KR910007067A - 다중몰드형 반도체장치 및 그 제조방법 - Google Patents
다중몰드형 반도체장치 및 그 제조방법 Download PDFInfo
- Publication number
- KR910007067A KR910007067A KR1019900014437A KR900014437A KR910007067A KR 910007067 A KR910007067 A KR 910007067A KR 1019900014437 A KR1019900014437 A KR 1019900014437A KR 900014437 A KR900014437 A KR 900014437A KR 910007067 A KR910007067 A KR 910007067A
- Authority
- KR
- South Korea
- Prior art keywords
- internal resin
- resin
- fatty acid
- internal
- semiconductor device
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 239000011347 resin Substances 0.000 claims 12
- 229920005989 resin Polymers 0.000 claims 12
- 235000014113 dietary fatty acids Nutrition 0.000 claims 6
- 229930195729 fatty acid Natural products 0.000 claims 6
- 239000000194 fatty acid Substances 0.000 claims 6
- 150000004665 fatty acids Chemical class 0.000 claims 6
- 150000001875 compounds Chemical class 0.000 claims 2
- 150000002148 esters Chemical class 0.000 claims 2
- 150000002191 fatty alcohols Chemical class 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 150000003839 salts Chemical class 0.000 claims 2
- 150000005846 sugar alcohols Polymers 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 다중몰드형 반도체장치의 제조방법을 나타낸 플로우 챠트.
Claims (2)
- 리드프레임(3)에 마운트되어 와이어 본딩된 반도체칩(4,5)과, 이 반도체칩(4,5)을 밀봉하도록 형성된 내부 수지(1), 이 내부 수지(1)를 에워싸도록 형성된 외부 수지(2)를 구비하여 구성되고, 상기 내부 수지(1)에 첨가된 왁스의 주성분이 에스테르류와 지방산계, 지방산 금속염계, 지방알콜, 다가의 알콜, 및 지방산 아미드로 이루어진 군으로부터 선택된 적어도 한 종류의 화합물인 것을 특징으로 하는 다중 몰드형 반도체 장치.
- 리드프레임(3)상에 마운트되어 와이어 본딩된 반도체칩(4,5)을 내부 수지용 금형의 캐비티에 탑재하는 공정과, 상기 내부 수지용 금형의 내부에 용융된 내부 수지(1)를 주입해서 경화 시킨 후에 꺼내는 공정, 끄집어낸 상기 내부 수지(1)에 밀봉된 상기 반도체칩(4,5)을 외부 수지용 금형의 캐비티에 탑재하는 공정, 상기 외부 수지용 금형의 내부에 용융된 외부 수지(2)를 주입해서 경화 시킨 후에 꺼내는 공정을 구비하여 이루어지고, 상기 내부의 수지(1)에 첨가시키는 왁스의 주성분이 에스테르류와 지방산계, 지방산 금속염계, 지방알콜, 다가의 알콜, 및 지방산 아미드로 이루어진 군으로부터 선택된 적어도 한 종류의 화합물인 것을 특징으로 하는 다중몰드형 반도체 장치의 제조방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1237578A JP2656356B2 (ja) | 1989-09-13 | 1989-09-13 | 多重モールド型半導体装置及びその製造方法 |
JP1-237578 | 1989-09-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910007067A true KR910007067A (ko) | 1991-04-30 |
KR940008334B1 KR940008334B1 (ko) | 1994-09-12 |
Family
ID=17017394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900014437A KR940008334B1 (ko) | 1989-09-13 | 1990-09-13 | 다중몰드형 반도체장치 및 그 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5057457A (ko) |
EP (1) | EP0417787B1 (ko) |
JP (1) | JP2656356B2 (ko) |
KR (1) | KR940008334B1 (ko) |
DE (1) | DE69029630T2 (ko) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5302553A (en) * | 1991-10-04 | 1994-04-12 | Texas Instruments Incorporated | Method of forming a coated plastic package |
US5310702A (en) * | 1992-03-20 | 1994-05-10 | Kulicke And Soffa Industries, Inc. | Method of preventing short-circuiting of bonding wires |
US5479051A (en) * | 1992-10-09 | 1995-12-26 | Fujitsu Limited | Semiconductor device having a plurality of semiconductor chips |
US5389578A (en) * | 1994-01-04 | 1995-02-14 | Texas Instruments Incorporated | Optical coupler |
NL9400766A (nl) * | 1994-05-09 | 1995-12-01 | Euratec Bv | Werkwijze voor het inkapselen van een geintegreerde halfgeleiderschakeling. |
JP3970377B2 (ja) | 1997-04-25 | 2007-09-05 | 沖電気工業株式会社 | 光半導体装置およびその製造方法 |
US5973337A (en) * | 1997-08-25 | 1999-10-26 | Motorola, Inc. | Ball grid device with optically transmissive coating |
US6008074A (en) * | 1998-10-01 | 1999-12-28 | Micron Technology, Inc. | Method of forming a synchronous-link dynamic random access memory edge-mounted device |
US6700210B1 (en) | 1999-12-06 | 2004-03-02 | Micron Technology, Inc. | Electronic assemblies containing bow resistant semiconductor packages |
US6384487B1 (en) * | 1999-12-06 | 2002-05-07 | Micron Technology, Inc. | Bow resistant plastic semiconductor package and method of fabrication |
JP2003133484A (ja) * | 2001-10-30 | 2003-05-09 | Tokai Rika Co Ltd | 半導体装置及びその製造方法 |
JP3537417B2 (ja) * | 2001-12-25 | 2004-06-14 | 株式会社東芝 | 半導体装置およびその製造方法 |
US7067905B2 (en) * | 2002-08-08 | 2006-06-27 | Micron Technology, Inc. | Packaged microelectronic devices including first and second casings |
TW586203B (en) * | 2002-11-04 | 2004-05-01 | Siliconware Precision Industries Co Ltd | Semiconductor package with lead frame as chip carrier and method for fabricating the same |
JP2004273570A (ja) * | 2003-03-05 | 2004-09-30 | Sanyo Electric Co Ltd | 樹脂封止型半導体装置およびその製造方法 |
US20090097222A1 (en) * | 2004-06-25 | 2009-04-16 | Wilfried Babutzka | Electrical Subassembly Comprising a Protective Sheathing |
US7435625B2 (en) * | 2005-10-24 | 2008-10-14 | Freescale Semiconductor, Inc. | Semiconductor device with reduced package cross-talk and loss |
US20080122122A1 (en) * | 2006-11-08 | 2008-05-29 | Weng Fei Wong | Semiconductor package with encapsulant delamination-reducing structure and method of making the package |
DE102007008464B4 (de) * | 2007-02-19 | 2012-01-05 | Hottinger Baldwin Messtechnik Gmbh | Optischer Dehnungsmessstreifen |
US20120313272A1 (en) * | 2011-06-10 | 2012-12-13 | Aliphcom, Inc. | Component protective overmolding |
US20120313296A1 (en) * | 2011-06-10 | 2012-12-13 | Aliphcom | Component protective overmolding |
US9069380B2 (en) | 2011-06-10 | 2015-06-30 | Aliphcom | Media device, application, and content management using sensory input |
JP5624091B2 (ja) * | 2012-08-06 | 2014-11-12 | パナソニック株式会社 | フォトカプラ装置の製造方法 |
CN103972181A (zh) * | 2013-02-01 | 2014-08-06 | 意法半导体制造(深圳)有限公司 | 内含表面包覆玻璃层的硅晶片的封装器件及其封装方法 |
JP2015054965A (ja) * | 2013-09-13 | 2015-03-23 | 株式会社東芝 | 封止用樹脂、半導体装置、および光結合装置 |
JP2015108558A (ja) * | 2013-12-05 | 2015-06-11 | 日立オートモティブシステムズ株式会社 | 樹脂封止型センサ装置 |
JP6710208B2 (ja) * | 2015-07-02 | 2020-06-17 | 株式会社カネカ | 熱伝導性樹脂組成物、tim及び半導体モジュール用tim |
US11139268B2 (en) * | 2019-08-06 | 2021-10-05 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and method of manufacturing the same |
CN112152871B (zh) * | 2020-08-14 | 2021-09-24 | 上海纽盾科技股份有限公司 | 网络安全设备的人工智能测试方法、装置及系统 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3762039A (en) * | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
NL189379C (nl) * | 1977-05-05 | 1993-03-16 | Richardus Henricus Johannes Fi | Werkwijze voor inkapselen van micro-elektronische elementen. |
JPS55154755A (en) * | 1979-05-23 | 1980-12-02 | Toshiba Corp | Resin composition for sealing semiconductor |
JPS6076529A (ja) * | 1983-10-03 | 1985-05-01 | Toyota Central Res & Dev Lab Inc | エポキシ樹脂組成物 |
JPS6065020A (ja) * | 1983-09-21 | 1985-04-13 | Hitachi Ltd | 半導体封止用樹脂組成物 |
JPS60210855A (ja) * | 1984-04-03 | 1985-10-23 | Hitachi Chem Co Ltd | 半導体装置の製造方法 |
JPS6129544A (ja) * | 1984-07-20 | 1986-02-10 | Toppan Printing Co Ltd | グラビア印刷法 |
JPS6184041A (ja) * | 1984-10-02 | 1986-04-28 | Fujitsu Ltd | 半導体装置 |
JPS6276747A (ja) * | 1985-09-30 | 1987-04-08 | Shindengen Electric Mfg Co Ltd | 樹脂封止型半導体装置 |
JPS6279654A (ja) * | 1985-10-02 | 1987-04-13 | Hitachi Ltd | 半導体装置 |
JPS6286747A (ja) * | 1985-10-14 | 1987-04-21 | Hitachi Ltd | 高密度実装部品 |
JPS62207355A (ja) * | 1986-03-07 | 1987-09-11 | Rishiyou Kogyo Kk | エポキシ樹脂組成物 |
JPS6372719A (ja) * | 1986-09-13 | 1988-04-02 | Fujitsu Ltd | 半導体封止用エポキシ樹脂組成物 |
JPS6377927A (ja) * | 1986-09-19 | 1988-04-08 | Fujitsu Ltd | 半導体封止用成形材料 |
JPS63110661A (ja) * | 1986-10-27 | 1988-05-16 | Mitsubishi Electric Corp | 半導体集積回路用樹脂封止形パツケ−ジ |
JPS63151054A (ja) * | 1986-12-16 | 1988-06-23 | Matsushita Electronics Corp | 半導体装置 |
JPS63230729A (ja) * | 1987-03-20 | 1988-09-27 | Sumitomo Chem Co Ltd | 半導体封止用樹脂組成物 |
JPS6444052A (en) * | 1987-08-11 | 1989-02-16 | Nec Corp | Hybrid integrated circuit |
JPS6475556A (en) * | 1987-09-18 | 1989-03-22 | Fujitsu Ltd | Epoxy resin composition for sealing semiconductor |
JPH01216545A (ja) * | 1988-02-24 | 1989-08-30 | Nec Corp | 半導体装置の製造方法 |
-
1989
- 1989-09-13 JP JP1237578A patent/JP2656356B2/ja not_active Expired - Lifetime
-
1990
- 1990-09-11 US US07/580,542 patent/US5057457A/en not_active Expired - Lifetime
- 1990-09-13 DE DE69029630T patent/DE69029630T2/de not_active Expired - Fee Related
- 1990-09-13 KR KR1019900014437A patent/KR940008334B1/ko not_active IP Right Cessation
- 1990-09-13 EP EP90117659A patent/EP0417787B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0417787A3 (en) | 1992-03-18 |
JP2656356B2 (ja) | 1997-09-24 |
DE69029630D1 (de) | 1997-02-20 |
JPH03101154A (ja) | 1991-04-25 |
EP0417787A2 (en) | 1991-03-20 |
US5057457A (en) | 1991-10-15 |
DE69029630T2 (de) | 1997-05-28 |
KR940008334B1 (ko) | 1994-09-12 |
EP0417787B1 (en) | 1997-01-08 |
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