CN108912829B - Insulating heat-dissipation ink and preparation method of insulating heat-dissipation shielding case - Google Patents
Insulating heat-dissipation ink and preparation method of insulating heat-dissipation shielding case Download PDFInfo
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- CN108912829B CN108912829B CN201810864866.5A CN201810864866A CN108912829B CN 108912829 B CN108912829 B CN 108912829B CN 201810864866 A CN201810864866 A CN 201810864866A CN 108912829 B CN108912829 B CN 108912829B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
- C09D11/103—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds of aldehydes, e.g. phenol-formaldehyde resins
Abstract
The invention relates to the technical field of insulating and heat-dissipating materials, in particular to insulating and heat-dissipating ink and a preparation method of an insulating and heat-dissipating shielding case, wherein the insulating and heat-dissipating ink comprises the following raw materials in parts by weight: 48-60 parts of polyfluorinated ethylene propylene, 36-50 parts of polyformaldehyde, 30-45 parts of epoxy resin, 50-60 parts of heat-conducting filler, 4-8 parts of flatting agent, 4.5-9 parts of thixotropic thickening agent, 8-12 parts of curing crosslinking catalyst, 15-30 parts of coupling agent, 34-68 parts of solvent and 15-25 parts of pigment and filler, and has high heat conductivity coefficient, excellent dielectric property, thermal stability, toughness and aging resistance.
Description
Technical Field
The invention relates to the technical field of insulating and heat-dissipating materials, in particular to insulating and heat-dissipating ink and a preparation method of an insulating and heat-dissipating shielding case.
Background
The shielding cover is a tool for shielding the influence of external electromagnetic waves on an internal circuit and the outward radiation of the electromagnetic waves generated inside, and is mainly applied to the fields of mobile phones, GPS and the like. The shielding case is made of stainless steel with a thickness of 0.2mm and copper white, wherein the copper white is not only a metal shielding material which is easy to be tinned, but also has a certain conductivity, and the shielding case made of copper white may be electrically connected with an electronic element or a PCB board, which may cause an open circuit of the electronic element or a short circuit of the PCB board, and affect the normal and stable operation of the electronic product. Meanwhile, electronic product components can generate heat when working, when the heat inside the electronic product cannot be diffused to the outside of the electronic product in time through the shielding case, the heat inside the electronic product can be concentrated, and the temperature of the electronic components is increased to cause the problem of dead halt or component burnout. Therefore, the heat dissipation performance and the insulation performance of the shielding case are critical to the service life of the electronic product.
Disclosure of Invention
In order to overcome the disadvantages and shortcomings of the prior art, a first object of the present invention is to provide an insulating and heat dissipating ink having a high thermal conductivity and excellent dielectric properties, thermal stability, toughness and aging resistance.
The second purpose of the invention is to provide a preparation method of the insulating heat dissipation shielding case, the prepared insulating heat dissipation shielding case has the thermal conductivity coefficient of 110-0.5KV/mm, volume resistivity of 1.15x1015-1.48x1015Omega cm, surface resistivity of 1.59x1015-1.81x1015Omega, good mechanical property.
The first purpose of the invention is realized by the following technical scheme: an insulating heat-dissipating ink comprises the following raw materials in parts by weight: 48-60 parts of polyfluorinated ethylene propylene, 36-50 parts of polyformaldehyde, 30-45 parts of epoxy resin, 50-60 parts of heat-conducting filler, 4-8 parts of flatting agent, 4.5-9 parts of thixotropic thickening agent, 8-12 parts of curing crosslinking catalyst, 15-30 parts of coupling agent, 34-68 parts of solvent and 15-25 parts of pigment and filler.
According to the invention, the insulating heat-dissipating ink is prepared from the raw materials in parts by weight, and the prepared insulating heat-dissipating ink has high heat conductivity coefficient, excellent dielectric property, thermal stability, toughness and aging resistance.
Polyformaldehyde has the characteristics of high electrical insulation strength, excellent mechanical property and good fatigue resistance, polyperfluorinated ethylene propylene not only has excellent insulation property, but also has certain flame retardance, polyformaldehyde, polyperfluorinated ethylene propylene and epoxy resin are blended and polymerized to form a resin matrix with insulating flame retardance, then a heat-conducting filler is filled in the resin matrix, and under the synergistic action of other additives, the prepared insulating heat-radiating ink has excellent heat-conducting property and dielectric property, and a cured ink layer also has the advantages of good flame retardance, good adhesive force and excellent mechanical property.
The coupling agent with the weight part is added to carry out surface modification on the heat-conducting filler, so that the compatibility of a resin matrix of the heat-conducting filler is improved, the filler is favorably and uniformly dispersed in the resin matrix, a heat-conducting network is favorably formed in the resin matrix of the heat-conducting filler, the interface thermal resistance is reduced, and the insulating and heat-dissipating performance of the ink is favorably improved. When the amount of the coupling agent added is more than 30 parts by weight, the coupling agent in excess may be dispersed in the resin matrix to cause phonon scattering, resulting in a decrease in thermal conductivity of the ink. When the addition amount of the coupling agent is less than 15 parts by weight, the coupling agent cannot fully modify the heat-conducting filler, so that the heat-conducting property of the prepared insulating and heat-dissipating ink is reduced.
The leveling agent in parts by weight can improve transferability of the insulating heat-dissipation ink in the construction process and leveling performance on the surface of a metal material, so that the insulating heat-dissipation ink can uniformly cover the surface of the metal material, the metal material coated with the insulating heat-dissipation ink has good insulating performance, and the electric leakage condition is avoided. When the addition amount of the leveling agent is more than 8 parts by weight, the leveling agent is not beneficial to leveling of the insulating heat-dissipation ink on the surface of the metal material due to great interfacial tension difference, so that the ink layer on the surface of the metal material shrinks and the surface of the metal material cannot be uniformly covered, the insulating property of the metal material coated with the insulating heat-dissipation ink is reduced, and the electric leakage condition occurs. When the addition amount of the leveling agent is less than 4 parts by weight, the surface tension of the ink is too small, and the transferability of the insulating and heat-dissipating ink in the construction process and the leveling performance on the surface of a metal material are affected.
When the curing crosslinking catalyst in parts by weight is adopted, the curing speed of the insulating and heat-dissipating ink is high, and the cured ink layer has excellent dielectric property, high heat conductivity coefficient, high hardness and high toughness. When the addition amount of the curing crosslinking catalyst is more than 12 parts by weight or less than 8 parts by weight, the insulating property of the insulating heat-dissipating ink is degraded and the adhesion property is poor.
The thixotropic thickening agent is added to adjust the thixotropy of the insulating and heat-dissipating ink in parts by weight, so that the viscosity is improved, the thickness of a single printing ink layer is increased to 100 mu m, and the insulating and heat-dissipating performance of the cured ink layer is improved. When the addition amount of the thixotropic thickener is too low, the viscosity of the prepared insulating and heat-dissipating ink is too low, which is not beneficial to construction, and when the addition amount is too high, the insulating and heat-dissipating performance of the prepared insulating and heat-dissipating ink is reduced.
The invention is further configured to: the heat conductive filler is at least one of metal oxide, metal nitride and carbide.
The metal oxide, the metal nitride and the carbide have heat conducting performance and insulating performance, and the conductive filler can improve the conductive performance and the electric insulating performance.
Wherein the metal oxide can be BeO, MgO, Al2O3CaO, NiO, etc.; the metal nitride can be AlN,BN and the like; the carbide can be SiC or B4C3And the like.
The invention is further configured to: the average grain diameter of the heat-conducting filler is 8-10 mu m.
By adopting the heat-conducting filler with the particle size, the heat-conducting filler is favorable for forming an effective heat-conducting network chain in the resin matrix and improving the heat-conducting property of the insulating heat-radiating ink, and the heat-conducting filler with the particle size has an excellent mechanical synergistic effect with the resin matrix, so that the impact strength and the bending strength of the ink layer after the insulating heat-radiating ink is cured are favorably improved. When the particle size of the heat-conducting filler is smaller than 8 mu m, the mechanical property of the cured ink layer is poor, the impact strength and the bending strength are obviously reduced, and when the particle size of the heat-conducting filler is larger than 10 mu m, the probability of forming a heat-conducting network chain in a resin matrix by the heat-conducting filler is low, so that the heat-conducting property of the prepared insulating heat-dissipating ink is reduced.
The invention is further configured to: the leveling agent is at least one of a polyether modified organic siloxane leveling agent, a polydimethylsiloxane leveling agent, an organic silicon modified polysiloxane leveling agent, an organic modified polysiloxane acrylic acid leveling agent and methyl silicone oil.
The leveling agent has good suspension stability, good adhesive force, high transparency and no influence on the surface gloss of the ink layer, can improve the compatibility of a resin matrix, enables the prepared insulating heat-dissipation ink to have uniform and stable properties, is not easy to generate a layering phenomenon, can reduce the surface tension of the insulating heat-dissipation ink, controls the surface flow capacity of the insulating heat-dissipation ink, enables the prepared insulating heat-dissipation ink to have good shrinkage resistance and adhesion resistance, and improves the interlayer adhesive force of the insulating heat-dissipation ink.
Preferably, the polyether modified organic siloxane leveling agent can be a 1080 leveling agent, a 1090 leveling agent, a 1070 leveling agent and a 1071 leveling agent; the organic silicon modified polysiloxane flatting agent can be selected from 1060 flatting agents, and has good heat resistance, and the heat resistance temperature is 200-; the organic modified polysiloxane acrylic flatting agent can be selected from 1073 flatting agent and 1074 flatting agent.
The invention is further configured to: the thixotropic thickener is any one of fumed silica, sodium bentonite, organic bentonite, diatomite, attapulgite and aluminum silicate. The thixotropic thickener has good suspension property and dispersibility, and is more favorable for improving the insulating and heat dissipation performance of the cured ink layer.
The invention is further configured to: the curing and crosslinking catalyst is at least one of p-toluenesulfonic acid, boron trifluoride, maleic anhydride, phthalic anhydride, dicyandiamide and boron nitride ethylamine complex.
The curing crosslinking catalyst is high in curing speed, and the cured ink layer is excellent in dielectric property, high in heat conductivity coefficient, high in hardness and high in toughness. The maleic anhydride and the phthalic anhydride can introduce a molecular chain with toughness in the molecular chain of the anhydride, increase the crosslinking density of the epoxy resin, improve the insulating property of a resin matrix and the heat dissipation performance of the ink, effectively reduce the curing time of the insulating heat dissipation ink, and improve the toughness and the glossiness of a cured paint film.
The invention is further configured to: the coupling agent is at least one of 3-glycidoxypropyltrimethoxysilane, gamma-aminopropyltriethoxysilane, vinyltriethoxysilane, aniline methyltriethoxysilane, gamma-methacryloxypropyltrimethoxysilane, methyltriethoxysilane, pyrophosphate titanate and vinyl tri (beta-methoxyethoxy) silane.
By adopting the coupling agent of the kind, the coupling agent can be matched with other raw materials to perform a synergistic reaction, so that the tight combination of the raw materials is effectively improved, the interface performance between a resin matrix and a heat-conducting filler can be improved, and the dispersibility, the viscosity, the compatibility and the processability of the raw materials are improved, so that the prepared insulating and heat-dissipating ink has better heat resistance, dispersibility and binding power, and has excellent electric insulating performance and heat dissipation performance; the adopted vinyl triethoxysilane can effectively improve the affinity among the raw materials and enhance the strength of the ink; the adopted gamma-methacryloxypropyltrimethoxysilane improves the mechanical property, the electrical property and the weather resistance of the composition, and has good adhesive force and strong durability; the adopted methyl triethoxysilane can effectively improve the performances of the composition such as impact resistance, rheological property, processability, stability and the like.
The invention is further configured to: the solvent is at least one of cyclohexanone, toluene, xylene, ethanol, acetone, butanol and methyl ethyl ketone.
The resin matrix and the heat-conducting filler are mixed with the solvent, so that the insulating heat-dissipating ink with proper viscosity can be prepared, the construction performance of the insulating heat-dissipating ink is improved, the insulating heat-dissipating ink is not easy to cause paint build-up, meanwhile, the prepared insulating heat-dissipating ink has excellent film-forming performance, all raw material components are uniformly and stably dispersed in the resin matrix, the stability, the weather resistance and the mechanical performance of the insulating heat-dissipating ink are improved, and an ink layer after film formation has excellent insulating performance, high heat conductivity coefficient and high adhesive force, and the insulating heat-dissipating ink with stable property is more favorable for storage.
The invention is further configured to: the viscosity of the insulating heat dissipation ink is 200-300dPa & s.
The insulating heat-dissipating ink with the viscosity has good construction performance, is not easy to cause paint piling phenomenon, and has high adhesive force.
The second purpose of the invention is realized by the following technical scheme: a preparation method of an insulating heat dissipation shielding cover uses the insulating heat dissipation ink, and insulating heat dissipation ink patterns are printed on a metal material strip for manufacturing the insulating heat dissipation shielding cover by a screen printing method according to design requirements to form an insulating heat dissipation layer, and comprises the following steps:
s1, punching the metal material belt to be processed to form a positioning hole;
s2, manufacturing a silk screen printing plate matched with the positioning hole in position according to the unfolding shape of the insulating heat dissipation layer on the insulating heat dissipation shielding cover, and placing the silk screen printing plate into rotary silk screen printing equipment;
s3, positioning the punched metal material belt to a printing position of a rotary screen printing device through a positioning hole;
s4, adding insulating heat dissipation ink onto the silk screen printing plate to print the metal material belt conveyed to a printing position;
s5, conveying the printed metal material belt to curing equipment for curing;
and S6, feeding the metal material band solidified in the S5 into a stamping device, and performing stamping forming to obtain the insulating heat dissipation shielding cover.
Wherein the curing equipment is ultraviolet curing equipment or infrared curing equipment.
The preparation method is simple, the metal material belt is subjected to insulation heat dissipation processing before being stamped, so that the insulation heat dissipation film does not need to be manually attached after stamping forming, the production cost and the labor intensity are greatly reduced, manual film attachment is replaced by equipment in a silk-screen printing mode, and the yield of the heat dissipation shielding case is improved. The insulating heat dissipation layer of the shielding case is prepared by a screen printing mode, compared with a mode of film pasting, the production efficiency and the yield are higher, the thickness of the insulating heat dissipation layer can be effectively reduced by adopting the insulating heat dissipation ink, when the thickness of the heat dissipation layer is 0.005-0.008mm, the insulating heat dissipation shielding case can have excellent insulating heat dissipation performance, the heat conductivity coefficient of the insulating heat dissipation shielding case is between 110 and 118W/(m.k), the electrical strength is between 105-110.5KV/mm, and the volume resistivity is 1.15x1015-1.48x1015Omega cm, surface resistivity of 1.59x1015-1.81x1015And omega, the normal use of electronic elements in the shielding case is not influenced.
The invention has the beneficial effects that:
1. according to the invention, polyformaldehyde, polyfluorinated ethylene propylene and epoxy resin are blended and polymerized to form a resin matrix with insulating and flame-retardant properties, then the resin matrix is filled with a heat-conducting filler, and under the synergistic effect of other additives, the prepared insulating and heat-dissipating ink has excellent heat-conducting property and dielectric property, and a cured ink layer also has excellent flame-retardant property, good adhesive force and excellent mechanical property;
2. the electric strength of the insulation shielding case prepared by the invention is between 105 KV/mm and 110.5KV/mm, and the volume resistivity is 1.15x1015-1.48x1015Omega cm, surface resistivity of 1.59x1015-1.81x1015Between omega, excellent insulating property and heat conductivity coefficient of insulating radiating shielding caseBetween 110-;
3. according to the preparation method of the insulating heat dissipation shielding case, the insulating heat dissipation layer of the shielding case is prepared in a screen printing mode, compared with a film pasting mode, the production efficiency and the yield are high, the insulating heat dissipation ink can effectively reduce the thickness of the insulating heat dissipation layer, and when the thickness of the heat dissipation layer is 0.005-0.008mm, the insulating heat dissipation shielding case can have excellent insulating heat dissipation performance.
Drawings
Fig. 1 is a schematic diagram of the present invention, which prints the insulating heat dissipation ink on the metal material strip for manufacturing the insulating heat dissipation shield.
In the figure: 1. a metal material belt; 2. a heat dissipation layer; 3. and (7) positioning the holes.
Detailed Description
For the understanding of those skilled in the art, the present invention will be further described with reference to the following examples and the accompanying fig. 1, and the description of the embodiments is not intended to limit the present invention.
Example 1
An insulating heat-dissipating ink comprises the following raw materials in parts by weight: 48 parts of polyfluorinated ethylene propylene, 36 parts of polyformaldehyde, 30 parts of epoxy resin, 50 parts of AlN heat-conducting filler, 4 parts of methyl silicone oil leveling agent, 4.5 parts of organic bentonite thixotropic thickening agent, 8 parts of toluene sulfonic acid curing and crosslinking catalyst, 15 parts of 3-glycidyloxypropyltrimethoxysilane coupling agent, 34 parts of cyclohexanone solvent and 15 parts of pigment and filler.
Wherein the particle size of the heat-conducting filler is 8 μm; the viscosity of the insulating and heat dissipating ink was 200 dPas.
A preparation method of an insulating heat dissipation shielding case uses the insulating heat dissipation ink, and a screen printing method is adopted to print insulating heat dissipation ink patterns on a metal material belt 1 for manufacturing the insulating heat dissipation shielding case according to design requirements so as to form an insulating heat dissipation layer 2, and comprises the following steps:
s1, punching the metal material belt 1 to be processed to form a positioning hole 3;
s2, manufacturing a silk-screen printing plate matched with the positioning hole 3 according to the unfolding shape of the insulating heat dissipation layer 2 on the insulating heat dissipation shielding cover, and placing the silk-screen printing plate into rotary silk-screen printing equipment;
s3, positioning the punched metal material belt 1 to a printing position of a rotary screen printing device through a positioning hole 3;
s4, adding insulating heat dissipation ink onto the silk screen printing plate to print the metal material belt 1 conveyed to the printing position;
s5, conveying the printed metal material belt 1 to ultraviolet curing equipment for curing;
and S6, feeding the metal material strap 1 solidified in the S5 into a stamping device, and performing stamping forming to obtain the insulating heat dissipation shielding cover.
Example 2
An insulating heat-dissipating ink comprises the following raw materials in parts by weight: 54 parts of fluorinated ethylene propylene, 43 parts of polyformaldehyde, 37.5 parts of epoxy resin and Al2O355 parts of heat-conducting filler, 6 parts of 1080 flatting agent, 7 parts of attapulgite thixotropic thickener, 10 parts of boron trifluoride curing and crosslinking catalyst, 22.5 parts of gamma-aminopropyl triethoxysilane coupling agent, 51 parts of butanol solvent and 20 parts of pigment and filler.
Wherein the particle size of the heat-conducting filler is 9 μm; the viscosity of the insulating and heat-dissipating ink was 250 dPas.
A method for manufacturing an insulating heat dissipation shield according to the present embodiment is the same as the method for manufacturing the insulating heat dissipation shield according to embodiment 1.
Example 3
An insulating heat-dissipating ink comprises the following raw materials in parts by weight: 60 parts of polyfluorinated ethylene propylene, 50 parts of polyformaldehyde, 45 parts of epoxy resin, 60 parts of SiC heat-conducting filler, 8 parts of 1074 leveling agent, 9 parts of diatomite thixotropic thickener, 12 parts of dicyandiamide curing and crosslinking catalyst, 30 parts of aniline methyl triethoxysilane coupling agent, 68 parts of toluene solvent and 25 parts of pigment and filler.
Wherein the particle size of the heat-conducting filler is 10 μm; the viscosity of the insulating and heat dissipating ink is 300 dPas.
A method for manufacturing an insulating heat dissipation shield according to the present embodiment is the same as the method for manufacturing the insulating heat dissipation shield according to embodiment 1.
Example 4
An insulating heat-dissipating ink comprises the following raw materials in parts by weight: 54 parts of fluorinated ethylene propylene, 43 parts of polyformaldehyde, 37.5 parts of epoxy resin, 55 parts of heat-conducting filler, 6 parts of flatting agent, 7 parts of aluminum silicate thixotropic thickener, 10 parts of curing crosslinking catalyst, 22.5 parts of coupling agent, 51 parts of solvent and 20 parts of pigment and filler.
Wherein the heat-conducting filler is a mixture of CaO, BN and B4C3 according to the weight ratio of 1:1:1, and the particle size of the heat-conducting filler is 9 μm. The viscosity of the insulating and heat-dissipating ink was 250 dPas.
Wherein the flatting agent is a mixture of a methyl silicone oil flatting agent and a 1060 flatting agent according to the weight ratio of 1.2: 3.
The curing and crosslinking catalyst is a mixture of maleic anhydride and phthalic anhydride according to the weight ratio of 1: 1.3.
The coupling agent is a mixture of 3-glycidoxypropyltrimethoxysilane, vinyltriethoxysilane and pyrophosphate titanate in a weight ratio of 1:1: 1.
The solvent is cyclohexanone, toluene and xylene according to the weight ratio of 1.3: 2: 3.
A method for manufacturing an insulating heat dissipation shield according to the present embodiment is the same as the method for manufacturing the insulating heat dissipation shield according to embodiment 1.
The following performance tests were performed on the insulation heat dissipation shields prepared in examples 1 to 4, and the test results are recorded in table 1.
Table 1 summary of the performance test results for the insulating and heat-dissipating shields prepared in examples 1-4
As can be seen from Table 1, the electric strength of the insulation shielding case prepared by the invention is 105-110.5KV/mm, the volume resistivity is 1.15x1015-1.48x1015 omega-cm, the surface resistivity is 1.59x1015-1.81x1015 omega, the insulation performance is excellent, the heat conductivity coefficient of the insulation heat dissipation shielding case is 110-.
The above-described embodiments are preferred implementations of the present invention, and the present invention may be implemented in other ways without departing from the spirit of the present invention.
Claims (5)
1. The insulating heat-dissipation ink is characterized by comprising the following raw materials in parts by weight: 48-60 parts of polyfluorinated ethylene propylene, 36-50 parts of polyformaldehyde, 30-45 parts of epoxy resin, 50-60 parts of heat-conducting filler, 4-8 parts of flatting agent, 4.5-9 parts of thixotropic thickening agent, 8-12 parts of curing crosslinking catalyst, 15-30 parts of coupling agent, 34-68 parts of solvent and 15-25 parts of pigment and filler;
at least one of the curing crosslinking catalyst p-toluenesulfonic acid, boron trifluoride, maleic anhydride, phthalic anhydride, dicyandiamide and boron nitride ethylamine complex;
the coupling agent is at least one of 3-glycidoxypropyltrimethoxysilane, gamma-aminopropyltriethoxysilane, vinyltriethoxysilane, aniline methyltriethoxysilane, gamma-methacryloxypropyltrimethoxysilane, methyltriethoxysilane, pyrophosphate titanate and vinyl tri (beta-methoxyethoxy) silane;
the heat conducting filler is at least one of metal oxide, metal nitride and carbide;
the average grain diameter of the heat-conducting filler is 8-10 mu m;
the viscosity of the insulating heat dissipation ink is 200-300dPa & s.
2. The insulating and heat-dissipating ink according to claim 1, wherein the leveling agent is at least one of a polyether-modified organosiloxane leveling agent, a polydimethylsiloxane leveling agent, an organosilicon-modified polysiloxane leveling agent, and methyl silicone oil.
3. The insulating and heat-dissipating ink as claimed in claim 1, wherein the thixotropic thickener is any one of fumed silica, sodium bentonite, organobentonite, diatomaceous earth, attapulgite and aluminum silicate.
4. The insulating heat-dissipating ink according to claim 1, wherein the solvent is at least one of cyclohexanone, toluene, xylene, ethanol, acetone, butanol, and methyl ethyl ketone.
5. A preparation method of an insulating heat dissipation shielding case, which uses the insulating heat dissipation ink as claimed in any one of claims 1 to 4, and adopts a screen printing method to print insulating heat dissipation ink patterns according to design requirements on a metal material belt for manufacturing the insulating heat dissipation shielding case so as to form an insulating heat dissipation layer, and is characterized by comprising the following steps:
s1, punching the metal material belt to be processed to form a positioning hole;
s2, manufacturing a silk screen printing plate matched with the positioning hole in position according to the unfolding shape of the insulating heat dissipation layer on the insulating heat dissipation shielding cover, and placing the silk screen printing plate into rotary silk screen printing equipment;
s3, positioning the punched metal material belt to a printing position of a rotary screen printing device through a positioning hole;
s4, adding insulating heat dissipation ink onto the silk screen printing plate to print the metal material belt conveyed to a printing position;
s5, conveying the printed metal material belt to curing equipment for curing;
and S6, feeding the metal material band solidified in the S5 into a stamping device, and performing stamping forming to obtain the insulating heat dissipation shielding cover.
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| KR20170035571A (en) * | 2015-09-23 | 2017-03-31 | (주)창성 | Improved Graphene ink composition and manufacturing method |
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