CN2875001Y - 散热器 - Google Patents

散热器 Download PDF

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Publication number
CN2875001Y
CN2875001Y CNU200520121199XU CN200520121199U CN2875001Y CN 2875001 Y CN2875001 Y CN 2875001Y CN U200520121199X U CNU200520121199X U CN U200520121199XU CN 200520121199 U CN200520121199 U CN 200520121199U CN 2875001 Y CN2875001 Y CN 2875001Y
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Prior art keywords
radiator
bottom end
screw
heat
electronic component
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Expired - Fee Related
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CNU200520121199XU
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English (en)
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郭斯蔚
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CNU200520121199XU priority Critical patent/CN2875001Y/zh
Priority to US11/309,546 priority patent/US20070147000A1/en
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Publication of CN2875001Y publication Critical patent/CN2875001Y/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

一种散热器，呈柱体状，其底部端面设有一凹陷的容置部，可与电子元件贴合，所述散热器顶部端面向内凹设若干散热孔，所述散热器底部端面还设有弹性屏蔽层和若干固定模组，通过所述固定模组可将所述散热器固定于主板上。所述散热器不但能够通过散热孔起到散热作用，还可以通过散热孔和弹性屏蔽层达到防电磁干扰的目的。

Description

散热器
【技术领域】
本实用新型是关于一种散热器，特别是指一种可有效防止电磁干扰的散热器。
【背景技术】
电磁干扰(EMI)是人们早就发现的电磁现象。所有电器和电子设备工作时都会有间歇或连续性电压电流变化，有时变化速率还相当快，这样会导致在不同频率内或一个频带间产生电磁能量，而相应的电路则会将这种能量发射到周围的环境中，这就是电磁波。一些电器、电子设备工作时所产生的电磁波，容易对周围的其他电气、电子设备形成电磁干扰，引发故障或者影响信号的传输。另外，过度的电磁干扰会形成电磁污染，危害人们的身体健康，破坏生态平衡。
EMI有两条途径离开或进入一个电路：辐射和传导。信号辐射是通过电器或电子设备外壳的缝、槽、开孔或其他缺口泄漏出去；而信号传导则通过耦合到电源、信号和控制线上离开外壳，在开放的空间中自由辐射，从而产生干扰。
很多EMI抑制都采用外壳屏蔽和缝隙屏蔽结合的方式来实现，大多数时候下面这些简单原则可以有助于实现电磁屏蔽：从源头处降低干扰；通过屏蔽、过滤或接地将干扰产生电路隔离以及增强敏感电路的抗干扰能力等。当电磁波通过开孔传播时，若开孔的直径较小而孔的深度较大时，由于电磁波多次反射的累计效果，会使电磁波衰减，起到防电磁干扰的作用。
随着电子元件工作频率的快速提升，其所产生的热量也越来越大，如果不将产生的热量及时散发出去，过高的温度将严重影响电子元件运行时的稳定性，甚至还可能将整个元件烧毁，所以电子元件的散热问题极需解决。
在传统散热方式中，一种方式是在发热电子元件顶面贴合一散热器，这类散热器，主要依靠由金属基座上向上延伸出的若干用于增加散热面积的散热片散热。
电脑主板由于电子元件的集中不可避免的会产生EMI问题，随着电子元件工作频率的快速提升，其产生的电磁干扰也日益加大，传统的散热器只能解决电子元件的散热问题而不能对电子元件产生的电磁干扰进行有效处理，若将散热器的散热片改变为散热孔，则不但能解决电子元件的散热问题，更可以从电磁波干扰产生的源头上进行有效的电磁屏蔽，减小主板上电子元件间的电磁干扰。
【发明内容】
鉴于以上内容，有必要提供一种散热器，即可为元件有效散热，又屏蔽元件产生的电磁干扰。
一种散热器，呈柱体状，其底部端面设有一凹陷的容置部，可与电子元件贴合，所述散热器顶部端面向内凹设若干散热孔。
所述散热器底部端面还设有弹性屏蔽层和若干固定模组，通过所述固定模组可将所述散热器固定于主板上。
所述散热器不但能够通过散热孔起到散热作用，还可以通过散热孔和弹性屏蔽层达到防电磁干扰的目的。
【附图说明】
下面参照附图结合具体实施方式对本实用新型作进一步的说明。
图1是本实用新型散热器较佳实施方式的立体图。
图2是沿图1中II-II线的剖视图。
图3是本实用新型散热器较佳实施方式应用于主板的安装分解图。
图4是本实用新型散热器较佳实施方式的使用状态图。
【具体实施方式】
一并参考图1和图2，一种散热器10，呈矩形柱体状，其底部端面设有一凹陷的容置部12，所述散热器10顶部端面向底部凹设若干散热孔14，所述散热孔14呈蜂巢状排布，所述散热器10底部端面还设有若干固定模组16及弹性屏蔽层18，所述固定模组16设于所述散热器10底部端面的四角处，所述固定模组16为圆柱体，其上设有螺孔162，所述弹性屏蔽层18设于所述散热器10底部端面，所述弹性屏蔽层18由导电泡棉组成。
参考图3，是所述散热器10应用于主板20的安装分解图，所述散热器10的容置部12贴合于主板20的电子元件22上，所述容置部12表面附着有散热膏，提高热量从电子元件22向所述散热器10传输的效率。所述散热器10的固定模组16为柱体状，可对应插入主板20的固定孔24中，再通过固定件30固定于主板20上。
每一固定件30包括螺丝32、弹簧34及垫片36，所述螺丝32穿过所述弹簧34及垫片36后螺锁于所述固定模组16的螺孔162，将所述散热器10固定于主板20上。
参考图4，是本实用新型散热器较佳实施方式的使用状态图，所述散热器10由固定件30固定后，通过所述弹性屏蔽层18与主板20紧密贴和，所述弹性屏蔽层18可避免散热器10与主板20之间的磨损，还可屏蔽电子元件22产生的电磁干扰。所述散热孔14可有效的将电子元件22的热量散发，还对电子元件22产生的电磁干扰进行衰减，起到防电磁干扰的作用。
所述散热器10不但能够通过散热孔14起到散热作用，还可以通过散热孔14和弹性屏蔽层18达到防电磁干扰的目的。

Claims (7)

1.一种散热器，呈柱体状，其底部端面设有一凹陷的容置部，可与电子元件贴合，其特征在于：所述散热器顶部端面向底部凹设若干散热孔。
2.如权利要求1所述的散热器，其特征在于：所述散热器为矩形柱体，所述散热孔呈蜂巢状排布。
3.如权利要求1所述的散热器，其特征在于：所述散热器底部端面还设有弹性屏蔽层。
4.如权利要求3所述的散热器，其特征在于：所述弹性屏蔽层为导电泡棉。
5.如权利要求1所述的散热器，其特征在于：所述散热器底部端面还设有若干固定模组，通过所述固定模组可将所述散热器固定于主板上。
6.如权利要求5所述的散热器，其特征在于：所述固定模组为柱体，其上设有螺孔，可与固定件连接。
7.如权利要求6所述的散热器，其特征在于：所述固定件包括螺丝、弹簧及垫片，所述螺丝穿过所述弹簧及垫片后螺锁于所述固定模组的螺孔。
CNU200520121199XU 2005-12-23 2005-12-23 散热器 Expired - Fee Related CN2875001Y (zh)

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CNU200520121199XU CN2875001Y (zh) 2005-12-23 2005-12-23 散热器
US11/309,546 US20070147000A1 (en) 2005-12-23 2006-08-18 Motherboard assembly

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CN103702541A (zh) * 2012-09-28 2014-04-02 鸿富锦精密工业（深圳）有限公司 电子装置及其散热器
CN103796486A (zh) * 2012-10-31 2014-05-14 英业达科技有限公司 电子装置
CN104914948A (zh) * 2015-05-25 2015-09-16 铜陵宏正网络科技有限公司 一种具有顶部悬挂结构的cpu散热器

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CN101715284B (zh) * 2009-06-03 2013-01-16 崇贸科技股份有限公司 固定结构
CN102711350A (zh) * 2011-03-28 2012-10-03 鸿富锦精密工业（深圳）有限公司 具有导电泡棉的便携式电子装置
CN103702541A (zh) * 2012-09-28 2014-04-02 鸿富锦精密工业（深圳）有限公司 电子装置及其散热器
CN103796486A (zh) * 2012-10-31 2014-05-14 英业达科技有限公司 电子装置
CN103796486B (zh) * 2012-10-31 2017-02-08 英业达科技有限公司 电子装置
CN104914948A (zh) * 2015-05-25 2015-09-16 铜陵宏正网络科技有限公司 一种具有顶部悬挂结构的cpu散热器

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