DE4394393T1 - Kühlkörper - Google Patents

Kühlkörper

Info

Publication number
DE4394393T1
DE4394393T1 DE4394393T DE4394393T DE4394393T1 DE 4394393 T1 DE4394393 T1 DE 4394393T1 DE 4394393 T DE4394393 T DE 4394393T DE 4394393 T DE4394393 T DE 4394393T DE 4394393 T1 DE4394393 T1 DE 4394393T1
Authority
DE
Germany
Prior art keywords
heatsink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4394393T
Other languages
English (en)
Inventor
Henry F Villaume
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aavid Engineering Inc Laconia Nh Us
Aavid Thermal Products Inc
Original Assignee
Aavid Engineering Inc Laconia Nh Us
Aavid Engineering Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Engineering Inc Laconia Nh Us, Aavid Engineering Inc filed Critical Aavid Engineering Inc Laconia Nh Us
Publication of DE4394393T1 publication Critical patent/DE4394393T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE4394393T 1992-08-28 1993-08-24 Kühlkörper Withdrawn DE4394393T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/937,470 US5285350A (en) 1992-08-28 1992-08-28 Heat sink plate for multiple semi-conductors
PCT/US1993/007937 WO1994006267A1 (en) 1992-08-28 1993-08-24 Heat sink

Publications (1)

Publication Number Publication Date
DE4394393T1 true DE4394393T1 (de) 1994-11-10

Family

ID=25469954

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4394393T Withdrawn DE4394393T1 (de) 1992-08-28 1993-08-24 Kühlkörper

Country Status (6)

Country Link
US (1) US5285350A (de)
CA (1) CA2117271C (de)
DE (1) DE4394393T1 (de)
GB (1) GB2275370B (de)
NL (1) NL9320011A (de)
WO (1) WO1994006267A1 (de)

Families Citing this family (70)

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US5514327A (en) * 1993-12-14 1996-05-07 Lsi Logic Corporation Powder metal heat sink for integrated circuit devices
US5459081A (en) * 1993-12-21 1995-10-17 Nec Corporation Process for transferring a device to a substrate by viewing a registration pattern
US5976955A (en) * 1995-01-04 1999-11-02 Micron Technology, Inc. Packaging for bare dice employing EMR-sensitive adhesives
US5530202A (en) * 1995-01-09 1996-06-25 At&T Corp. Metallic RF or thermal shield for automatic vacuum placement
US5630469A (en) * 1995-07-11 1997-05-20 International Business Machines Corporation Cooling apparatus for electronic chips
US5696405A (en) * 1995-10-13 1997-12-09 Lucent Technologies Inc. Microelectronic package with device cooling
US5814536A (en) * 1995-12-27 1998-09-29 Lsi Logic Corporation Method of manufacturing powdered metal heat sinks having increased surface area
US5781411A (en) * 1996-09-19 1998-07-14 Gateway 2000, Inc. Heat sink utilizing the chimney effect
US5832987A (en) * 1997-03-21 1998-11-10 Lowry; David A. Rotatable heat transfer coupling
US6049469A (en) * 1997-08-20 2000-04-11 Dell Usa, L.P. Combination electromagnetic shield and heat spreader
US5870286A (en) * 1997-08-20 1999-02-09 International Business Machines Corporation Heat sink assembly for cooling electronic modules
US5835355A (en) * 1997-09-22 1998-11-10 Lsi Logic Corporation Tape ball grid array package with perforated metal stiffener
US5928076C1 (en) * 1997-09-25 2001-04-24 Hewlett Packard Co Emi-attenuating air ventilation panel
US5978223A (en) * 1998-02-09 1999-11-02 International Business Machines Corporation Dual heat sink assembly for cooling multiple electronic modules
US5991157A (en) * 1998-03-31 1999-11-23 Sun Microsystems, Inc. Module of enclosure for electronic cards
US6297446B1 (en) * 1999-02-26 2001-10-02 Hewlett Packard Company High performance EMC vent panel
DE29909161U1 (de) * 1999-05-26 2000-09-07 Siemens Ag Abdeckung für Leiterplatten
SE521646C2 (sv) * 1999-11-23 2003-11-18 Ericsson Telefon Ab L M Täckande element för modul
US6841250B2 (en) * 2000-02-25 2005-01-11 Advanced Energy Technology Inc. Thermal management system
US7044212B1 (en) * 2000-08-25 2006-05-16 Net Nanofiltertechnik Gmbh Refrigeration device and a method for producing the same
US6426881B1 (en) * 2000-10-04 2002-07-30 Arthur A. Kurz Shielding arrangement for inter-component shielding in electronic devices
US6445583B1 (en) 2001-01-26 2002-09-03 Laird Technologies, Inc. Snap in heat sink shielding lid
GB0106547D0 (en) * 2001-03-16 2001-05-02 Aavid Thermalloy Ltd Heat sinks
JP3513116B2 (ja) * 2001-03-22 2004-03-31 株式会社東芝 情報処理装置
US6671186B2 (en) * 2001-04-20 2003-12-30 Hewlett-Packard Development Company, L.P. Electromagnetic interference shield
US6567276B2 (en) * 2001-04-20 2003-05-20 Hewlett-Packard Development Company L.P. Electromagnetic interference shield
US6477053B1 (en) 2001-07-17 2002-11-05 Tyco Telecommunications (Us) Inc. Heat sink and electronic assembly including same
TW530995U (en) * 2002-02-05 2003-05-01 Wen-Chen Wei Heat sink base pad
JP2003303928A (ja) * 2002-04-10 2003-10-24 Elpida Memory Inc 半導体装置実装用パッケージ
US6817405B2 (en) * 2002-06-03 2004-11-16 International Business Machines Corporation Apparatus having forced fluid cooling and pin-fin heat sink
US6765796B2 (en) 2002-11-21 2004-07-20 Teradyne, Inc. Circuit board cover with exhaust apertures for cooling electronic components
JP3941723B2 (ja) * 2003-03-27 2007-07-04 日本電気株式会社 電子機器の筐体
JP2005093662A (ja) * 2003-09-17 2005-04-07 Pioneer Electronic Corp 冷却装置及び冷却装置を備えた電子機器
US20050152116A1 (en) * 2004-01-12 2005-07-14 Mcclary Charles R. Methods and apparatus for passive cooling of electronic units
US7028754B2 (en) * 2004-04-26 2006-04-18 Hewlett-Packard Development Company, L.P. High surface area heat sink
US7173822B2 (en) * 2004-10-28 2007-02-06 Cisco Technology, Inc. Techniques for providing ventilation and EMI shielding to electronic circuitry using a panel member with brimmed holes
US9047066B2 (en) * 2005-09-30 2015-06-02 Intel Corporation Apparatus and method to efficiently cool a computing device
US7281573B2 (en) * 2005-12-14 2007-10-16 Hua-Hsin Tsai Cooler
US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
US20080080160A1 (en) * 2005-12-16 2008-04-03 Laird Technologies, Inc. Emi shielding assemblies
US7450387B2 (en) * 2006-03-02 2008-11-11 Tdk Innoveta Technologies, Inc. System for cooling electronic components
US7463496B2 (en) * 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
US7317618B2 (en) * 2006-03-09 2008-01-08 Laird Technologies, Inc. Combined board level shielding and thermal management
US7623360B2 (en) * 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
JP5017977B2 (ja) * 2006-09-14 2012-09-05 富士通セミコンダクター株式会社 半導体装置およびその製造方法
US9243794B2 (en) 2006-09-30 2016-01-26 Cree, Inc. LED light fixture with fluid flow to and from the heat sink
US20090086491A1 (en) * 2007-09-28 2009-04-02 Ruud Lighting, Inc. Aerodynamic LED Floodlight Fixture
US7686469B2 (en) 2006-09-30 2010-03-30 Ruud Lighting, Inc. LED lighting fixture
US9028087B2 (en) 2006-09-30 2015-05-12 Cree, Inc. LED light fixture
US7952262B2 (en) * 2006-09-30 2011-05-31 Ruud Lighting, Inc. Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules
US7764514B2 (en) * 2006-12-08 2010-07-27 Intel Corporation Electromagnetic interference shielding for device cooling
US8253076B2 (en) * 2007-10-29 2012-08-28 Smiths Medical Asd, Inc. Respiratory system heater unit
CN101451540B (zh) * 2007-12-06 2011-12-21 鸿富锦精密工业（深圳）有限公司 风扇逆流防止装置
US7957140B2 (en) * 2007-12-31 2011-06-07 Intel Corporation Air mover for device surface cooling
KR101438647B1 (ko) * 2008-01-15 2014-09-17 삼성디스플레이 주식회사 수납 부재 및 이를 구비한 표시 장치
US8537548B2 (en) * 2008-01-29 2013-09-17 Intel Corporation Method, apparatus and computer system for vortex generator enhanced cooling
EP2085858A1 (de) * 2008-02-01 2009-08-05 Telefonaktiebolaget LM Ericsson (publ) Verfahren zur Kühlung tragbarer Geräte
US20100187963A1 (en) * 2009-01-28 2010-07-29 Guy Vaccaro Heat Sink for Passive Cooling of a Lamp
US7965514B2 (en) 2009-06-05 2011-06-21 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
CN102281747A (zh) * 2010-06-10 2011-12-14 鸿富锦精密工业（深圳）有限公司 机箱
US8467191B2 (en) 2010-12-02 2013-06-18 Micron Technology, Inc. Assemblies including heat sink elements and methods of assembling
US20120264362A1 (en) * 2011-04-18 2012-10-18 Samsung Sdi Co., Ltd. Fuel cell and case for fuel cell
US8879269B2 (en) * 2011-08-31 2014-11-04 Apple Inc. Systems and method for providing a graphite layer in an electronic device
JP6134127B2 (ja) * 2012-11-21 2017-05-24 三菱重工業株式会社 ヒートシンクを有する機器
US10088194B2 (en) * 2014-07-30 2018-10-02 Regal Beloit America, Inc. Systems for and methods of directing airflow in air handling systems
JP6722568B2 (ja) * 2016-11-17 2020-07-15 サンコール株式会社 半導体素子取付用基板端子板の製造方法
FR3083957B1 (fr) * 2018-07-12 2020-06-12 Continental Automotive France Dissipateur thermique a conductivite thermique amelioree
US11089712B2 (en) * 2019-03-19 2021-08-10 Microsoft Technology Licensing, Llc Ventilated shield can
FR3104892B1 (fr) * 2019-12-12 2021-11-12 Valeo Systemes Thermiques Ensemble d’une carte électronique et d’un dissipateur thermique, et groupe moto-ventilateur comprenant un tel ensemble

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2052164B (en) * 1979-06-30 1983-12-07 Burroughs Corp Assemblies of electrical components
JPS5626982U (de) * 1979-08-04 1981-03-12
US4327398A (en) * 1979-09-04 1982-04-27 Product Technologies, Inc. Cooling system for automatic bowling pin spotter
US4609126A (en) * 1985-12-05 1986-09-02 Gte Communications Systems Corporation Venting cap for apparatus housing
US5105336A (en) * 1987-07-29 1992-04-14 Lutron Electronics Co., Inc. Modular multilevel electronic cabinet
US4914551A (en) * 1988-07-13 1990-04-03 International Business Machines Corporation Electronic package with heat spreader member
US5175395A (en) * 1991-11-27 1992-12-29 Rockwell International Corporation Electromagnetic shield

Also Published As

Publication number Publication date
GB9407054D0 (en) 1994-06-29
US5285350A (en) 1994-02-08
CA2117271A1 (en) 1994-03-17
GB2275370A (en) 1994-08-24
WO1994006267A1 (en) 1994-03-17
CA2117271C (en) 1998-10-13
NL9320011A (nl) 1994-10-03
GB2275370B (en) 1995-08-16

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee