FR3083957B1 - Dissipateur thermique a conductivite thermique amelioree - Google Patents

Dissipateur thermique a conductivite thermique amelioree Download PDF

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Publication number
FR3083957B1
FR3083957B1 FR1856426A FR1856426A FR3083957B1 FR 3083957 B1 FR3083957 B1 FR 3083957B1 FR 1856426 A FR1856426 A FR 1856426A FR 1856426 A FR1856426 A FR 1856426A FR 3083957 B1 FR3083957 B1 FR 3083957B1
Authority
FR
France
Prior art keywords
thermal
pin
face
dissipator
dome
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1856426A
Other languages
English (en)
Other versions
FR3083957A1 (fr
Inventor
Philippe Lopez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Continental Automotive France SAS
Original Assignee
Continental Automotive GmbH
Continental Automotive France SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH, Continental Automotive France SAS filed Critical Continental Automotive GmbH
Priority to FR1856426A priority Critical patent/FR3083957B1/fr
Priority to PCT/EP2019/068717 priority patent/WO2020011937A1/fr
Priority to CN201980046450.5A priority patent/CN112369132A/zh
Priority to US17/257,924 priority patent/US20210289665A1/en
Publication of FR3083957A1 publication Critical patent/FR3083957A1/fr
Application granted granted Critical
Publication of FR3083957B1 publication Critical patent/FR3083957B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/06—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being attachable to the element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/02—Arrangements of fins common to different heat exchange sections, the fins being in contact with different heat exchange media

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Dissipateur thermique (1) comprenant une première face (2) au contact de composants électroniques générant de la chaleur à évacuer et une deuxième face (3) en contact avec le milieu dans lequel dissiper la chaleur générée par les composants électroniques, comprenant • au moins un dispositif d'amélioration de la conductivité thermique comprenant une surface en forme de dôme (5), un pion (6) et une section latérale de révolution (7) autour du pion (6), la surface en forme de dôme (5) étant connectée à une extrémité d'un pion (6) et à la section latérale de révolution (7), • la surface en forme de dôme (5) étant disposée du côté de la deuxième face (3), l'extrémité libre du pion (6) étant disposée du côté de la première face (2).
FR1856426A 2018-07-12 2018-07-12 Dissipateur thermique a conductivite thermique amelioree Active FR3083957B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR1856426A FR3083957B1 (fr) 2018-07-12 2018-07-12 Dissipateur thermique a conductivite thermique amelioree
PCT/EP2019/068717 WO2020011937A1 (fr) 2018-07-12 2019-07-11 Dissipateur thermique à conductivité thermique améliorée
CN201980046450.5A CN112369132A (zh) 2018-07-12 2019-07-11 具有改进的热导率的散热器
US17/257,924 US20210289665A1 (en) 2018-07-12 2019-07-11 Heat sink with improved thermal conductivity

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1856426 2018-07-12
FR1856426A FR3083957B1 (fr) 2018-07-12 2018-07-12 Dissipateur thermique a conductivite thermique amelioree

Publications (2)

Publication Number Publication Date
FR3083957A1 FR3083957A1 (fr) 2020-01-17
FR3083957B1 true FR3083957B1 (fr) 2020-06-12

Family

ID=63491759

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1856426A Active FR3083957B1 (fr) 2018-07-12 2018-07-12 Dissipateur thermique a conductivite thermique amelioree

Country Status (4)

Country Link
US (1) US20210289665A1 (fr)
CN (1) CN112369132A (fr)
FR (1) FR3083957B1 (fr)
WO (1) WO2020011937A1 (fr)

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5285350A (en) * 1992-08-28 1994-02-08 Aavid Engineering, Inc. Heat sink plate for multiple semi-conductors
US5814536A (en) * 1995-12-27 1998-09-29 Lsi Logic Corporation Method of manufacturing powdered metal heat sinks having increased surface area
JP3067699B2 (ja) * 1997-07-03 2000-07-17 日本電気株式会社 輻射冷却形進行波管
US6025643A (en) * 1998-07-29 2000-02-15 Auger; Ronald N. Device for dissipating heat from a semiconductor element
US6237223B1 (en) * 1999-05-06 2001-05-29 Chip Coolers, Inc. Method of forming a phase change heat sink
EA006968B1 (ru) * 2001-04-30 2006-06-30 Термо Композит, Ллс Терморегулирующий материал, устройство и способ его изготовления
JP4686274B2 (ja) * 2005-06-30 2011-05-25 ポリマテック株式会社 放熱部品及びその製造方法
US7281573B2 (en) * 2005-12-14 2007-10-16 Hua-Hsin Tsai Cooler
KR20080012515A (ko) * 2006-08-03 2008-02-12 엘지전자 주식회사 열교환기 핀
TWM321686U (en) * 2007-01-02 2007-11-01 Shuen-Tzung Jang Heat sink with fins in different shapes
US7539019B2 (en) * 2007-07-31 2009-05-26 Adc Telecommunications, Inc. Apparatus for transferring heat from a heat spreader
JP4945433B2 (ja) * 2007-12-28 2012-06-06 シャープ株式会社 照明装置
CN101505029B (zh) * 2008-02-04 2011-11-30 北京中视中科光电技术有限公司 激光器及其散热装置
CN202135433U (zh) * 2008-07-10 2012-02-01 格拉弗技术国际控股有限公司 散热器以及使用该散热器的电子装置和光伏太阳能面板
CN101776412B (zh) * 2010-03-02 2012-11-21 金龙精密铜管集团股份有限公司 蒸发传热管
CN102803888A (zh) * 2012-01-05 2012-11-28 萨帕有限公司 散热器及其制造方法
CN202565644U (zh) * 2012-02-16 2012-11-28 中兴通讯股份有限公司 散热器及终端
CN103781328A (zh) * 2012-10-25 2014-05-07 台达电子企业管理（上海）有限公司 适用于电磁设备的散热器
US9196564B2 (en) * 2013-03-14 2015-11-24 Futurewei Technologies, Inc. Apparatus and method for a back plate for heat sink mounting
US20170314870A1 (en) * 2016-04-30 2017-11-02 Taiwan Microloops Corp. Heat dissipating structure and water-cooling heat dissipating apparatus including the structure
CN205726867U (zh) * 2016-07-01 2016-11-23 全椒赛德利机械有限公司 一种组合式铜制散热器
US10388540B2 (en) * 2017-03-13 2019-08-20 International Business Machines Corporation High-performance compliant heat-exchanger comprising vapor chamber
CN107529322B (zh) * 2017-09-12 2022-03-29 珠海格力电器股份有限公司 电控箱

Also Published As

Publication number Publication date
WO2020011937A1 (fr) 2020-01-16
US20210289665A1 (en) 2021-09-16
FR3083957A1 (fr) 2020-01-17
CN112369132A (zh) 2021-02-12

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