DE69130928T2 - Wärmeübertragungsplatte und integrierter Schaltungschip oder andere elektrische Baugruppen einschliesslich einer derartigen Platte - Google Patents

Wärmeübertragungsplatte und integrierter Schaltungschip oder andere elektrische Baugruppen einschliesslich einer derartigen Platte

Info

Publication number
DE69130928T2
DE69130928T2 DE1991630928 DE69130928T DE69130928T2 DE 69130928 T2 DE69130928 T2 DE 69130928T2 DE 1991630928 DE1991630928 DE 1991630928 DE 69130928 T DE69130928 T DE 69130928T DE 69130928 T2 DE69130928 T2 DE 69130928T2
Authority
DE
Germany
Prior art keywords
plate
integrated circuit
heat transfer
circuit chip
assemblies including
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1991630928
Other languages
English (en)
Other versions
DE69130928D1 (de
Inventor
Albert Nicholas Hopfer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Globe Motors Inc
Original Assignee
Labinal Components and Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Labinal Components and Systems Inc filed Critical Labinal Components and Systems Inc
Application granted granted Critical
Publication of DE69130928D1 publication Critical patent/DE69130928D1/de
Publication of DE69130928T2 publication Critical patent/DE69130928T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE1991630928 1990-03-26 1991-03-23 Wärmeübertragungsplatte und integrierter Schaltungschip oder andere elektrische Baugruppen einschliesslich einer derartigen Platte Expired - Fee Related DE69130928T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US49902590A 1990-03-26 1990-03-26

Publications (2)

Publication Number Publication Date
DE69130928D1 DE69130928D1 (de) 1999-04-08
DE69130928T2 true DE69130928T2 (de) 1999-07-29

Family

ID=23983499

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1991630928 Expired - Fee Related DE69130928T2 (de) 1990-03-26 1991-03-23 Wärmeübertragungsplatte und integrierter Schaltungschip oder andere elektrische Baugruppen einschliesslich einer derartigen Platte

Country Status (5)

Country Link
EP (1) EP0449150B1 (de)
JP (1) JP2554409B2 (de)
CA (1) CA2038998A1 (de)
DE (1) DE69130928T2 (de)
ES (1) ES2128302T3 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5201866A (en) * 1992-02-03 1993-04-13 International Business Machines Corporation Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surface
JP2901867B2 (ja) * 1993-03-19 1999-06-07 富士通株式会社 ヒートシンク及びヒートシンクの取付構造
SE9501455L (sv) 1995-04-20 1996-10-21 Ericsson Telefon Ab L M Telefonväxeltillhörigt korskopplingsarrangemang
SE504430C2 (sv) 1995-06-20 1997-02-10 Ericsson Telefon Ab L M Magasin
US6537082B2 (en) * 1997-10-23 2003-03-25 Cinch Connectors, Inc. Electrical connector
US5930114A (en) * 1997-10-23 1999-07-27 Thermalloy Incorporated Heat sink mounting assembly for surface mount electronic device packages
US5917703A (en) * 1998-04-17 1999-06-29 Advanced Interconnections Corporation Integrated circuit intercoupling component with heat sink
CN113835488B (zh) * 2021-09-24 2024-03-26 北京百度网讯科技有限公司 处理器模组及服务器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL275274A (de) * 1961-11-21
US3917375A (en) * 1974-06-17 1975-11-04 Teradyne Inc Electrical connection apparatus
JPS533010U (de) * 1976-06-25 1978-01-12
US4190098A (en) * 1978-02-16 1980-02-26 Ncr Corporation Multiple component circuit board cooling device
US4373778A (en) * 1980-12-30 1983-02-15 International Business Machines Corporation Connector implemented with fiber optic means and site therein for integrated circuit chips
US4508405A (en) * 1982-04-29 1985-04-02 Augat Inc. Electronic socket having spring probe contacts
JPS5972739U (ja) * 1982-11-04 1984-05-17 富士通株式会社 放熱フイン
DE3335377A1 (de) * 1983-09-29 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum festhalten eines kuehlkoerpers auf einem integrierten baustein
DE3439556A1 (de) * 1984-08-07 1986-02-20 Aavid Engineering Inc., Laconia, N.H. Eine waermesenke bildende abdeckung fuer einen ein elektronisches chip aufnehmenden traeger

Also Published As

Publication number Publication date
JPH0595195A (ja) 1993-04-16
JP2554409B2 (ja) 1996-11-13
EP0449150B1 (de) 1999-03-03
CA2038998A1 (en) 1991-09-27
ES2128302T3 (es) 1999-05-16
EP0449150A2 (de) 1991-10-02
DE69130928D1 (de) 1999-04-08
EP0449150A3 (en) 1991-11-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee