GB2229041A - Electrical circuit heat sink - Google Patents

Electrical circuit heat sink Download PDF

Info

Publication number
GB2229041A
GB2229041A GB8902067A GB8902067A GB2229041A GB 2229041 A GB2229041 A GB 2229041A GB 8902067 A GB8902067 A GB 8902067A GB 8902067 A GB8902067 A GB 8902067A GB 2229041 A GB2229041 A GB 2229041A
Authority
GB
United Kingdom
Prior art keywords
heat sink
electrical circuit
heat
metal oxide
ambient air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8902067A
Other versions
GB8902067D0 (en
Inventor
Antonio Verissimo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electrolube Ltd
Original Assignee
Electrolube Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrolube Ltd filed Critical Electrolube Ltd
Priority to GB8902067A priority Critical patent/GB2229041A/en
Publication of GB8902067D0 publication Critical patent/GB8902067D0/en
Publication of GB2229041A publication Critical patent/GB2229041A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A metal oxide-filled fluid resin which cures on exposure to ambient air, for example an RTV (room temperature vulcanisable) silicone elastomer, is used to form a heat transfer layer electrical circuit heat sink material. The resin may be applied to preformed heat sink material by screen printing.

Description

ELECTR1(## CIRaJIT HEAT SINK The invention relates to the provision of heat transfer material for transferring heat between a heat generating electrical circuit cocconent and a heat sink.
Presently available thermally conductive materials include thermally conductive grease (thermopath) and insulating silicone rubber pads (flexipads), which are supplied as a separate component for sandwiching between the heat-generating oamponent and the preformed heat sink on assembly of the circuit.
The invention allows the supply of heat sinks preformed with a layer of heat transfer material, ready for direct placement of the heat generating component. The invention resides in the use of a metal oxide filled fluid resin that may be applied to the surface of the heat sink material and which will cure on exposure to ambient air, thus bonding to the surface of the material.
The resin should preferably be applied in a uniform layer. It has been found that this may be achieved by printing. Screen printing is a particularly preferred process.
The curable resin composition may be applied to a blank of heat sink material which may then be formed, if necessary, into a required shape. Usually a sheet of heat sink material sufficient to make several blanks will have the curable resin composition applied where appropriate and will then be formed into separate heat sinks. The heat sink material could for example be aluminium, which can be anodized without disturbing the layer of heat transfer material.
The curable resin oamposition could be applied directly to a preshaped heat sink. Another possibility is to apply the curable resin composition to areas of exposed copper on circuit boards, such areas being specifically left exposed for use as heat sinks. In this case, there is no need for an additional heat sink component.
The curable resin composition may be applied over the entire heat sink surface or in a desired shape or shapes to fit the heat generating cocconent(s). The areas of heat sink coated with the resin may be varied on demand.
Particularly useful curable resins for use in the invention are so-called room temperature vulcanisable (RTV) materials, in particular RTV silicone elastomers. Elastomeric or similar heat transfer layers can give good thermal contact with the heat sink material. At least some of the metal oxide filled materials are novel in themselves.
The optimum properties of the layer will vary according to the precise context. For example, the thermal conductivity of the heat transfer medium may be between 5 and 15 n##/cm0C, and the dielectric strength around 18 kV/m.
The thermal conductivity of the cured resin oomposition is governed inter alia by the amount of metal oxide filler.
An increase in the metal oxide concentration will increase the thermal conductivity, but depending on the metal oxide, may be to the detriment of the electrical insulating properties.
The viscosity of the curable resin oomposition is also dependent on the level of filler. For screen printing, it is preferred that the viscosity falls between 50 and 500 cyst.
It is necessary to avoid curing the curable materials during application. The eapplication may be done under a blanket of nitrogen, or other shield gas, to prevent premature curing.
There are several aspects to this invention. Invention resides not only in the use of curable resin compositions for making heat sinks preformed with a layer of heat transfer material, but also in the finished coccosite heat sinks, the resin-coated blanks for making them, the resin-coated sheet material for forming the blanks, and in circuit boards with the resin cepposition applied to exposed copper areas.
Furthermore, invention resides in the methods for making these products and intermediates, and in the novel metal oxide filled compositions per se.

Claims (6)

CLAIMS:
1. The use of a metal oxide-filled fluid resin, which cures on exposure to ambient air, to preform a heat transfer layer on electrical circuit heat sink material.
2. A heat sink for dissipating heat from a heat generating electrical circuit component, the heat sink being preformed with a heat transfer component thereon by forming and curing on the heat sink material surface a layer of ambient air-curable metal oxide-filled fluid resin.
3. A method of preforming an electrical circuit heat sink combined with a heat transfer component thereon, the method comprising forming and curing on the heat sink material surface a layer of ambient air-curable metal oxide-filled fluid resin.
4. A method according to claim 3 wherein said layer is formed by screen printing.
5. A method according to claim 3 or 4 wherein the resin is an RTV silicone elastomer.
6. A metal oxide-filled fluid resin which is curable in ambient air to form a heat transfer medium for an electrical circuit heat sink.
GB8902067A 1989-01-31 1989-01-31 Electrical circuit heat sink Withdrawn GB2229041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8902067A GB2229041A (en) 1989-01-31 1989-01-31 Electrical circuit heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8902067A GB2229041A (en) 1989-01-31 1989-01-31 Electrical circuit heat sink

Publications (2)

Publication Number Publication Date
GB8902067D0 GB8902067D0 (en) 1989-03-22
GB2229041A true GB2229041A (en) 1990-09-12

Family

ID=10650866

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8902067A Withdrawn GB2229041A (en) 1989-01-31 1989-01-31 Electrical circuit heat sink

Country Status (1)

Country Link
GB (1) GB2229041A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0986292A2 (en) * 1998-09-09 2000-03-15 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Thermal transfer mat for electrical or electronic apparatuses
DE19905869C1 (en) * 1999-02-12 2000-10-26 Peters Research Gmbh & Co Kg Binder-containing composition for the coating of printed circuit boards, use as printed circuit boards and manufacturing method
EP1094516A2 (en) * 1999-10-20 2001-04-25 Fuji Polymer Industries Co,, Ltd. Thermally conductive composition and method of forming thermally conductive film with use of same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1293730A (en) * 1970-07-09 1972-10-25 Dow Corning High filler content silicone elastomer with increased extrusion rate
GB1296302A (en) * 1970-07-09 1972-11-15
GB2026767A (en) * 1978-07-10 1980-02-06 Optical Coating Laboratory Inc Concentrator solar cell array module
EP0065686A2 (en) * 1981-05-21 1982-12-01 General Electric Company Power device module
EP0146255A2 (en) * 1983-12-07 1985-06-26 The Harshaw Chemical Company Formable light-reflective compositions

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1293730A (en) * 1970-07-09 1972-10-25 Dow Corning High filler content silicone elastomer with increased extrusion rate
GB1296302A (en) * 1970-07-09 1972-11-15
GB2026767A (en) * 1978-07-10 1980-02-06 Optical Coating Laboratory Inc Concentrator solar cell array module
EP0065686A2 (en) * 1981-05-21 1982-12-01 General Electric Company Power device module
EP0146255A2 (en) * 1983-12-07 1985-06-26 The Harshaw Chemical Company Formable light-reflective compositions

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0986292A2 (en) * 1998-09-09 2000-03-15 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Thermal transfer mat for electrical or electronic apparatuses
EP0986292A3 (en) * 1998-09-09 2000-12-20 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Thermal transfer mat for electrical or electronic apparatuses
DE19905869C1 (en) * 1999-02-12 2000-10-26 Peters Research Gmbh & Co Kg Binder-containing composition for the coating of printed circuit boards, use as printed circuit boards and manufacturing method
EP1028608A3 (en) * 1999-02-12 2003-08-27 Peters Research GmbH + Co. KG Process and coating composition for applying heat-sink paste to circuit boards
EP1094516A2 (en) * 1999-10-20 2001-04-25 Fuji Polymer Industries Co,, Ltd. Thermally conductive composition and method of forming thermally conductive film with use of same
EP1094516A3 (en) * 1999-10-20 2003-01-15 Fuji Polymer Industries Co,, Ltd. Thermally conductive composition and method of forming thermally conductive film with use of same

Also Published As

Publication number Publication date
GB8902067D0 (en) 1989-03-22

Similar Documents

Publication Publication Date Title
US7094822B2 (en) Thermally conductive elastomeric pad
US6803328B2 (en) Print thermally conductive interface assembly
US10370575B2 (en) Thermally conductive sheet
JP2756075B2 (en) Metal base substrate and electronic device using the same
EP1066942A2 (en) Heat-resistant thermally conductive silicone rubber composite sheet and method of producing the same
KR20030006964A (en) Heat sink sheet and pdp panel
JP2003277479A (en) Method for producing substrate for carrying led bare chip and resin composition
GB2229041A (en) Electrical circuit heat sink
CN109504295B (en) Heat-conducting silicone rubber with multilayer structure and application thereof
EP1160862B1 (en) Thermal conductive material and method for producing the same
JPH10100320A (en) Coomposite ceramic plate and its production
JP2003133596A (en) High heat conductive three-dimensional substrate, manufacturing method therefor and led display device
JPH11307697A (en) Thermally conductive composite sheet
JP6448736B2 (en) Thermally conductive sheet
WO1990012683A1 (en) Transfer fixture and process for printed circuit boards
CA2226149A1 (en) Method of manufacturing a printed circuit board assembly
JPS6352496A (en) Circuit board
KR102172003B1 (en) Method for manufacturing substitute substrate for adhesive
JP6299372B2 (en) Semiconductor device and manufacturing method thereof
KR102576375B1 (en) Heat dissipation composition comprising strontium-based fluorescent filler and solvent-free silicone resin
CN108912829B (en) Insulating heat-dissipation ink and preparation method of insulating heat-dissipation shielding case
JPS6079757A (en) Ceramic substrate package
JPH0129002B2 (en)
KR101810215B1 (en) Heat conductive tape without base film
SU763427A1 (en) Adhesive compound

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)