JP2015054965A - 封止用樹脂、半導体装置、および光結合装置 - Google Patents
封止用樹脂、半導体装置、および光結合装置 Download PDFInfo
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- 238000005859 coupling reaction Methods 0.000 title claims abstract description 48
- 230000003287 optical effect Effects 0.000 title claims abstract description 48
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000005538 encapsulation Methods 0.000 title abstract 3
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- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims abstract description 10
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- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 claims description 4
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- 150000004665 fatty acids Chemical class 0.000 claims description 3
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- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 3
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- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 3
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- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
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- 229910052581 Si3N4 Inorganic materials 0.000 description 1
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
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- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
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- 235000012239 silicon dioxide Nutrition 0.000 description 1
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Abstract
【解決手段】封止用樹脂は、エポキシ基を有するイソシアヌル酸を含む主剤と、酸無水物基を有する酸無水物を含む硬化剤と、を有する。前記エポキシ基に対する前記酸無水物基のモル比は、0.67以上、かつ0.8以下である。
【選択図】図3
Description
第1の実施形態にかかる封止用樹脂は、エポキシ基を有するイソシアヌル酸を主剤(ベースレジン)とし、酸無水物を硬化剤とする。
封止用樹脂は、主剤として1,3,5-トリス(2,3-エポキシプロピル)イソシアヌル酸、硬化剤としてイソメチルテトラヒドロ無水フタル酸、を用いているが、材料はこれに限定されない。縦軸は密着強度(N)、横軸はエポキシ基に対する酸無水基のモル比である。白丸はPCT(Pressure Cooker Test)前の密着強度、黒丸はPCT後の密着強度、をそれぞれ表す。
第1のリード10に接着されたLED(Light Emitting Diode)のような発光素子20と、第2のリード12に接着された受光素子31と、が互いに対向している。なお、発光素子20は、エンキャップのためポッティング樹脂22で覆われている。また、封止用樹脂40は、赤外光に対して透光性を有するものとする。
光結合効率の変動率(%)は、PCTを一定時間行い、その後常温常圧に戻してから測定した受光側に流れる電流値を、PCT開始前に常温常圧で測定した受光側に流れる電流値で除して、算出している。
受光素子31の表面と封止用樹脂40との間に剥離により生じた空間Gを生じている。このため、光結合効率が変化する。
光結合装置は、第1のリード10に接着された発光素子20と、第2のリード12に接着された受光素子31と、が互いに対向している。また、発光素子20は、エンキャップのためポッティング樹脂22で覆われている。
縦軸は光結合効率の初期値に対する変動率(%)、横軸は時間、である。2000時間経過しても、光結合効率の変動率は小さい。なお、第1の実施形態に封止用樹脂であるインナ樹脂41において、200℃の雰囲気に90時間放置後の透過率の変動率も25%以下と小さかった。
インナ樹脂は、母体に対するエポキシ基が1つのオルソクレゾールノボラック(OCN)を主剤とし、フェノール系樹脂を硬化剤としている。フェノール系樹脂は、酸化により、キノン構造を生じ変色する。このため、200℃の雰囲気に90時間放置後、透過率は、初期値の42〜51%に低下する。この結果、150℃の雰囲気で1500時間経過した後、光結合効率の変動率は20〜50%にもなる。
樹脂成型体にワックスを添加すると、成型後の金型からの離型を容易にし生産性を高めることができる。通常、インナーとアウター樹脂には外滑ワックスを用いている。しかしながら、アウタ樹脂50と、インナ樹脂41と、の間に、ワックスがしみ出し、被膜が形成されると水素結合が阻害され、密着強度が低下する。(表2)は、第2の変形例のワックスの組み合わせの一例を表す。
Claims (9)
- エポキシ基を有するイソシアヌル酸を含む主剤と、
酸無水物基を有する酸無水物を含む硬化剤と、
を備え、
前記エポキシ基に対する前記酸無水物基のモル比は、0.67以上、かつ0.8以下である封止用樹脂。 - 前記イソシアヌル酸は、1,3,5-トリス(2,3-エポキシプロピル)イソシアヌル酸を含み、
前記酸無水物は、イソメチルテトラヒドロ無水フタル酸を含む請求項1記載の封止用樹脂。 - 請求項1または2に記載の封止用樹脂と、
前記封止用樹脂に覆われた半導体素子と、
を備えた半導体装置。 - 前記半導体素子は、発光素子または受光素子を含む請求項3記載の半導体装置。
- 請求項1または2に記載の封止用樹脂と、
前記封止用樹脂に包まれ、入力電気信号で駆動される発光素子と、
前記封止用樹脂に包まれ、前記発光素子の放出光を電気信号に変換して出力する受光素子と、
を備えた光結合装置。 - 前記封止用樹脂を包み、前記放出光を遮光するアウタ樹脂をさらに備えた請求項5記載の光結合装置。
- 前記封止用樹脂には、60重量%以上、かつ85重量%以下の第1の配合比である第1の無機充填剤が配合され、
前記アウタ樹脂には、60重量%以上、かつ85重量%以下の第2の配合比の第2の無機充填剤が配合され、
前記第1の配合比と前記第2の配合比との差が5重量%以上、かつ12重量%以下である請求項6記載の光結合装置。 - 前記アウタ樹脂には、極性が低い第1の外滑ワックスが配合され、
前記封止用樹脂には、極性が高く脂肪酸を含む内滑ワックスおよび極性が低い第2の外滑ワックスが配合された請求項6または7に記載の光結合装置。 - 前記第1および第2の外滑ワックスは、脂肪酸エステルをそれぞれ含み、
前記内滑ワックスは、脂肪酸を含む請求項8記載の光結合装置。
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US14/202,521 US20150076524A1 (en) | 2013-09-13 | 2014-03-10 | Sealing resin, semiconductor device, and photocoupler |
US14/751,687 US20150295121A1 (en) | 2013-09-13 | 2015-06-26 | Sealing resin, semiconductor device, and photocoupler |
US15/071,260 US20160197224A1 (en) | 2013-09-13 | 2016-03-16 | Sealing resin, semiconductor device, and photocoupler |
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JP2017050487A (ja) * | 2015-09-04 | 2017-03-09 | 株式会社東芝 | 光結合装置 |
JP2017135214A (ja) * | 2016-01-26 | 2017-08-03 | 株式会社東芝 | 半導体装置 |
US10475949B2 (en) | 2017-06-29 | 2019-11-12 | Kabushiki Kaisha Toshiba | Optical coupling device |
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DE102015223439A1 (de) | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Verfahren zur Herstellung einer elektrischen Vorrichtung mit einer Umhüllmasse |
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JP2010106243A (ja) * | 2008-09-30 | 2010-05-13 | Shin-Etsu Chemical Co Ltd | 光半導体装置用シリコーン樹脂組成物 |
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JPH03101154A (ja) * | 1989-09-13 | 1991-04-25 | Toshiba Corp | 多重モールド型半導体装置及びその製造方法 |
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JP2017050487A (ja) * | 2015-09-04 | 2017-03-09 | 株式会社東芝 | 光結合装置 |
JP2017135214A (ja) * | 2016-01-26 | 2017-08-03 | 株式会社東芝 | 半導体装置 |
US10475949B2 (en) | 2017-06-29 | 2019-11-12 | Kabushiki Kaisha Toshiba | Optical coupling device |
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US20150295121A1 (en) | 2015-10-15 |
US20160197224A1 (en) | 2016-07-07 |
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