JP5624091B2 - フォトカプラ装置の製造方法 - Google Patents
フォトカプラ装置の製造方法 Download PDFInfo
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- JP5624091B2 JP5624091B2 JP2012173645A JP2012173645A JP5624091B2 JP 5624091 B2 JP5624091 B2 JP 5624091B2 JP 2012173645 A JP2012173645 A JP 2012173645A JP 2012173645 A JP2012173645 A JP 2012173645A JP 5624091 B2 JP5624091 B2 JP 5624091B2
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- epoxy resin
- sealing
- primary sealing
- resin composition
- secondary sealing
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- 125000001624 naphthyl group Chemical group 0.000 description 1
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- 239000011574 phosphorus Substances 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- QLNJFJADRCOGBJ-UHFFFAOYSA-N propionamide Chemical compound CCC(N)=O QLNJFJADRCOGBJ-UHFFFAOYSA-N 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical group [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical class S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- BJQWBACJIAKDTJ-UHFFFAOYSA-N tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC BJQWBACJIAKDTJ-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
具体的には、例えば、プロピオン酸アミド(融点79℃)、ラウリン酸アミド(融点99℃)、オレイン酸アミド(融点70℃)、エルカ酸アミド(融点79−81℃)などが挙げられる。
(無機充填剤)
溶融シリカ、平均粒子径15μm
(エポキシ樹脂)
オルトクレゾールノボラック型エポキシ樹脂、DIC(株)製「N665EXP」、エポキシ当量195g/eq
(フェノール樹脂硬化剤)
フェノールノボラック樹脂、明和化成(株)製「H1」、水酸基当量105g/eq
(硬化促進剤)
イミダゾール系硬化促進剤、四国化成工業(株)製「製品名2PZ」
(離型剤)
脂肪酸アミドワックス、エルカ酸アミド、融点80℃、日本化成(株)製「L300」
脂肪酸ワックス、融点80℃、クラリアントジャパン(株)製「Licowax−S」
(シランカップリング剤)
γ−メルカプトプロピルトリメトキシシラン、信越化学工業(株)製「KBM803」
表1に示す各配合成分のうち、シランカップリング剤以外の配合成分をミキサーやブレンダーで均一に混合した後、シランカップリング剤を添加した。その後、熱ロールやニーダーで100〜140℃で溶融混合して押し出し、冷却後、粉砕機で所定粒度に粉砕して一次封止用エポキシ樹脂組成物と二次封止用エポキシ樹脂組成物を得た。
25mm×25mmのCrメッキ板上に接着面積100mm2の成形品を成形175℃、90秒の条件で成形し、成形直後プッシュプルにて測定を実施した。この値が低い方が、離型性が良好であることを示す。インナー材とアウター材のそれぞれについて測定を行った。
一次封止用エポキシ樹脂組成物を、金型温度175℃、硬化時間90秒の条件で板状(25mm×25mm)に成形した。
耐リフロー性評価用の18ピンSOPパッケージを作製した。一次封止用エポキシ樹脂組成物によってリードフレームの一次封止を行い(金型温度175℃、硬化時間90秒)、次いで二次封止用エポキシ樹脂組成物によって二次封止を行った(金型温度175℃、硬化時間90秒)。
評価結果を表1および表2に示す。
2 リードフレーム
4 発光素子
5 受光素子
7 一次封止樹脂
8 二次封止樹脂
Claims (1)
- 発光素子と受光素子とが対向する状態で搭載されたリードフレームに、一次封止用エポキシ樹脂組成物を用いた成形によって、前記発光素子と前記受光素子とを覆い光伝送に必要な光透過性を有する一次封止樹脂を形成する工程と、
二次封止用エポキシ樹脂組成物を用いた成形によって、前記一次封止樹脂の外周部に外部からの光に対して遮光性を有する二次封止樹脂を形成する工程とを含み、
前記一次封止用エポキシ樹脂組成物は、一次封止用のエポキシ樹脂、一次封止用のフェノール樹脂硬化剤、一次封止用の無機充填剤、および一次封止用の脂肪酸ワックスを含有し、
前記二次封止用エポキシ樹脂組成物は、二次封止用のエポキシ樹脂、二次封止用のフェノール樹脂硬化剤、二次封止用の無機充填剤、および二次封止用の脂肪酸ワックスを含有し、
前記一次封止用エポキシ樹脂組成物および前記二次封止用エポキシ樹脂組成物の両方に、脂肪酸アミドワックスを含有することを特徴とするフォトカプラ装置の製造方法。
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