * 1985-08-29 1996-10-30 松下電器産業株式会社 ヒ−トシンク装置
JPS632357A (ja) * 1986-06-19 1988-01-07 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション ヒート・シンク装置
US4745456A (en) * 1986-09-11 1988-05-17 Thermalloy Incorporated Heat sink clip assembly
US4716494A (en) * 1986-11-07 1987-12-29 Amp Incorporated Retention system for removable heat sink
US5019940A (en) 1987-02-24 1991-05-28 Thermalloy Incorporated Mounting apparatus for electronic device packages
JPS63142850U (de) * 1987-03-10 1988-09-20
US4734820A (en) * 1987-04-16 1988-03-29 Ncr Corporation Cryogenic packaging scheme
US4807441A (en) * 1987-07-17 1989-02-28 Allied-Signal Inc. Cooling system for a sealed enclosure
DE8716007U1 (de) * 1987-12-03 1989-01-05 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
US5132780A (en) * 1988-01-07 1992-07-21 Prime Computer, Inc. Heat sink apparatus with an air deflection member
JPH01140842U (de) * 1988-03-22 1989-09-27
US5485351A (en) * 1989-06-09 1996-01-16 Labinal Components And Systems, Inc. Socket assembly for integrated circuit chip package
US5282111A (en) * 1989-06-09 1994-01-25 Labinal Components And Systems, Inc. Thermal transfer plate and integrated circuit chip or other electrical component assemblies including such plate
JPH03124007A (ja) * 1989-10-06 1991-05-27 Furukawa Electric Co Ltd:The トランス又はチョークコイルの放熱構造
DE69130928T2 (de) * 1990-03-26 1999-07-29 Labinal Components & Systems Wärmeübertragungsplatte und integrierter Schaltungschip oder andere elektrische Baugruppen einschliesslich einer derartigen Platte
JPH04257145A (ja) * 1991-02-12 1992-09-11 Hitachi Ltd パケット流量制御方法およびパケット交換システム
GB9209912D0 (en) * 1992-05-08 1992-06-24 Winslow Int Ltd Mounting arrangement for an intergrated circuit chip carrier
JP3069819B2 (ja) * 1992-05-28 2000-07-24 富士通株式会社 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
US5309983B1 (en) * 1992-06-23 1997-02-04 Pcubid Computer Tech Low profile integrated heat sink and fan assembly
US5288203A (en) * 1992-10-23 1994-02-22 Thomas Daniel L Low profile fan body with heat transfer characteristics
US5302853A (en) * 1993-01-25 1994-04-12 The Whitaker Corporation Land grid array package
US5299632A (en) * 1993-02-19 1994-04-05 Lee Lien Jung Fin device for an integrated circuit
US5396402A (en) * 1993-05-24 1995-03-07 Burndy Corporation Appliance for attaching heat sink to pin grid array and socket
US5430611A (en) * 1993-07-06 1995-07-04 Hewlett-Packard Company Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate
US5464054A (en) * 1993-08-09 1995-11-07 Thermalloy, Inc. Spring clamp and heat sink assembly
US5335722A (en) * 1993-09-30 1994-08-09 Global Win Technology Co., Ltd Cooling assembly for an integrated circuit
US5381305A (en) * 1993-12-22 1995-01-10 Wakefield Engineering, Inc. Clip for clamping heat sink module to electronic module
JP3124007B1 (ja) 1999-08-31 2001-01-15 株式会社日立製作所 電気掃除機

Also Published As

Publication number Publication date
EP0893828B1 (de) 2004-06-30
DE69434411D1 (de) 2005-07-28
EP0616366A3 (de) 1995-07-26
EP0893828A2 (de) 1999-01-27
DE69431011D1 (de) 2002-08-29
DE69433878T2 (de) 2004-10-21
EP0616366A2 (de) 1994-09-21
DE69434411T2 (de) 2005-12-22
US6222731B1 (en) 2001-04-24
DE69431011T2 (de) 2002-11-07
US5953208A (en) 1999-09-14
JPH07130924A (ja) 1995-05-19
EP0893828A3 (de) 1999-04-07
KR940023328A (ko) 1994-10-22
EP0908949B1 (de) 2005-06-22
US6487079B2 (en) 2002-11-26
EP0908949A1 (de) 1999-04-14
JP2901867B2 (ja) 1999-06-07
EP0616366B1 (de) 2002-07-24
KR100190426B1 (ko) 1999-06-01
US20010010624A1 (en) 2001-08-02
US5559674A (en) 1996-09-24

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