GB2052164B - Assemblies of electrical components - Google Patents

Assemblies of electrical components

Info

Publication number
GB2052164B
GB2052164B GB7922814A GB7922814A GB2052164B GB 2052164 B GB2052164 B GB 2052164B GB 7922814 A GB7922814 A GB 7922814A GB 7922814 A GB7922814 A GB 7922814A GB 2052164 B GB2052164 B GB 2052164B
Authority
GB
United Kingdom
Prior art keywords
assemblies
electrical components
electrical
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7922814A
Other versions
GB2052164A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Burroughs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burroughs Corp filed Critical Burroughs Corp
Priority to GB7922814A priority Critical patent/GB2052164B/en
Publication of GB2052164A publication Critical patent/GB2052164A/en
Application granted granted Critical
Publication of GB2052164B publication Critical patent/GB2052164B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB7922814A 1979-06-30 1979-06-30 Assemblies of electrical components Expired GB2052164B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB7922814A GB2052164B (en) 1979-06-30 1979-06-30 Assemblies of electrical components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7922814A GB2052164B (en) 1979-06-30 1979-06-30 Assemblies of electrical components

Publications (2)

Publication Number Publication Date
GB2052164A GB2052164A (en) 1981-01-21
GB2052164B true GB2052164B (en) 1983-12-07

Family

ID=10506214

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7922814A Expired GB2052164B (en) 1979-06-30 1979-06-30 Assemblies of electrical components

Country Status (1)

Country Link
GB (1) GB2052164B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3321321A1 (en) * 1982-06-19 1983-12-22 Ferranti plc, Gatley, Cheadle, Cheshire ELECTRICAL CIRCUIT ARRANGEMENT
US4587593A (en) * 1983-09-06 1986-05-06 James P. Liautaud Integrally cast mobile radio housing
GB2189085B (en) * 1986-04-10 1989-11-22 Plessey Co Plc Electronics module mounting assembly
SE460008B (en) * 1987-11-04 1989-08-28 Saab Scania Ab REFRIGERATOR CONTAINS AN ELECTRIC CIRCUIT CARD AND USE THEREOF
US5185691A (en) * 1991-03-15 1993-02-09 Compaq Computer Corporation Thermal packaging for natural convection cooled electronics
US5258888A (en) * 1991-03-15 1993-11-02 Compaq Computer Corporation Thermal packaging for natural convection cooled electronics
SE469298B (en) * 1991-10-24 1993-06-14 Ericsson Telefon Ab L M DEVICE FOR COOLING ELECTRONICS BY RADIO TRANSMISSION
US5274530A (en) * 1992-05-29 1993-12-28 Anderson William B Module for protecting and cooling computer chip die mounted on a thin film substrate and a chassis for conduction cooling of such modules
CA2096983C (en) * 1992-05-29 1996-08-13 Naoya Taki Radiator assembly for substrate
US5267122A (en) * 1992-06-15 1993-11-30 Alcatel Network Systems, Inc. Optical network unit
US5323295A (en) * 1992-07-21 1994-06-21 P & P Marketing, Inc. Assembly for integrating heat generating electronic device with nonheat generating devices
US5285350A (en) * 1992-08-28 1994-02-08 Aavid Engineering, Inc. Heat sink plate for multiple semi-conductors
US5482109A (en) * 1994-03-15 1996-01-09 E-Systems, Inc. Modular heat exchanger
US5719745A (en) * 1995-07-12 1998-02-17 International Business Machines Corporation Extended surface cooling for chip stack applications
US6333849B1 (en) 1996-07-01 2001-12-25 Compaq Computer Corporation Apparatus for liquid cooling of specific computer components
TW200409584A (en) * 2002-11-25 2004-06-01 Jun-Guang Luo Multi-position liquid storage tank temperature conduction apparatus and method

Also Published As

Publication number Publication date
GB2052164A (en) 1981-01-21

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19940630