JP2016160317A - 半導体封止用樹脂組成物及び半導体装置 - Google Patents
半導体封止用樹脂組成物及び半導体装置 Download PDFInfo
- Publication number
- JP2016160317A JP2016160317A JP2015039003A JP2015039003A JP2016160317A JP 2016160317 A JP2016160317 A JP 2016160317A JP 2015039003 A JP2015039003 A JP 2015039003A JP 2015039003 A JP2015039003 A JP 2015039003A JP 2016160317 A JP2016160317 A JP 2016160317A
- Authority
- JP
- Japan
- Prior art keywords
- group
- formula
- component
- integer
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 28
- 239000011342 resin composition Substances 0.000 title abstract description 13
- 238000007789 sealing Methods 0.000 title description 12
- -1 phenol compound Chemical class 0.000 claims abstract description 85
- 150000001875 compounds Chemical class 0.000 claims abstract description 60
- 239000004593 Epoxy Substances 0.000 claims abstract description 49
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 16
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 14
- 229920001577 copolymer Polymers 0.000 claims abstract description 11
- 239000011256 inorganic filler Substances 0.000 claims abstract description 11
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 11
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 62
- 125000004432 carbon atom Chemical group C* 0.000 claims description 36
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 28
- 239000005011 phenolic resin Substances 0.000 claims description 20
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 11
- 150000002500 ions Chemical class 0.000 claims description 10
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 150000003003 phosphines Chemical class 0.000 claims description 9
- 150000003839 salts Chemical class 0.000 claims description 9
- 125000001931 aliphatic group Chemical group 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims description 5
- 150000004053 quinones Chemical class 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 150000001450 anions Chemical group 0.000 claims description 4
- 150000004714 phosphonium salts Chemical class 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-M phenolate Chemical compound [O-]C1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-M 0.000 claims description 3
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 5
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 230000009477 glass transition Effects 0.000 abstract description 24
- 239000010949 copper Substances 0.000 abstract description 12
- 229910000679 solder Inorganic materials 0.000 abstract description 12
- 238000005979 thermal decomposition reaction Methods 0.000 abstract description 10
- 238000003860 storage Methods 0.000 abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052802 copper Inorganic materials 0.000 abstract description 7
- 229910000073 phosphorus hydride Inorganic materials 0.000 abstract description 4
- 150000001642 boronic acid derivatives Chemical class 0.000 abstract description 2
- 230000007774 longterm Effects 0.000 abstract description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 31
- 239000003822 epoxy resin Substances 0.000 description 29
- 229920000647 polyepoxide Polymers 0.000 description 29
- 239000000047 product Substances 0.000 description 24
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- 239000003795 chemical substances by application Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 13
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 11
- 238000000465 moulding Methods 0.000 description 10
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical class OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 8
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 7
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 7
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 6
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 6
- 238000013329 compounding Methods 0.000 description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- 150000002430 hydrocarbons Chemical group 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 150000002989 phenols Chemical class 0.000 description 6
- 238000001721 transfer moulding Methods 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 125000001624 naphthyl group Chemical group 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 238000012790 confirmation Methods 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 238000005040 ion trap Methods 0.000 description 4
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 4
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 4
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 4
- 125000004344 phenylpropyl group Chemical group 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 125000003944 tolyl group Chemical group 0.000 description 4
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 4
- 230000004580 weight loss Effects 0.000 description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229940125782 compound 2 Drugs 0.000 description 3
- 229940126214 compound 3 Drugs 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 125000004093 cyano group Chemical group *C#N 0.000 description 3
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 238000011417 postcuring Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 125000005023 xylyl group Chemical group 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- INZDTEICWPZYJM-UHFFFAOYSA-N 1-(chloromethyl)-4-[4-(chloromethyl)phenyl]benzene Chemical group C1=CC(CCl)=CC=C1C1=CC=C(CCl)C=C1 INZDTEICWPZYJM-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 2
- 239000004203 carnauba wax Substances 0.000 description 2
- 235000013869 carnauba wax Nutrition 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229940125904 compound 1 Drugs 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229960001755 resorcinol Drugs 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910001415 sodium ion Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 2
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- KYLUAQBYONVMCP-UHFFFAOYSA-N (2-methylphenyl)phosphane Chemical compound CC1=CC=CC=C1P KYLUAQBYONVMCP-UHFFFAOYSA-N 0.000 description 1
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N 1-monostearoylglycerol Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical group CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- QIRNGVVZBINFMX-UHFFFAOYSA-N 2-allylphenol Chemical compound OC1=CC=CC=C1CC=C QIRNGVVZBINFMX-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ZDZYGYFHTPFREM-UHFFFAOYSA-N 3-[3-aminopropyl(dimethoxy)silyl]oxypropan-1-amine Chemical compound NCCC[Si](OC)(OC)OCCCN ZDZYGYFHTPFREM-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- 0 CC(C)(C)Cc(cc1)ccc1-c1ccc(*)cc1 Chemical compound CC(C)(C)Cc(cc1)ccc1-c1ccc(*)cc1 0.000 description 1
- XNOOYOFCVMANIQ-UHFFFAOYSA-N CCc(cc1)ccc1-c1ccc(CC(C)(C)C(C=CC=C2)C=C2O)cc1 Chemical compound CCc(cc1)ccc1-c1ccc(CC(C)(C)C(C=CC=C2)C=C2O)cc1 XNOOYOFCVMANIQ-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 description 1
- 241000370738 Chlorion Species 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- DCXXMTOCNZCJGO-UHFFFAOYSA-N Glycerol trioctadecanoate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCCCC DCXXMTOCNZCJGO-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- VMBUUPYAGAQZMM-UHFFFAOYSA-N OC1=CC=CCC1 Chemical compound OC1=CC=CCC1 VMBUUPYAGAQZMM-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- TZSXPYWRDWEXHG-UHFFFAOYSA-K bismuth;trihydroxide Chemical class [OH-].[OH-].[OH-].[Bi+3] TZSXPYWRDWEXHG-UHFFFAOYSA-K 0.000 description 1
- 229910000085 borane Inorganic materials 0.000 description 1
- 229940063013 borate ion Drugs 0.000 description 1
- 229940006460 bromide ion Drugs 0.000 description 1
- 125000005998 bromoethyl group Chemical group 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 229940125898 compound 5 Drugs 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- RGBIPJJZHWFFGE-UHFFFAOYSA-N cyclohexa-2,5-diene-1,4-dione;triphenylphosphane Chemical class O=C1C=CC(=O)C=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RGBIPJJZHWFFGE-UHFFFAOYSA-N 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- ZJOLCKGSXLIVAA-UHFFFAOYSA-N ethene;octadecanamide Chemical class C=C.CCCCCCCCCCCCCCCCCC(N)=O.CCCCCCCCCCCCCCCCCC(N)=O ZJOLCKGSXLIVAA-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 229960001545 hydrotalcite Drugs 0.000 description 1
- 229910001701 hydrotalcite Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical class CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- KPADFPAILITQBG-UHFFFAOYSA-N non-4-ene Chemical compound CCCCC=CCCC KPADFPAILITQBG-UHFFFAOYSA-N 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical class CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 125000004365 octenyl group Chemical group C(=CCCCCCC)* 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- MDCWDBMBZLORER-UHFFFAOYSA-N triphenyl borate Chemical compound C=1C=CC=CC=1OB(OC=1C=CC=CC=1)OC1=CC=CC=C1 MDCWDBMBZLORER-UHFFFAOYSA-N 0.000 description 1
- MXSVLWZRHLXFKH-UHFFFAOYSA-N triphenylborane Chemical compound C1=CC=CC=C1B(C=1C=CC=CC=1)C1=CC=CC=C1 MXSVLWZRHLXFKH-UHFFFAOYSA-N 0.000 description 1
- UYUUAUOYLFIRJG-UHFFFAOYSA-N tris(4-methoxyphenyl)phosphane Chemical compound C1=CC(OC)=CC=C1P(C=1C=CC(OC)=CC=1)C1=CC=C(OC)C=C1 UYUUAUOYLFIRJG-UHFFFAOYSA-N 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/50—Phosphorus bound to carbon only
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5377—Phosphinous compounds, e.g. R2=P—OR'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/10—Block- or graft-copolymers containing polysiloxane sequences
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing & Machinery (AREA)
Abstract
Description
(A)下記一般式(1)で表されるエポキシ化合物
(B)アルケニル基含有エポキシ化合物と下記平均式(2)で表されるオルガノポリシロキサンとのヒドロシリル化反応により得られる共重合物:(A)成分、(B)成分及び(C)成分の合計100質量部に対して2〜20質量部
(C)下記一般式(3)で表されるフェノール化合物:(A)成分、(B)成分及び(C)成分の合計100質量部に対して20〜50質量部
(D)無機充填剤:(A)成分、(B)成分及び(C)成分の合計100質量部に対して150〜1,500質量部、
(E)有機ホスフィン、テトラ置換ホスホニウム化合物のテトラフェニルボレート塩、及び、ホスフィン化合物とキノン化合物の付加物から選ばれる少なくとも1種類の化合物
(A)成分、(B)成分及び(C)成分の合計100質量部に対して0.1〜5質量部、及び
(F)下記式(I)で示される化合物または下記式(II)で示される塩から選ばれる少なくとも1種 (A)成分、(B)成分及び(C)成分の合計100質量部に対して0.1〜5質量部
さらに本発明は上記組成物を硬化して成る硬化物を備える半導体装置を提供する。
下記平均式(4)または(5)で表すことができる。
上記式において、Rは互いに独立に、置換又は非置換の、炭素数1〜10、好ましくは炭素数1〜6の一価炭化水素基であり、R9は水素原子またはRの選択肢から選ばれる基であり、R8は下記に示す基である。n1は5〜200の整数であり、n2は0〜2の整数であり、n3は0〜10の整数であり、n4は1または0である。
(式中、dは1〜3の整数)
エポキシ化合物1
下記式(6)で表されるエポキシ化合物:NC−3500(日本化薬株式会社製)
攪拌装置、及びコンデンサー、及び窒素ガス導入管を備えたガラス製反応容器に、後述のSH−005−04(明和化成株式会社製、1価フェノールと2価フェノールの比率=71/29であるフェノール樹脂55.0g(0.33モル)、エピクロルヒドリン365.6g(4.0モル)、メタノール50gを仕込み、均一に溶解させた。50℃で固形の96%水酸化ナトリウム13.7g(0.3モル)を90分かけて分割投入した。その後50℃で2時間反応させ、70℃昇温後さらに2時間反応を継続した。反応終了後、過剰のエピクロルヒドリンを減圧下において除去した。
撹拌装置、コンデンサー、及び窒素ガス導入管を備えたガラス製反応釜に、レゾルシン220g(2.0モル)を150gの水に溶解させ、4,4’−ジ(クロロメチル)ビフェニル125.5g(0.5モル)を仕込み、100℃で3時間反応させた。その後、160℃に昇温し、4,4’−ジ(クロロメチル)ビフェニルを全て反応させた。その間、生成するHCl、及び水を留去した。反応終了後、減圧蒸留により未反応レゾルシンを留去することにより1価フェノールと2価フェノールの比率=0/100(個数比(%))であるフェノール樹脂180gを得た。該フェノール樹脂の水酸基当量は115g/eqであった。
ビフェニルアラルキル型エポキシ樹脂:NC−3000(日本化薬株式会社製)、1価フェノールと2価フェノールの比率=100/0(個数比(%))、エポキシ当量:272
トリフェニルアルカン型エポキシ樹脂:EPPN−501H(日本化薬株式会社製)1価フェノールと2価フェノールの比率=100/0(個数比(%))、エポキシ当量:165
アルケニル基含有エポキシ化合物とオルガノポリシロキサンとの反応により得られる共重合化合物
リフラックスコンデンサー、温度計、撹拌機及び滴下ロートを具備した内容積1リットルの四つ口フラスコへアリルグリシジルエーテルで変性されたフェノールノボラック樹脂(フェノール当量125、アリル当量1100)200g、クロロメチルオキシラン800g、セチルトリメチルアンモニウムブロマイド0.6gをそれぞれ入れて加熱し、温度110℃で3時間撹拌混合した。これを冷却して温度70℃とし、160mmHgに減圧してから、この中に水酸化ナトリウムの50%水溶液128gを共沸脱水しながら3時間かけて滴下した。得られた内容物を減圧して溶剤を留去し、次いでメチルイソブチルケトン300gとアセトン300gの混合溶剤にて溶解させた後、水洗し、これを減圧下で溶剤留去してアリル基含有のエポキシ樹脂(アリル当量1590、エポキシ当量190)を得た。このエポキシ樹脂とメチルイソブチルケトン170g、トルエン330g、2%の白金濃度の2−エチルヘキサノール変性塩化白金酸溶液0.07gを入れ、1時間の共沸脱水を行ない、還流温度にて下記式(7)で表されるオルガノポリシロキサン133gを滴下時間30分にて滴下した。更に、同一温度で4時間撹拌して反応させた後、得られた内容物を水洗し、溶剤を減圧下で留去したところ白黄色不透明固体の共重合体が得られた。エポキシ当量は280であり、150℃でのICI溶融粘度は800cPであり、珪素含有量31%であった。
フェノール化合物1
下記式(8)で表される化合物:SH−005−02(明和化成株式会社製)
SH−005−04(明和化成株式会社製):上記式(8)で示され、R4〜R6=H、1価フェノールと2価フェノールの比率=71/29(個数比(%))、水酸基当量169である化合物
無機充填剤:溶融球状シリカ(平均粒径15μm、株式会社龍森製)
トリフェニルホスフィン(TPP(登録商標) 、 北興化学工業株式会社製)
テトラフェニルホスフォニウムテトラフェニルボレート (TPP−K(登録商標) 、北興化学工業株式会社製)
1,8−ジアザビシクロ[5.4.0]ウンデセン−7のフェノール樹脂塩 (U−CAT(登録商標) SA851、サンアプロ株式会社製)
8−ベンジル−1,8−ジアザビシクロ[5.4.0]ウンデセン−7のテトラフェニルボレート塩 (U−CAT(登録商標) 5002、サンアプロ株式会社製)
カルナバワックス(TOWAX−131、東亜化成株式会社製)
シランカップリング剤:
3−メルカプトプロピルトリメトキシシラン(KBM−803、信越化学工業株式会社製)
3−グリシドキシプロピルトリメトキシシラン(KBM−403、信越化学工業株式会社製)
難燃材:モリブデン担持酸化亜鉛(KEMGARD−911B、シャーウイン ウイリアムズ製)
イオントラップ剤:ハイドロタルサイト化合物(DHT−4A−2、協和化学工業株式会社製)
EMMI規格に準じた金型を使用して、175℃、6.9N/mm2、成形時間180秒の条件で測定した。
各組成物を、175℃×120秒間、成形圧6.9MPaの条件でトランスファー成形し、次いで250℃、4時間ポストキュアすることにより、5×5×15mmの試験片を得た。試験片の、5℃/分の昇温速度における寸法変化を測定(Rigaku TMA8310)し、50〜100℃の接線と270〜290℃の接線の交点よりガラス転移点を求めた。
各組成物を、175℃×120秒間、成形圧6.9MPaの条件でトランスファー成形し、次いで180℃、4時間ポストキュアすることにより、10×100×4mmの試験片を得た。試験片を250℃オーブン中に336時間保管した。保管前の試験片の重量を基に保管により重量減少した率(%)を測定した。
チップ6mm×6mm、DA剤Ablestick製84−1LMI−SR4、ダイパッド部(8mm×8mm)及びワイヤーボンディング部がAgメッキされたCu合金(Olin C7025)製100pin QFPリードフレームを、各組成物で、175℃×120秒間、成形圧6.9MPaの条件でトランスファー成形し、次いで180℃、4時間ポストキュアすることにより封止した。リードフレームカッターでタイバーを切断し、20mm×14mm×2.7mmのQFPパッケージを得た。このパッケージを200℃オーブン中に1000時間保管し、保管後パッケージクラックの確認及び超音波探傷装置による内部クラック、リードフレームとの剥離を観察した。
チップ6mm×6mm、DA剤Ablestick製84−1LMI−SR4、ダイパッド部(8mm×8mm)及びワイヤーボンディング部がAgメッキされたCu合金(Olin C7025)製100pin QFPリードフレームを、各組成物で、175℃×120秒間、成形圧6.9MPaの条件でトランスファー成形し、次いで180℃、4時間ポストキュアすることにより封止した。リードフレームカッターでタイバーを切断し、20mm×14mm×2.7mmのQFPパッケージを得た。このパッケージについて、−65℃×30分⇔175℃×30分の条件で温度サイクル試験を1500サイクル行い、パッケージクラックの確認及び超音波探傷装置による内部クラック、リードフレームとの剥離を観察した。
厚み0.15mmを有する15mm×15mmのCu合金(Olin C7025)製の100pin QFPリードフレームを、各組成物にて、175℃×120秒間、成形圧6.9MPaの条件でトランスファー成形し、底面積10mm2、高さ3.5mmの成形物を得た。ついで、ダイシェアテスター(DAGE製)を用いて成形物にせん断速度 0.2mm/sでせん断力を加え、Cuリードフレームから成型物が剥がれるときのせん断強さを測定した。
チップ6mm×6mm、DA剤Ablestick製84−1LMI−SR4、ダイパッド部(8mm×8mm)及びワイヤーボンディング部がAgメッキされたCu合金(Olin C7025)製100pin QFPリードフレームを、各組成物で、175℃×120秒間、成形圧6.9MPaの条件でトランスファー成形し、次いで180℃、4時間ポストキュアすることにより封止した。リードフレームカッターでタイバーを切断し、20mm×14mm×2.7mmのQFPパッケージを得た。このパッケージを85℃/65%RH×72hの条件で吸湿させた後、IRリフロー炉(最高温度265℃)に3回通過させ、パッケージクラックの確認及び超音波探傷装置による内部クラック、リードフレームとの剥離を観察した。
Claims (4)
- 下記(A)成分〜(F)成分を含む組成物
(A)下記一般式(1)で表されるエポキシ化合物
(B)アルケニル基含有エポキシ化合物と下記平均式(2)で表されるオルガノポリシロキサンとのヒドロシリル化反応により得られる共重合物:(A)成分、(B)成分及び(C)成分の合計100質量部に対して2〜20質量部
(C)下記一般式(3)で表されるフェノール化合物:(A)成分、(B)成分及び(C)成分の合計100質量部に対して20〜50質量部
(D)無機充填剤:(A)成分、(B)成分及び(C)成分の合計100質量部に対して150〜1,500質量部、
(E)有機ホスフィン、テトラ置換ホスホニウム化合物のテトラフェニルボレート塩、及び、ホスフィン化合物とキノン化合物の付加物から選ばれる少なくとも1種類の化合物
(A)成分、(B)成分及び(C)成分の合計100質量部に対して0.1〜5質量部、及び
(F)下記式(I)で示される化合物または下記式(II)で示される塩から選ばれる少なくとも1種 (A)成分、(B)成分及び(C)成分の合計100質量部に対して0.1〜5質量部
(式中、dは1〜3の整数)
(式中、R’’は水素原子、または、炭素数1〜6の脂肪族炭化水素基、及び炭素数6〜10の芳香族炭化水素基から選ばれる基であり、dは1〜3の整数であり、Xはテトラフェニルボレートイオン(テトラフェニルホウ酸イオン)、フェノールイオン、フェノール樹脂イオン、トルエンスルホン酸イオン、ハロゲン化物イオン、及び炭素数1〜10のカルボン酸イオンから選ばれる陰イオンである)。 - (B)成分における前記オルガノポリシロキサンが下記式(a)〜(c)で表される化合物から選ばれる少なくとも1である、請求項1または2記載の組成物。
n1は5〜200の整数であり、n2は0〜2の整数であり、n3は0〜10の整数であり、n4は1または0であり、括弧内に示される各シロキサン単位はランダムに結合していてもブロック単位を形成していてもよい。但し、上記式(a)の化合物は1分子中に少なくとも1の、ケイ素原子に結合した水素原子を有する)
- 請求項1〜3のいずれか1項記載の組成物を硬化してなる硬化物を備えた半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015039003A JP6300744B2 (ja) | 2015-02-27 | 2015-02-27 | 半導体封止用樹脂組成物及び半導体装置 |
KR1020160021808A KR20160105323A (ko) | 2015-02-27 | 2016-02-24 | 반도체 밀봉용 수지 조성물 및 반도체 장치 |
US15/053,730 US20160251511A1 (en) | 2015-02-27 | 2016-02-25 | Resin composition for encapsulating a semiconductor element and a semiconductor device |
CN201610106257.4A CN105924899A (zh) | 2015-02-27 | 2016-02-26 | 半导体封装用树脂组合物及半导体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015039003A JP6300744B2 (ja) | 2015-02-27 | 2015-02-27 | 半導体封止用樹脂組成物及び半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016160317A true JP2016160317A (ja) | 2016-09-05 |
JP6300744B2 JP6300744B2 (ja) | 2018-03-28 |
Family
ID=56798144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015039003A Active JP6300744B2 (ja) | 2015-02-27 | 2015-02-27 | 半導体封止用樹脂組成物及び半導体装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20160251511A1 (ja) |
JP (1) | JP6300744B2 (ja) |
KR (1) | KR20160105323A (ja) |
CN (1) | CN105924899A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016210907A (ja) * | 2015-05-11 | 2016-12-15 | 信越化学工業株式会社 | 半導体封止用樹脂組成物及びその硬化物を備えた半導体装置 |
JP2018087322A (ja) * | 2016-11-21 | 2018-06-07 | 三菱ケミカル株式会社 | エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子部品 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109716544B (zh) * | 2016-09-30 | 2021-11-09 | 日产化学株式会社 | Led用密封材料组合物 |
CN109790385B (zh) * | 2016-09-30 | 2021-09-21 | 日产化学株式会社 | 交联性有机聚硅氧烷组合物、其固化物及led装置 |
MY177304A (en) * | 2017-03-31 | 2020-09-11 | Hitachi Chemical Co Ltd | Protective material for electronic circuit, sealing material for protective material for electronic circuit, sealing method, and method for manufacturing semiconductor device |
JP2019085534A (ja) * | 2017-11-10 | 2019-06-06 | 信越化学工業株式会社 | シリコーン変性エポキシ樹脂組成物及び半導体装置 |
CN110016142B (zh) * | 2019-04-30 | 2021-08-03 | 合肥工业大学 | 一种含嘧啶硼酸结构的硅油及其制备方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6284147A (ja) * | 1985-10-07 | 1987-04-17 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
JPH04359921A (ja) * | 1991-06-07 | 1992-12-14 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JPH0586169A (ja) * | 1991-09-25 | 1993-04-06 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び硬化物 |
JP2006233149A (ja) * | 2005-02-28 | 2006-09-07 | Shin Etsu Chem Co Ltd | 低誘電膜形成素子封止用樹脂組成物及び半導体装置 |
WO2012053522A1 (ja) * | 2010-10-19 | 2012-04-26 | 住友ベークライト株式会社 | 封止用樹脂組成物及び電子部品装置 |
WO2013136685A1 (ja) * | 2012-03-16 | 2013-09-19 | 住友ベークライト株式会社 | 封止用樹脂組成物およびこれを用いた電子装置 |
JP2014156607A (ja) * | 2014-04-21 | 2014-08-28 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3689022T2 (de) * | 1985-10-07 | 1994-04-21 | Shinetsu Chemical Co | Epoxyharzzusammensetzung. |
JPS62212417A (ja) | 1986-03-13 | 1987-09-18 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
US5362775A (en) * | 1991-03-27 | 1994-11-08 | Nippondenso Co., Ltd. | Epoxy resin composition and cured product thereof |
JP3388537B2 (ja) | 1998-05-15 | 2003-03-24 | 信越化学工業株式会社 | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
JP2011252037A (ja) | 2010-05-31 | 2011-12-15 | Meiwa Kasei Kk | エポキシ樹脂組成物、該エポキシ樹脂組成物を用いた半導体封止材料及び積層板 |
JP5754731B2 (ja) | 2011-08-25 | 2015-07-29 | 明和化成株式会社 | エポキシ樹脂、エポキシ樹脂の製造方法、及びその使用 |
-
2015
- 2015-02-27 JP JP2015039003A patent/JP6300744B2/ja active Active
-
2016
- 2016-02-24 KR KR1020160021808A patent/KR20160105323A/ko unknown
- 2016-02-25 US US15/053,730 patent/US20160251511A1/en not_active Abandoned
- 2016-02-26 CN CN201610106257.4A patent/CN105924899A/zh active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6284147A (ja) * | 1985-10-07 | 1987-04-17 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
JPH04359921A (ja) * | 1991-06-07 | 1992-12-14 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JPH0586169A (ja) * | 1991-09-25 | 1993-04-06 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物及び硬化物 |
JP2006233149A (ja) * | 2005-02-28 | 2006-09-07 | Shin Etsu Chem Co Ltd | 低誘電膜形成素子封止用樹脂組成物及び半導体装置 |
WO2012053522A1 (ja) * | 2010-10-19 | 2012-04-26 | 住友ベークライト株式会社 | 封止用樹脂組成物及び電子部品装置 |
WO2013136685A1 (ja) * | 2012-03-16 | 2013-09-19 | 住友ベークライト株式会社 | 封止用樹脂組成物およびこれを用いた電子装置 |
JP2014156607A (ja) * | 2014-04-21 | 2014-08-28 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016210907A (ja) * | 2015-05-11 | 2016-12-15 | 信越化学工業株式会社 | 半導体封止用樹脂組成物及びその硬化物を備えた半導体装置 |
JP2018087322A (ja) * | 2016-11-21 | 2018-06-07 | 三菱ケミカル株式会社 | エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子部品 |
Also Published As
Publication number | Publication date |
---|---|
US20160251511A1 (en) | 2016-09-01 |
JP6300744B2 (ja) | 2018-03-28 |
CN105924899A (zh) | 2016-09-07 |
KR20160105323A (ko) | 2016-09-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6300744B2 (ja) | 半導体封止用樹脂組成物及び半導体装置 | |
JP5692070B2 (ja) | 半導体封止用樹脂組成物、及び半導体装置 | |
JP2015174874A (ja) | 半導体封止用樹脂組成物及び半導体装置 | |
WO2011052157A1 (ja) | 半導体封止用樹脂組成物およびこれを用いた半導体装置 | |
TWI536514B (zh) | 半導體密封用樹脂組成物及使用其之半導體裝置 | |
WO2019131095A1 (ja) | ボールグリッドアレイパッケージ封止用エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置 | |
JP5228496B2 (ja) | 半導体封止用エポキシ樹脂組成物及び半導体装置 | |
JP5386836B2 (ja) | 半導体封止用樹脂組成物及び半導体装置 | |
JP6315368B2 (ja) | 半導体封止用エポキシ樹脂組成物および半導体装置 | |
JP6008107B2 (ja) | 樹脂組成物および電子部品装置 | |
TW201821526A (zh) | 環氧樹脂組成物及半導體裝置 | |
JP6315367B2 (ja) | 半導体封止用エポキシ樹脂組成物および半導体装置 | |
JP5386837B2 (ja) | 半導体封止用樹脂組成物及び半導体装置 | |
JP6277611B2 (ja) | 素子封止用エポキシ樹脂成形材料及び電子部品装置 | |
JP2012007086A (ja) | 封止用樹脂組成物及び電子部品装置 | |
JP2010144115A (ja) | 半導体封止用樹脂組成物及び半導体装置 | |
JP2006213849A (ja) | 封止用樹脂組成物および半導体封止装置 | |
JP2018104603A (ja) | 硬化性樹脂組成物及び電子部品装置 | |
JP2011094106A (ja) | 半導体封止用樹脂組成物及び半導体装置 | |
JP2004203911A (ja) | 封止用樹脂組成物および樹脂封止型半導体装置 | |
JP2010031233A (ja) | 半導体封止用エポキシ樹脂組成物、及び該組成物を用いて半導体素子を封止して得られる片面封止型半導体装置 | |
JP2001247652A (ja) | エポキシ樹脂組成物及び半導体装置 | |
JP2013234305A (ja) | 半導体封止用エポキシ樹脂組成物および半導体装置 | |
JP6115451B2 (ja) | 半導体封止用エポキシ樹脂組成物及び半導体装置 | |
JP2011094105A (ja) | 半導体封止用樹脂組成物及び半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170125 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20171115 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171122 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180117 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180202 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180227 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6300744 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |