CN1913766A - 能防电磁干扰的散热器 - Google Patents

能防电磁干扰的散热器 Download PDF

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Publication number
CN1913766A
CN1913766A CN200510036592.3A CN200510036592A CN1913766A CN 1913766 A CN1913766 A CN 1913766A CN 200510036592 A CN200510036592 A CN 200510036592A CN 1913766 A CN1913766 A CN 1913766A
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China
Prior art keywords
electronic component
radiator
electromagnetic interference
receiving space
fin
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CN200510036592.3A
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English (en)
Inventor
徐月华
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN200510036592.3A priority Critical patent/CN1913766A/zh
Priority to US11/308,059 priority patent/US20070035929A1/en
Publication of CN1913766A publication Critical patent/CN1913766A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

一种能防电磁干扰的散热器，用于防电磁干扰及散发电子元件产生的热量，其包括一本体和多个散热片。所述本体包括至少一收容空间，所述电子元件收容在所述收容空间中。所述散热片设置于本体并与收容空间相对设置，用于散发所述电子元件所产生的热量。所述能防电磁干扰的散热器既可以屏蔽安装于其中的电子元件产生的电磁波，又可以屏蔽其它电子元件产生的电磁波，同时可有效降低安装于其中的电子元件的温度。

Description

能防电磁干扰的散热器
【技术领域】
本发明涉及一种散热器，特别是一种能防电磁干扰的散热器。
【背景技术】
随着高科技的蓬勃发展，电子元件如CPU的体积趋于微小化，而且单位面积上的密集度也越来越高，其效能更是不断增强，在这些因素的下，电子元件的总发热量几乎逐年升高，倘若没有良好的散热方式来排除电子元件所产生的热量，过高的温度将导致电子元件产生电子游离(Thermal Runaway)与热应力(Thermal Stress)等现象，造成整体稳定性降低，以及缩短电子元件本身的寿命。为了散发电子元件产生的热量，通常借助散热器来散发上述热量。
请参照图1，揭示了一种传统的散热器40。所述散热器40安装于电子元件上，其包括多个散热片42，用于散发电子元件产生的热量。然而，因现有的电子元件通常整合了各种高频电路、数字电路和模拟电路，电子元件在工作会产生大量的电磁波，且这种散热器40没有其它结构以屏蔽所述电子元件产生的电磁波，也不能屏蔽其它电子元件产生的电磁波。故所述电子元件和其它电子元件会互相产生电磁干扰(Electromagnetic Interference，EMI)，其不仅影响电子元件的功能，而且危害人体健康。因而如何协调防EMI和散热两者的关系，成为散热器制作中亟待解决的问题。
【发明内容】
本发明所要解决技术问题是提供一种能防电磁干扰的散热器。
本发明的能防电磁干扰的散热器用于防电磁干扰及散发电子元件产生的热量，其包括一本体和多个散热片。所述本体包括至少一收容空间，所述电子元件收容在所述收容空间中。所述散热片设置于所述本体并与所述收容空间相对设置，用于散发所述电子元件所产生的热量。
作为本发明的进一步改进，所述本体与所述散热片一体成型。本体包括多个侧壁和至少一凸块，所述收容空间由所述侧壁围成。所述凸块位于所述收容空间中。
与现有技术相比，本发明的优点在于：因所述能防电磁干扰的散热器不仅包括收容电子元件的收容空间而且包括散热片，从而使得安装于其中的电子元件既可以防止外部电子元件产生的电磁波干扰其本身，又可以防止其本身产生的电磁波干扰外部电子元件，同时可有效降低所述电子元件的温度，进而保证了所述电子元件的性能。
【附图说明】
下面参照附图结合实施例对本发明作进一步的描述。
图1是现有散热器的立体图。
图2是本发明能防电磁干扰的散热器与电路板的立体分解图。
图3是本发明能防电磁干扰的散热器的另一角度立体图。
图4是本发明能防电磁干扰的散热器与电路板的立体组装图。
【具体实施方式】
请参照图2，揭示了本发明能防电磁干扰(Electromagnetic Interference，EMI)的散热器10，其可安装于电路板20上。所述散热器10包括多个散热片12及一本体14。
电路板20包括多个电子元件24、多个第一装配孔22及多个定位孔26。第一装配孔22和定位孔26分别位于所述电子元件24的四周。
请同时参照图3，本体14包括多个侧壁142，所述侧壁142围成多个收容空间140。所述电子元件24收容在所述收容空间140中。在本实施方式中，收容空间140为三个。当然所述收容空间140也可为一个，其个数根据需要可随意变更。至少一凸块144凸设于所述收容空间，所述凸块144与电路板20的电子元件24相对应。本体14对应所述第一装配孔22和所述定位孔26设有多个第二装配孔146和多个定位柱148。第二装配孔146与第一装配孔22一起用于将所述散热器10安装于上述电路板20。安装时，定位柱148和定位孔26可定位所述散热器10。
所述散热片12与本体14一体成型，并分别与本体14垂直，两相邻散热片12间各有一槽120。
请同时参照图4，组装时，将定位柱148插入电路板20的定位孔26，且使固持件如螺钉(未图示)分别穿过第二装配孔146和第一装配孔22并锁固于电路板10的底部，从而散热器10便安装于电路板20。此时，所述凸块144分别紧贴所述电子元件24。这样，所述电子元件24产生的热量便可及时被散发，进而保证了所述电子元件24的性能。
因本体14具有多个收容空间140，这样所述散热器10可同时为多个电子元件24散热，而且所述散热器10既可以防止安装于其中的电子元件64相互的间的电磁干扰又可以屏蔽外部电子元件产生的电磁波，同时可防止电子元件64产生的电磁波干扰外部电子元件。

Claims (5)

1.一种能防电磁干扰的散热器，用于防电磁干扰及散发所述电子元件产生的热量，其包括一本体和多个能散发所述电子元件所产生的热量的散热片，所述散热片设置于所述本体，其特征在于：所述本体包括至少一收容空间，所述电子元件收容在所述收容空间中，所述散热片与所述收容空间相对设置。
2.如权利要求1所述的能防电磁干扰的散热器，其特征在于：所述本体包括多个侧壁，所述收容空间由所述侧壁围成。
3.如权利要求1所述的能防电磁干扰的散热器，其特征在于：所述本体还包括至少一凸块，所述凸块位于所述收容空间中。
4.如权利要求1所述的能防电磁干扰的散热器，其特征在于：所述本体还包括多个用于定位的定位柱，所述定位柱分别凸设于所述本体底部的边缘。
5.如权利要求1所述的能防电磁干扰的散热器，其特征在于：所述本体与所述散热片一体成型。
CN200510036592.3A 2005-08-12 2005-08-12 能防电磁干扰的散热器 Pending CN1913766A (zh)

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CN200510036592.3A CN1913766A (zh) 2005-08-12 2005-08-12 能防电磁干扰的散热器
US11/308,059 US20070035929A1 (en) 2005-08-12 2006-03-04 Heat sink with emi shielding walls

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WO2015144007A1 (zh) * 2014-03-27 2015-10-01 特富特科技(深圳)有限公司 电磁器件封装外壳
WO2016037322A1 (zh) * 2014-09-10 2016-03-17 华为技术有限公司 散热屏蔽结构及通信产品

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CN104955319A (zh) * 2014-03-27 2015-09-30 特富特科技(深圳)有限公司 一种电磁器件安装装置
WO2015144007A1 (zh) * 2014-03-27 2015-10-01 特富特科技(深圳)有限公司 电磁器件封装外壳
CN104955319B (zh) * 2014-03-27 2017-12-22 特富特科技(深圳)有限公司 一种电磁器件安装装置
WO2016037322A1 (zh) * 2014-09-10 2016-03-17 华为技术有限公司 散热屏蔽结构及通信产品
CN105940775A (zh) * 2014-09-10 2016-09-14 华为技术有限公司 散热屏蔽结构及通信产品

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