GB8902067D0 - Electrical circuit heat sink - Google Patents

Electrical circuit heat sink

Info

Publication number
GB8902067D0
GB8902067D0 GB8902067A GB8902067A GB8902067D0 GB 8902067 D0 GB8902067 D0 GB 8902067D0 GB 8902067 A GB8902067 A GB 8902067A GB 8902067 A GB8902067 A GB 8902067A GB 8902067 D0 GB8902067 D0 GB 8902067D0
Authority
GB
United Kingdom
Prior art keywords
heat sink
electrical circuit
circuit heat
electrical
sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8902067A
Other versions
GB2229041A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electrolube Ltd
Original Assignee
Electrolube Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrolube Ltd filed Critical Electrolube Ltd
Priority to GB8902067A priority Critical patent/GB2229041A/en
Publication of GB8902067D0 publication Critical patent/GB8902067D0/en
Publication of GB2229041A publication Critical patent/GB2229041A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB8902067A 1989-01-31 1989-01-31 Electrical circuit heat sink Withdrawn GB2229041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8902067A GB2229041A (en) 1989-01-31 1989-01-31 Electrical circuit heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8902067A GB2229041A (en) 1989-01-31 1989-01-31 Electrical circuit heat sink

Publications (2)

Publication Number Publication Date
GB8902067D0 true GB8902067D0 (en) 1989-03-22
GB2229041A GB2229041A (en) 1990-09-12

Family

ID=10650866

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8902067A Withdrawn GB2229041A (en) 1989-01-31 1989-01-31 Electrical circuit heat sink

Country Status (1)

Country Link
GB (1) GB2229041A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0986292B1 (en) * 1998-09-09 2006-04-19 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Thermal transfer mat for electrical or electronic apparatuses
DE19905869C1 (en) * 1999-02-12 2000-10-26 Peters Research Gmbh & Co Kg Binder-containing composition for the coating of printed circuit boards, use as printed circuit boards and manufacturing method
JP2001118973A (en) * 1999-10-20 2001-04-27 Fuji Kobunshi Kogyo Kk Forming method of heat conductive film

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3696127A (en) * 1970-07-09 1972-10-03 Dow Corning High filler content silicone elastomer with increased extrusion rate
US3642685A (en) * 1970-07-09 1972-02-15 Dow Corning Flowable filled vinyl siloxanes containing hexamethyldisilazanes
US4180414A (en) * 1978-07-10 1979-12-25 Optical Coating Laboratory, Inc. Concentrator solar cell array module
EP0065686A3 (en) * 1981-05-21 1984-10-10 General Electric Company Power device module
US4533489A (en) * 1983-12-07 1985-08-06 Harshaw/Filtrol Partnership Formable light reflective compositions

Also Published As

Publication number Publication date
GB2229041A (en) 1990-09-12

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)