JP2002003717A - Heat conductive sheet - Google Patents
Heat conductive sheetInfo
- Publication number
- JP2002003717A JP2002003717A JP2000186193A JP2000186193A JP2002003717A JP 2002003717 A JP2002003717 A JP 2002003717A JP 2000186193 A JP2000186193 A JP 2000186193A JP 2000186193 A JP2000186193 A JP 2000186193A JP 2002003717 A JP2002003717 A JP 2002003717A
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- JP
- Japan
- Prior art keywords
- heat conductive
- volume
- conductive sheet
- graphitized carbon
- carbon fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、高い熱伝導性と電
気絶縁性が要求される熱伝導性シートに関する。さらに
詳しくは、電気製品に使用される各種半導体素子や電
源、光源、部品などから発生する熱を効果的に放散させ
る高い熱伝導性と電気絶縁性を兼ね備えた熱伝導性シー
トに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat conductive sheet which requires high heat conductivity and electrical insulation. More specifically, the present invention relates to a heat conductive sheet having both high heat conductivity and electric insulation for effectively dissipating heat generated from various semiconductor elements, power supplies, light sources, components, and the like used in electric products.
【０００２】[0002]
【従来の技術】従来より、発熱する電子部品と放熱させ
る部材とを接合させる目的でシリコーンゴム系の柔軟な
熱伝導性シートが使用されている。これらの熱伝導性シ
ートには、熱伝導性を高めるために、銀、銅、金、アル
ミニウム、ニッケルなどの熱伝導率の大きい金属や合
金、酸化アルミニウム、酸化マグネシウム、酸化ケイ
素、窒化ホウ素、窒化アルミニウム、窒化ケイ素、炭化
ケイ素などのセラミックス製の粉末状や繊維状の熱伝導
率が大きい充填剤が充填されている。2. Description of the Related Art Conventionally, a flexible silicone rubber-based heat conductive sheet has been used for the purpose of joining a heat-generating electronic component to a heat-dissipating member. These heat conductive sheets include metals, alloys such as silver, copper, gold, aluminum, and nickel having a high heat conductivity, aluminum oxide, magnesium oxide, silicon oxide, boron nitride, and nitride to increase the heat conductivity. Fillers made of ceramics such as aluminum, silicon nitride, silicon carbide, and the like, which have a large thermal conductivity and are in a powdery or fibrous form are filled.
【０００３】また、熱伝導率が大きい充填剤として炭素
繊維をシリコーンゴム等に配合した熱伝導性シートが公
知である。例えば、特開平９−２８３９５５号公報に、
特定の平均アスペクト比の黒鉛質炭素繊維をシリコーン
ゴムなどのマトリックス中に分散した熱伝導性シートが
提案されている。Further, a heat conductive sheet in which carbon fiber is blended with silicone rubber or the like as a filler having a high heat conductivity is known. For example, in Japanese Patent Application Laid-Open No. 9-283955,
A thermally conductive sheet in which a graphitic carbon fiber having a specific average aspect ratio is dispersed in a matrix such as silicone rubber has been proposed.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うな従来の炭素繊維を分散した熱伝導性シートは導電性
があるため、電気絶縁性を要求される用途には使用でき
なかった。この問題点を解決するものとして、特許登録
第２６９５５６３号公報に、電気絶縁性を有する皮膜で
被覆された炭素繊維を、その皮膜に対して相溶性を有す
る合成樹脂に均一分散することによって電気絶縁性を有
する伝熱用材料が提唱されている。しかし、この方法で
は、炭素繊維を電気絶縁性被膜で被覆することが容易で
なく、かつ電気絶縁性被膜の組成、製造方法、電気的性
質等に関しては詳細が不明であり、十分な電気絶縁性と
熱伝導性の両方を要求される用途には利用することがで
きなかった。However, such a conventional heat conductive sheet in which carbon fibers are dispersed has conductivity and cannot be used for applications requiring electrical insulation. To solve this problem, Japanese Patent No. 2695563 discloses a method of electrically insulating carbon fibers coated with an electrically insulating film by uniformly dispersing the carbon fibers in a synthetic resin having compatibility with the film. A heat transfer material having properties has been proposed. However, in this method, it is not easy to coat the carbon fiber with an electric insulating film, and details of the composition, manufacturing method, electric properties, etc. of the electric insulating film are unknown, and sufficient electric insulating properties are not obtained. It cannot be used for applications requiring both thermal conductivity and thermal conductivity.
【０００５】[0005]
【課題を解決するための手段】本発明は、上述の課題を
解決する目的で、電気製品に使用される半導体素子や電
源、光源などの部品から発生する熱を効果的に放散させ
る高い熱伝導性と電気絶縁性を兼ね備えた熱伝導性シー
トを提供するものである。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention has a high heat conduction for effectively dissipating heat generated from components such as semiconductor elements, power supplies, and light sources used in electric appliances. An object of the present invention is to provide a heat conductive sheet having both properties and electrical insulation.
【０００６】すなわち、シリコーンゴムからなるシート
中に、黒鉛化炭素繊維を濃度が５〜４０体積％、電気絶
縁性熱伝導充填剤を濃度が３０〜５０体積％で含有させ
てなる、体積抵抗率が１０６Ω・ｃｍ以上の電気絶縁性
を有する熱伝導性シートである。さらに、黒鉛化炭素繊
維が、直径５〜２０μｍ、長さ２０〜８００μｍ、繊維
長さ方向の熱伝導率２００Ｗ／ｍ・Ｋ以上であることを
特徴とする熱伝導性シートである。さらに、シートが、
アスカーＣ硬度５０以下であることを特徴とする熱伝導
性シートである。That is, a sheet made of silicone rubber contains a graphitized carbon fiber at a concentration of 5 to 40% by volume and an electrically insulating heat conductive filler at a concentration of 30 to 50% by volume. Is a heat conductive sheet having an electrical insulation of 10 6 Ω · cm or more. Further, the heat conductive sheet is characterized in that the graphitized carbon fiber has a diameter of 5 to 20 μm, a length of 20 to 800 μm, and a thermal conductivity of 200 W / m · K or more in the fiber length direction. In addition, the sheet
A heat conductive sheet having an Asker C hardness of 50 or less.
【０００７】本発明のシリコーンゴムに含有させる黒鉛
化炭素繊維の濃度は、５〜４０体積％が好ましい。５体
積％よりも少ないと、得られる熱伝導性シートの熱伝導
率が低く、放熱特性が劣り、４０体積％を越えると配合
組成物の粘度が増大して繊維を均一に分散させることが
困難になり、かつ、気泡の混入が避けられず好ましくな
い。好ましい黒鉛化炭素繊維の濃度は、５〜３０体積％
である。[0007] The concentration of the graphitized carbon fibers contained in the silicone rubber of the present invention is preferably 5 to 40% by volume. If the amount is less than 5% by volume, the heat conductivity of the resulting heat conductive sheet is low, and the heat radiation property is inferior. If the amount exceeds 40% by volume, the viscosity of the compounded composition increases and it is difficult to uniformly disperse the fibers. And mixing of air bubbles is unavoidable, which is not preferable. A preferable concentration of the graphitized carbon fiber is 5 to 30% by volume.
It is.
【０００８】本発明のシリコーンゴムに含有させる電気
絶縁性熱伝導充填剤の濃度は、３０〜５０体積％が好ま
しい。３０体積％よりも少ないと体積抵抗率が小さく、
電気絶縁性の効果が低くなり、６０体積％を越えると、
配合組成物の粘度が増大し、黒鉛化炭素繊維の充填が困
難になり、熱伝導率の低下が起き、放熱特性が劣ってし
まう。[0008] The concentration of the electrically insulating heat conductive filler contained in the silicone rubber of the present invention is preferably 30 to 50% by volume. If less than 30% by volume, the volume resistivity is small,
When the effect of electrical insulation is reduced and exceeds 60% by volume,
The viscosity of the blended composition increases, making it difficult to fill the graphitized carbon fibers, lowering the thermal conductivity, and deteriorating the heat radiation characteristics.
【０００９】本発明は、熱伝導性シートが電気絶縁性を
有することが重要である。この電気絶縁性とは、体積抵
抗率が１０６Ω・ｃｍ以上であることを意味する。体積
抵抗率が１０６Ω・ｃｍ未満であると、電極やリード、
電気配線などがショートするなどの電気的なトラブルが
発生して電子機器が作動しなくなるので好ましくない。In the present invention, it is important that the heat conductive sheet has electrical insulation. This electrical insulation means that the volume resistivity is 10 6 Ω · cm or more. If the volume resistivity is less than 10 6 Ω · cm, electrodes and leads,
It is not preferable because the electronic device stops operating due to an electrical trouble such as a short-circuit of the electric wiring.
【００１０】[0010]
【発明の実施の形態】以下に、本発明をさらに詳細に説
明する。本発明は、シリコーンゴムからなるシート中
に、黒鉛化炭素繊維を濃度が５〜４０体積％、電気絶縁
性熱伝導充填剤を濃度が３０〜５０体積％で含有させて
なる、体積抵抗率が１０６Ω・ｃｍ以上の電気絶縁性を
有する熱伝導性シートである。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail. The present invention provides a sheet made of silicone rubber containing a graphitized carbon fiber at a concentration of 5 to 40% by volume and an electrically insulating heat conductive filler at a concentration of 30 to 50% by volume. It is a heat conductive sheet having an electrical insulating property of 10 6 Ω · cm or more.
【００１１】本発明の黒鉛化炭素繊維は、ＰＡＮ系より
もピッチ系やメソフェーズピッチ系を主材料とし、溶融
紡糸、不溶化、炭化などの処理工程後に、２０００〜３
０００℃あるいは３０００℃を越える高温で熱処理し、
黒鉛構造の発達したピッチ系炭素繊維とした。これは繊
維長さ方向の熱伝導率が大きくて好ましい。さらに気相
成長法によって得られるピッチ系の黒鉛化炭素繊維も好
適である。本発明の黒鉛化炭素繊維の繊維長さ方向の熱
伝導率は２００Ｗ／ｍ・Ｋ以上が好ましく、さらに好ま
しくは４００Ｗ／ｍ・Ｋ以上、さらには１０００Ｗ／ｍ・
Ｋ以上が好ましい。The graphitized carbon fiber of the present invention has a pitch-based or mesophase-pitch-based material as a main material rather than a PAN-based material.
Heat treatment at a high temperature exceeding 000 ° C or 3000 ° C,
A pitch-based carbon fiber having a developed graphite structure was used. This is preferable because the thermal conductivity in the fiber length direction is large. Further, pitch-based graphitized carbon fibers obtained by a vapor growth method are also suitable. The thermal conductivity in the fiber length direction of the graphitized carbon fiber of the present invention is preferably 200 W / m · K or more, more preferably 400 W / m · K or more, and even more preferably 1000 W / m · K.
K or more is preferable.
【００１２】また、本発明の黒鉛化炭素繊維の形状につ
いては、短繊維、長繊維、織布、不織布、フェルト状、
マット状、紙状など特定するものではなくいずれの形状
の黒鉛化炭素繊維でも適応可能である。短繊維形状の場
合、黒鉛化炭素繊維の直径は、５〜２０μｍ、さらに好
ましくは７〜１４μｍ、長さは２０〜８００μｍ、さら
に好ましくは２０〜５００μｍの範囲がシリコーンゴム
へ容易に充填することができ、得られる熱伝導性シート
の熱伝導率が大きくなるので好ましい。The graphitized carbon fibers of the present invention may be in the form of short fibers, long fibers, woven fabrics, non-woven fabrics, felts, or the like.
The shape is not limited to a mat shape or a paper shape, and any shape of graphitized carbon fiber is applicable. In the case of the short fiber shape, the diameter of the graphitized carbon fiber is 5 to 20 μm, more preferably 7 to 14 μm, and the length is 20 to 800 μm, more preferably 20 to 500 μm. It is preferable because the thermal conductivity of the resulting thermally conductive sheet is increased.
【００１３】平均直径が５μｍよりも小さい場合や、平
均長さが８００μｍよりも長い場合は、シリコーンゴム
に高濃度で配合することが困難になる。一方、黒鉛化炭
素の平均粒径が２０μｍを越えると、繊維生産性が低下
するので好ましくない。平均長さが２０μｍよりも短い
とかさ比重が小さくなり、製造工程中の取り扱い性や作
業性に問題が生じることがあるので好ましくない。When the average diameter is smaller than 5 μm or when the average length is longer than 800 μm, it becomes difficult to mix the silicone rubber with the silicone rubber at a high concentration. On the other hand, if the average particle size of the graphitized carbon exceeds 20 μm, the fiber productivity is undesirably reduced. If the average length is shorter than 20 μm, the bulk specific gravity becomes small, which may cause problems in handling and workability during the manufacturing process, which is not preferable.
【００１４】本発明の黒鉛化炭素繊維表面は、あらかじ
め電解酸化などによる公知の酸化処理を施しておいても
良い。また、黒鉛化炭素繊維表面に金属やセラミックス
などを無電解メッキ法、電解メッキ法、真空蒸着やスパ
ッタリングなどによる物理的蒸着法、化学的蒸着法、塗
装、浸漬、微細粒子を機械的に固着させるメカニケミカ
ル法などの方法によって被覆することもできる。The surface of the graphitized carbon fiber of the present invention may be previously subjected to a known oxidation treatment such as electrolytic oxidation. In addition, electroless plating, electrolytic plating, physical vapor deposition by vacuum vapor deposition, sputtering, etc., chemical vapor deposition, painting, dipping, and mechanically fixing fine particles on the surface of graphitized carbon fiber The coating may be performed by a method such as a mechanical chemical method.
【００１５】本発明の電気絶縁性熱伝導充填剤として
は、熱伝導率が大きい酸化アルミニウム、窒化ホウ素、
窒化アルミニウム、酸化亜鉛、炭化ケイ素、石英、水酸
化アルミニウムなどの金属酸化物、金属窒化物、金属炭
化物、金属水酸化物で、球状、紛状、繊維状、針状、鱗
片状、ウィスカー状などが挙げられ、充填率向上、粘
度、硬度の調整を目的とし、１種、または２種以上の選
択することができる。As the electrically insulating heat conductive filler of the present invention, aluminum oxide, boron nitride,
Metal oxides such as aluminum nitride, zinc oxide, silicon carbide, quartz and aluminum hydroxide, metal nitrides, metal carbides, metal hydroxides, spherical, powdery, fibrous, needle-like, scale-like, whisker-like, etc. One or two or more types can be selected for the purpose of improving the filling rate, adjusting the viscosity and the hardness.
【００１６】本発明の熱伝導性シートの黒鉛化炭素繊維
および電気絶縁性熱伝導充填剤を充填するマトリックス
となるシリコーンゴムは、公知のオルガノポリシロキサ
ンを硬化することによって得られる。硬化方法について
は限定するものではなく、ビニル基を含むオルガノポリ
シロキサンとケイ素原子にハイドロジェン基を含むオル
ガノポリシロキサンと白金系触媒からなる付加反応タイ
プ、有機過酸化物によるラジカル反応タイプ、縮合反応
タイプ、紫外線や電子線による硬化タイプなどが挙げら
れる。なかでも、黒鉛化炭素繊維、電気絶縁性熱伝導充
填剤を充填しやすい液状の付加反応タイプのポリオルガ
ノシロキサンを用いることが好ましい。また、公知の補
強用シリカや難燃剤、着色剤、耐熱性向上剤、接着助
剤、粘着剤、オイル、可塑剤などを適宜配合することが
できる。The silicone rubber serving as a matrix for filling the graphitized carbon fibers and the electrically insulating heat conductive filler of the heat conductive sheet of the present invention can be obtained by curing a known organopolysiloxane. There is no limitation on the curing method, and an addition reaction type comprising an organopolysiloxane containing a vinyl group, an organopolysiloxane containing a hydrogen group on a silicon atom and a platinum catalyst, a radical reaction type using an organic peroxide, and a condensation reaction And a curing type using ultraviolet rays or electron beams. Among them, it is preferable to use a graphitized carbon fiber and a liquid addition reaction type polyorganosiloxane that is easy to fill with an electrically insulating heat conductive filler. In addition, known reinforcing silica, a flame retardant, a colorant, a heat resistance improver, an adhesion aid, a pressure-sensitive adhesive, an oil, a plasticizer, and the like can be appropriately compounded.
【００１７】さらに、黒鉛化炭素繊維および電気絶縁性
熱伝導充填剤の表面処理を目的として、公知のカップリ
ング剤やサイジング剤で処理することによってマトリク
スのシリコーンゴムとの濡れ性や充填性を向上させたり
シリコーンゴムとの剥離強度を改善することが可能であ
る。また、組成物の粘度を低下させるためには、揮発し
やすい有機溶剤や反応性可塑剤を添加すると効果的であ
る。Further, for the purpose of surface treatment of the graphitized carbon fiber and the electrically insulating heat conductive filler, the matrix is treated with a known coupling agent or sizing agent to improve the wettability of the matrix with the silicone rubber and the filling property. It is possible to improve the peel strength with silicone rubber. Further, in order to lower the viscosity of the composition, it is effective to add an organic solvent or a reactive plasticizer which is easily volatilized.
【００１８】硬化させた熱伝導性シートの硬度について
は、使用する用途に応じて決定されるが、使用時の応力
緩和性と追従性に関しては低硬度ほど有利である。具体
的な硬度としては、タイプＡ硬度で９０以下、好ましく
は６０以下の低硬度品が好適である。さらに図１のよう
に凹凸のある複数の半導体パッケージ５などの発熱する
電子部品と筐体６間に介在させて使用する際には、アス
カーＣ硬度が５０以下のゲル状低硬度品が応力緩和性お
よび追従性の点から望ましい。本発明の熱伝導性シート
は、未硬化のシリコーンゴム中に黒鉛化炭素繊維および
電気絶縁性熱伝導充填剤を混入させ、その後シート状に
硬化させることにより得られる。The hardness of the cured thermally conductive sheet is determined according to the intended use, but the lower the hardness, the better the stress relaxation and follow-up properties during use. As a specific hardness, a low hardness product having a type A hardness of 90 or less, preferably 60 or less is suitable. Further, as shown in FIG. 1, when used while being interposed between a housing 6 and a heat-generating electronic component such as a plurality of uneven semiconductor packages 5, a gel-like low-hardness product having an Asker C hardness of 50 or less reduces stress. It is desirable from the viewpoints of responsiveness and followability. The heat conductive sheet of the present invention is obtained by mixing graphitized carbon fibers and an electrically insulating heat conductive filler into uncured silicone rubber, and thereafter curing the sheet into a sheet.
【００１９】以下、実施例を挙げて説明する。なお本発
明において、体積抵抗率はＪＩＳ−Ｋ６９１１に準拠し
て測定し、アスカーＣ硬度はＳＲＩＳ０１０１（日本ゴ
ム規格協会）に準拠してアスカーＣ硬度計にて測定し、
またタイプＡ硬度はＪＩＳ−Ｋ６２５３に準拠してタイ
プＡデュロメータにて測定した。熱伝導率はレーザーフ
ラッシュ法によって測定した。Hereinafter, the present invention will be described with reference to examples. In the present invention, the volume resistivity is measured according to JIS-K6911, and the Asker C hardness is measured with an Asker C hardness meter according to SRIS0101 (Japan Rubber Standards Association).
The type A hardness was measured with a type A durometer according to JIS-K6253. Thermal conductivity was measured by the laser flash method.
【００２０】[0020]
【実施例１】平均直径８μｍ、平均長さが８０μｍ、繊
維方向の熱伝導率が１０００Ｗ／ｍ・Ｋの黒鉛化炭素繊
維５体積％、電気絶縁性熱伝導充填剤としてシランカッ
プリング剤で処理したアルミナ（昭和電工株式会社製）
を５０体積％、および、付加型の液状シリコーンゴム
（東レ・ダウコーニングシリコーン株式会社製）４５体
積％からなる組成物を混合分散し真空脱泡した組成物を
加熱プレス成形して厚み１ｍｍの熱伝導性シートを作製
した。Example 1 5% by volume of graphitized carbon fiber having an average diameter of 8 μm, an average length of 80 μm and a thermal conductivity in the fiber direction of 1000 W / m · K, treated with a silane coupling agent as an electrically insulating heat conductive filler Alumina (Showa Denko KK)
Of 50% by volume and 45% by volume of an additional type liquid silicone rubber (manufactured by Dow Corning Toray Silicone Co., Ltd.). A conductive sheet was produced.
【００２１】[0021]
【実施例２】実施例１同様の黒鉛化炭素繊維を４０体積
％、実施例１同様の電気絶縁性熱伝導充填剤を３０体積
％、および、実施例１同様の液状シリコーンゴム３０％
からなる組成物を混合分散し、実施例１同様に厚み１ｍ
ｍの熱伝導性シートを作製した。Example 2 40% by volume of the same graphitized carbon fiber as in Example 1, 30% by volume of the same electrically insulating heat conductive filler as in Example 1, and 30% of liquid silicone rubber as in Example 1
Was mixed and dispersed, and the thickness was 1 m as in Example 1.
m of a thermally conductive sheet was prepared.
【００２２】[0022]
【実施例３】平均直径１４μｍ、平均長さが４５０μ
ｍ、繊維方向熱伝導率が１４００Ｗ／ｍ・Ｋの黒鉛化炭
素繊維５体積％、実施例１同様の電気絶縁性熱伝導充填
剤を５０体積％、および、実施例１同様の液状シリコー
ンゴム４５体積％からなる組成物を混合分散し、実施例
１同様に厚み１ｍｍの熱伝導性シートを作製した。Example 3 Average diameter 14 μm, average length 450 μm
m, 5% by volume of graphitized carbon fiber having a fiber direction thermal conductivity of 1400 W / m · K, 50% by volume of the electrically insulating heat conductive filler as in Example 1, and liquid silicone rubber 45 as in Example 1. A 1% thick thermally conductive sheet was produced in the same manner as in Example 1 by mixing and dispersing the composition consisting of volume%.
【００２３】[0023]
【実施例４】実施例３同様の黒鉛化炭素繊維を３０体積
％、実施例１同様の電気絶縁性熱伝導充填剤を３０体積
％、実施例１同様の液状シリコーンゴム３０体積％から
なる組成物を混合分散し、実施例１同様に厚み１ｍｍの
熱伝導性シートを作製した。EXAMPLE 4 A composition comprising 30% by volume of the same graphitized carbon fiber as in Example 3, 30% by volume of the electrically insulating heat conductive filler as in Example 1, and 30% by volume of liquid silicone rubber as in Example 1. The materials were mixed and dispersed to produce a heat conductive sheet having a thickness of 1 mm in the same manner as in Example 1.
【００２４】[0024]
【実施例５】実施例３同様の黒鉛化炭素繊維を４０体積
％、実施例１同様の電気絶縁性熱伝導充填剤を３０体積
％、実施例１同様の液状シリコーンゴム３０体積％から
なる組成物を混合分散し、実施例１同様に厚み１ｍｍの
熱伝導性シートを作製した。EXAMPLE 5 A composition comprising 40% by volume of the same graphitized carbon fiber as in Example 3, 30% by volume of the electrically insulating heat conductive filler as in Example 1, and 30% by volume of liquid silicone rubber as in Example 1. The materials were mixed and dispersed to produce a heat conductive sheet having a thickness of 1 mm in the same manner as in Example 1.
【００２５】[0025]
【実施例６】実施例３同様の黒鉛化炭素繊維を１５体積
％、実施例１同様の電気絶縁性熱伝導充填剤を４５体積
％、実施例１同様の液状シリコーンゴム４０体積％から
なる組成物を混合分散し、実施例１同様に厚み１ｍｍの
熱伝導性シートを作製した。Example 6 A composition comprising 15% by volume of the same graphitized carbon fiber as in Example 3, 45% by volume of the electrically insulating heat conductive filler as in Example 1, and 40% by volume of liquid silicone rubber as in Example 1. The materials were mixed and dispersed to produce a heat conductive sheet having a thickness of 1 mm in the same manner as in Example 1.
【００２６】[0026]
【実施例７】平均直径１１μｍ、平均長さが１２０μ
ｍ、繊維方向熱伝導率が４００Ｗ／ｍ・Ｋの黒鉛化炭素
繊維１５体積％、実施例１同様の電気絶縁性熱伝導充填
剤を４５体積％、および実施例１同様の液状シリコーン
ゴム４０体積％からなる組成物を混合分散し、実施例１
同様に厚み１ｍｍの熱伝導性シートを作製した。Embodiment 7 The average diameter is 11 μm and the average length is 120 μm
m, 15% by volume of graphitized carbon fiber having a thermal conductivity in the fiber direction of 400 W / m · K, 45% by volume of the same electrically insulating heat conductive filler as in Example 1, and 40% by volume of liquid silicone rubber as in Example 1. % Was mixed and dispersed in Example 1.
Similarly, a heat conductive sheet having a thickness of 1 mm was produced.
【００２７】[0027]
【実施例８】平均直径１２μｍ、平均長さが２００μ
ｍ、繊維方向熱伝導率が７００Ｗ／ｍ・Ｋの黒鉛化炭素
繊維１５体積％、実施例１同様の電気絶縁性熱伝導充填
剤を４５体積％、および実施例１同様の液状シリコーン
ゴム４０体積％からなる組成物を混合分散し、実施例１
同様に厚み１ｍｍの熱伝導性シートを作製した。Embodiment 8 The average diameter is 12 μm and the average length is 200 μm.
m, 15% by volume of graphitized carbon fiber having a thermal conductivity in the fiber direction of 700 W / m · K, 45% by volume of the electrically insulating heat conductive filler as in Example 1, and 40% by volume of liquid silicone rubber as in Example 1. % Was mixed and dispersed in Example 1.
Similarly, a heat conductive sheet having a thickness of 1 mm was produced.
【００２８】[0028]
【実施例９】平均直径１２μｍ、平均長さが２００μ
ｍ、繊維方向熱伝導率が７００Ｗ／ｍ・Ｋの黒鉛化炭素
繊維１５体積％、電気絶縁性熱伝導充填剤として窒化ホ
ウ素を３０体積％、および実施例１同様の液状シリコー
ンゴム５５体積％からなる組成物を混合分散し、実施例
１同様に厚み１ｍｍの熱伝導性シートを作製した。Embodiment 9 The average diameter is 12 μm and the average length is 200 μm.
m, 15% by volume of graphitized carbon fiber having a thermal conductivity in the fiber direction of 700 W / m · K, 30% by volume of boron nitride as an electrically insulating heat conductive filler, and 55% by volume of liquid silicone rubber as in Example 1. The resulting composition was mixed and dispersed to produce a heat conductive sheet having a thickness of 1 mm in the same manner as in Example 1.
【００２９】[0029]
【実施例１０】平均直径１２μｍ、平均長さが２００μ
ｍ、繊維方向熱伝導率が７００Ｗ／ｍ・Ｋの黒鉛化炭素
繊維１５体積％、電気絶縁性熱伝導充填剤として窒化ア
ルミニウムを３０体積％、および実施例１同様の液状シ
リコーンゴム５５体積％からなる組成物を混合分散し、
実施例１同様に厚み１ｍｍの熱伝導性シートを作製し
た。Embodiment 10 The average diameter is 12 μm and the average length is 200 μm.
m, 15% by volume of graphitized carbon fiber having a thermal conductivity in the fiber direction of 700 W / m · K, 30% by volume of aluminum nitride as an electrically insulating heat conductive filler, and 55% by volume of liquid silicone rubber as in Example 1. Mixing and dispersing the composition
In the same manner as in Example 1, a heat conductive sheet having a thickness of 1 mm was produced.
【００３０】[0030]
【比較例１】平均直径８μｍ、平均長さが８０μｍ、繊
維方向熱伝導率が１０００Ｗ／ｍ・Ｋの黒鉛化炭素繊維
４０体積％、および実施例１同様の液状シリコーンゴム
６０体積％からなる組成物を混合分散し、実施例１同様
に厚み１ｍｍの熱伝導性シートを作製した。Comparative Example 1 A composition comprising 40% by volume of graphitized carbon fiber having an average diameter of 8 μm, an average length of 80 μm, a thermal conductivity in the fiber direction of 1000 W / m · K, and 60% by volume of liquid silicone rubber as in Example 1. The materials were mixed and dispersed to produce a heat conductive sheet having a thickness of 1 mm in the same manner as in Example 1.
【００３１】[0031]
【比較例２】電気絶縁性熱伝導充填剤としてシランカッ
プリング剤で処理したアルミナ（昭和電工株式会社製）
を５０体積％、および、実施例１同様の液状シリコーン
ゴム５０体積％からなる組成物を混合分散し、実施例１
同様に厚み１ｍｍの熱伝導性シートを作製した。Comparative Example 2 Alumina (Showa Denko KK) treated with a silane coupling agent as an electrically insulating heat conductive filler
And a composition comprising 50% by volume of the same liquid silicone rubber as in Example 1 was mixed and dispersed.
Similarly, a heat conductive sheet having a thickness of 1 mm was produced.
【００３２】[0032]
【比較例３】平均直径８μｍ、平均長さが８０μｍ、繊
維方向の熱伝導率が１０００Ｗ／ｍ・Ｋの黒鉛化炭素繊
維２体積％、実施例１同様の電気絶縁性熱伝導充填剤を
５０体積％、および、実施例１同様の液状シリコーンゴ
ム体積４８％からなる組成物を混合分散し、実施例１同
様に厚み１ｍｍの熱伝導性シートを作製した。Comparative Example 3 2% by volume of graphitized carbon fiber having an average diameter of 8 μm, an average length of 80 μm, and a thermal conductivity of 1000 W / m · K in the fiber direction, and 50 electrically insulating heat conductive fillers as in Example 1 were used. A composition consisting of a volume% and a liquid silicone rubber volume of 48% as in Example 1 was mixed and dispersed to produce a heat conductive sheet having a thickness of 1 mm as in Example 1.
【００３３】[0033]
【比較例４】平均直径８μｍ、平均長さが８０μｍ、繊
維方向の熱伝導率が１０００Ｗ／ｍ・Ｋの黒鉛化炭素繊
維４５体積％、実施例１同様の電気絶縁性熱伝導充填剤
を２０体積％、および、実施例１同様の液状シリコーン
ゴム体積３５％からなる組成物を混合分散し、実施例１
同様に厚み１ｍｍの熱伝導性シートを作製した。COMPARATIVE EXAMPLE 4 45 volume% of graphitized carbon fibers having an average diameter of 8 μm, an average length of 80 μm, and a thermal conductivity in the fiber direction of 1000 W / m · K. % Of a composition containing 35% by volume of a liquid silicone rubber similar to that of Example 1.
Similarly, a heat conductive sheet having a thickness of 1 mm was produced.
【００３４】本発明の実施例１から実施例１０および比
較例１から比較例４にて得られた熱伝導性シートの特性
評価結果を表１に表す。Table 1 shows the results of evaluating the properties of the heat conductive sheets obtained in Examples 1 to 10 and Comparative Examples 1 to 4 of the present invention.
【００３５】[0035]
【表１】 [Table 1]
【００３６】実施例１から実施例１０までに関しては、
熱伝導率、硬度、体積抵抗率のいずれも良好となった。
しかしながら、比較例１の様に黒鉛化炭素繊維のみを充
填させた場合においては、電気絶縁性を示す体積抵抗率
が小さくなってしまい、プリント基板等における実装時
には電気導通による誤動作、ショート等の不具合を発生
する可能性がある。比較例２の様に電気絶縁性熱伝導充
填剤のみを充填させた場合においては、十分な熱伝導率
が得られない。実施例３に関しては、黒鉛化炭素繊維を
２体積％充填させているものの、十分な熱伝導率が得ら
れない。また、実施例４では、電気絶縁性熱伝導充填剤
が２０体積％充填されているが、体積抵抗率が小さくな
ってしまう。With respect to the first to tenth embodiments,
All of the thermal conductivity, hardness, and volume resistivity were good.
However, when only the graphitized carbon fiber is filled as in Comparative Example 1, the volume resistivity showing the electrical insulation becomes small, and when mounted on a printed circuit board or the like, malfunctions due to electrical continuity, short-circuits, etc. May occur. When only the electrically insulating heat conductive filler is filled as in Comparative Example 2, a sufficient heat conductivity cannot be obtained. In Example 3, although the graphitized carbon fibers were filled at 2% by volume, sufficient thermal conductivity was not obtained. Further, in Example 4, the electric insulating heat conductive filler is filled at 20% by volume, but the volume resistivity is reduced.
【００３７】特に、実施例１、実施例３、実施例６、実
施例７、実施例８については、硬度がいずれもアスカー
Ｃにて５０以下を示しており、図１に示すようなプリン
ト基板２上に高さの異なる複数の半導体素子を実装した
パッケージ５と伝熱部材となる筐体６に介在させる場合
には、追従性に優れ、良好となる。In particular, in Examples 1, 3, 6, 7, and 8, the hardness of the Asker C is 50 or less, and the printed circuit board as shown in FIG. When interposed between a package 5 on which a plurality of semiconductor elements having different heights are mounted on a housing 2 and a housing 6 serving as a heat transfer member, the followability is excellent and good.
【００３８】さらに、実施例６、実施例７に関しては繊
維長さ方向の熱伝導率が大きい黒鉛化炭素繊維を充填さ
せた方が、熱伝導性シートの熱伝導率が大きく良好であ
る。また、本発明品を使用する際には、図１に示す設置
方法のほかにも図２から図４のように半導体パッケージ
３、放熱器４、プリント基板２等との組み合わせによ
り、様々な設置方法が考えられる。Furthermore, in Examples 6 and 7, the heat conductivity of the heat conductive sheet is larger and better when filled with graphitized carbon fibers having a higher heat conductivity in the fiber length direction. In addition, when using the product of the present invention, in addition to the installation method shown in FIG. 1, various installations may be made by combining the semiconductor package 3, the radiator 4, the printed circuit board 2 and the like as shown in FIGS. A method is conceivable.
【００３９】[0039]
【発明の効果】本発明の実施例１から比較例１０にて得
られたような熱伝導性シートは、熱伝導率が大きく、か
つ電気絶縁性に優れている。したがって、熱伝導率と電
気絶縁性の両方が要求される半導体素子と筐体、ヒート
シンク等の放熱器との隙間、あるいは半導体素子とプリ
ント基板やダイパッドとの隙間に介在させ、電気的な障
害を発生させることなく正常に作動することが可能な半
導体装置を提供することができる。また、本発明の熱伝
導性シートを応用して、射出成形や押し出し成形品、圧
縮成型品などの金属成形加工品にも適用することができ
る。The heat conductive sheets as obtained in Example 1 to Comparative Example 10 of the present invention have high thermal conductivity and excellent electrical insulation. Therefore, intervening in the gap between the semiconductor element that requires both thermal conductivity and electrical insulation and a radiator such as a housing or a heat sink, or the gap between the semiconductor element and a printed circuit board or die pad, an electrical obstacle is prevented. It is possible to provide a semiconductor device that can operate normally without causing any generation. Further, the heat conductive sheet of the present invention can be applied to metal molded products such as injection molded products, extrusion molded products, and compression molded products.
【図１】 本発明品の熱伝導性シートを使用した半導体
装置の例（複数の半導体パッケージ型の半導体パッケー
ジ５と筐体６の隙間に配置）FIG. 1 shows an example of a semiconductor device using the heat conductive sheet of the present invention (disposed in a gap between a plurality of semiconductor package type semiconductor packages 5 and a housing 6).
【図２】 本発明品の熱伝導性シートを使用した半導体
装置の例（ボールグリッドアレイ型の半導体パッケージ
３と放熱器４の隙間に配置）FIG. 2 shows an example of a semiconductor device using the heat conductive sheet of the present invention (disposed in a gap between a ball grid array type semiconductor package 3 and a radiator 4).
【図３】 本発明品の熱伝導性シートを使用した半導体
装置の例（チップサイズ型の半導体パッケージ３とプリ
ント基板２の隙間に配置）FIG. 3 shows an example of a semiconductor device using the heat conductive sheet of the present invention (disposed in a gap between a chip size semiconductor package 3 and a printed board 2).
【図４】 本発明品の熱伝導性シートを使用した半導体
装置の例（ピングリッドアレイ型の半導体パッケージ３
と放熱器４の隙間に配置）FIG. 4 shows an example of a semiconductor device using the thermally conductive sheet of the present invention (pin grid array type semiconductor package 3).
And the radiator 4)
１ 本発明の熱伝導性シート ２ プリント基板 ３ 半導体パッケージ ４ 放熱器 ５ 複数の半導体パッケージ ６ 筐体 DESCRIPTION OF SYMBOLS 1 Thermal conductive sheet of this invention 2 Printed circuit board 3 Semiconductor package 4 Heat sink 5 Plural semiconductor packages 6 Housing
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【手続補正書】[Procedure amendment]
【提出日】平成１２年７月７日（２０００．７．７）[Submission date] July 7, 2000 (200.7.7)
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００８[Correction target item name] 0008
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【０００８】本発明のシリコーンゴムに含有させる電気
絶縁性熱伝導充填剤の濃度は、３０〜５０体積％が好ま
しい。３０体積％よりも少ないと体積抵抗率が小さく、
電気絶縁性の効果が低くなり、５０体積％を越えると、
配合組成物の粘度が増大し、黒鉛化炭素繊維の充填が困
難になり、熱伝導率の低下が起き、放熱特性が劣ってし
まう。[0008] The concentration of the electrically insulating heat conductive filler contained in the silicone rubber of the present invention is preferably 30 to 50% by volume. If less than 30% by volume, the volume resistivity is small,
When the effect of electrical insulation is reduced and exceeds 50% by volume,
The viscosity of the blended composition increases, making it difficult to fill the graphitized carbon fibers, lowering the thermal conductivity, and deteriorating the heat radiation characteristics.
【手続補正２】[Procedure amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３６[Correction target item name] 0036
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００３６】実施例１から実施例１０までに関しては、
熱伝導率、硬度、体積抵抗率のいずれも良好となった。
しかしながら、比較例１の様に黒鉛化炭素繊維のみを充
填させた場合においては、電気絶縁性を示す体積抵抗率
が小さくなってしまい、プリント基板等における実装時
には電気導通による誤動作、ショート等の不具合を発生
する可能性がある。比較例２の様に電気絶縁性熱伝導充
填剤のみを充填させた場合においては、十分な熱伝導率
が得られない。比較例３に関しては、黒鉛化炭素繊維を
２体積％充填させているものの、十分な熱伝導率が得ら
れない。また、比較例４では、電気絶縁性熱伝導充填剤
が２０体積％充填されているが、体積抵抗率が小さくな
ってしまう。With respect to the first to tenth embodiments,
All of the thermal conductivity, hardness, and volume resistivity were good.
However, when only the graphitized carbon fiber is filled as in Comparative Example 1, the volume resistivity showing the electrical insulation becomes small, and when mounted on a printed circuit board or the like, malfunctions due to electrical continuity, short-circuits, etc. May occur. When only the electrically insulating heat conductive filler is filled as in Comparative Example 2, a sufficient heat conductivity cannot be obtained. In Comparative Example 3, although the graphitized carbon fibers were filled at 2% by volume, sufficient thermal conductivity was not obtained. In Comparative Example 4, the electric insulating heat conductive filler was filled at 20% by volume, but the volume resistivity was small.
【手続補正３】[Procedure amendment 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００３９[Correction target item name] 0039
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【００３９】[0039]
【発明の効果】本発明の実施例１から実施例１０にて得
られたような熱伝導性シートは、熱伝導率が大きく、か
つ電気絶縁性に優れている。したがって、熱伝導率と電
気絶縁性の両方が要求される半導体素子と筐体、ヒート
シンク等の放熱器との隙間、あるいは半導体素子とプリ
ント基板やダイパッドとの隙間に介在させ、電気的な障
害を発生させることなく正常に作動することが可能な半
導体装置を提供することができる。また、本発明の熱伝
導性シートを応用して、射出成形や押し出し成形品、圧
縮成型品などの金属成形加工品にも適用することができ
る。The heat conductive sheets obtained in Examples 1 to 10 of the present invention have high thermal conductivity and excellent electrical insulation. Therefore, intervening in the gap between the semiconductor element that requires both thermal conductivity and electrical insulation and a radiator such as a housing or a heat sink, or the gap between the semiconductor element and a printed circuit board or die pad, an electrical obstacle is prevented. It is possible to provide a semiconductor device that can operate normally without causing any generation. Further, the heat conductive sheet of the present invention can be applied to metal molded products such as injection molded products, extrusion molded products, and compression molded products.
フロントページの続き Ｆターム(参考） 4F071 AA67 AB03 AB18 AB26 AB27 AD01 AE22 AF25 AF25Y AF39 AF39Y AF44 AF44Y AH12 BA03 BB03 BC01 BC10 4J002 CP031 DA026 DE107 DE147 DF017 DJ007 DJ017 DK007 FA046 FD016 FD207 GQ00Continued on front page F-term (reference) 4F071 AA67 AB03 AB18 AB26 AB27 AD01 AE22 AF25 AF25Y AF39 AF39Y AF44 AF44Y AH12 BA03 BB03 BC01 BC10 4J002 CP031 DA026 DE107 DE147 DF017 DJ007 DJ017 DK007 FA046 FD016 FD207 GQ00
Claims (3)
化炭素繊維を濃度が５〜４０体積％、電気絶縁性熱伝導
充填剤を濃度が３０〜５０体積％で含有させてなる、体
積抵抗率が１０６Ω・ｃｍ以上の電気絶縁性を有する熱
伝導性シート。1. A volume resistivity comprising a sheet of silicone rubber containing a graphitized carbon fiber at a concentration of 5 to 40% by volume and an electrically insulating heat conductive filler at a concentration of 30 to 50% by volume. Is a heat conductive sheet having an electrical insulating property of 10 6 Ω · cm or more.
さ２０〜８００μｍ、繊維長さ方向の熱伝導率が２００
Ｗ／ｍ・Ｋ以上であることを特徴とする請求項１に記載
の熱伝導性シート。2. The graphitized carbon fiber has a diameter of 5 to 20 μm, a length of 20 to 800 μm, and a thermal conductivity in the fiber length direction of 200.
The heat conductive sheet according to claim 1, wherein the heat conductive sheet has a W / m · K or more.
ことを特徴とする請求項１あるいは２に記載の熱伝導性
シート。3. The heat conductive sheet according to claim 1, wherein the sheet has an Asker C hardness of 50 or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000186193A JP2002003717A (en) | 2000-06-21 | 2000-06-21 | Heat conductive sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000186193A JP2002003717A (en) | 2000-06-21 | 2000-06-21 | Heat conductive sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002003717A true JP2002003717A (en) | 2002-01-09 |
Family
ID=18686396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000186193A Pending JP2002003717A (en) | 2000-06-21 | 2000-06-21 | Heat conductive sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2002003717A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006335957A (en) * | 2005-06-03 | 2006-12-14 | Polymatech Co Ltd | Method of manufacturing thermally conductive molded article and thermally conductive molded article |
| JP2008169513A (en) * | 2007-01-12 | 2008-07-24 | Teijin Ltd | Light-reflecting heat-conductive filler, light-reflecting heat-conductive resin composition, light-reflecting heat-conductive layer, light-reflecting film, electronic mounting substrate, and light-reflecting heat-conductive coverlay film |
| US7625638B2 (en) | 2002-07-08 | 2009-12-01 | Dynic Corporation | Hygroscopic molding |
| WO2013035652A1 (en) * | 2011-09-06 | 2013-03-14 | 日東電工株式会社 | Electrical insulation sheet |
| KR20180050392A (en) | 2016-01-26 | 2018-05-14 | 데쿠세리아루즈 가부시키가이샤 | HEAT CONDUCTIVE SHEET, METHOD FOR PRODUCING THERMAL CONDUCTIVE SHEET |
| CN109627783A (en) * | 2019-01-04 | 2019-04-16 | 东莞市汉华热能科技有限公司 | A kind of heat conductive silica gel of Specific gravity and preparation method thereof |
| CN110105638A (en) * | 2019-05-05 | 2019-08-09 | 华南协同创新研究院 | A kind of low-density high thermal conductivity non-silicon material and its preparation method and application |
| JPWO2019244881A1 (en) * | 2018-06-20 | 2021-03-18 | 信越ポリマー株式会社 | Heat dissipation structure, manufacturing method of heat dissipation structure and battery |
-
2000
- 2000-06-21 JP JP2000186193A patent/JP2002003717A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7625638B2 (en) | 2002-07-08 | 2009-12-01 | Dynic Corporation | Hygroscopic molding |
| JP2006335957A (en) * | 2005-06-03 | 2006-12-14 | Polymatech Co Ltd | Method of manufacturing thermally conductive molded article and thermally conductive molded article |
| JP4657816B2 (en) * | 2005-06-03 | 2011-03-23 | ポリマテック株式会社 | Method for producing thermally conductive molded body and thermally conductive molded body |
| JP2008169513A (en) * | 2007-01-12 | 2008-07-24 | Teijin Ltd | Light-reflecting heat-conductive filler, light-reflecting heat-conductive resin composition, light-reflecting heat-conductive layer, light-reflecting film, electronic mounting substrate, and light-reflecting heat-conductive coverlay film |
| WO2013035652A1 (en) * | 2011-09-06 | 2013-03-14 | 日東電工株式会社 | Electrical insulation sheet |
| KR20180050392A (en) | 2016-01-26 | 2018-05-14 | 데쿠세리아루즈 가부시키가이샤 | HEAT CONDUCTIVE SHEET, METHOD FOR PRODUCING THERMAL CONDUCTIVE SHEET |
| KR20190120421A (en) | 2016-01-26 | 2019-10-23 | 데쿠세리아루즈 가부시키가이샤 | Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor device |
| US10526519B2 (en) | 2016-01-26 | 2020-01-07 | Dexerials Corporation | Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor device |
| KR20200070435A (en) | 2016-01-26 | 2020-06-17 | 데쿠세리아루즈 가부시키가이샤 | Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor device |
| JPWO2019244881A1 (en) * | 2018-06-20 | 2021-03-18 | 信越ポリマー株式会社 | Heat dissipation structure, manufacturing method of heat dissipation structure and battery |
| CN109627783A (en) * | 2019-01-04 | 2019-04-16 | 东莞市汉华热能科技有限公司 | A kind of heat conductive silica gel of Specific gravity and preparation method thereof |
| CN110105638A (en) * | 2019-05-05 | 2019-08-09 | 华南协同创新研究院 | A kind of low-density high thermal conductivity non-silicon material and its preparation method and application |
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