CN112457706A - Heat dissipation ink, preparation method and preparation method of heat dissipation shielding case - Google Patents
Heat dissipation ink, preparation method and preparation method of heat dissipation shielding case Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/108—Hydrocarbon resins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
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- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
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- Life Sciences & Earth Sciences (AREA)
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- Polymers & Plastics (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The application relates to the field of printing ink, and particularly discloses heat dissipation printing ink, a preparation method and a preparation method of a heat dissipation shielding case. The heat dissipation ink comprises a component A and a component B, wherein the component A comprises: epoxy resin, polyphenyl ether, polystyrene, pigment, a leveling agent, an anti-settling agent, a solvent and infrared heat dissipation filler; the component B comprises: a curing agent and a coupling agent; the preparation method comprises the following steps: uniformly mixing the raw materials of the component A to prepare a component A; then uniformly mixing the raw materials of the component B to prepare the component B; mixing the two solutions before use. The preparation method of the heat dissipation shielding case comprises the following steps: and adding heat dissipation ink onto the screen printing plate to print the metal material belt conveyed to the printing position, conveying the printed metal material belt to curing equipment to be cured, conveying the cured metal material belt into stamping equipment, and performing stamping forming to obtain the heat dissipation shielding cover. The heat dissipation ink can be used for improving the heat conductivity coefficient, so that the heat dissipation performance of the heat dissipation shielding cover is improved.
Description
Technical Field
The application relates to the field of printing ink, in particular to heat dissipation printing ink, a preparation method and a preparation method of a heat dissipation shielding case.
Background
The shielding cover is a tool for shielding the influence of external electromagnetic waves on an internal circuit and the outward radiation of the electromagnetic waves generated inside, and is mainly applied to the fields of mobile phones, GPS and the like. Meanwhile, electronic product components can generate heat when working, when the heat inside the electronic product cannot be diffused to the outside of the electronic product in time through the shielding case, the heat inside the electronic product can be concentrated, and the temperature of the electronic components is increased to cause the problem of dead halt or component burnout. Therefore, the heat dissipation performance and the insulation performance of the shielding case are critical to the service life of the electronic product.
The invention with the authorization notice number of CN109266094A discloses a preparation method of heat dissipation ink and a heat dissipation shielding case, wherein the heat dissipation ink comprises the following raw materials in parts by weight: 60-80 parts of polyimide modified epoxy resin, 30-45 parts of polyvinyl chloride resin, 50-65 parts of infrared heat dissipation filler, 25-40 parts of radiation heat dissipation filler, 10-15 parts of coupling agent, 10-15 parts of anti-settling agent, 8-12 parts of flatting agent, 15-26 parts of pigment filler, 50-60 parts of solvent and 35-46 parts of curing agent. The heat dissipation shielding case prepared by adopting the raw materials has excellent heat dissipation performance and good mechanical performance, and the heat conductivity coefficient is between 112W/(m.k) -115W/(m.k).
In view of the above-mentioned related technologies, the inventor considers that the heat conductivity coefficient of the heat dissipation shield is not high enough, and the heat inside the electronic product cannot be diffused to the outside of the electronic product in time through the heat dissipation shield, which may cause the heat inside the electronic product to be concentrated, so that the temperature of the electronic components is raised to cause the electronic components to be halted or the components to be burned, thereby reducing the service life of the electronic components.
Disclosure of Invention
In order to improve the heat dissipation performance of the heat dissipation shielding case, the application provides heat dissipation ink, a preparation method and a preparation method of the heat dissipation shielding case.
In a first aspect, the present application provides a heat dissipation ink, which adopts the following technical scheme:
the heat dissipation ink comprises a component A and a component B, wherein the weight ratio of the component A to the component B is 3-4: 1;
the component A comprises the following raw materials in parts by weight: 40-60 parts of epoxy resin, 30-40 parts of polyphenyl ether, 20-30 parts of polystyrene, 5-7 parts of pigment, 8-12 parts of flatting agent, 6-10 parts of anti-settling agent, 15-20 parts of solvent and 10-15 parts of infrared heat dissipation filler; the component B comprises the following raw materials in parts by weight: 30-40 parts of curing agent and 15-20 parts of coupling agent.
By adopting the technical scheme, the component A and the component B are compounded, so that the prepared heat-dissipation ink has good heat dissipation performance and insulating performance, the adhesion performance of a cured paint film is good, the adhesion reaches one level, the curing time of the paint film is short, the curing temperature is low, and the paint film can be cured at room temperature.
The epoxy resin is modified by the curing agent, and the modified epoxy resin system not only can reduce the internal stress of the epoxy resin, improve the toughness, heat resistance and cold resistance of the epoxy resin system, improve the water resistance, solvent resistance and the like, but also has the high adhesion performance and insulating performance of the epoxy resin.
By adding the curing agent and the coupling agent in parts by weight for compounding, the cured paint film has excellent insulating property, good glossiness, no whitening phenomenon, high toughness and good adhesion property, and can be cured in a normal-temperature environment at low curing temperature.
By adding the infrared heat dissipation filler, the prepared heat dissipation ink has excellent heat conduction performance, high infrared emissivity and good insulation performance, can realize compatibility of heat conduction and high radiation, is favorable for improving the heat dissipation performance of the ink, and can show good heat dissipation performance when the ink is used in a small amount.
Preferably, the leveling agent is polydimethylsiloxane.
By adopting the technical scheme, the polydimethylsiloxane has good suspension stability, good adhesive force, is very easy to disperse and dissolve, has high transparency, does not influence the surface gloss of a paint film, can improve the compatibility of a composite resin system, enables the prepared heat-dissipating ink to have uniform and stable properties, is not easy to generate the layering phenomenon, can reduce the surface tension of the composite resin system, controls the surface flowing capability of the heat-dissipating ink, enables the prepared heat-dissipating ink to have good shrinkage cavity resistance and adhesion resistance, and improves the interlayer adhesive force of the heat-dissipating ink.
Preferably, the solvent is one or a mixture of two of acetone and butanol.
By adopting the technical scheme, the acetone and the butanol are good solvents, the heat-dissipating ink with proper viscosity can be prepared, the construction performance of the heat-dissipating ink is improved, and the phenomenon of paint piling in the coating process of the heat-dissipating ink is reduced. Meanwhile, the prepared heat-dissipating ink has excellent film-forming property, the raw material components can be uniformly and stably distributed, the stability, the weather resistance and the mechanical property of the heat-dissipating ink are improved, and the heat-dissipating ink with excellent insulating property, high heat conductivity coefficient and high adhesive force and stable property is more favorable for storage.
Preferably, the curing agent is one or a mixture of two of phthalic anhydride and laurylamine.
By adopting the technical scheme, phthalic anhydride and laurylamine are both common curing agents. The phthalic anhydride and the laurylamine are compounded to form the composite curing agent for use, so that a molecular chain with toughness of the anhydride molecular chain can be introduced, the crosslinking density of the epoxy resin is increased, the heat dissipation performance of the heat dissipation ink is improved, the insulating performance of the heat dissipation ink can be improved, the curing time of the heat dissipation ink is effectively reduced, and the toughness and the glossiness of a cured paint film are improved.
Tests show that when the content of the curing agent is too high, the heat-dissipating ink can be dried too fast, so that the storage period of the heat-dissipating ink is greatly shortened, and the use process is influenced. When the content of the curing agent is too low, the heat dissipation ink has poor leveling property, long curing time, high curing temperature and reduced heat dissipation performance.
Preferably, the coupling agent is at least one of vinyltriethoxysilane, gamma-methacryloxypropyltrimethoxysilane, and methyltriethoxysilane.
By adopting the technical scheme, the coupling agent can be matched with raw materials such as the infrared heat dissipation filler and the like to generate a synergistic effect, so that the tight combination among the raw materials can be effectively improved, and meanwhile, the dispersion performance, viscosity, compatibility and processability among the raw materials are improved, and the prepared heat dissipation ink has good heat dissipation performance.
The adopted vinyl triethoxysilane can effectively improve the bonding strength among the raw materials and enhance the strength of the heat-dissipating ink. The adopted gamma-methacryloxypropyltrimethoxysilane improves the mechanical property, the electrical property and the weather resistance of the composition, and has good adhesive force and strong durability. The adopted methyl triethoxysilane can effectively improve the performances of the composition such as impact resistance, rheological property, processability, stability and the like.
Preferably, the infrared heat dissipation filler is aluminum oxide.
By adopting the technical scheme, the aluminum oxide has excellent heat-conducting property, high infrared emissivity and good insulating property, can realize heat conduction and high radiation compatibility, is more favorable for improving the heat-radiating property of the heat-radiating ink, and ensures that the heat-radiating ink can show good heat-radiating property when in smaller use amount.
The alumina also has outstanding high-temperature resistance, and the alumina is added into the epoxy resin to prepare a high-performance composite material. In addition, alumina is an agent that promotes the ring-opening of epoxides and increases the curing speed of epoxy resins, thereby reducing the curing time of epoxy resins.
In a second aspect, the present application provides a method for preparing a heat-dissipating ink, which adopts the following technical scheme:
a preparation method of heat dissipation ink comprises the following preparation steps: uniformly mixing epoxy resin, polyphenyl ether, polystyrene, pigment, a flatting agent, an anti-settling agent, a solvent and an infrared heat dissipation filler to obtain a component A; then evenly mixing the curing agent and the coupling agent to prepare a component B; and finally, adding the component B into the component A and uniformly mixing.
Preferably, the weight ratio of the polyphenylene ether to the polystyrene is 1: 1.4.
By adopting the technical scheme, the polyphenyl ether is high-temperature-resistant plastic, and in order to reduce the cost and improve the processing performance, the polyphenyl ether and the polystyrene are often blended for use. The polyphenyl ether and the polystyrene are a pair of polymers with good compatibility, and the polyphenyl ether and the polystyrene form a blending system, so that the curing reaction of the epoxy resin can be promoted, the curing speed of the epoxy resin is improved, and the curing time is shortened.
Preferably, the average particle size of the infrared heat dissipation filler is 6-8 μm.
By adopting the technical scheme, the infrared heat dissipation filler is added, so that the infrared heat dissipation filler can form an effective heat conduction network chain in the epoxy resin, the heat conduction performance of the heat dissipation ink is improved, the infrared heat dissipation filler with the particle size and the epoxy resin have excellent mechanical synergistic effect, and the impact strength and the bending strength of the ink layer after the heat dissipation ink is cured can be improved. When the particle size of the infrared heat dissipation filler is smaller than 6 microns, the mechanical property of the cured ink layer is poor, the impact strength and the bending strength are obviously reduced, and when the particle size of the infrared heat dissipation filler is larger than 8 microns, the probability that the infrared heat dissipation filler forms a heat conduction network chain in epoxy resin is low, so that the heat conduction performance of the prepared heat dissipation ink is reduced.
In a third aspect, the present application provides a method for manufacturing a heat dissipation shield, which adopts the following technical scheme:
a preparation method of a heat dissipation shielding case comprises the following preparation steps:
s1, punching the metal material belt to be processed to form a positioning hole;
s2, manufacturing a silk screen printing plate matched with the positioning holes according to the unfolding shape of the heat dissipation layer on the heat dissipation shielding cover, and placing the silk screen printing plate into rotary silk screen printing equipment;
s3, positioning the punched metal material belt to a printing position of a rotary screen printing device through a positioning hole;
s4, adding heat dissipation ink onto the silk screen printing plate to print the metal material belt conveyed to a printing position;
s5, conveying the printed metal material belt to curing equipment for curing;
and S6, feeding the metal material band solidified in the S5 into a stamping device, and performing stamping forming to obtain the heat dissipation shielding cover.
In summary, the present application has the following beneficial effects:
1. because the component A and the component B are compounded, the curing agent modifies the epoxy resin and the curing agent and the coupling agent are compounded, the heat-dissipating ink has good heat-dissipating and insulating effects, and the adhesion performance of a cured paint film is good;
2. in the application, a mixture of phthalic anhydride and laurylamine is preferably used as a curing agent, and due to the toughness of an anhydride molecular chain and the low curing temperature of phthalic anhydride, the effects of increasing the crosslinking density of the epoxy resin, improving the heat dissipation performance of the heat dissipation ink and improving the insulating performance are achieved;
3. the aluminum oxide is preferably adopted as the infrared heat dissipation filler in the application, and the aluminum oxide has excellent heat conduction performance, higher infrared emissivity and good insulating performance, so that the prepared heat dissipation ink can realize heat conduction and high radiation compatibility, the heat dissipation performance of the heat dissipation ink is favorably improved, and the heat dissipation ink can show good heat dissipation performance when in smaller use amount.
Drawings
Fig. 1 is a schematic view of a metal strip for printing heat dissipation ink to manufacture a heat dissipation shield according to the present application.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples.
The vinyltriethoxysilane, gamma-methacryloxypropyltrimethoxysilane, phthalic anhydride, solvent Red 24 and methyltriethoxysilane in this application are all selected from Shanghai Michelin Biotech, Inc.; byk333 is selected from Pickering chemical Germany.
Example 1
The heat dissipation ink comprises a component A and a component B, wherein the weight ratio of the component A to the component B is 3.5: 1. The component A consists of the following raw materials in parts by weight: 58 parts of epoxy resin, 37 parts of polyphenyl ether, 25 parts of polystyrene, 5 parts of solvent red, 10 parts of polydimethylsiloxane, 10 parts of organic bentonite, 18 parts of solvent and 12 parts of alumina, wherein the solvent is 9 parts of acetone and butanol respectively.
The component B comprises the following raw materials in parts by weight: 20 parts of laurylamine, 15 parts of phthalic acid, 5 parts of vinyltriethoxysilane, 5 parts of gamma-methacryloxypropyltrimethoxysilane and 5 parts of methyltriethoxysilane.
The preparation method of the heat dissipation ink comprises the following preparation steps:
s1, uniformly mixing the raw materials in the component A for later use;
s2, uniformly mixing the raw materials in the component B for later use.
A method for preparing a heat dissipation shielding cover is characterized in that a metal material belt for manufacturing the heat dissipation shielding cover is printed with a heat dissipation ink pattern according to design requirements by a screen printing method to form a heat dissipation layer, and comprises the following preparation steps:
a1, punching the metal material belt to be processed to form a positioning hole;
a2, manufacturing a silk screen printing plate matched with the positioning hole according to the unfolding shape of the heat dissipation layer on the heat dissipation shielding cover, and placing the silk screen printing plate into rotary silk screen printing equipment;
a3, positioning the punched metal material belt to a printing position of a rotary screen printing device through a positioning hole;
a4, adding the heat dissipation ink onto the silk screen printing plate to print the metal material belt conveyed to a printing position;
a5, conveying the printed metal material belt to curing equipment for curing;
and A6, feeding the metal material belt solidified by the A5 into a stamping device, and performing stamping forming to obtain the heat dissipation shielding cover.
Examples 2 to 5
The amounts of the raw materials of the heat-dissipating inks of examples 2 to 5 were different from those of the heat-dissipating ink of example 1, and the rest were the same as those of example 1, as shown in table 1:
TABLE 1 raw material compositions and amounts of heat-dissipating inks of examples 1-5
Example 6
The heat-dissipating ink of example 6 was prepared in the same manner as the heat-dissipating ink of example 1 except that the polydimethylsiloxane was replaced with byk333 in the same manner as in example 1.
Example 7
The heat-dissipating ink of example 7 was prepared in the same manner as the heat-dissipating ink of example 1 except that aluminum oxide was replaced with zinc oxide, as in example 1.
Performance test
Electrical strength: testing according to testing method of breakdown strength of paint film of insulating paint of HG/T3330 and 2012;
volume resistivity and surface resistivity: testing according to GB/T1410-2006 solid insulating material volume resistivity and surface resistivity test method;
adhesion force: testing according to the national standard GB 9286-1998 paint and varnish paint film marking test;
hardness: testing according to the national standard GB6739-2006 Pencil determination method for film hardness;
coefficient of thermal conductivity: testing according to the national standard GB/T5598-2015 beryllium oxide ceramic thermal conductivity coefficient determination method;
temperature resistance: placing the heat dissipation shielding case coated with the heat dissipation ink in a high-temperature environment of 250 ℃ for 200h, and observing whether paint is removed after cooling;
curing time: the prepared heat dissipation ink is coated on a heat dissipation shielding case, the coating thickness is 1mm, and the time required for testing the hardness of the heat dissipation ink to reach 2H is tested.
Table 2 heat dissipation performance test results for examples 1-7
Table 3 insulation performance test results for examples 1-7
It can be seen from the combination of examples 1-7 and tables 1-3 that the heat-dissipating ink prepared by compounding the component A and the component B has good heat-dissipating performance and insulating performance, and the cured paint film has good adhesion performance, first-order adhesion, short curing time, capability of being cured at room temperature, and low curing temperature.
As can be seen by combining examples 1 and 7 and tables 2 and 3, the thermal conductivity of alumina is superior to that of zinc oxide, indicating that alumina has excellent thermal conductivity. In addition, the aluminum oxide has good insulating property, so that the aluminum oxide can realize heat conduction and high radiation compatibility, and is more favorable for improving the heat dissipation performance of the heat dissipation ink, so that the heat dissipation ink can show good heat dissipation performance when the usage amount of the heat dissipation ink is smaller.
Comparative example 1
The heat-dissipating ink of comparative example 1 was prepared in the same manner as the heat-dissipating ink of example 1 except that the weight ratio of the a component to the B component in the heat-dissipating ink was 2: 1.
Comparative example 2
The heat-dissipating ink of comparative example 2 was prepared in the same manner as the heat-dissipating ink of example 1 except that the weight ratio of the a component to the B component in the heat-dissipating ink was 5:1, as in example 1.
Comparative example 3
The heat-dissipating ink of comparative example 3 was prepared in the same manner as the heat-dissipating ink of example 1 except that the weight ratio of the a component to the B component in the heat-dissipating ink was 1:3, as in example 1.
Comparative example 4
The heat-dissipating ink of comparative example 4 was prepared in the same manner as the heat-dissipating ink of example 1 except that the weight ratio of polyphenylene ether to polystyrene in the heat-dissipating ink was 1:2, as in example 1.
Comparative example 5
The heat-dissipating ink of comparative example 5 was prepared in the same manner as the heat-dissipating ink of example 1 except that the weight ratio of polyphenylene ether to polystyrene in the heat-dissipating ink was 1:1, as in example 1.
Comparative example 6
The heat-dissipating ink of comparative example 6 was prepared in the same manner as the heat-dissipating ink of example 1 except that the weight ratio of polyphenylene ether to polystyrene in the heat-dissipating ink was 1.4:1, as in example 1.
Performance test
The performance test of comparative examples 1 to 6 employed the same test method as that of examples 1 to 7.
TABLE 4 Heat dissipation Property test results for comparative examples 1-6
As can be seen by combining examples 1-7 and comparative examples 1-6 with tables 2 and 4, the heat-dissipating inks prepared in comparative examples 1-6 have low thermal conductivity, two-level and three-level paint adhesion, poor temperature resistance, and easy paint removal.
As can be seen by combining example 1 and comparative examples 1 to 3 with tables 2 and 4, the heat dissipating ink obtained had the best thermal conductivity when the weight ratio of the A component to the B component was 3.5: 1. Too high or too low a weight ratio affects the heat-conducting property.
As can be seen by combining example 1 and comparative examples 4 to 6 with tables 2 and 4, the weight ratio of polyphenylene ether to polystyrene was 1:1.4, the prepared heat-dissipating ink has the best heat-conducting property. Too high or too low a weight ratio affects the heat-conducting property.
TABLE 5 insulating Property test results for comparative examples 1-6
As can be seen by combining example 1 and comparative examples 1 to 3 with tables 3 and 5, the insulation properties of the resulting heat dissipating ink were the best when the weight ratio of the A component to the B component was 3.5: 1. Too high or too low a weight ratio affects the insulation properties.
As can be seen by combining example 1 and comparative examples 4 to 6 with tables 3 and 5, the weight ratio of polyphenylene ether to polystyrene was 1:1.4, the prepared heat-dissipating ink has the best insulating property. Too high or too low a weight ratio affects the insulation properties.
The present embodiment is only for explaining the present application, and it is not limited to the present application, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present application.
Claims (10)
1. The heat dissipation ink is characterized by comprising a component A and a component B, wherein the weight ratio of the component A to the component B is 3-4: 1;
the component A comprises the following raw materials in parts by weight: 40-60 parts of epoxy resin, 30-40 parts of polyphenyl ether, 20-30 parts of polystyrene, 8-12 parts of a flatting agent, 5-7 parts of pigment, 6-10 parts of an anti-settling agent, 15-20 parts of a solvent and 10-15 parts of infrared heat dissipation filler;
the component B comprises the following raw materials in parts by weight: 30-40 parts of curing agent and 15-20 parts of coupling agent.
2. The heat dissipating ink of claim 1, wherein: the leveling agent is polydimethylsiloxane.
3. The heat dissipating ink of claim 1, wherein: the solvent is one or a mixture of two of acetone and butanol.
4. The heat dissipating ink of claim 1, wherein: the curing agent is one or a mixture of two of phthalic anhydride and laurylamine.
5. The heat dissipating ink of claim 1, wherein: the coupling agent is at least one of vinyl triethoxysilane, gamma-methacryloxypropyl trimethoxysilane and methyl triethoxysilane.
6. The heat dissipating ink of claim 1, wherein: the infrared heat dissipation filler is aluminum oxide.
7. The method for preparing a heat-dissipating ink as claimed in any one of claims 1 to 6, comprising the steps of: uniformly mixing epoxy resin, polyphenyl ether, polystyrene, pigment, a leveling agent, an anti-settling agent, a solvent and an infrared heat dissipation filler to prepare a component A for later use; and then uniformly mixing the curing agent and the coupling agent to obtain a component B for later use.
8. The method of claim 7, wherein the step of preparing the heat-dissipating ink comprises: the weight ratio of the polyphenylene ether to the polystyrene is 1: 1.4.
9. The method of claim 7, wherein the step of preparing the heat-dissipating ink comprises: the average grain diameter of the infrared heat dissipation filler is 6-8 μm.
10. A preparation method of a heat dissipation shielding case is characterized by comprising the following preparation steps:
s1, punching the metal material belt to be processed to form a positioning hole;
s2, manufacturing a silk screen printing plate matched with the positioning holes according to the unfolding shape of the heat dissipation layer on the heat dissipation shielding cover, and placing the silk screen printing plate into rotary silk screen printing equipment;
s3, positioning the punched metal material belt to a printing position of a rotary screen printing device through a positioning hole;
s4, adding the heat dissipation ink as claimed in any one of claims 1 to 6 to the silk screen printing plate to print the metal strip conveyed to the printing place;
s5, conveying the printed metal material belt to curing equipment for curing;
and S6, feeding the metal material band solidified in the S5 into a stamping device, and performing stamping forming to obtain the heat dissipation shielding cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202011323096.7A CN112457706A (en) | 2020-11-23 | 2020-11-23 | Heat dissipation ink, preparation method and preparation method of heat dissipation shielding case |
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| CN202011323096.7A CN112457706A (en) | 2020-11-23 | 2020-11-23 | Heat dissipation ink, preparation method and preparation method of heat dissipation shielding case |
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| CN112457706A true CN112457706A (en) | 2021-03-09 |
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| CN (1) | CN112457706A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115139675A (en) * | 2022-05-31 | 2022-10-04 | 浙江恒成硬质合金有限公司 | Hard alloy workpiece surface printing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108997831A (en) * | 2018-08-01 | 2018-12-14 | 广东和润新材料股份有限公司 | The preparation method of dielectric ink, preparation method and an insulating shroud |
| CN109266094A (en) * | 2018-08-01 | 2019-01-25 | 广东和润新材料股份有限公司 | The preparation method of heat dissipation ink and the shielding case that radiates |
-
2020
- 2020-11-23 CN CN202011323096.7A patent/CN112457706A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108997831A (en) * | 2018-08-01 | 2018-12-14 | 广东和润新材料股份有限公司 | The preparation method of dielectric ink, preparation method and an insulating shroud |
| CN109266094A (en) * | 2018-08-01 | 2019-01-25 | 广东和润新材料股份有限公司 | The preparation method of heat dissipation ink and the shielding case that radiates |
Non-Patent Citations (1)
| Title |
|---|
| 小野嘉夫等: "《固体碱催化》", 31 May 2013 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115139675A (en) * | 2022-05-31 | 2022-10-04 | 浙江恒成硬质合金有限公司 | Hard alloy workpiece surface printing method |
| CN115139675B (en) * | 2022-05-31 | 2024-05-28 | 浙江恒成硬质合金有限公司 | Hard alloy workpiece surface printing method |
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